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Microcomputer Peripheral LSIs

MN1380 Series
CMOS LSIs for Voltage Detection
Overview

Pin Assignment

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The MN1380 series are elements that monitor the power


supply voltage supplied to microcomputers and other LSI
systems and issue reset signals for initializing the system
after the power is first applied or for preventing runaway
operation when the supply voltage fluctuates.
There is a choice of three output types: CMOS output,
N-channel open drain output, and inverted CMOS output. There are also three package types: M, TO-92, and a
mini type for surface mounting.
Choose the ideal element for your application from the
series' wide selection of detection ranks (17 ranks between
2.0 and 4.9 volts), output types, and package types.

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23
MN1380 - R

M type package

Features

1381
23R

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Applications

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Battery checkers

Power outage detectors


Level discriminators
Memory backup systems

TO-92 type package

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Three-pin element requiring no adjustment


Wide selection of detection ranks (17 ranks between
2.0 and 4.9 volts)
Highly precise detection voltage
Detection voltage with hysteresis characteristic
VD = 50 mV for ranks C to K
VD = 100 mV for ranks L to U
Low current consumption: IDD = 1A (typ.) for VDD
=5V
Low fluctuation in detection voltage with temperature (typ. 1 mV/C)
Wide selection of output types: CMOS output, Nchannel open drain output, and inverted CMOS
output
Wide selection of package types: M, TO-92, and a
mini type for surface mounting.

LCR

Mini type package

1=OUT
2=VDD
3=VSS

Microcomputer reset circuits


Reset circuits for other electronic circuits

SAG00003CEM

MN1380 Series

Microcomputer Peripheral LSIs

MN1380 Series Naming Conventions


The MN1380 series offers a wide selection of detection ranks, output types, package types, and packaging. All
combinations use the following naming conventions. When ordering, be sure to give the correct part number using
these naming conventions.

MN13801R (TA)

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Winding direction for tape packaging


(TA) ...... Tape packaging for TO-92 type package
(TX) ...... Embossed tape packing for mini type package
(TW) ..... Embossed tape packing for mini type package
For further details, see the package specifications.

Detection voltage rank (C to U)

Output type:
Blank CMOS output
1 N-channel open drain output
2 inverted CMOS output

Package:
0 M type package
1 TO-92 type package
2 Mini type package

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Matsushita Electronics Corporation MN1380 series of voltage detection CMOS


LSIs with low current consumptions

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(Example)

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MN13821R (TW)

Embossed tape packaging

R rank (detection voltage of 4.0 to 4.3 V)

N-channel open drain output

Mini type package

MN1380 series of voltage detection CMOS LSIs with low current consumption

Minimum Packaging Unit


Bulk (M and TO-92 types) 1,000
Magazine (Mini type) 50
Taping (Mini and TO-92 types) 3,000

Microcomputer Peripheral LSIs

MN1380 Series

Series Lineup
Package

Output
CMOS output

M type Package
MN1380

TO-92 type Package


MN1381

Mini type Package


MN1382

N-channel open drain output

MN13801

MN13811

MN13821

Inverted CMOS output

MN13802

MN13812

MN13822

Detection Ranks (on Voltage)


Detection Voltage for Drop in Power Supply Voltage (VDL)

Unit

Detection Voltage Hysteresis Width (VD)

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Rank

min
2.0

max
2.2

2.1

2.3

2.2

2.4

2.3

2.5

2.4

2.6

2.5

2.7

2.6

2.9

2.8

3.1

3.0

3.3

3.2

3.5

3.4

3.7

max

Unit

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min

3.6

3.9

3.8

4.1

4.0

4.3

4.2

4.5

4.4

4.7

4.6

4.9

50

300

mV

50

300

mV

100

300

mV

Ma

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MN1380 Series

Microcomputer Peripheral LSIs

Block Diagram

2
Voltage
Reference 1

VDD

+
Comparator

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*1
Output Circuit

Level Converter

OUT

Comparator

Voltage
Reference 2

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VSS

Note *1: Circuits vary slightly depending on the output type (CMOS output, N-channel open drain output, or inverted CMOS
output)

Pin Descriptions
Symbol
OUT

Function Description
Reset signal output pin

VDD

Power supply pin

VSS

Ground pin

Ma

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Pin No.
1

Microcomputer Peripheral LSIs


Absolute Maximum Ratings

MN1380 Series

VSS=0V, Ta=25C

Parameter
Power supply voltage

Symbol
VDD

Rating
7.0

Output voltage

VO

0.3 to VDD +0.3

Operating ambient temperature

Ta

20 to +70

Storage temperature

Tstg

55 to +125

VSS=0V, Ta=25C

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Recommended Operating Conditions

Unit
V

Power supply
voltage

Symbol
VDD

Conditions
See Figures 1 and 4.

