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AC/DC Drivers
General Description
The quasi-resonant controller typed AC/DC converter IC
(BM1Q00XFJ series) provides an optimum system for all
products that include an electrical outlet.
Quasi-resonant operation enables soft switching and helps
to keep EMI low.
With MOSFET for switching and current detection resistors
as external devices, a higher degree of design freedom is
achieved.
As BM1Q00XFJ series built in HV starter circuit, it
contributes to low consumption power and high speed start.
Because the built-in burst mode is reduced switching loss
and IC consumption current is low, Stand-by power is very
low.
Because BM1Q00XFJ series built-in soft-start, burst mode,
over current limiter which is cycle-by-cycle, over load
protection, over voltage protection, CS open protection and
so on, BM1Q00XFJ series are highly safety.
Package
SOP-J8
Key Specifications
Operating Power Supply Voltage Range:
:
VCC8.9V to 26.0V
VH
to 600V
Operating Current:
Normal0.60mA (Typ.)
Burst 0.35mA(Typ.)
Max frequency:
120kHz(Typ.)
Operate temperature range:
-40 to +85
Applications
AC adapters and household appliances (printer, TV,
vacuum cleaners, air cleaners, air conditioners, IH
cooking heaters etc.)
Line Up
IC
VCC OVP
ZT OVP
BM1Q001FJ
Auto restart
None
BM1Q002FJ
Latch
Latch
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Datasheet
BM1Q00XFJ Series
Absolute Maximum RatingsTa=25C
Item
Symbol
Rating
Unit
Condition
Input voltage range 1
Vmax1
-0.3 ~ 30
V
VCC
Input voltage range 2
Vmax2
-0.3 ~ 6.5
V
CS, FB
Input voltage range 3
Vmax3
-0.3 ~ 7.0
V
ZT
Input voltage range 4
Vmax4
-0.3 ~ 15
V
OUT
Input voltage range 5
Vmax5
-0.3 ~ 650
V
VH
OUT pin out peak current1
IOH
-0.5
A
OUT pin out peak current2
IOL
1.0
A
ZT pin current1
ISZT1
-3.0
mA
ZT pin current2
ISZT2
3.0
mA
Allowable dissipation
Pd
674.9 (Note1)
mW
o
Operating temperature
Topr
-40 +85
C
o
Max junction temperature
Tjmax
150
C
o
Storage temperature range
Tstr
-55 +150
C
(Note1) When mounted (on 70 mm 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate).
Reduce to 5.4 mW/C when Ta = 25C or above.
Operating ConditionsTa=25C
Parameter
Power supply voltage range 1
Power supply voltage range 2
Symbol
VCC
VH
Rating
8.926.0
80600
Unit
V
V
Conditions
VCC
VH
Unit
Conditions
Circuit current
FB=2.0V
(Switching operation)
FB=0.5V
(Switching OFF)
VCC=12V , VH:open
VCC UVLO = disable
ION1
600
1000
uA
ION2
350
450
uA
Circuit current(OFF)
IOFF
25
uA
VH Start current1
VH Start current2
ISTART1
ISTART2
0.400
1.00
0.700
3.00
1.000
6.00
mA
mA
VH OFF current
ISTART3
10
20
uA
VSC
0.400
0.800
1.400
VCC= 0V
VCC=10V
Released VCCUVLO
VH pin current
VCC pin
VUVLO1
VUVLO2
VUVLO3
VCHG1
VCHG2
VOVP1
VOVP2
VOVP3
12.50
7.50
7.70
12.00
26.00
-
13.50
8.20
5.30
8.70
13.00
27.50
23.50
4.00
14.50
8.90
9.70
14.00
29.00
-
V
V
V
V
V
V
V
V
VCC rise
VCC fall
VUVLO3= VUVLO1-VUVLO2
Starter circuit
Stop voltage from VCHG1
VCC rise
VCC fall [BM1Q001]
[BM1Q001]
VOUTH
VOUTL
RPDOUT
10.5
75
12.5
100
14.5
0.30
125
V
V
k
IO=-20mA, VCC=15V
IO=+20mA
VH pin starter
