CTS-7700 Service Manual

DCY2.782.
7700WC/E-A00
CTS-7700
Digital Ultrasound Imaging System
SERVICE MANUAL
SHANTOU INSTITUTE OF ULTRASONIC INSTRUMENTS, INC.

SHANTOU, CHINA
CONTENTS
1.
System Composition and Technical Specifications..
1-1
1.1
System Composition.
1-1
1.2
Technical Specifications......
1-1
2.
System Working Principle........
2-1
2.1
Brief Introduction of Working Principle..
2-1
2.2
Introduction of PCB......... ..
2-3
2.2.1
Control Panel.
2-3
2.2.2
Digital Processing Board.....
2-6
2.2.3
Order and Amplification Board...
2-13
2.2.4
Probe Interface Board..
2-19
Interconnection Signal List Between PCBs......
2-25
2.3
2.3.1
Probe Interface Board...
2-25
2.3.2
Order and Amplification Board....
2-27
2.3.3
Industrial Control Board.......
2-29
2.4
Connection Diagram Between PCBs.
2-30
2.5
Disassemble Instruction..
2-31
2.5.1
General
2-31
2.5.2
Disassemble Plastic Housing..
2-32
2.5.3
Disassemble Keyboard....
2-34
2.5.4
Disassemble Rear Panel.
2-35
2.5.5
Disassemble industrial control board.....
2-36
2.5.6
Disassemble PR board and RVA board.
2-37
2.5.7
Disassemble Power Supply and Hard Disk...
2-38
2.5.8
Disassemble MONIT Board.
2-39
2.5.9
Disassemble FEP Board..
2-42
2.5.10 Assemble Schematic of Main Unit..
2-42
2.6
Installation Instruction for Computer Main Board (Industrial Control Board)..
2-48
2.6.1
Appearance of Computer Main Board..
2-48
2.6.2
Interface Position Map....
2-48
2.6.3
Installation of System Memory..
2-49
2.6.4
USB Port
2-49
2.6.5
IDE Port....
2-50
2.6.6
Floppy Disk Port...
2-51
2.6.7
Display Port......
2-52
2.6.8
Network Port.
2-52
2.6.9
Keyboard and Mouse Port.....
2-53
2.6.10
Power Supply Port..
2-53
2.6.11
Fan Port....
2-55
2.6.12
Status Indication Port..
2-55
2.6.13
TV Output Port..
2-56
3.
Troubleshooting.........
3-1
3.1
PCB Function and Potential Failure...
3-1
3.1.1
Main Function and Potential Failure of Probe Interface Board...
3-1
3.1.2
Main Function and Potential Failure of Order and Amplification Board
3-2
3.1.3
Main Function and Potential Failure of Digital Processing Board..
3-4
3.1.4
Main Function and Potential Failure of Power Supply Module..
3-7
3.1.5
Main Function and Potential Failure of Control Panel
3-8
3.1.6
Main Function and Potential Failure of Computer Main Board...
3-11
Common Failure and Troubleshooting..
3-12
3.2
3.2.1
System Cannot Start Up...
3-12
3.2.2
Lowered Image Quality.
3-14
3.2.3
Abnormal Image.
3-14
3.2.4
Failure Analysis on Monitor..
3-16
3.2.5
Other Common Failures and Troubleshooting..
3-20
4.
Software Maintenance.......
4-1
4.1
System Update.....
4-1
II
4.1.1
Update System Online..
4-1
4.1.2
Update System from USB disk
4-3
4.1.3
Network Setup...
4-3
Software and System Recovery..
4-4
4.2
4.2.1
Software Recovery....
4-4
4.2.2
System Recovery and Backup....
4-5
4.3
Creation of USB Startup Disk and Batch File..
4-17
4.3.1
Creation of USB Startup Disk...
4-17
4.3.2
Create Batch File ( AUTOEXEC.BAT)
4-20
4.4
Troubleshooting....
4-21
4.5
Collect Information.......
4-26
III
System Composition & Technical Specifications
Chapter 1
System Composition & Technical Specifications
1.1 System Composition

The system as shown below consists of a main unit, an operation panel, probes and
peripheral devices. The main unit includes Probe Interface Board, Order and Amplification
Board, Digital Processing Board, Control Platform, Monitor and Power Supply.
Ultrasound
Monitor
Receive/Transmit
Probe 1
Order
Front-end
and
Probe
Interface
Probe 2
Main Unit
Board
Amplification
Digital
Image Data
Control
Platform
Processing
Board
Control
USB Port
Network Port
Board
Video
Output
Operation
Power
Panel
Fig. 1-1 Block Diagram of System Composition
1.2 Technical Specifications

For detailed system specifications, please refer to the system operation manual.
1-1
System Working Principle
Chapter 2
2.1 Brief Introduction of Working Principle

The fundamental working principle of the main unit is as follows:
The Probe Interface Board receives transmit excitation signals from the Digital Processing
Board and generates transmit high-voltage pulse through high-voltage drive circuit. The
high-voltage pulse then is sent to the working elements of the probe to generate
ultrasound through the Probe Interface Board. The echo from the ultrasound during
propagation in human body is received by the same group of working elements and
converted into feeble echo electric signals, which will be sent to the Order and
Amplification Board through pre-amplification. There are two probe connectors available
on the Probe Interface Board, to which two probes can be connected at the same time.
The T/R control FPGA on the Digital Processing Board yields transmit excitation signals of
the current transmission based on control signals. This group of signals is then sent to the
Probe Interface Board. The pre-amplified echo signals from the Probe Interface Board is
ordered, and sent to the Digital Processing Board after two-step TGC amplification.
The echo signals are converted into digital signals via ADC by the Digital Processing
Board, and further into digital image signals after a series of processing, including beam
focusing, aperture control, dynamic apodization and beam forming, dynamic filtering,
dynamic range conversion, demodulation, persistence processing and scan conversion
and sent to the Ultrasound Control Platform through the Digital Processing Board.
The Digital Processing Board on one hand transmits the digital image signals to the
Control Platform, on the other hand receives control information from the Control Platform
2-1
and generates corresponding control data to achieve control of the front end.
The Control Platform is the management center of the whole system control, which
receives operation commands from the control panel to manage the whole system control
in accordance with the current system state. The other functions the Control Platform
fulfills also include measurement and calculation, interface display and video processing,
management of patient data and images, control of storage, printing and communication.
The wiring diagram of the whole system is shown below:
24cm
Monito
r tube
23
22
CH5
CH4
Monito
12
CH8
r boar
d
CH6
20
14
XS1 Key
board
13
XS3
XS2
bo
XS4
bo
ar
d
XS18
pl
ify
digital
board
Am
XS
3
Hard di
Po
XS
3
er
m
XS8
In
co d u s
bo ntr tria
ar ol l
d
pr
ob
e
21
in
XS
4
XS
3
PR
A
XS
6
XS
bo
5
ar
d
10
e
od
ul
19
11
XS11
XS12
nel
sk
16
7
XS10
8
4P p o
wer
XS9
Rear pa
4
g plate
17
ar
d
XS2
XS1
15
XS8 Adjus
tin
ATX po
wer
20P p
ower
9
2
18
1 Internal AC Wire
7 PS/2 and Start-up Wire
13 +12V Fan Wire
19 5V, 12V, HVC Power Wire
2 Extended Network Card Wire
8 COM2 Wire
14 +5V, +12V Power Wire
20 Contrast & Brightness Adjust Control Wire
3 Extended USB Wire
9 Print Control Wire
15 60V Power Wire
21 Contrast & Brightness Adjust DIsplay Wire
4 Extended VGA Wire
10 Front-end Data Wire
16 Hard Disk Data Wire
22 Deflecting Coil Connecting Wire
5 Power Indicator Wire
11 Hard-disk Data Wire
17 Keyboard Data Wire
23 Monitor Tube High-voltage Wire
6 Video Print Wire
12 +15, +30V Power Wire
18 External AC Power Wire
Fig. 2-1 Wiring Diagram for Whole System
2-2
2.2 Introduction of PCB

2.2.1 Control Panel
2.2.1.1 Functional Description
The Control Panel as shown below in Fig. 2-2 consists of a keyboard (KB), a silicon-gel
membrane of the keyboard, a keyboard interface board (KBIF) and a trackball.
Trackball
Industrial
Control Board
ADC0809
8 Gain control
potentiometers
ADC0809
Control
logic
Encoder 1
Decoder 1
Encoder n
Decoder n
Key Array
Toggle Switch
Additional
logic
circuit
Single chip
MicroComputer
Serial
Interface
FEP Board
Scanning
Logic
FPGA
Operation Panel
Main Unit
Fig. 2-2 Diagram of Control Panel

The keyboard mainly includes a printed circuit board (PCB) key array. Two key contact
points that are directly formed by exposed copper with gold plating on the printed circuit,
and an LED on each key for backlight. The keyboard button silicon gel membrane covers
on the keyboard. When the key on the silicon gel membrane is pressed, the conductive
silicon under the keys will connect the two contact points on the PCB to complete the key
operation for other circuit inspection.
The Keyboard Interface Board is the primary connection of control knobs, TGC adjust
potentiometers, and the required control circuit for the control panel. The primary task of
the Keyboard Interface Board is to monitor all the actions on the receiving panel, converts
them into established protocols and sends them to the main unit. Meanwhile, it receives
various control signals from the main unit and controls the related circuits on the Keyboard
2-3
Interface Board.
The displacement signals directly outputted from the trackball are PS/2 protocol signals,
which will be combined with other signals to XS4 via XS8 plug on the Keyboard Interface
Board. XS4 plug is connected to the FEP board via a 34-core cable, and XS10 plug on the
FEP board is connected to the PS/2 port on the Industrial Control Board via another cable.
There are several control knobs and subsection gain controls on the keyboard. Configure
an FPGA (XCS10XL-TQ100) as a logic interface, a single chip microcomputer (also called
micro controller unit, MCU) AT89C51-24JI as the overall control and protocol conversion,
and RS-232 as the communication interface. Use an MAX232 as switchover between TTL
level and RS-232 level.
The MCU of the keyboard controls the FPGA to output line-scanning signals, reads array
signals from P1 on the MCU to obtain key information, converts it into established
protocols and sends it to the main unit. All the line and array signals on the Interface Board
are connected to the keyboard via XS1.
All the interfaces are connected to the FEP board through XS4 on the Interface Board,
and XS4 also provides the power supply for the keyboard board. The power input is +5V,
and the measuring point is +5V. All kinds of signals are connected to the corresponding
ports on computer main board via the FEP board.
Because the working voltage of FPGA is +3.3V, the voltage converting circuit is configured
to convert the voltage from +5V to +3.3V required by the FPGA. The converting
component adopted is MIC39100.
The control knobs are placed on the keyboard panel. Using encoder OAK-700, 5 pairs of
orthogonal signals outputted from 5 encoders are connected to the FPGA for decoding.
The encoder actions are converted into enumerated data by using the FPGA built-in
decoder as an interface. The enumerated results are read in by the MCU, converted into
established protocols and sent to the main unit via the serial interface.
The subsection gain controls use sliding potentiometers, which are installed on the
2-4
interface board directly. The sliding end voltages of the 8 potentiometers are connected to
ADC0809 and converted into digital signals. Then the signals are read in by the MCU and
converted into established protocols and sent to the main unit via the serial interface.
2.2.1.2 Introduction of ADC0809
ADC0809 is an 8-bit A/D converter with an 8-channel analog switch, which has a universal
microprocessor interface. The 8-channel analog switch selects any channel of input and
connects to the converter via a 3-bit address decoder. The time needed for each A/D
conversion is about 100us. FPGA generates control signals to control ADC0809 to convert
the voltage input of the 8-channel TGC alternatively and saves the decoded results in the
FPGA temporarily, which will be read in for comparison by the MCU if required.
On the other hand, various control orders are sent as per the established protocols to the
keyboard via the serial port, light control and button sound for example. The light control is
placed on the keyboard panel, with the control signals (high for off, low for on) from the
71st pin of the FPGA sent to the voltage regulation circuit to control the output voltage of
LM1084IS-ADJ, which will be transmitted to the LED on the keyboard panel via XS1 to
control on/off of the backlight; The buzzer is placed on the Keyboard Interface Board. The
level signal from the 9th pin of the FPGA after being driven by D11 (74F14) controls the
buzzer.
The pin encapsulation drawing of the major components is displayed below:
2-5
LM1084IS-ADJ
AT89C51
ADC0809CN
Fig. 2-3 Pin Encapsulation of major Components
2.2.2 Digital Processing Board