Electrical Characteristics

min
1.5

typ

max
6.0

Unit
V

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Parameter

1) DC Characteristics VSS=0V, Ta=20C to +70C


Parameter
Power supply current

Symbol
Conditions
IDD
VDD = 5 V *1

min

typ

max

Unit

*2

*2

*2

*2

mV

Load resistance = 10 kW

Detection voltage for drop


in power supply voltage *2

Detection voltage hysteresis


width *2

"H" level output voltage

VDL

Ta=25C

VD

See Figures 1 and 4.

VOH

CMOS output IOH= 40A


Inverted

VDD=1.8V

CMOS output IOH= 0.5mA

VOL

N-channel open

VDD=1.8V

drain output

IOL=0.7mA

Inverted

VDD=6.0V

0.8

VDD

VDD

1.5

VSS

0.4

VSS

0.6

ue

"L" level output voltage

0.8VDD

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CMOS output IOH=0.3mA

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Notes
*1: This includes the output pin's leakage current.
*2: For particulars, see the detection voltage rank table.

MN1380 Series

Microcomputer Peripheral LSIs

Electrical Characteristics (continued)


2) AC Characteristics
Parameter

VSS=0V, Ta=25C

Symbol

Conditions
Rank
C

MN1380
MN1381
MN1382

Allowable Value (typ)


MN13801
MN13802
MN13811
MN13812
MN13821
MN13822

Unit

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D
E

3.0

2.5

230.0

tOH

Figures

2 and 3.

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See

Reset release time

3.0

3.0

100.0

2.0

4.0

30.0

250.0

160.0

3.0

115.0

100.0

3.0

15.0

35.0

3.0

K
L

M
N
P

Q
R
S

D
E
F

tOL

Figures

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2 and 3.

Ma

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See

Reset time

K
L

M
N
P

Q
R
S

Microcomputer Peripheral LSIs

MN1380 Series

Description of Operation

VDD

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VDH
VDL

1.5V
0V

VOUT

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CMOS output, N-channel


open drain output

MN1380/1381/1382
MN13801/13811/13821

tOH

tOH

tOL

0V

Inverted CMOS
output Figure

VOUT

tOL

MN13802/13812/13822

tOL

tOL

tOH

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tOH

0V

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Figure 1. Description of Operation

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Notes
1: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range.
2: VDL: Detection voltage for drop in power supply voltage
VDH: Detection voltage for rise in power supply voltage
tOL : Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that the
output pin (OUT) goes to "L" level.
tOH : Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that
the output pin (OUT) goes to "H" level.
3: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and VDD
pins.

MN1380 Series

Microcomputer Peripheral LSIs

Description for Measuring the Output Characteristics

VDD

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6.0V

1.6V

6.0V

CMOS output, N-channel


open drain output
MN1380/1381/1382
MN13801/13811/13821

tOH

1.5V

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0V

tOL

1.0V

0V

Inverted CMOS output

6.0V

tOH

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1.6V
1.5V

tOH

1.0V

int

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0V

MN13802/13812/13822

Ma

Figure 2. Description chart of Measuring the Output Characteristics

100k

VDD

Switch: Connect when measuring


N-channel open drain output
(MN13801/MN13811/MN13821)

MN1380 Series
100pF
VOUT

Figure 3. Circuit for Measuring the Output Characteristics


8

Microcomputer Peripheral LSIs

MN1380 Series

Description for Measuring the I/O Characteristics

VOUT

CMOS output, N-channel


open drain output

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MN1380/1381/1382
MN13801/13811/13821

VD

Operation indeterminate

1.5V

VDL

VOUT

Inverted CMOS output

en

an

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/D
isc
on
tin

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MN13802/13812/13822

VDD

VDH

int

Operation
indeterminate

Ma

1.5V

VD

VDD

VDL

VDH

Figure 4. Description chart for Measuring the I/O Characteristics


Notes
1: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range.
2: VDL: Detection voltage for drop in power supply voltage
VDH: Detection voltage for rise in power supply voltage
3: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and VDD pins.

MN1380 Series

Microcomputer Peripheral LSIs

Application Circuit Example


Connect resistors, capacitors, and the like only to the output pin on the MN1380 series element. Note that connecting them to the Power source pins changes VDH, VDL, and VD.

Sample Circuit 1

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Sample Circuit 2

VDD

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VDD

OUT

MN1380
Series

Ma

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Select the values of R and C to match the application.