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Datasheet
BM1Q00XFJ Series
IC control unit Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Specifications
Parameter
Symbol
Unit
MIN
TYP
MAX
Conditions
RFB
Vlim1A
Vlim1B
Vlim2A
Vlim2B
22.5
0.475
0.310
0.100
0.062
30.0
0.500
0.350
0.125
0.088
37.5
0.525
0.390
0.150
0.113
k
V
V
V
V
FB=0V
FB=2.2V (ACSNSL)
FB=2.2V (ACSNSH)
FB=0.5V (ACSNSL)
FB=0.5V (ACSNSH)
AVCS1
3.40
4.00
4.60
V/V
ACSNSL
AVCS2
4.86
5.71
6.57
V/V
ACSNSH
IZT1
IZT2
0.93
0.82
1.00
0.90
1.07
0.98
mA
mA
IZTHYS
0.10
mA
TLEB
TOFF
Tmin
Tmax
30.0
0.250
0.150
0.400
39.0
50.7
us
us
us
us
IZT1
IZT2
IZT3
FSW1
FSW2
4
6
8
108
21
14
16
18
120
30
24
26
28
132
39
uA
uA
uA
kHz
kHz
TLEBTOFF
VFBSW1
1.10
1.25
1.40
VFBSW2
VZT1
VZT2
0.42
60
120
0.50
100
200
0.58
140
280
V
mV
mV
TZTMASK
0.6
us
ZT trigger Timeout1
ZT trigger Timeout2
TZTOUT1
TZTOUT2
10.5
3.5
15.0
5.0
19.5
6.5
us
us
TSS1
TSS2
TSS3
TSS4
VBURST1
VFOLP1A
VFOLP1B
TFOLP
TOLPST
0.35
0.70
1.40
2.80
0.42
2.6
44.8
358
0.50
1.00
2.00
4.00
0.50
2.8
2.6
64
512
0.65
1.30
2.60
5.20
0.58
3.0
83.2
666
ms
ms
ms
ms
V
V
V
ms
ms
VLATCH
TLATCH
VZTL
50
4.65
200
5.35
ms
V
OUT=L, ZT=4.65V
OUT=L, ZT=5.00V
OUT=L, ZT=5.35V
FB=2.0V
FB=0.5V
ZT fall
ZT rise
In OUT H ->L,
prevent noise
From final ZT trigger
[DC/DC protection ]
Soft start time1
Soft start time 2
Soft start time 3
Soft start time 4
FB Burst voltage
FB OLP voltage a
FB OLP voltage b
FB OLP delay timer
FBOLP stop timer
Latch released voltage
VCC pin voltage
Latch mask time
ZT OVP voltage
VUVLO2
0.50
100
5.00
Burst ON
FBOLP detectFB rise
FBOLP detectFB fall
[BM1Q002FJ]
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Datasheet
BM1Q00XFJ Series
Pin Configuration
Table 1 Input-Output PIN Function
NO.
Pin Name
I/O
1
2
3
4
5
6
7
8
ZT
FB
CS
GND
OUT
VCC
N.C.
VH
I
I
I
I/O
O
I/O
I
External Dimensions
ESD Diode
Function
VCC
GND
4.90.2
MAX 5.25 ( include BURR)
Lot No.
1.3750.1
0.175
11.27
.27
0.45MIN
1Q00X
3.90.2
6.00.3
0.20.1
0.420.1
(Unit:mm)
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Datasheet
BM1Q00XFJ Series
Block Diagram
+
AC
FUSE
Filter
85-265Vac
Diode
Bridge
Starter
12V Clamp
Circuit
4.0V Regulator
13.5V/
8.2V
13.0V/
8.7V
NOUT
+
Internal
Supply
27.5V
OSC
OSC
1 shot
AND
TimeOut
( 15 us )
7V
100mV
/200mV
ZT Blanking
OUT(H->L)
0.60us
ERROR
AMP
OR
POUT
S Q
AND
NOUT
FBOLP_OH
AND
OR
PRE
Driver
5
NOUT
Max frequency
control
30k
BURST_OH
0.50V.
1M
Soft Start
300k
100k
FB/4
0.50V
SS
0.5ms
SS
1ms
SS
2ms
SS
4ms
Leading Edge
Blanking
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Datasheet
BM1Q00XFJ Series
Description of Blocks
( 1-1 ) Starter Circuit VH pin8pin
IC builds in starter circuit (tolerates 650V) to VH pin (8pin). It enables to be low standby power and high speed starting.
The operating current is shown in Fig-6.After starting IC, consumption power is decided by multiplied idling current ISTART3
typ=10uA with VH voltage. The loss by the idling current is below.
ex) power consumption of starter circuit only
Vac=100V Power100V*2*10uA=1.41mW
Vac=240V Power240V*2*10uA=3.38mW
Start time is decided by VH current and VCC pin capacitor.