The primary functions of the Digital Processing Board (DPB) include transmitting and
receiving controls, A/D conversion, digital beam forming, dynamic filtering, tissue imaging
processing, digital scan conversion, system control, PCI bus interface and also circuit for
voltage transform. The DPB receives multi-channel analog ultrasound echo signals from
the front-end processing module, goes through A/D conversion, and forms a channel of
digital signals through digital beam-forming in combination with control signals from the
Control Interface Module. After signal processing such as dynamic filtering and tissue
imaging, these signals then will be sent to the DSC part and converted into corresponding
display frame shape. Finally, the image will be sent to the Control Interface Module frame
2-6
by frame. The Control Interface Module is a bridge between the Computer Module and the
Ultrasound Part. For the computer module at the upper level, it receives all kinds of data
from computer software via PCI bus, decomposes and distributes them to modules and
simultaneously yields control signals per requirements to control working of the whole
Ultrasound Part; for the Ultrasound Part at the lower level, it receives full frame image
signals from the DSC module and sends the image signals to the Computer Module via
PCI bus.
Based on Y_SYNC signals from the system control module and a series of parameters,
the T/R Control Module will configure the states of high voltage switch and folding matrix
switch at the front end according to related parameters when Y_SYNC is at low level.
When Y_SYNC signals turn high from low level, multi-channel transmit pulses are
outputted from FPGA and converted into high-voltage pulse excitation probe via the
high-voltage exciting circuit on the Probe Interface Board, thus to achieve an ultrasound
transmission. The ultrasonic signals reflected from tissues are amplified through the
pre-amplifier on the Probe Interface Board, and transmitted through two-level time gain
compensation amplification circuit on the Amplification Board, and the output echo signals
after symmetric folding are sent to the Digital Processing Board.
Having been sent to the Digital Processing Board, the multi-channel analog echo signals
are converted into multi-channel digital signals via A/D conversion, and sent to the
Beam-forming Module. As per relevant control parameters, the multi-channel digital
signals are delayed and added by the Beam-forming Module to achieve focusing function
of ultrasound receiving.
One essential problem of ultrasound diagnosis is that the relationship between
parenchyma (soft tissue) ultrasound attenuation and frequency is approximately in
linearity. Because the probes used for the system are broad-brand, center frequency of
transmit excitation signals will shift down as ultrasonic pulse transmits deeper. In order to
improve image quality, the near field receives high-frequency echoes only to improve
resolution, while the far field only receives low-frequency echoes to improve S/N ratio. A
time-variable band-pass filter is required, thus a Dynamic Filter Module is configured to
2-7
achieve this function.

The data going through dynamic filtering are sent to the Tissue Imaging Processing
Module, the functions of which are to optimize ultrasound images. The functions, including
dynamic range conversion, logarithm compression, gray scale mapping, smoothness
enhancement and lateral filtering, significantly improve ultrasound image display quality,
which are conducive to better clinical diagnosis. There is an additional transmit voltage
control signal D/A output on the Dynamic Filter Module. The Dynamic Filter receives 8-bit
control information from the system Control Module and outputs it to the D/A part, sends to
the Power Module to control the transmit voltage outputted from the Power Module.
Meanwhile, Time Gain Compensation curve is sent out from the same module. After D/A
conversion and buffering, it is sent to the Amplification Board to control the corresponding
time gain compensation circuit.
Having been processed by the Tissue Imaging Processing Module, the ultrasonic signals
are sent to the Digital Scan Conversion Module in the form of scanning lines. The Digital
Scan Conversion Module coverts the image signals in line form to images in the same
geometric shape of the actual ultrasound scanning range (e.g. sector image of the convex
probe, rectangular image of the linear probe), as per the current probe and other control
parameters. At the same time, the image will be processed with interpolation when
required. Finally, an image is acquired for display.
The system Control Module receives image signals from the Digital Scan Conversion
Module and buffers them before sending them to the PCI Interface Module frame by frame
at an appropriate time. Meanwhile, the system Control Module receives and processes
the control parameters from the PCI Interface Module and yields the overall control
signals for ultrasound scanning and distributes some of the parameters to the modules
that need these parameters.
The PCI Interface Module is an important bridge in the whole ultrasound system. It via the
communicates with the computer via the PCI bus and acquires all kinds of settings and
control commands from the computer system; at the same time it reads in various state
2-8
information from the Digital Processing Board and sends them to the computer via the PCI
bus. The most important task of it is to receive image signals from the system Control
Module and send them to the computer via the PCI cable, and to obtain a real-time
ultrasound image in the computer. The ultrasound image will be displayed on the screen
after being processed in the computer application.
The power supply changeover circuit transforms the inputted +5V voltage on the Power
Module into +3.3V and +2.5V for low-voltage parts like FPGA or SRAM on circuit boards.
The power changeover adopted is TPS76833QPWP and TPS76825QPWP manufactured
by TI. The schematic is shown below.
Fig. 2-4 Schematic of Power Supply Changeover Circuit
Indicators for the major power supplies on the circuit boards are for indicating whether the
voltages are proper or not. If any of the indicators is off, please use a multimeter to
measure the corresponding measured points to verify if the voltage meets the rated
values.
2-9
C144
104
104
C55
2-10
Fig. 2-5 FEP Welding Surface

156/25V
C81
156/25V
R87
R88
C90
104
C42
C91
104
C163
R211
R212
R213
156/25V
104
C41
C40
104
681
681
681
C50
C117 104
104
C148
C135
C133
104
104
C130
000
R80
201
331
104
C111
104
104
C30
C153
104
C4
C110
104
104
C65
104
C118
104
C38
R50
R54
R55
R56
R57
R58
R59
156/25V
000
000
000
000
000
473/500V X 3
C8
104
C155
156/25V
156/25V
C5
156/25V
104
331
201
C113
R112
R111
104
331
201
C123
R122
R121
104
C112
C9
C6
104
R64
R63
R62
R61
R60
R84 000
R16 472
R15 472
R42 472
104
C72
C71 104
R81 201
R82 201
C83 104
C114
104
104
C17
C119
104
C120
R1 470
C43
R2 470
104
C154
104
R4 470
R3 470
C73
104
C59
R89
104
104
220
104
104
C82
R91
R92
C93
C37
104
R18 472
R17 472
R43 472
C14 104
104
C115
104
C21
156/25V
R49
000
000
000
000
000
000
000
000
C25
104
R431
R432
104
C18
R421
R422
104
C164
R36
000
R37
000 R38
000
000
R39
681
R433
681
681
C70
104
681
R423
681
681
C66
104
C16 104
104
201
201
104
104
C139
C89
104
R65 470
R66 470
104
C68
104
104
681
R413
C13 104
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
104
104
104
104
104
104
104
104
104
104
104
104
104
C471
104
C493
C603
156/25V
C593
156/25V
C583
156/25V
C573
156/25V
C563
156/25V
C553
156/25V
C543
156/25V
C533
156/25V
C523
156/25V
C513
156/25V
C503
156/25V
C491
102
R485
156/25V
156/25V
156/25V
C27
C591
R26 472
R24 472
R45 472
C122
C67
C581
104
R7 103
C61 104
L7 C99
R79
512
512
R85
C63
R44 472
R19 472
R20 472
104
104
C150 C152
L6 C98
C571
C39
104
C121
C69
C15 104
L5 C97
C561
R101
R102
C103
C125
104
C10
C551
C116
104
C44
104
C541
104
C85
R223
R222
R221
472
R83
C531
681
681
681
104
R163
104
C11
104
681
C60
L4 C96
104
C233
L3 C95
C45
C64
R411 681
R412 681
104
R161
R162
104
104
L2 C94
R12
R11
R40
C58
R6
472
472
472
104
C62
C12
103
C521
681
681
C88
104
104
472 R10
472 R9
472
R25
L1 C92
C511
C124
C46
152 104
R74 C231
C244
104
C146
C47
R70
C381
R72
R76
R71
152
152
101
152
470
104
152 R73
104
101 R75 C242
104
C134
104
C147
104
R78
R77
C35
C34
202
104
104
C245
C382
C472
R475 C481
R477 R487
C501
R29
472
R28 472
R46 472
104
104
104
C86
C232
C380
156/25V
156/25V
156/25V
R242
104
C383
104
C143
C141 104
C151
104
C243
R241
104
202
202
152
222
681
222
152
152 152 R483
101
101 104 C482
102 104 102 R484
681 104
470 470
201
201
104
C142
104
104
104
R47 472
472 472
R33 R30
C149
C241
681
681
R465
C473
R463
R464
C483
R473
R471
R472
C140
104
C53
R131 156/25V
R132
R133 156/25V
156/25V
104
C54
R22
104
C137
C145
104
104
104
103
C79
C33 C49
C36
104
104
202
104
C126
681
681
681
C80
104
681
R53
C52
104
C127
104
104
C157
C138
C56
104
C48
104
C379
104
C131
R21 511
C28
104
C84
104
104
C235
R5 103
C236
C29
C78
104
104
R51 681
R52 681
C128
104
R451
472
C158
202
C234 R231
104 202
104
R232
C159
104
C129
R34 472
R48 472
C51
104
R8
R474
104
104
C162
C26
104
R35 472
C87
104
104
C161
104
103
104
C160
C136
104
C132
R31
681
R32
681
R67
331
R27
101
R68
202
R69
202
Component composition:
The components on the Digital Processing Board mainly include power supply
changeover, A/D converter part, FPGA part and its configured FLASH ROM, signal drive
parts, SRAM part, resistors and capacitors.
The layout of major components:
R481
R482
C601
L8 C100 L9 C101 L10 C102 L11 C104 L12 C105
C2
C3
C1
156/25V
C7
C57
V12
V7
V11
V10
10
1A
25A
15
20
D25
20
15
10
1A
10
D1
D25
20
15
10
D1
XS5
D25
D1
20
15
20
15
10
25A
1A
20
15
10
U71
74LVC245A
D1
U70
U69
74LVC245A
74LVC245A
DHB-RB100-S13NN
DHB-RB100-S13NN
25A
10
74LVC245A
1A
U46
GND
101 R551
104 C554
104 C552
101 R541
104 C544
104 C542
101 R531
104 C534
104 C532
101 R521
104 C524
104 C522
101 R511
104 C514
104 C512
101 R501
104 C504
104 C502
101 R491
104 C494
104 C492
AD9057
U55
AD9057
U54
AD9057
U53
AD9057
U52
AD9057
U51
AD9057
U50
AD9057
U49
U41
74LVC245A
101 R561
104 C564
104 C562
AD9057
U56
U42
XS13
NS-1*2
U43
XC2S200-5PQ208
XS6
NS-1*2
101 R571
104 C574
104 C572
AD9057
U57
U47
101 R581
104 C584
104 C582
AD9057
U58
U48
101 R591
104 C594
104 C592
AD9057
U59
AD712JR
GND
XS8
U68
NF3 473
XC2S200-5PQ208
XC2S200-5PQ208
AT27C1024-70JI
AT27C020-70JI
NF4
473
D40
U34
XCF02S
473
473
14
C31 104
U36
XCF02S
U81
IDT74FCT3807
U35
XCF02S
U33
XCF02S
U73
74LVC245A
U31
XCF02S
V13
HZ5C1
LH-34R
XC2S200-5PQ208
104
C23
473
XCF02S
JS-1001-14
104
NF5 NF1 NF2
C22
104
11
AD9057
U60
XS11
1
C32
JS-1001-11
XS12
1
101 R601
104 C604
104 C602
AD712JR
U67
74LVC245A
10
15
20
74LVC245A
U65
U66
U72
XS2
D25
34
XS3
33
XS4
V8
15
20
DHB-RB100-S13NN
V9
WW17-215 X 6
25A
DHB-RB100-S13NN
D45
1
GND
WW17-215 X 6
U18
74LVC245A
U20
74LVC245A
U25
50.0000MHz
U19
U75
74LVC245A
LIGHT1
LIGHT2
IS63LV1024L-12H
U27
IS63LV1024L-12H
U26
DAC0800LCM
U24
DAC0800LCM
U23
V4
74LVC245A
V3
V2
74LVC245A
U13
XS15
NS-1*2
JS-1001-10
V1
GND
U16
6
U76
74LVC245A
A1
A49
U32
XCF02S
U6
XCF02S
XC2S200-5PQ208
A61
RJB60DCHN-S578
U4
U8
U9
U10
LM1084
LM1084
LM1084
LM1084
B2
B48
B62
XS1
74LVC245A
U74
74LVC245A
U7
XS7
Fig. 2-6 FEP Component Surface
2-11
JS-1001-6
U1
IS63LV1024L-12H
U5
JS-1001-6
XS18
XCF02S
U30
GND
U22
U29
IS61LV12816L
LM1084
DAC0800LCM
U3
XC2S200-5PQ208
IS63LV1024L-12H
XC2S200-5PQ208
GND
LM1084
XC2S200-5PQ208
XS16
NS-1*2
NS-1*2
XC2S200-5PQ208
U11
U12
AD712JR
U2
XS14
U28
IS61LV12816L
U21
10
XS10
U15
XS9
IS63LV1024L-12H
U14
BH-10S
U17
Fig. 2-7 Silk-Screen Diagram of FEP (1174E) Board
Sockets and Connection:

The Digital Processing Board (DPB) also works as the connection bridge for the whole
system. The Probe Interface Board is connected to the DPB via sockets XS4 and XS5;
The Order and Amplification Board is connected to the DPB via sockets XS2 and XS3; the
Industrial Control Board of the Computer Module is connected to PCI socket on the DPB
via PCI socket XS1; The Keyboard Board is connected to the DPB via a 34-core socket
XS8; the power from the system Power Module is inputted to the DPB via sockets XS11
and XS12 before it is distributed to other ultrasonic circuits. Some of the signals from the
keyboard send keyboard information to the Industrial Control Board via sockets XS9 and
XS10 on the DPB as well at the same time.
2-12
For the specific sockets, other circuit boards or modules, please refer to Fig. 2-1.
2.2.3 Order and Amplification Board
2.2.3.1 General
The Order and Amplification Board consists of the impedance transform circuit 3904, the
order folding matrix switch circuit MT8816 or CD22M3494, the two-step TGC amplification
circuit AD602, the drive and amplitude control circuit AD817 and the control signal
interface circuit SN74LVC245. The diagram for the Order and Amplification Board is
shown below in Fig. 2-8. After the echo signals are sent from the Pre-amplification Circuit
on the Probe Interface Board and before the signals enter the Folding Circuit, the emitter
made up of primary 3904 audion follows the circuit, in order to enhance loading capacity
of the Pre-amplification Circuit output, which also serves for impedance transform.
Preamp
Output
Impedance
Transform
Echos
3904
Audion
Array
Resettle
-ment
and
Folded
Circuit
Echos
AD602
Array
TGC
Amplifier
MT8816
Array
Echos
ADC
Driver
AD817
Array
RF Echos
Output
Control signals
Fig. 2-8 Circuit Diagram of Order and Amplification Board
The power voltages on the Order and Amplification Board are 5 and 12V. The
voltages of MT8816 or CD22M3494 and AD602 are 5V. The voltages of 3904 and
AD817 are 12V. The voltage of the Bus Interface Circuit SN74LC245 is +5V.
The channel parallel echo signals on the Probe Interface Board, after being pre-amplified
are ordered, with channel symmetry superposed and amplified, are finally sent to the
Digital Processing Board for A/D and following processing.
2.2.3.2 Order and Folding Circuit
The circuit adopted by the Order and Folding Circuit is CD22M3494E-MQ or MT8816
manufactured by INTERSIL, the chip of which has 168128 analog switches. Its
2-13
appearance is shown below in Fig. 2-9. The chip has 44 pins, which is very convenient for
connection. It can be connected with 16 inputs and 8 outputs, or 8 inputs and 16 inputs.
The input and output pins are controlled separately. AX0~3 control pins X0~15, and
AY0~2 control pins Y0~Y7. The DATA pin can be disconnected against access. When
DATA is 0, the addressed switch is disconnected. When DATA is 1, the addressed
switch is connected. The RESET signal can reset all the switches. When RESET is high,
all the switches are disconnected.
Fig. 2-9 Outside Drawing of CD22M3494E-MQ
2-14
Fig.2-10 Sequence Chart of CD22M3494E-MQ

The configured sequence chart of CD22M3494E-MQ or MT8816 chip is shown above in
Fig. 2-10.
And the truth tables are showed below in Table 2-1.
2-15
Table 2-1 Truth Table of CD22M3494E-MQ or MT8816
As the central element for each transmission varies with the difference in each line, the
task of order and folding is to link echoes of the Amplification Circuit corresponding to the
current transmitted central elements to the channel center, to link the echoes of the
Amplification Circuit corresponding to echoes of the current transmitted edge elements to
the edge channel, and the rest may be deduced by analogy. The channels not to be
compounded are linked to pin XX12, which is linked to 0.1uF capacitance to ground.
Finally, the output signals from CD22M3494E-MQ or MT8816 chip are the channel echo
signals going through channel symmetric superposition and ordering.
2.2.3.3 Two-step TGC Amplification Circuit
The output signals of the echo signals from the folding circuit are pre-amplified by the
two-step TGC Amplification Circuit composed of AD602 part array.
The internal block diagram of one channel of AD602 is shown below in Fig. 2-11.
2-16
Fig. 2-11 Internal Block Diagram of AD602
Table2-2 Pin Definition of AD602
2-17
The pin definition of AD602 is shown above in Table 2-2.

a) Main features of AD602:
z Each AD602 has two independent channels, namely two amplifiers;
z The gain dB value of each channel is in direct proportion to the control voltage;
z Low input noise 1.4nV/ Hz ;
z High bandwidth, with -3dB bandwidth at DC~35MHz;
z Each channel consists of a precise passive input attenuator and a fixed gain
amplifier (31dB);
z The input attenuator is controlled by control voltage (CHI-CLO), the control
sensitivity is: 31.25mV/dB;
z Power consumption of each channel is 125mW;
z Gain control range of each channel is: -10dB~+30dB.
b) Calculation equation ofAD602 gain control:
Gain (dB)=32Vg+10
Vg (V)=CHI-CLO
Range of Vg:
-625mv ~ +625mv
If: CHI1=0V~1.35V
CHI2= 0.312V~1.35V
When CLO is about 0.625V, the gain that first-step AD602 acquires is about
10dB~+31.07dB, and the gain that the second-step AD602 acquires is about
0~+31.07dB. The second control voltage works only if the gain in the first stage runs out.
Including pre-amplification, in theory the maximum gain of the entire channel can reach
82.14dB, and the gain variable range is -10dB~62.14dB. Due to the resistance between
steps, the gain may decrease several dB.
2-18
After processed by the folding circuit and the two-step TGC, the RF echoes are driven by
high speed operational amplifier comprised by AD817, the output echo range is limited
below 1.2 V p p to meet requirements of the latter analog parts.
2.2.3.4 Input Power Supply
a) +5VA:
+5V analog power supply for AD602, interface circuit and CD22M3494E-MQ or MT8816
b) 5VA:
5VA analog power supply for AD602 and CD22M3494E-MQ or MT8816
c) 12V: For AD817 chip circuit.
2.2.4 Probe Interface Board
2.2.4.1 Introduction of the Probe Interface Board (PIB)
The Probe Interface Board provides connectors between the transducers and the main
unit. Two probe connectors are available on the PIB of CTS-7700. Each connector has a
corresponding high-voltage switch, which is HV232 or like products from Hitachi. Each
PIB has a SIUI912x2 pre-amplification and high-voltage pulse drive thick- film circuit.
There are several power voltages on the PIB:+5, 12V, high-voltage switch power over
60V and +HV. +5V voltage is used for logical configuration of high voltage switch,
12V for SIUI912x2 T/R circuit, +HV for transmit high voltage, the value of which is variable
between 0V~60V and above. The main unit provide excitation high-voltage pulse to
piezoelectric crystal array of the probe via the high-voltage switch array on the PIB,
pre-amplifies the ultrasound from the probe, and sends it to the Order and Amplification
Board. Another function of the high-voltage switch is selection of the current working
probe.
The top-level connection block diagram of the PIB is follows:
2-19
156Pin
Connector
Probe A
Drive and
Echo A
High Voltage
Array A
HV232
DIND0-3
SN74LVC245
DIN0-3
PROBE1
156Pin
Connector
Probe B
Drive and
Echo B
High Voltage
Array B
HV232
HV Drive and Echo
Preamp and
HV generator
SIUI912X2
Array
ECHO
HV Drive
PROBE2
PROBE1-2
PIDSEL1-2
SN74LVC245
PRS1-2
Two
100
Pin
Sockets
PIDS1-2
PID0-7
SN74LVC245
PIDSEL2
DC Power
Output
PIDSEL1
SN74LVC245
DC Power
Filter
DC Power
Input
Fig.2-12 Schematic of Probe Interface Board
2.2.4.2 High-Voltage Switch Circuit

The high-voltage switch adopted for CTS-7700 is HV232 manufactured by Supertex or the
same chip type with the same encapsulation manufactured by Hitachi. Each probe
connector is linked to a high-voltage switch and independent to its corresponding
high-voltage switch array.
Each high-voltage switch has 8 channels, which are connected to 8 elements, with the
8-channel outputs merged in parallel into 2-channel outputs
The configured sequence diagram of HV232 high-voltage switch is shown below:
2-20
Fig. 2-13 Configured Sequence Diagram of HV232 High-voltage Switch
Each high-voltage switch has 48 pins. Definitions for the pins are as follows:
a) Ultrasonic Signal Pin:
Pins 1, 3, 5, 8, 10, 12,14, 16, 18, 20, 22, 39, 41, 43, 45, 47 are signal pins
connected to element SWx.
b) Parameter Setup Pin:
Pin 33 is parameter input pin Din.
Pin 37 is parameter output pin Dout.
c) Power Connection Pin:
Pin 24 is connected to over +60V.
Pin 25 is connected to over -60V.
Pin 29 is connected to +5V.
Pins 27 and 28 are grounded.
2-21
d) Control Signal Pin:

Pin 36 is connected to chip selection signal CLR. When connecting this pin to 0 is
selected, Pin36 of the high-voltage switches corresponding to each probe are
connected together as a select signal for the working probe.
Pin 35 is a logical input enabled port/LE. When 1 is connected, parameter setup
this chip for is allowed.
Pin 34 is a logical input clock. The control data series shifts 1 bit whenever a clock
comes.
e) Void Pin:
Pins 2, 4, 6, 7, 9, 11, 13, 15, 17, 19, 21, 23, 26, 30, 31, 32, 38, 40, 42, 44, 46, 48
are void, which are suspended.
The internal logical circuit of HV232 is shown below in Fig. 2-14:
Fig. 2-14 Internal Logic Circuit of HV232
2-22
The working process of high-voltage switches:

The parameter setup pins of each group of high-voltage switches are in serial connection.
DOUT of the first high-voltage switch is linked to DIN of the second high-voltage switch.
The working state of the high-voltage switches should be preset for the preset period of
each line transmission. When the corresponding data of this channel is 1, the input of
this channel is connected to output. When the corresponding data of this channel is 0,
this channel is disconnected with output.
The maximum clock setup of high-voltage switch is 5MHz, namely 200ns. The
high-voltage switch control data is 4 bits, namely D0~D3. DIN of the first high-voltage
switch in each group is linked to one of these bits. For example: D0 is linked to DIN of the
first high-voltage switch in the first group, D1 to DIN of the first high-voltage switch in the
second group, D2 to DIN of the first high-voltage switch in the third group, and D3 to DIN
of the first high-voltage switch in the fourth group. The parameters are outputted from the
DIN of Pin 16 of the first high-voltage switch in each group, and DOUT of Pin 20 serial
shifted to DIN of the next switch. The rest may be deduced by analogy. All the current
work state setups are completed via 32 shift clocks.
What shall be closed are closed,
and what shall be ducted are ducted.

The truth table of HV232 is shown below in Table 2-3.
Table 2-3 Truth Table of HV232
2-23
2.2.4.3 Transmit Drive and Echo Pre-amplification

In the CTS-7700, the yield of transmit drive high-voltage pulse and the echo
pre-amplification are processed in the SIUI912x2 array. A piece of MOS field-effect tube in
each transmit circuit serves as a switch, with one end connected to transmit high voltage
and the drive pulse of which is 0~12V. This tube is ducted as drive pulse comes, and
forms high-voltage pulse, which will connect to probe elements via high-voltage switch.
The ultrasound received is also from the same path. The echo will have about 20dB
amplification in the pre-amplification Circuit SIUI912x2. Then the echo signals are sent to
the subsequent TGC Amplification Circuit for amplification.
2.2.4.4 Interface Circuit of the Probe Interface Board (PIB)
The Interface Circuit on the PIB consists of two pieces of SN74LVC245. U18 is for driving
probe select signals PRS1~2 and probe code select signals PIDS1~2. The driven
PROBE1~2 are linked respectively to Pin 36 of two groups of high-voltage switches as
selection signals of the working probe, and the driven PIDSEL1~2 is linked respectively to
Pin19 of U19 and U20 as the probe code gating circuit for the two probes. When any of
the signals of PIDSEL1~2 is at low level, the probe code of SN74LVC245 is sent to the
bus, otherwise the output of it is at high resistance. U17 is for driving high-voltage switch
data DIND0~DIND3, clock STROBEP and enabling signal LED.
Description of input and output signals on the PIB: There are two 100-pin sockets on the
PIB linking to 2 corresponding sockets on the Digital Board.
Description of input power
a) VCC:
+5V analog power to Pin29 on high-voltage switch;
b) 12V:
To Pin7 and Pin8 on SIUI912x2 respectively;
c) Above 60V:
2-24
To Pin24 and P25 on high-voltage switch respectively;

d) +HV:
Variable input high voltage, varying from above 0V~60V, linked to Pin2 of SIUI912X2 for
generating transmit high-voltage pulse.
2.3 Interconnection Signal List Between PCBs

2.3.1 Probe Interface Board
Table 2-4 Interconnection Signal List for Probe Interface Board XS4
Probe Interface Board XS4 (XS4)
Pin
Signal
Pin
Signal
Pin
Signal
Pin
Signal
A25
GND
B25
GND
C25
GND
D25
GND
A24
GND
B24
GND
C24
GND
D24
GND
A23
+5VA
B23
+5VA
C23
+5VA
D23
+5VA
A22
+5VA
B22
+5VA
C22
+5VA
D22
+5VA
A21
GND
B21
GND
C21
GND
D21
GND
A20
GND
B20
GND
C20
GND
D20
GND
A19
-12V
B19
-12V
C19
-12V
D19
-12V
A18
-12V
B18
-12V
C18
-12V
D18
-12V
A17
GND
B17
GND
C17
GND
D17
GND
A16
GND
B16
GND
C16
GND
D16
GND
A15
+12V
B15
+12V
C15
+12V
D15
+12V
A14
+12V
B14
+12V
C14
+12V
D14
+12V
A13
GND
B13
GND
C13
GND
D13
GND
A12
-NV
B12
-NV
C12
-NV
D12
-NV
A11
-60V
B11
-60V
C11
-60V
D11
-60V
A10
-NV
B10
-NV
C10
-NV
D10
-NV
A9
GND
B9
GND
C9
GND
D9
GND
A8
+PV
B8
+PV
C8
+PV
D8
+PV
A7
+60V
B7
+60V
C7
+60V
D7
+60V
A6
+PV
B6
+PV
C6
+PV
D6
+PV
A5
GND
B5
GND
C5
GND
D5
GND
A4
GND
B4
GND
C4
GND
D4
GND
A3
+PV
B3
+PV
C3
+PV
D3
+PV
A2
+HV
B2
+HV
C2
+HV
D2
+HV
A1
+HV
B1
+HV
C1
+HV
D1
+HV
2-25
Table 2-5 Interconnection Signal List for Probe Interface Board XS5
Probe Interface Board XS5 (XS5)
Pin
Signal
Pin
Signal
Pin
Signal
Pin
Signal
A25
GND
B25
PID0
C25
GND
D25
PID1
A24
GND
B24
PID2
C24
GND
D24
PID3
A23
GND
B23
PID4
C23
GND
D23
PID5
A22
GND
B22
PID6
C22
GND
D22
PID7
A21
GND
B21
STROBEP
C21
GND
D21
LE
A20
GND
B20
PRS1
C20
PRS3
D20
DIN0
A19
GND
B19
PRS2
C19
PIDS3
D19
DIN1
A18
GND
B18
PIDS1
C18
GND
D18
DIN2
A17
GND
B17
PIDS2
C17
GND
D17
DIN3
A16
GND
B16
DH2
C16
GND
D16
DH1
A15
GND
B15
DH4
C15
GND
D15
DH3
A14
GND
B14
DH6
C14
GND
D14
DH5
A13
GND
B13
DH8
C13
GND
D13
DH7
A12
GND
B12
DH10
C12
GND
D12
DH9
A11
GND
B11
DH12
C11
GND
D11
DH11
A10
GND
B10
DH14
C10
GND
D10
DH13
A9
GND
B9
DH16
C9
GND
D9
DH15
A8
GND
B8
DH18
C8
GND
D8
DH17
A7
GND
B7
DH20
C7
GND
D7
DH19
A6
GND
B6
DH22
C6
GND
D6
DH21
A5
GND
B5
DH24
C5
GND
D5
DH23
A4
GND
B4
DH26
C4
GND
D4
DH25
A3
GND
B3
DH28
C3
GND
D3
DH27
A2
GND
B2
DH30
C2
GND
D2
DH29
A1
GND
B1
DH32
C1
GND
D1
DH31
2-26
2.3.2 Order and Amplification Board

Table 2-6 Interconnection Signal List for Order and Amplification Board XS2
Order and Amplification Board XS2 (XS2)
Pin
Signal
Pin
Signal
Pin
Signal
Pin
Signal
A25
GND
B25
GND
C25
GND
D25
NC
A24
GND
B24
RF8
C24
GND
D24
NC
A23
GND
B23
RF8
C23
GND
D23
NC
A22
GND
B22
GND
C22
GND
D22
NC
A21
GND
B21
RF7
C21
GND
D21
NC
A20
GND
B20
RF7
C20
GND
D20
GND
A19
NC
B19
-5V
C19
NC
D19
-5V
A18
GND
B18
RF6
C18
NC
D18
-5V
A17
GND
B17
RF6
C17
GND
D17
GND
A16
NC
B16
+5VA
C16
NC
D16
+5VA
A15
GND
B15
RF5
C15
NC
D15
+5VA
A14
GND
B14
RF5
C14
GND
D14
GND
A13
GND
B13
GND
C13
GND
D13
GND
A12
GND
B12
RF4
C12
GND
D12
GND
A11
GND
B11
RF4
C11
GND
D11
GND
A10
-12V
B10
-12V
C10
-12V
D10
-12V
A9
GND
B9
RF3
C9
-12V
D9
-12V
A8
GND
B8
RF3
C8
GND
D8
GND
A7
GND
B7
GND
C7
GND
D7
GND
A6
GND
B6
RF2
C6
GND
D6
GND
A5
GND
B5
RF2
C5
GND
D5
GND
A4
+12V
B4
GND
C4
+12V
D4
+12V
A3
GND
B3
RF1
C3
+12V
D3
+12V
A2
GND
B2
RF1
C2
GND
D2
GND
A1
TGC1
B1
GND
C1
GND
D1
TGC2
2-27
Table 2-7 Interconnection Signal List for Order and Amplification Board XS3
Order and Amplification Board XS3 (XS3)
Pin
Signal
Pin
Signal
Pin
Signal
Pin
25A
GND
B25
RF10
C25
GND
D25
DCS4
24A
GND
B24
RF16
C24
GND
D24
DCS3
23A
GND
B23
RF16
C23
GND
D23
DCS3
22A
GND
B22
RF10
C22
GND
D22
DCS2
21A
GND
B21
RF15
C21
GND
D21
DCS2
20A
GND
B20
RF15
C20
GND
D20
DCS1
19A
GND
B19
RF10
C19
GND
D19
DCS1
18A
GND
B18
RF14
C18
GND
D18
DAX3
17A
GND
B17
RF14
C17
GND
D17
DAX3
16A
GND
B16
RF10
C16
GND
D16
DAX2
15A
GND
B15
RF13
C15
GND
D15
DAX2
14A
GND
B14
RF13
C14
GND
D14
DAX1
13A
GND
B13
RF10
C13
GND
D13
DAX1
12A
GND
B12
RF12
C12
GND
D12
DAX0
11A
GND
B11
RF12
C11
GND
D11
DAX0
10A
GND
B10
RF10
C10
GND
D10
DAY2
9A
GND
B9
RF11
C9
GND
D9
DAY2
8A
GND
B8
RF11
C8
GND
D8
DAY1
7A
GND
B7
RF10
C7
GND
D7
DAY1
6A
GND
B6
RF10
C6
GND
D6
DAY0
5A
GND
B5
RF10
C5
GND
D5
!TGATE
4A
GND
B4
GND
C4
GND
D4
RESSET
3A
GND
B3
RF9
C3
GND
D3
DDATA
2A
GND
B2
RF9
C2
GND
D2
STROBE
1A
GND
B1
GND
C1
GND
D1
STROBE
2-28
Signal
2.3.3 Industrial Control Board