10

OUT

MN1380
Series

0.7R

0.85

0.550.1

1.25

2.50.5 2.50.5

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Note) The package will be changed to lead-free type (M3A). See the new package dimensions section later of this datasheet.

int

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Microcomputer Peripheral LSIs
MN1380 Series

Package Dimensions (Unit: mm)


M type package

6.9
1.5
1.5
1.0

2.5

0.450.1

11

0.45 -0.1

+0.2

2.540.15

1 2 3

12

2.30.2

Note) The package will be changed to lead-free type (SSIP003-P-0000S). See the new package dimensions section later of this
datasheet.

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5.10.2

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MN1380 Series
Microcomputer Peripheral LSIs

Package Dimensions (Unit: mm)(continued)


TO-92 type package

5.00.2
4.00.2

0.40.2

0.16

+0.2
-0.1

+0.1
-0.05

0.5

1.45

0.95

+0.2
-0.05

+0.1
-0.05

0.95

1.90.2

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Note) The package will be changed to lead-free type (MINI-3DC). See the new package dimensions section later of this
datasheet.

Ma
0.5

M
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Microcomputer Peripheral LSIs

0.650.15

MN1380 Series

Package Dimensions (Unit: mm)(continued)


Mini type package

2.8 -0.3

+0.2

1.5 -0.05

+0.25

0.650.15

0.1 to 0.3

13

MN1380 Series

Microcomputer Peripheral LSIs

Reference Characteristics
The following characteristics curves represent results from a specific sample therefore they do not guarantee the
characteristics for the final product.

1.4

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1.2

VSS

OUT

0.8

VDD

0.6
0.4

0.2
0

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IDD(A )

1.0

1.0

2.0

3.0
4.0
VDD(V)

5.0

6.0

Figure 5.a. IDD vs. VDD Characteristic (Rank Q)

ce
/D
isc
on
tin

an

1.5

Figure 5.b. Measurement Circuit

VSS

OUT

int

en

VDD

Ma

IDD(A )

7.0

ue

2.0

1.0

5V

0.5
40

20

20

40

60

80

Ambient temperature, Ta (C)

Figure 6.a. IDD Temperature Characteristic (Rank Q)

14

Figure 6.b. Measurement Circuit

Microcomputer Peripheral LSIs

MN1380 Series

Reference Characteristics (continued)

4.8
4.6
4.4

VSS

M
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OUT

VDH

VDD

4.0

VDL

3.8

3.6
3.4

40 20

20

40

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VDL,VDH(V)

4.2

60

80

Temperature Ta(C)

Figure 7.a. VDL/VDH Temperature Characteristic (Rank Q)

0.3

ce
/D
isc
on
tin

ue

0.25

en

an

0.15

Ma

int

VD(V)

0.2

0.1

0.05

Figure 7.b. Measurement Circuit

VSS

OUT

VDD

0
40 20
0
20
40 60
80
Ambient temperature, Ta (C)

Figure 8.a. VD Temperature Characteristic (Rank Q)

Figure 8.b. Measurement Circuit

15

MN1380 Series

Microcomputer Peripheral LSIs

Reference Characteristics (continued)

3
30C
Room temperature

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80C

VSS

OUT

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IOL(mA)

VDD

1.8V

1.0

0.5

1.5

VOL(V)

2.0

2.5

20

ce
/D
isc
on
tin

Room temperature
15

an
en

VDD

int

2
3
VOL(V)

Figure 10.a. IOH vs. VOH Characteristic

16

OUT

5V

VSS

Ma

| IOH | (mA)

80C

10

Figure 9.b. Measurement Circuit

ue

30C

3.0

Figure 9.a. IOL vs. VOL Characteristic

Figure 10.b. Measurement Circuit

Microcomputer Peripheral LSIs

MN1380 Series

Reference Characteristics (continued)

2.5

M
Di ain
sc te
on na
tin nc
ue e/
d

2.0
VSS

OUT

VDD

di
p
Pl
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pla m d m des
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.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
life
an ut e
d
as lat
cy
on es
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.jp rm
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IOL(mA)

1.5

1.0

1.8V

0.5

0
40

0
20
40
60
Ambient temperature, Ta (C)

20

80

Figure 11.a. IOL vs. Temperature Characteristic

Figure 11.b. Measurement Circuit

ce
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on
tin

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7.0

an

6.0

en
20

OUT

VDD

5V

5.0

4.5
40

VSS

int

5.5

Ma

| IOH | (mA)

6.5

20

40

60

80

Ambient temperature, Ta (C)