The reference value of start time is shown in Fig7. For example, VCC capacitor is charged within 0.1s in CVCC=10uF
When VCC pin is shorted to GND, current of ISTART1 flows. (Fig-6)
When VH pin is shorted to GND, large current flows from VH line to GND. To prevent it, need to insert
resistor (5k~60k) of RVH to limit current between VH line and VH pin.
2
When VH pin is shorted to GND, the power of VH /RVH is applied. For that, please decide resistor size to confirm power
dissipation. When it does not satisfy power dissipation by one resistor, please use more than two resistors.
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Datasheet
BM1Q00XFJ Series
It shows operation waveform of start-up in Fig-8.
VH
Voltage
ISTART2
VH input
current
ISTART1
ISTART3
VUVLO1
VCC(5pin)
VSC
Switing
Set voltage
Secondary
output
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Datasheet
BM1Q00XFJ Series
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Datasheet
BM1Q00XFJ Series
(2 ) Start Sequence (Soft start, Light load operation, Auto recovery in over load protection)
The start sequence of IC is shown in Fig-10. About each detail, explain in each section.
VH(8pin)
13.0V
13.5V
VCC(6pin)
VCC=8.7V
Internal REF
Pull Up
64msec
64msec
512msec
64msec
2.8V
FB(2pin)
Vout
Over Load
Normal Load
Light LOAD
Iout
Burst mode
Switing
Soft
Start
BC
GH I
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Datasheet
BM1Q00XFJ Series
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Datasheet
BM1Q00XFJ Series
For Capacitor Value of VCC pin
For stable operation of the IC, please set the 1uF or higher capacitor value of VCC pin. When the VCC capacitor
terminal is too large, response of the VCC pin to the Secondary output is slows down. Please be careful.
If the degree of the transformer coupling is low, since a large surge occurs to the VCC pin, the IC may be destroyed. In
this case, please attach a resistor which is from 10 to 100 to the path between the capacitor and diode at the back of
the auxiliary winding. Please set the resistance value in order that surge of VCC pin does not exceed the absolute
maximum rating of the VCC pin by performing the waveform evaluation of VCC pin.
For settings VCC OVP voltage protection when Vout (Secondary output) is increased
VCC pin voltage is determined by the transformer ratio and Vout ( Secondary output ).Therefore, when the Secondary
output is large, it is possible to protect IC by VCCOVP. Setting VCCOVP protection is below.
Vout
Np
Ns
Nb
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Datasheet
BM1Q00XFJ Series
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BM1Q00XFJ Series
( 4 ) DC/DC Driver
The IC operates PFM (Pulse Frequency Modulation) mode method.
By monitoring FB pin(2pin) and ZT pin (1pin), CS pin(3pin), the IC supply optimum system for DC/DC operation.
The IC controls ON width (Turn Off) of external MOSFET by FB pin (2pin) and CS pin (3pin). The IC controls OFF width (Turn
ON) of external MOSFET by ZT pin1pin. The detail is shown below.
(4-1) For QR-basic Operations
The QR basic block diagram and the basic operation are shown in Fig-14,15.
7
NOUT
+
12V Clamp
Circuit
1 shot
TimeOut
15 usec
5 usec
AND
7V
ZT Blanking
OUT(H->L)
0.60us
100mV
/200mV
OR
AND
SET
POUT
S Q
NOUT
FBOLP_OH
AND
AND
PRE
Driver
5
NOUT
OR
Max frequency
control
RESET
30k
0.5V
Timer
(64ms)
1M
FBOLP_OH
OSC
300k
100k
Soft Start
FB/4 0.50V -
SS
0.5ms
SS
1ms
SS
2ms
SS
4ms
Leading Edge
Blanking
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Datasheet
BM1Q00XFJ Series
For Fig-15
A: The internal oscillator outputs the SET signal, and turns ON the MOSFET.
At this time, the Drain - source capacitance of the MOSFET is discharged, so noise is generated to the CS pin.
This noise is called Leading Edge.
The filter for this noise is built in this IC. (It refer to (4-3))
Minimum pulse width of the IC is a 400ns (typ) by this filter and the delay time.
After that, current flows through the MOSFET, and Voltage Vcs = Rs * Ip is applied to the CS pin.