Table 2-8 Interconnection Signal List for Industrial Control Board
Industrial Control Board (XS1)
Pin
Signal
Pin
Signal
A1
+5VP
1B
NC
A2
NC
2B
GND
A3
+5VP
3B
GND
A4
+5VP
4B
NC
A5
+5VP
5B
+5VP
A6
INTA
6B
NC
A7
NC
7B
NC
A8
NC
8B
NC
A9
NC
9B
NC
A10
NC
10B
REQ
A11
NC
11B
NC
A12
GND
12B
GND
A13
GND
13B
GND
A14
GNT
14B
NC
A15
RST
15B
GND
A16
NC
16B
CLK
A17
NC
17B
GND
A18
GND
18B
NC
A19
NC
19B
NC
A20
AD30
20B
AD31
A21
NC
21B
AD29
A22
AD28
22B
GND
A23
AD26
23B
AD27
A24
GND
24B
AD25
A25
AD24
25B
NC
A26
NC
26B
C_BE3
A27
NC
27B
AD23
A28
AD22
28B
GND
A29
AD20
29B
AD21
A30
GND
30B
AD19
A31
AD18
31B
NC
A32
AD16
32B
AD17
A33
NC
33B
C_BE2
A34
FRAME
34B
GND
A35
GND
35B
IRDY
A36
TRDY
36B
NC
A37
GND
37B
DEVSEL
2-29
Industrial Control Board (XS1)

Pin
Signal
Pin
Signal
A38
STOP
38B
GND
A39
NC
39B
NC
A40
NC
40B
PERR
A41
NC
41B
NC
A42
GND
42B
SERR
A43
PAR
43B
NC
A44
AD15
44B
C_BE1
A45
NC
45B
AD14
A46
AD13
46B
GND
A47
AD11
47B
AD12
A48
GND
48B
AD10
A49
AD9
49B
GND
A50
NC
50B
NC
A51
NC
51B
NC
A52
C_BE0
52B
AD8
A53
NC
53B
AD7
A54
AD6
54B
NC
A55
AD4
55B
AD5
A56
GND
56B
AD3
A57
AD2
57B
GND
A58
AD0
58B
AD1
A59
NC
59B
NC
A60
NC
60B
NC
A61
NC
61B
NC
A62
NC
62B
NC
2.4 Connection Diagram Between PCBs

For the connection diagram between PCBs, please refer to Fig. 2-1. The Industrial Control
Board diagram is shown below in Fig. 2-15:
2-30

From main board
VGA wire
To print control plug

XS3 of the rear panel
CH8
XS10
To monitor CH8
From rear panel
Color
patch
wire
3 S-start-up wire
8
To main board
VGA1
Color patch wire
KM1
LAN1
USB2
COM2
1
FP1
80-cores hard disk wire
Color patch wire
IDE1
To hard disk
11
4P-ATX
ATXPWR
J2
XS7
To video plug XS7
of the rear panel
Wire from ATX power
Network card wire
PS/2 and start-up wire
USB wire
COM2 wire
VGA wire
11
Hard disk data wire
Video print wire
Fig. 2-15 Connection Diagram for Industrial Control Board
2.5 Disassemble Instruction

2.5.1 General
2.5.1.1 This instruction covers disassembly of the system only. On how to assemble the
system, please follow the reverse procedures of disassembly.
2.5.1.2 The expression and meaning of all the screws involved in this instruction are
shown in the following examples:
Example 1: countersunk head screws, spec M3, metric length 6 mm, expressed as:
countersunk head screws M3X6.
2-31
Example 2: screws assemblies, spec M4, expressed as: screws assemblies M4.
2.5.1.3 All the screws for disassembling are Phillips screws, so the operator of the
disassembly shall use corresponding Philips screwdrivers. Due to the heads of Phillips
screws have two types: shallow and deep, to avoid any damage to the screws and
consequent failure of screw disassembling, please select appropriate screwdrivers for the
screws when disassembling the screws. A small slotted screwdriver may be required
when disassembling some special parts.
Note: Generally, the screws we use are M3 or under M3 pan screws, as well as
under M3 (excluding M3) cheese head screws, whose Philips head are
shallow, while the others are deep.
2.5.1.4 Before disassembly, make sure that the power cable is unplugged, and all the
probes are disconnected and laid aside properly.
2.5.1.5 When unplugging the cables from the system, please mark the corresponding
plugs and sockets to facilitate plugging the plugs into the right sockets during reassembly.
2.5.1.6 During disassembly, the exterior plastic parts and the keyboard silicon-gel
buttons demounted shall be placed upon a bubble wrap bag or a PE foam, keeping them
away from the work area as far as possible to avoid any disfigurement caused by
disassembling other structural parts.
2.5.1.7 Due to updates of system parts and consequent structure changes, there might
be some tiny differences in disassembly of systems from different lots. This instruction
may not cover all these differences.
2.5.2 Disassemble Plastic Housing
2.5.2.1 Disassemble lower cover of back housing from main unit
The lower cover shall be disassembled following the steps below:
a) Unclench the left, right rubber stoppers on the back enclosure cover with a slotted
screwdriver. Remove two M4X8 pan screws fixing the back enclosure cover, and
2-32
then remove the back enclosure cover.

Note: The left and right rubber stoppers are not symmetric. Please be
cautious to distinguish the left and the right ones for the sake of
reassembling them properly.
b) Turn the main unit 180 degrees to show its bottom up.
Note 1:
Before turning over the main unit, lay a pad such as bubble wrap bag
or PE foam on worktable to avoid any damage to the plastic housing.
Note 2:
For the upper cover of back housing of main unit, the side with no
probe connectors is vulnerable to pressure. Please pay special
attention when tuning the main unit over.
c) Remove six M4X8 pan screws fixing the lower cover of the back housing, and then
remove the lower cover of back housing.
d) After removing the lower cover of back housing, remove the front, left and right
cover for ventilation openings, and clean the dust off the dustproof nets.
2.5.2.2 Disassemble upper cover of back housing from main unit
After completing the operation in Section 3.2.1 (disassemble lower cover of back housing
from main unit), the upper cover of back housing shall be disassembled following the
steps below:
a) Turn the main unit 180 degrees to show its top up.
b) Remove two M4X6 pan screws on both sides of the upper cover of handle, and
remove the upper cover of handle;
c) Remove two M4X16 pan screws fixing the handle, and the reinforcing plate and the
lower cover of handle.
d) Unclench the left, right rubber stoppers at the back of the upper cover of back
housing with a slotted screwdriver. Remove two M4X8 pan screws and the back
enclosure cover.
2-33
Note: The left and right rubber stoppers are not symmetric. Please be cautious to
distinguish the left and the right ones for the sake of reassembling them
properly.
2.5.3 Disassemble Keyboard
2.5.3.1 Disassemble keyboard form main unit
The disassembly of the keyboard from the main unit shall follow the steps below:
a) Unfold the keyboard by pressing the buttons at the top of the front frame and lay it
down horizontally. Unclench the two rubber stoppers at the top of the keyboard
upper housing with a slotted screwdriver, and remove two M3X12 cheese head
screws.
b) Turn the keyboard 45 degrees proximately. Hold on the projection of the lower
cover of the keyboard tightly. Press upon the left and right edge of the upper cover
of keyboard with two thumbs, and draw the lower cover of keyboard toward the
operator to displace it from the upper cover of keyboard. And then unclench the
fixing buckles on the left and the right with a slotted screwdriver to remove the
lower cover of the keyboard.
c) Turn the keyboard vertically. Remove three M3X10 screw assemblies at the bottom
left, then withdraw the left turning shaft.
d) Unplug all the flat cables connecting to the main unit, withdraw the left side of the
keyboard slightly, remove the right turning shaft from the right supporting fixture of
keyboard, and then remove the keyboard.
2.5.3.2 Disassemble parts from the keyboard
After completing the operation in Section 2.5.3.1 (disassemble keyboard form main unit),
the parts of the keyboard shall be disassembled following the steps below:
a) Unplug the cable of the trackball. Remove two M3X8 screw assemblies fixing the
trackball to remove the trackball.
2-34
b) Remove five knobs and eight slides on the keyboard with a slotted screwdriver, and
seven M320 screw assemblies of the KBIF board at the back of the keyboard.
Then remove the KBIF board.
Note: Please be cautious not to scratch the knobs or the keyboard surface
when unclenching the keyboard knobs. After the KBIF board is
removed, keep the seven braces of the KBIF board in place for
reassembly.
c) Having finished steps a) & b), remove all M36 screw assemblies on the KB board
at the back of the keyboard to remove the KB board.
Note: During disassembling the KB board, when splitting the positioning
nails at the back of the silicon-gel buttons embedded in the KB board,
special attention shall be paid to avoid breaking the positioning gel
nails.
d) Having removed the KB board, withdraw the silicon-gel buttons through the holes
on the plastic housing carefully.
Note: To prevent any scratch, the silicon-gel surface of the keyboard shall be
placed with the buttons upward.
2.5.4 Disassemble Rear Panel
2.5.4.1 Disassemble rear panel from main unit
After completing the operation in Section 2.5.2 (disassemble plastic housing), the rear
panel shall be disassembled following the steps below:
a) Remove six M3X6 screw assemblies in the right, left and upper parts.
b) Unplug all the cables connecting the real panel with the main unit, then
disassemble the real panel.
2.5.4.2 Disassemble platelets of the rear panel
After completing the operation in Section 2.5.4.1 (disassemble rear panel from main unit),
2-35
all the platelets on the real panel shall be disassembled following the steps below:
a) Unplug the plug connecting the Fan Patch Board. Remove two M36 screw
assemblies and then remove the Fan Patch Board;
b) Unplug the plug connecting the Net Port Board. Remove two M36 screw
assemblies and then the Net Port Board;
c) Unplug the plug connected to the USB board. Remove four M3X6 screw
assemblies, and then take out USB board.
d) Unplug the plug connected the LED board. Remove M3X6 screw assembly, and
then take out LED board.
e) Unplug the plug connecting the Print Control Interface Board. Remove two M3X6
screw assemblies and then remove the Print Control Interface Board.
2.5.5 Disassemble Industrial Control Board
2.5.5.1 Solution 1:
After completing the operation in Section 2.5.4.1 (Disassemble rear panel from main unit),
follow the steps below to disassemble the Industrial Control Board:
a) Unplug all plugs on the top of the Industrial Control Board connecting to other
components;
b) Remove four M36 screw assemblies fixing the Industrial Control Board shield
enclosure, then remove the shield enclosure.
c) Unplug all plugs connecting to the Industrial Control Board.
d) To withdraw the Industrial Control Board from the slot, remove two M36 screw
assemblies fixing both corners of the Industrial Control Board.
2.5.5.2 Solution 2:
After completing the operation in Section 2.5.2 (Disassemble plastic housing), follow the
steps below to disassemble the Industrial Control Board:
2-36
a) Unplug all plugs on the top of the Industrial Control Board connecting to other
components;
b) Remove four M36 screw assemblies fixing the Industrial Control Board shield
enclosure, then remove the shield enclosure.
c) Unplug all plugs connecting to the Industrial Control Board.
d) To withdraw the Industrial Control Board from the slot, remove two M36 screw
assemblies fixing both corners of the Industrial Control Board.
2.5.6 Disassemble PR Board and RVA Board
follow the steps below to disassemble the PR Board and the RVA Board:
a) Remove two M2.56 screw assemblies and three M38 screw assemblies fixing
the lower housing of the installation sleeve, then remove the lower housing of the
installation sleeve;
b) Remove eight M3X6 screw assemblies fixing the probe press board, and then
remove the probe press board.;
c) Remove the linking wires between the PR Board and the RVA Board, and withdraw
the RVA Board along the sliding guides from the FEP board;
d) Remove six M36 screw assemblies fixing the probe cover board to take out the
probe cover board;
e) Having finished step d), withdraw the PR Board along the sliding guide from the
FEP board;
Note 1: Given that the printed board cannot be removed easily due to tight
binding, the screws fixing the back of the shield plate shall be loosened
appropriately.
Note 2: Having removed four M2.5X6 countersunk head screws on the earth
board, the earth board can be removed from the PR Board.
2-37
2.5.7 Disassemble Power Supply and Hard Disk