Figure 12.a. IOH vs. Temperature Characteristic

Figure 12.b. Measurement Circuit

17

MN1380 Series

Microcomputer Peripheral LSIs

TO-92 Type Package Taping-Specifications (MN1381/MN13811/MN13812)

h1

A1
P

h2

t1

t2

W0

di
p
Pl
lan nclu
ea
e
se
pla m d m des
ne ain ain foll
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d te t o
p:/ fo
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W
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
life
an ut e
d
as lat
cy
on es
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.jp rm
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H0

l1 H1

W2

M
Di ain
sc te
on na
tin nc
ue e/
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P1

F1 F2

Drawing direction

P0

D0

Figure 13. TO-92 Type Package Taping-Dimensions (Ammunition pack)

TO-92 Type Package Taping Dimensions (Ammunition pack)


Name
Product height*

Symbol
A

Length (mm)
5.3 max

Product width*

A1

Product thickness*

Lead width*

Taped lead length

l1

Product pitch

F1, F2

h1, h2
W

int

en

an

0.5 max

Distance to top of product

25.0 max

12.71.0

Distance to
bottom of product

H0

19.00.5

12.70.3

Lead clinch height

H1

16.00.5

Feed hole diameter

D0

4.00.2

Tape thickness

t1

0.70.2

Total tape thickness

t2

1.5 max

2.0 max

6.350.5

2.5 +0.5
0.2

2.0 max

18.0 +1.0
0.5

Note*1: For further details, see the specifications issued separately.

25 elements (example)

Ma
W
330

9.00.5

W2

0.45 +0.15
0.1

H
250

D
41

Unit: mm

Leave the space for at


least three elements

Figure 14. Box Dimensions for TO-92 Type Packages with Ammunition pack
18

Length (mm)
6.00.5

Tape width

W1

Adhesive tape position

Product deflection angle

Feed hole position

4.2 max

Lead spacing

5.2 max

ue

P0

P1

Symbol
W0

ce
/D
isc
on
tin

Feed hole pitch

Feed hole position

Name
Adhesive tape width

Microcomputer Peripheral LSIs

MN1380 Series

Embossed Taping Specifications for Mini Type Package (MN1382/MN13821/MN13822)


There is a choice of two orientations, TW and TX, for the product relative to the tape.

TW

TX

Tape feed hole

Tape feed hole

M
Di ain
sc te
on na
tin nc
ue e/
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Drawing
direction

(Marking surface on top)

1.5

3.50.05

8.00.3

1.750.1

Figure 15. TW Orientation

+0.1
-0

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mi UR ue ued pe pe Pro
co L a d t ty
du
130.5
n.p bo yp pe
c
801.0
an ut e
d 3.30.1 1.750.1 t life
as lat
cy
1782.0
on es
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.jp rm
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(Marking surface on top)

Drawing
direction

Figure 16. TX Orientation

Unit: mm

4.00.1

t+0.30.1

3.20.1

4.00.1

Product orientation A is labeled TW; orientation B, TX.

ce
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on
tin

ue

Figure 17. Embossed Taping Dimensions for Mini Type Package

Ma

int

en

an

210.8

Unit: mm

0.5

20.5
101.5

3,000 packages per reel

Figure 18. Embossed Taping Reel Dimensions for Mini Type Package
19

MN1380 Series

Microcomputer Peripheral LSIs

Reliability Testing Results for MN1380 Series


(1) M type package (MN1380/MN13801/MN13802) and TO-92 type package (MN1381/MN13811/MN13812)
Test Subjects
Operating lifetime test

Test Conditions

Results

VDD=5.5V, Ta=125C, t=1000hrs

0/15

High-temperature storage test

Ta=150C, t=1000hrs

0/15

Low-temperature storage test

Ta=65C, t=1000hrs

0/15

High-temperature,

Ta=85C, RH=85%, t=1000hrs

0/15

M
Di ain
sc te
on na
tin nc
ue e/
d

high-humidity storage test


High-temperature,

VDD=5.5V, Ta=85C, RH=85%, t=1000hrs

0/15

Ta=150C and 65C.

0/15

Thermal shock test

di
p
Pl
lan nclu
ea
e
se
pla m d m des
ne ain ain foll
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d te t o
p:/ fo
/w llo dis disc nan enan wing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
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life
an ut e
d
as lat
cy
on es
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co fo
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high-humidity bias test

Five minutes at each temperature for ten cycles

Temperature cycle test

Ta=150C and 65C.