B: If CS pin voltage rises than FB pin voltage/Gain (typ = 4) or the overcurrent detection voltage Vcs,
RESET signal is output, OUT turns OFF
C: There is a delay time Tondelay from the point of B to turn OFF actually. Because of Tondelay the difference occurs in
the maximum power by the AC voltage. This IC has a built-in function to reduce this difference. (It refer to (4-4))
D: The energy stored in the transformer during Ton is discharged to the secondary side, and Free vibration of the Drain
voltage caused by the Cds (Drain - source capacitance) of MOSFET and Lp(transformer value) begins.
E: Since the switching frequency is determined by the IC.
SET signal is output from the internal oscillator and turn ON the MOSFET by process of certain time from A.
mode1
mode2
mode3
mode4
120kHz
30kHz
0.0V
0.5V
1.25V
2.0V
2.8V
X
FB [V]
Y
CS Limiter[V]
mode1
mode2
mode3
mode4
Vlim1
Vlim2
0.0V
0.5V
1.25V
2.0V
2.8V
X
FB [V]
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Datasheet
BM1Q00XFJ Series
The ON width of Ton is decided by CS Limiter level VCS
.
Ton = (Lp*Vcs)/(Vin*RS)
Lp: primary inductance valueVin :VH voltage in Fig-14, RS: Sense resistor in Fig-14
To adjust over current limiter level, CS over current protection voltage is switched in soft-start, AC voltage.
Vlim1 and Vlim2 is changed below.
Soft start
AC=230V
Vlim1
Vlim2
Vlim1
Vlim2
start0.5ms
0.063V ( 12%)
0.016V ( 3%)
0.044V (10%)
0.011V ( 2%)
0.5ms1ms
0.125V ( 25%)
0.032V (6%)
0.088V (20%)
0.022V ( 4%)
1ms2ms
0.250V ( 50%)
0.063V (12%)
0.175V (40%)
0.044V ( 9%)
2ms4ms
0.375V ( 75%)
0.094V (19%)
0.263V (60%)
0.066V ( 13%)
4ms
0.500V (100%)
0.125V (25%)
0.350V (70%)
0.088V (18%)
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Datasheet
BM1Q00XFJ Series
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BM1Q00XFJ Series
CS
Limiter[V] Y
Vlim1
Vlim1*0.7
0.9mA 1.0mA
Fig-19
X
Izt[mA]
CS
Limiter[V] Y
Vlim1
Vlim1*0.7
192V 214V
X
VH[V]
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BM1Q00XFJ Series
VZT2
ZT VZT1
Bottom
detection
5us
5us
timeout
15us
timeout
5us
15us
15us
CS
OUT
A
B C
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BM1Q00XFJ Series
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BM1Q00XFJ Series
VCCOVP
Timeout
Bottom det
OR
POUT
AND
Q
FBOLP_OH AND
5 OUT
PRE
Driver
NOUT
VREF(4V)
1M
CURRENT SENSE
(V-V Change)
Normal : 1.0
Leading
Edge
Blanking
CS
RS
FB
VFOLP1A
VH charge
charge
charge
64ms
64ms
Switching
512ms
VUVLO1
VCHG2
VCC
512ms
VCHG1
VUVLO2
Fg-26
C D
GH
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Datasheet
BM1Q00XFJ Series
(9) OUT5pinVoltage Clamp Function
By the purpose which protects external MOSFET, H level of OUT 5pin is clamped to VOUTHtyp=12.5V
It prevents gate destruction of MOSFET by rising VCC 6pin voltage. It refers to Fig-23
OUT 5pin is pull-down RPDOUT(typ=100k).
6
12V Clamp
Circuit
POUT
PRE
Driver
5
NOUT
Fig-27 OUT5pinConstruction
Protection Mode
BM1Q001FJ
BM1Q002FJ
Self-restart
Self-restart
CS Open Protection
Self-restart
Self-restart
None
Self-restart
Self-restart
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BM1Q00XFJ Series
Power Dissipation
The thermal design should set operation for the following conditions.
(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)
1. The ambient temperature Ta must be 85 or less.
2. The ICs loss must be within the allowable dissipation Pd.
The thermal abatement characteristics are as follows.
(PCB: 70 mm 70 mm 1.6 mm, mounted on glass epoxy substrate)
1000
900
800
700
Pd[mW]
600
500
400
300
200
100
0
0
25
50
75
100
125
150
Ta[]
Fig-28
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BM1Q00XFJ Series
Operational Notes
(1) Absolute maximum ratings
Damage may occur if the absolute maximum ratings such as for applied voltage or operating temperature range are
exceeded, and since the type of damage (short, open circuit, etc.) cannot be determined, in cases where a particular
mode that may exceed the absolute maximum ratings is considered, use of a physical safety measure such as a
fuse should be investigated.