2.5.7.1 Disassemble hard disk
follow the steps below to disassemble the hard disk:
a) Unplug all the plugs connecting to the hard disk;
b) Remove two M36 screw assemblies fixing the Hard Disk Fixture to withdraw the
hard disk together with the fixture;
c) To remove the IDE interface board, remove two M36 screw assemblies;
d) Remove four M38 screw assemblies on both sides to take out the hard disk from
the fixture.
2.5.7.2 Disassemble power supply module from main unit
follow the steps below to disassemble the power supply:
a) Unplug all the plugs connecting to the power supply module and the plugs
connecting to the FEP Board;
b) Remove two M36 screw assemblies through the gap at the top of the Monitor
Board Fixture, and two M36 screw assemblies on the left of the frame through two
holes on the Industrial Control Board shield enclosure. Withdraw the power supply
module from the main unit.
Note: If it is too tight between the power supply module and the frame, loosen four
screw assemblies fixing the monitor back supporting board, then to withdraw
the power supply module from the frame.
2.5.7.3 Disassemble ATX power supply
After completing the operation in Section 2.5.7.2 (Disassemble power supply from main
unit), follow the steps below to disassemble the ATX power supply:
2-38
a) Unplug all the plugs connecting the ATX power supply with the PW board;
b) Follow the process in Section 2.5.7.1(Disassemble hard disk) to withdraw the hard
disk together with the fixture from the hard disk box.
c) Remove three M36 screw assemblies to disassemble the fan and the fan fixture;
d) Remove four M36 screw assemblies and two M36 countersunk head screws of
the hard disk box to disassemble the ATX power supply cover;
e) Remove four M36 screw assemblies to withdraw the ATX power supply.
2.5.7.4 Disassemble PW board
After completing the operation in Section 2.5.7.2 (Disassemble power supply module from
main unit), follow the steps below to disassemble the PW board:
a) Remove eight M36 screw assemblies at the front and the back to disassemble the
power supply frame cover board and the hard disk box;
b) Remove four M36 screw assemblies and a M36 pan head screw on the right
side, then withdraw the PW board.
2.5.8 Disassemble MONIT Board
2.5.8.1 Disassemble front frame
2.5.8.1.1 Disassemble color filter
The color filter shall be disassembled as the following:
Unfold the keyboard and then level it. Toggle up the right and left buckles locking the top
of the color filter on the front frame, when the buckles are in place, the top of the color filter
will be ejected automatically with the bounce of the post at the top of the color filter. Then
draw out the whole color filter from the top.
Note: The operator shall wear gloves during the whole disassembly process. Dust
or fingerprint on the surface of the color filter, if any, could be wiped off with
lens cleaning paper. Attention shall be paid to prevent any scratch upon the
color filter.
2-39
2.5.8.1.2 Disassemble front frame from main unit

After completing the operation in Section 2.5.3.1 (disassemble keyboard form main unit),
the front frame shall be disassembled following the steps below:
a) Remove six M3X10 screw assemblies fixing the front frame on the left and right
sides.
b) Draw out the front frame a little bit, and unplug the cables connecting the back of
the front frame with the contrast platelet. Then remove the whole front frame.
Note: Attention shall be paid to prevent any scratch upon the color filter after
disassembly of the front frame.
2.5.8.1.3 Disassemble contrast adjust platelet
After completing the operation in Section 2.5.8.1.2 (disassemble front frame from main
unit), remove three M3X8 screw assemblies to take out the contrast adjust platelet.
Note: After disassembling the contrast adjust platelet, take out four adjust knobs
and polyester plates, then place them aside properly for reassembly.
2.5.8.2 Disassemble MONIT board and monitor tube
2.5.8.2.1 Disassemble MONIT board
After completing the operation in Section 2.5.6 (disassemble PR Probe Board and RVA
Board), the MONIT board shall be disassembled following the steps below:
a) Remove four M36 screw assemblies, then remove the probe shield board on the
right side of the main unit.
b) Remove two M36 screw assemblies and two M36 countersunk head screws,
then remove the front board of the probe shied board.
c) Unclench the anode cap of the monitor tube carefully.
d) Remove four M4X8 screw assemblies and then rear arm of the handle.
e) Remove two M3X6 screw assemblies and turn the MONIT board to the vertical
2-40
position.
f)
Remove a M4X8 screw assembly on the front arm of the MONIT board to loosen
the earth cable.
g) Take out the mounting plate at the tail of monitor tube.

h) Unplug all the plugs connecting the MONIT board.
i)
Draw out the tail of the rotation-supporting axis at the fixture tail of the monitor
board from the slot of the back supporting plate, then draw out the whole MONIT
board fixture backward.
j)
Remove four M3X6 screw assemblies and then take out the MONIT board.
2.5.8.2.2 Disassemble monitor tube

After completing the operation in Section 2.5.8.2.1(Disassemble MONIT board), follow the
steps below to disassemble the Video Tube:
a) Remove four M48 screw assemblies on the top to disassemble the front
supporting piece of the handle.
b) Hold on the bottom of the monitor tube, remove six M48 screw assemblies on the
left and the right to withdraw the monitor tube together with the fixing structure
forward slowly.
Note: When drawing out the monitor tube, attention shall be paid to prevent
any collision with the tail of the tube. After the monitor tube is drawn
out, it shall be placed upon spacer such as bubble wrap bag with the
surface of the tube downward to avoid any scratch upon the surface of
the tube.
c) Remove four M48 screw assemblies and the fixing structure. Then remove the
monitor tube.
2-41
2.5.9 Disassemble FEP Board

2.5.5 (Disassemble Industrial Control Board) and 2.5.6 (Disassemble PR Board and RVA
Board), follow the steps below to disassemble the FEP board:
a) Unplug all the plugs linking to the FEP board;
b) Remove two screw assemblies and six countersunk head screws fixing the frame
and the base to separate the frame from the base;
c) Remove twelve M36 screw assemblies to take out the FEP board.
2.5.10 Assemble Schematic of Main Unit
The assemble schematics of the main unit of the main unit are shown in Fig. 2-16 and Fig.
2-17, which can be used as an auxiliary reference chart for disassemble and assemble
process.
2-42
Fig. 2-16 Assemble Schematic of CTS-7700 Main Unit (1)

(Please refer to Table 2-9 for the corresponding numbers and descriptions)
2-43
Fig. 2-17 Assemble Schematic of CTS-7700 Main Unit (2)

(Please refer to Table 2-9 for the corresponding numbers and descriptions)
2-44
Table 2-9 Checklist for numbers and descriptions of main unit assembly
No.
Description
Quantity
Monitor tube
Spacer
Supporting fixture of keyboard shaft (left)
Supporting fixture of keyboard shaft (right)
Supporting fixture of keyboard shaft (front)
Supporting fixture of keyboard shaft (back)
Base
Industrial control board shield enclosure
Industrial control board
10
Handle arm (rear)
11
Display board joint (rear)
12
Display board joint (front)
13
Base plate for display board
14
Ground board
15
Fixing bracket of monitor
16
Probe board cover plate
17
Shield board (front)
18
Shield board (middle)
19
Shield board (back)
20
Shield board press board
21
PR board
22
RVA board
23
Hard disk fixture
24
Locating pin bracket
25
Plank
26
Hard disk
27
IDE patch panel
28
PW board
29
ATX power supply
30
Fan rack
31
Soleplate of power supply rack
32
Cover plate of power supply rack
33
Cover plate of ATX power supply
34
Hard disk mounting deck
35
Rear panel
36
Hard disk fixture
37
Fan
1
2-45
Table 2-9 (Continued)

No.
Description
Quantity
38
Fan cover
39
Power socket
40
Fan socket strips
41
LED board
42
USB board
43
Net port board
44
Print control port board
45
Switch
46
Fuse holder
47
Video output
48
Ground pole
49
MONIT board
50
Panel fixture (left)
51
Panel fixture (right)
52
Frame
53
Handle fixture (front)
54
KB board
55
KBIF board
56
Trackball
57
Reversal seating (left)
58
Reversal seating (right)
59
Slider
60
Keyboard knob
61
Keyboard silicon-gel button panel
62
Keyboard panel stopper
63
Keyboard sleeve
64
Keyboard housing (upper)
65
Keyboard housing (lower)
66
Color filter
67
Dustproof net
68
Dustproof net
69
Front frame
70
Cover for ventilation opening (left)
71
Cover for ventilation opening (right)
72
Cover for ventilation opening (front)
73
Button 2
74
Button 1
75
Hook
76
Hook fixing press board
77
Polyester spacer
78
Contrast adjust board
2-46
Table 2-9 (Continued)

No.
Description
Quantity
79
Pin (fixed)
80
Pin (removable)
81
FEP board
82
Reinforcing plate of handle
83
Upper cover of handle
84
Lower cover of handle
85
Upper cover of back housing
86
Lower cover of back housing
87
Back enclosure cover
88
Lower housing of sleeve
89
Stopper of back housing (right)
90
Stopper of back housing (left)
91
Stopper of back enclosure cover (right)
92
Stopper of back enclosure cover (left)
93
Amplification board fan cover
94
Fan
95
Fan
96
Fan fixture
97
Torsion spring
98
Dual probe sleeve
99
Hard disk mounting deck cover board
100
Fan brace
2-47
2.6 Installation Instruction for Computer Main Board (Industrial

Control Board)
2.6.1 Appearance of Computer Main Board
Unit: mm
Fig. 2-18 Appearance of Computer Main Board
2.6.2 Interface Position Map
Fig. 2-19 Interface Position Map

2-48
2.6.3 Installation of System Memory

2.6.3.1 Please pay attention to the following when installing memory bank:
a) To install the memory bank, match the gap of DIMM memory bank and DIMM Slot,
then press down DIMM memory bank in place.
b) The 184Pin SO-DIMM memory module adopted for the Computer Main Board
(Industrial Control Board) shall be compliant with DDR 266/DDR333 specifications,
with the maximum capacity up to 1GMB.
2.6.4 USB Port
USB1 provides two standard USB ports, and USB2 is a set of 25 Pin USB device pin.
USB2 needs a conversion cable to connect the USB port signal to a standard USB port.
The pin definitions of USB ports are shown in Table 2-10 and Table 2-11:
Table 2-10 Pin Definition of USB1 Port
USB1
Signal
+5V
USB Data-
USB Data+
GND
Table 2-11 Pin Definition of USB2 Port