0/15

Thirty minutes at each temperature for ten cycles

Pressure cooker test

Two atmospheres for 50 hours at ambient temperature (Ta) of 121C

0/15

Soldering test

Ambient temperature (Ta) of 230C for five seconds

0/15

Solder heat resistance test

Ambient temperature (Ta) of 270C for ten seconds

0/15

(2) Mini type package (MN1382/MN13821/MN13822)


Test Subjects
Operating lifetime test

Test Conditions
VDD=5.5V, Ta=125C, t=1000hrs

High-temperature storage test

Ta=150C, t=1000hrs

Results
0/15
0/15

Low-temperature storage test

Ta=65C, t=1000hrs

0/15

High-temperature,

Ta=85C, RH=85%, t=1000hrs

0/15

VDD=5.5V, Ta=85C, RH=85%, t=1000hrs

0/15

Ta=150C and 65C.

0/15

high-humidity storage test


High-temperature,

high-humidity bias test

ue

Thermal shock test

ce
/D
isc
on
tin

Five minutes at each temperature for ten cycles

Temperature cycle test

Ta=150C and 65C.

0/15

Thirty minutes at each temperature for ten cycles

Two atmospheres for 24 hours at ambient temperature (Ta) of 121C

0/15

Soldering test

Ambient temperature (Ta) of 230C for five seconds

0/15

Ambient temperature (Ta) of 260C for five seconds

0/15

an

Pressure cooker test *1

Ma

int

en

Solder heat resistance test *1

Note*1: Note that the testing conditions for the mini package differ from those for the other two packages.

20

0.20

2R0.70

(0.85)

0.40+0.10
-0.05

0.550.10

2.50

2.50

0.20

0.10

(0.40)

(1.50)

0.10

6.900.10

0.20

0.10

di
p
Pl
lan nclu
ea
e
se
pla m d m des
1.00
ne ain ain foll
htt visit
2.25
2.85
3.50
d te t o
p:/ fo
/w llo dis disc nan enan wing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
(1.00)
life
an ut e
d
as lat
4.10 cy
4.50
on es
cle
ic. t in
sta
co fo
ge
.jp rm
.
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n.

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ce
/D
isc
on
tin

an

en

int

Ma

M
Di ain
sc te
on na
tin nc
ue e/
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Microcomputer Peripheral LSIs
MN1380 Series

M3A (Lead-free package)

New Package Dimensions (Unit: mm)

(1.50)

2.500.10

R0.90
(1.00)

21

22
(1.00)

0.600.15

0.400.10

1.27

1.27

0.50

di
p
Pl
lan nclu
ea
e
se
pla m d m des
13.30
v
f
a
n
a
o
i
htt sit
ed int int llo
p:/ fo
e
/w llo dis disc nan enan wing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
life
an ut e
d
as lat
cy
on es
cle
ic. t in
sta
co fo
ge
.jp rm
.
/en at
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ue

ce
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isc
on
tin

an

en

int

Ma

5.000.20

(1.00)

M
Di ain
sc te
on na
tin nc
ue e/
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MN1380 Series
Microcomputer Peripheral LSIs

SSIP003-P-0000S (Lead-free package)

New Package Dimensions (Unit: mm)(continued)

5.000.20
4.000.20

0.40+0.10
-0.05

2.300.20

+0.20
-0.10

0.95

0.95

1.90+0.20

2.90+0.20
-0.05

Seating plane

0.400.20

+0.10
-0.06

+0.20
-0.30

+0.25
-0.05

(0.65)

+0.30
-0.10

di
p
Pl
lan nclu
ea
1.10
e
se
pla m 0dtom0.10des1.20
(0.65)1.50
ne ain ain foll
htt visit
d te t o
p:/ fo
2.80
/w llo dis disc nan enan wing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
life
an ut e
d
as lat
cy
on es 0.16
cle
ic. t in
sta
co fo
ge
.jp rm
.
/en at
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n.

ue

ce
/D
isc
on
tin

an

en

int

Ma

M
Di ain
sc te
on na
tin nc
ue e/
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Microcomputer Peripheral LSIs
MN1380 Series

MINI-3DC (Lead-free package)

New Package Dimensions (Unit: mm)(continued)

(1.45)
0.40+0.10
-0.05

0.10 to 0.30

23

Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.

M
Di ain
sc te
on na
tin nc
ue e/
d

(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
Any applications other than the standard applications intended.

d
pla inc
ne lud
se
pla m d m es
v
ne ain ain foll
htt isit
d te t o
p:/ fo
/w llo dis disc nan enan wing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
life
an ut e
d
as lat
cy
on es
cle
ic. t in
sta
co fo
ge
.jp rm
.
/en at
i
o
/
n.

(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

Pl
ea

Ma

int

en

an

ce
/D

isc

on
tin

ue

(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.

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