(2) Power supply and ground lines
In the board pattern design, power supply and ground lines should be routed so as to achieve low impedance. If there
are multiple power supply and ground lines, be careful with regard to interference caused by common impedance in
the routing pattern. With regard to ground lines in particular, be careful regarding the separation of large current routes
and small signal routes, including the external circuits. Also, with regard to all of the LSIs power supply pins, in
addition to inserting capacitors between the power supply and ground pins, when using capacitors there can be
problems such as capacitance losses at low temperature, so check thoroughly as to whether there are any problems
with the characteristics of the capacitor to be used before determining constants.
(3) Ground potential
The ground pins potential should be set to the minimum potential in relation to the operation mode.
(4) Pin shorting and attachment errors
When attaching ICs to the set board, be careful to avoid errors in the ICs orientation or position. If such attachment
errors occur, the IC may become damaged. Also, damage may occur if foreign matter gets between pins, between a pin
and a power supply line, or between ground lines.
(5) Operation in strong magnetic fields
Note with caution that these products may become damaged when used in a strong magnetic field.
(6) Input pins
In IC structures, parasitic elements are inevitably formed according to the relation to potential. When parasitic
elements are active, they can interfere with circuit operations, can cause operation faults, and can even result in damage.
Accordingly, be careful to avoid use methods that enable parasitic elements to become active, such as when a voltage
that is lower than the ground voltage is applied to an input pin. Also, do not apply voltage to an input pin when there is no
power supply voltage being applied to the IC. In fact, even if a power supply voltage is being applied, the voltage applied
to each input pin should be either below the power supply voltage or within the guaranteed values in the electrical
characteristics.
(7) External capacitors
When a ceramic capacitor is used as an external capacitor, consider possible reduction to below the nominal
capacitance due to current bias and capacitance fluctuation due to temperature and the like before determining
constants.
(8) Thermal design
The thermal design should fully consider allowable dissipation (Pd) under actual use conditions.
Also, use these products within ranges that do not put output Tr beyond the rated voltage and ASO.
(9) Rush current
In a CMOS IC, momentary rush current may flow if the internal logic is undefined when the power supply is turned ON,
so caution is needed with regard to the power supply coupling capacitance, the width of power supply and GND pattern
wires, and how they are laid out.
(10) Handling of test pins and unused pins
Test pins and unused pins should be handled so as not to cause problems in actual use conditions, according to the
descriptions in the function manual, application notes, etc. Contact us regarding pins that are not described.
(11) Document contents
Documents such as application notes are design documents used when designing applications, and as such their
contents are not guaranteed. Before finalizing an application, perform a thorough study and evaluation, including for
external parts.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
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TSZ02201-0F2F0A200110-1-2
17.JUN.2015 Rev.003
Datasheet
BM1Q00XFJ Series
Ordering Information
Package
Product name
E2
Packaging and
forming specification
E2: Embossed tape and reel
SOP-J8
<Tape and Reel information>
4.90.2
(MAX 5.25 include BURR)
+6
4 4
6
0.45MIN
3.90.2
6.00.3
Tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
0.545
0.20.1
0.175
1.3750.1
1.27
0.420.1
0.1 S
1pin
(Unit : mm)
Marking Diagram
Reel
Direction of feed
Line Up
Product (BM1Q00XFJ)
BM1Q001FJ
BM1Q002FJ
1Q00X
LOT No.
1PIN MARK
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2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
24/25
TSZ02201-0F2F0A200110-1-2
17.JUN.2015 Rev.003
Datasheet
BM1Q00XFJ Series
Revision History
Date
Revision
2013.04.05
2014.03.07
2014.03.07
2014.03.07
2014.03.07
2015.06.17
001
002
002
002
002
003
Changes
New Release
Datasheet Format modified
P-17 calculation changeResonant time = 1 / (2(LpCds) )
P-17 Delete Figure-27
Change Operational Notes
P-1,P-8,P-13 Modify transformer polarity in figure
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2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
25/25
Add
TSZ02201-0F2F0A200110-1-2
17.JUN.2015 Rev.003
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (Specific Applications), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHMs Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASS
CLASSb
CLASS
CLASS
CLASS
CLASS
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHMs Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
Notice-PGA-E
2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHMs Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHMs Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an as is basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice WE
Rev.001
Mouser Electronics
Authorized Distributor
ROHM Semiconductor:
BM1Q001FJ-E2 BM1Q002FJ-E2