Pin
Signal
Pin
Signal
+5V
+5V
USB Data-
USB Data-
USB Data+
USB Data+
GND
GND
VOID
10
GND
2-49
2.6.5 IDE Port

This single-chip computer provides a set of 40-pin IDE port. Please be noted for the
following when installing IDE devices:
a) Two IDE devices can be connected to the IDE port: one is a Master, and the other a
Slave. Connection method: the Master shall be connected to the end of the cable,
and the Slave to the middle of the cable.
b) When connecting to Ultra100 or Ultra66 hard disk, It is recommended to use a
80-line special flat cable (The pin on the IDE cable marked in red is first pin).
See Table 2-12 for the pin definitions.
Table 2-12 Pin Definition of IDE Port
Pin
Signal
Pin
Signal
Reset IDE
Ground
Data7
Data8
Data6
Data9
Data5
Data10
Data4
10
Data11
11
Data3
12
Data12
13
Data2
14
Data13
15
Data1
16
Data14
17
Data0
18
Data15
19
Ground
20
Key
21
DRQ0
22
Ground
23
IOW
24
Ground
25
IOR
26
Ground
27
IOCHRDY
28
Host ALE
29
DACK0
30
Ground
31
IRQ14
32
No connect
33
Address 1
34
No connect
35
Address 0
36
Address 2
37
Chip select 0
38
Chip select 1
39
Activity
40
Ground
2-50
2.6.6 Floppy Disk Port

The CPU card provides a set of 34-pin floppy drive port, which can be connected to at
most two 3.5-inch or 5.25-inch floppy disk drives. Please pay attention to the orientation of
the cables and the sockets during connection (The pin on the floppy drive cable marked in
red is first pin). See Table 2-13 and Table 2-14 for pin definition of the ports COM1, COM2,
COM3 and COM4.
Table 2-13 Pin Definition of Port COM1
Pin
Signal
DCD, Data Carrier Detection
RXD, Receive Data
TXD, Transmit Data
DTR, Data Terminal Ready
GND, Ground
DSR, Data Set Ready
RTS, Request To Send
CTS, Clear To Send
RI, Ring Indicator
Table 2-14 Pin Definition of Port COM2/ COM3/COM4

Pin
Signal
DCD, Data Carrier Detection
RXD, Receive Data
TXD, Transmit Data
DTR, Data Terminal Ready
GND, Ground
DSR, Data Set Ready
RTS, Request To Send
CTS, Clear To Send
RI, Ring Indicator
10
Not used
2-51
2.6.7 Display Port

A 15-core model D VGA monitor socket can be connected to any monitor with standard
VGA port.
Table 2-15
Pin Definition of Display Port
Pin
Signal
Pin
Signal
Red
Green
Blue
Pull up to +5V
GND
GND
GND
GND
+5V
10
GND
11
Pull up to +5v
12
DDCDATA
13
HSYNC
14
VSYNC
15
DDCCLK
2.6.8 Network Port

LAN1 is a 10/100Mbps Ethernet port on the Main Board. LILED and ACTLED are the
green and the yellow LEDs on both sides of the Ethernet port, which indicates LAN activity
and transmitting status. Please refer to the following status description of each LED:
Fig. 2-20 Network Port

TD+,TD-Positive/Negative Transmitting Data Signal
RD+,RD-Positive/Negative Receiving Data Signal
ACTLEDNetwork Activity Indicator
LILEDNetwork Link Indicator
LILED
On: Network line available
(Green Light)
Off: Network line not available
Indication State
2-52
ACTLED
On: Transmitting or Receiving Data
Yellow Light
Off: No Data being transmitted or received
Indication State
2.6.9 Keyboard and Mouse Port

KM1 is a 6-pin mini DIN socket for the keyboard and the mouse, which can be connected
to a PS/2 keyboard directly. A 1 to 2 PS/2 keyboard mouse cable configured with the
single-chip computer is required for connecting the keyboard and the mouse at the same
time.
Table 2-16 Pin Definition of KM1
Pin
Signal
Keyboard data
Mouse data
GND
+5V
Keyboard clock
Mouse clock
2.6.10 Power Supply Port

Note:
a) To avoid any damage to the CPU card, please use the 12V (4P to 2xP standard
port) power switchover cable (attached with the CPU card) to connect the PW2
(+12V power outlet) on the CPU card with the 4P power cable of the power supply,
or connect the special power cable on P4 power supply with PW2, so as to ensure
sufficient power supply to the CPU card.
b) Before using the ATX power supply, unplug AC power (100/200V), then plug the
ATX power supply plug into the ATX power supply socket tightly. Connect other
2-53
related accessories properly before connecting AC power (110/220V) to the AC

power socket.
1) ATX Power Supply Port
Table 2-17 Pin Definition of ATX Power Supply
Pin
Signal
Pin
Signal
+3.3V
11
+3.3V
+3.3V
12
-12V
GND
13
GND
+5V
14
PS-ON (power
switch control)
GND
15
GND
+5V
16
GND
GND
17
GND
Power Good
18
-5V
+5V SB (backup +5V)
19
+5V
10
+12V
20
+5V
2) +12V Power Supply Port

Table 2-18 Pin Definition of +12V Power Supply Port
Pin
Signal
GND
GND
+12V
+12V
2-54
2.6.11 Fan Port

The CPU card provides two sets of standard fan sockets [FAN1 (CPU fan), FAN2
(Housing fan)]. Please pay attention to the following 3 points when using the fan sockets:
a) The current for the fan shall be less than 350mA (4.2W, 12V).
b) Ensure that the connection of the fan matches the fan socket. The power wire
(normally in red) is in the middle, and the others are ground wire (normally in black)
and fan rotation speed output pulse signal wire (in other color). Some fans do not
have rotation speed detection, but this wire has an output as high as 12V, which
might damage the CPU card, and this is not a standard connection wire. It is
recommended to use a fan with rotation speed detection.
c) The direction of the fan air current shall be adjusted to exhaust heat from the
cabinet.
Table 2-19 Pin Definition of Fan Port
Pin
Signal
GND
+12V
Rotation speed pulse
2.6.12 Status Indication Port

Pin definition of FP1 is shown below:
Table 2-20 Pin Definition of FP1
Pin
Signal
Pin
Signal
Power Button
VCC5SB
GND
RESET
IDELED
IDELED1
2-55

Pin
Signal
Speaker out
NC
GND
+5V

Pin
Signal
Power LED+
NC
GND
2.6.13 TV Output Port

a)
J2:TV-OUT Port is shown below:

Table 2-23 Pin Definition of J2: TV-OUT Port
b)
Pin
Signal
GND
TVCVB
CN1: S-VIDEO Port is shown below:

Table 2-24 Pin Definition of CN1: S-VIDEO Port
Pin
Signal
Chroma signal C
GND
Brightness signal Y
2-56
Troubleshooting
Chapter 3
Troubleshooting
3.1 PCB Function and Potential Failure

As shown in Fig. 1-1 Block Diagram of System Composition, the system consists of 8
modules. In practice, it consists of 9 PCBs. They are: 1) Probe Interface Board (PBSW
Board); 2) Order and Amplification Board (RVA Board); 3) Digital Processing Board (FEP
Board); 4) Power Supply Module (ATX power supply); 5) Power Module (DC-DC power
supply); 6) Control Panel (KB Board); 7) Control Panel (KBIF Board); 8) Computer Main
Board (Industrial Control Board); and 9) Monitor Board. Here is a detailed introduction to
the main functions and potential failures of the PCBs.
3.1.1 Main Function and Potential Failure of Probe Interface Board (PBSW Board)
The main functions of the Probe Interface Board include probe interface, probe switching,
T/R pre-amplification circuit, and T/R element select.
If any failure occurs on this PCB, the following (but not limited to the following) failures
may be found:
a) The probe cannot be switched; the screen prompts no probe, or cannot identify the
probe, or probe code identification error;
b) One or more black strip(s) in the ultrasound image;
c) One or more white strip(s) in the ultrasound image;
d) Multiple echo signals are displayed when using a coin to inspect (one echo signal
only in normal situation).
3-1
Troubleshooting
Fig. 3-1 Silk Screen Diagram of Probe Interface Board
3.1.2 Main Function and Potential Failure of Order and Amplification Board (RVA
Board)
The main functions of the Order and Amplification Board include: order folding circuit and
its control, two-section TGC amplification circuit.
may be found:
a) Many black strip(s) in the ultrasound image;
b) Many white strip(s) in the ultrasound image;
c) Black strip(s) in the echo signal when using a coin to inspect (no black strip in
normal echo signals).
3-2
XS1
DHB-PA100-R13NN
3-3
U36
SN74LVC245APW
C121 C120 C119 C118 C117 C116 C115 C114 C113 C112
GND
U5
C111 C110 C109
-5V
C2
Z2 Z1
U4
C1
Fig. 3-3 Component Side of RVA Board
L9
U19
VCC
C108 C107
U3
Z3
C4
XS2
DHB-PA100-R13NN
U17
C106 C105
U2
-12V
C104 C103
U1
+12V
C102
Z4
L1
L2
22uH
102K
22uH
AD602JR
L6
102K
L42
3904
Q1
AD817AR
U21
102K
102K
L41 L43
22uH
L3
22uH
L4
22uH
AD602JR
22uH
U18
156/25V
L13
Q3
102K
AD817AR
3904
102K
156/25V
GND
L44 L46
VCLO
156/25V
U6
L10
L8
C3
U7
Q5
U20
156/25V
U23
L11
223Q
L17
3904
476/16V
L14
22uH
3904
22uH
GND
Q4
AD817AR
3904
L12
156/25V
Q7
U22
AD602JR
3904
476/16V
L15
AD602JR
U24
Q6
AD817AR
MT8816AP
156/25V
156/25V
S2
156/25V
2
1
AD817AR
L19
C18
103
103
C19
C60
C58
C53
C48
C76
181
0R0
0R0
181
R136
102
473
C57
473
R74
R135
102
181
473
473
C56
R128
102
181
R72
473
R68
C52
0R0
R184
102
R64 C309
100
R191
102
104
101
102
101
104
103
101
R238
226/16
R222 226/16
100
C214
C213
103
104
C167
104
104
C169
101
R236
104
C179
104
C183
102
101
104
R216
100
103
101
R232
C163
101
104
C222
226/16
C149
C221
102
103
226/16
R218
0R0 R186
100
102
R73 C312
103
101
100
101
104
102
R234
103
0R0 R187
104
R185
R71 C311
100
0R0
102
104
C147
101
104
C218
226/16
C217
226/16
103
104
R67 C310
473
100
R123
102
181
473
473
C47
R65
0R0
181
102
R156
473
C73
R190
R86
102
R155
R85 C316
473
100
473
R84
102
181
C72
R189
102
R83 C315
100
473
102
R148
C155 R129
510
104
C159
102
223Q
U8
L16
22uH
3904
22uH
Q8
22uH
MT8816AP
181
22uH
AD602JR
XS3
AD602JR
BH-34R
681
R43
R75
181
681
R45
681
R39
473
C54
102
104
473
681
R41
R69
181
R132 C157
C251 C249
C161
C285
C51
473
C45
102
R121 C146
C246 C245
C148
C281
C46
473
R63
104
181
C70
473
102
104
R152 C177
C259 C257
C181
C293
C67
181
473
473
C61
102
104
C62
473
R202
R131
101
104
226/16
101
101
104
103
101
104
101
102
101
104
103
101
226/16
226/16
R223
100
C216
104
C172
C215
104
C174
103
104
102
226/16
R221
100
226/16
C212
C140
C144
C211
104
104
104
C180
104
C184
101
101
C164
104
103
104
103
101
104
C224
226/16
C223
102
C288 R235
R219
100
226/16
103
C152
101
C154
101
104
101
104
103
104
104
102
R217
100
C220
226/16
C219
226/16
103
C160
104
102
476/16V
U9
181
102
R133
C156 R130
510
156/25V
U25
C145 R119
510
AD817AR
L18
C282 R127
102
104
102
102
C59
473
102
104
C55
473
C49
R66
681
181
R42
R70
R138 C158
C252 C250
C162
C286
R40
104
473
181
681
C50
473
C75
R82
R126 C151
C248 C247
C153
C283
681
R46
104
473
181
C71
473
103
C271
C275
103
C272
103
R78
R44
R158 C178
C260 C258
C182
C294
681
104
102
181
473
C65
R58
R118 C139
C244 C242
C142
C277
R146 C171
C256 C255
C173
C291
681
R38
181
C66
473
C43
473
102
104
C40
473
473
C31
R106 C99
C241 C239
C134
C273
181 R54
681
R36
R203
R137
156/25V
L21
C284 R233
156/25V
Q9
R200
R120
AD817AR
3904
102
156/25V
L20
22uH
S3
22uH
3904
22uH
U26
181
22uH
L23
AD602JR
Q10
R122
C150 R124
510
156/25V
U10
102
156/25V
U11
181
R201
R125
223Q
C122
C296 R239
R81
AD817AR
U27
C295 R154
AD602JR
L22
102
156/25V
3904
C175 R149
510
AD817AR
L24
22uH
3904
22uH
2
1
C176 R150
510
156/25V
Q11
181
22uH
Q12
R153
22uH
C68
R80
101
102
156/25V
C6
473
R206
R151
156/25V
C5
473
473
101
103
104
C165 R139
510
C74
C69
102
R220
100
R141 C166
C254 C253
C168
C289
C292 R237
AD817AR
104
181
AD602JR
C10
R147
AD602JR
22uH
R188
C210
226/16
C209
226/16
104
101
103
101
104
C100
C208
102
156/25V
U28
22uH
0R0
C290
R207
R157
223Q
C124 C123
C170 R144
510
156/25V
U12
22uH
181
R79 C314
473
100
102
R143
102
R142
22uH
473
181
R204
R140
AD817AR
C64
C63
681
R37
R57
181
102
103
226/16
R215
100
C279 R231
156/25V
104
R77
473
C39
102
104
103
104
104
C135
C207
C33
473
R205
R145
156/25V
AD602JR
C8 473
C133
104
103
102
104
C143
104
101
R230
C136 R109
510
R76 C313
100
473
R183
102
C138
C240
C32
102
R116
181
0R0
R114
102
181
C41 473
R62
101
C278
473
102
103
226/16
R214
100
R198
R111
C44
0R0
R61 C308
100
R182
102
102
R115
181
C137 R110
510
AD817AR
AD602JR
C14
181
R60
R113
473
152
201
102
101
101
R199
R117
156/25V
156/25V
C13
473
R229
104
C7
104
C205
102
681
C42
104
473
104
C95
0R0
C206 R179
R112
C243
226/16
C141
C276
104
C34
473
101
103
102
104
C93 R99 C26

510
104
C97
101
C9
473
C36
101
R228
332
C204
104
226/16
102
C203
226/16
103
100
R213
C274
476/16V
SN74LVC245APW
U35
R107
R181
102
C270
0R0
R269
R314
C15
R290
102
R59 C307
473
100
473
181
102
R108
101
C27
181
C35
R56
101
103
104
R100 R51 R35

R196
473
C25
R263
152
473
102
R212
100
C94 R101
C237 C238
C96
C269
C98 R104
510
104
C37
R180
C202
226/16
C201
226/16
R197
R105
C12
C11 104
0R0
102
R52 C305
100
181
R55 C306
100
473
102
R103
473
C29
R33
C16
181
181
104
473
C28
R53
C17
R34
R102
511
104
511
C38
473
C30
473
C24
473
103
C22
103
C21 103
C20
681
681
681
681
R23
R24
681
R22
681
R21
681
681
681
R16
R19
681
R15
R18
681
R14
R17
681
R13
R20
681
R12
R11 681
681
681
681
R10
681
681
R8
R9
R7
681
681
681
R6
681
R5
R3
R4
R1 681
R2
Troubleshooting
C287 R134
181
Fig. 3-2 RVA Board Welding Surface
BH-34R
XS4
S1
1
MT8816AP
Q2
3904
L7
L45
L5
C101
Troubleshooting
Fig. 3-4 Silk Screen Diagram of RVA
3.1.3 Main Function and Potential Failure of Digital Processing Board (FEP Board)
The main functions of the Digital Processing Board include: A/D conversion, digital beam
forming, dynamic filtering, tissue imaging processing, digital scan conversion (DSC),
transmit pulse generation, probe switch control, and T/R element select control.
may be found:
a) No ultrasound image is displayed;
b) The ultrasound image is mal-positioned, or only half of the image is displayed;
c) Black strip in the echo signal when using a coin to inspect (no black strip in normal
3-4
C144
104
104
C55
3-5
Fig. 3-5 FEP Board Welding Surface

156/25V
C81
156/25V
R87
R88
C90
104
C42
201
331
104
C111
104
104
C30
C91
156/25V
104
C163
C148
C135
000
R80
R81 201
R82 201
C83 104
C110
104
104
104
C133
104
C153
104
104
C41
R211
R212
R213
681
681
681
C130
104
R50
R54
R55
R56
R57
R58
R59
156/25V
000
000
000
000
000
473/500V X 3
C8
104
C155
156/25V
156/25V
C5
156/25V
104
331
201
C113
R112
R111
104
331
201
C123
R122
R121
104
C112
C9
C6
104
R64
R63
R62
R61
R60
R84 000
R16 472
R15 472
R42 472
104
C72
C71 104
C4
C40
104
C117 104
C50
C118
104
C38
C65
104
C82
R91
R92
C93
C114
104
104
C17
C119
104
C120
104
C154
104
C59
C43
R1 470
C73
104
R4 470
R3 470
104
R89
R2 470
104
220
R65 470
R66 470
R431
R432
C21
156/25V
R49
000
000
000
000
000
000
000
000
C25
104
104
C164
R36
000
000 R37
R38
000
000
R39
681
R433
681
681
C70
104
681
R423
681
681
C66
104
C16 104
104
201
201
104
C37
104
104
104
C18
R421
R422
104
C13 104
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
220uH
104
104
104
104
104
104
104
104
104
104
104
104
C493
C603
156/25V
C593
156/25V
C583
156/25V
C573
156/25V
C563
156/25V
C553
156/25V
C543
156/25V
C533
156/25V
C523
156/25V
C513
156/25V
C503
156/25V
C491
102
R485
156/25V
156/25V
156/25V
C591
R26 472
R24 472
R45 472
104
104
104
R7 103
104
R18 472
R17 472
R43 472
C14 104
104
C115
C89
104
C139
C63
104
C68
104
C67
R79
512
512
R85
C61 104
L7 C99
C581
R101
R102
C103
C122
R44 472
R19 472
R20 472
104
104
C150 C152
L6 C98
C571
C39
104
C121
C69
681
R413
L5 C97
C561
201
201
104
C125
104
C10
C551
C116
104
C44
104
C541
104
C85
R223
R222
R221
472
R83
C531
681
681
681
104
R163
104
C11
104
681
C60
L4 C96
104
C233
L3 C95
C15 104
104
R161
R162
C64
R411 681
R412 681
L2 C94
C521
681
681
104
104
R6
R12
R11
R40
C58
103
472
472
472
104
C62
C12
L1 C92
C511
C45
R70
C381
R72
R76
R71
152
152
101
152
470
104
152 R73
104
C501
C124
C46
C146
C88
104
104
104
C147
C47
C244
104
C382
C472
R475 C481
R477 R487
104
C380
156/25V
C245
104
152
222
681
222
681
681
152
152 152 R483
101
101 104 C482
102 104 102 R484
681 104
470 470
R29
472
R28 472
R46 472
104
104
104
C86
C232
104
C143
C141 104
C151
104
104
472 472
R33 R30
156/25V
C79
156/25V
C84
104
C471
104
104
C27
104
R5 103
R47 472
104
C383
472 R10
472 R9
472
R25
104
C157
C149
104
C134
C29
681
R53
R242
202
202
C243
R241
156/25V
104
R21 511
104
R131 156/25V
R132
R133 156/25V
C80
104
681
681
C33 C49
681
C36
104
104 101 R75 C242
202
202
104
152 104
104
R74 C231
R78
R77
C35
C34
104
C126
C241
104
104
104
104
C54
C53
C235
C236
C158
R465
C473
R463
R464
C483
R473
R471
R472
C140
104
C142
104
104
C137
C52
104
C127
104
C48
104
C379
C128
104
104
C78
104
C159
104
C145
104
202
R451
472
R474
104
C138
C56
104
R22
104
C129
R34 472
R48 472
103
R232
C234 R231
104 202
104
C131
R51 681
R52 681
C51
104
R8
C28
104
C162
C26
104
R35 472
C87
104
104
C161
104
103
104
C160
C136
104
C132
R31
681
R32
681
R67
331
R27
101
R68
202
R69
202
Troubleshooting
echo signal);
d) The whole ultrasound image is too dark or too bright;
e) Many black strips in the ultrasound image.
R481
R482
C601
L8 C100 L9 C101 L10 C102 L11 C104 L12 C105
C2
C3
C1
156/25V
C7
C57
Troubleshooting
V12
V7
V11
V10
10
1A
25A
15
20
D25
20
15
10
1A
10
D1
D25
20
15
10
D1
XS5
D25
D1
20
15
20
15
10
25A
1A
20
15
10
U71
74LVC245A
D1
U70
U69
74LVC245A
74LVC245A
DHB-RB100-S13NN
DHB-RB100-S13NN
25A
10
74LVC245A
1A
U46
GND
101 R551
104 C554
104 C552
101 R541
104 C544
104 C542
101 R531
104 C534
104 C532
101 R521
104 C524
104 C522
101 R511
104 C514
104 C512
101 R501
104 C504
104 C502
101 R491
104 C494
104 C492
AD9057
U55
AD9057
U54
AD9057
U53
AD9057
U52
AD9057
U51
AD9057
U50
AD9057
U49
U41
74LVC245A
101 R561
104 C564
104 C562
AD9057
U56
U42
XS13
NS-1*2
U43
XC2S200-5PQ208
XS6
NS-1*2
101 R571
104 C574
104 C572
AD9057
U57
U47
101 R581
104 C584
104 C582
AD9057
U58
U48
101 R591
104 C594
104 C592
AD9057
U59
AD712JR
GND
XS8
U68
NF3 473
XC2S200-5PQ208
XC2S200-5PQ208
AT27C1024-70JI
AT27C020-70JI
NF4
473
D40
U34
XCF02S
473
473
14
C31 104
U36
XCF02S
U81
IDT74FCT3807
U35
XCF02S
U33
XCF02S
U73
74LVC245A
U31
XCF02S
V13
HZ5C1
LH-34R
XC2S200-5PQ208
104
C23
473
XCF02S
JS-1001-14
104
NF5 NF1 NF2
C22
104
11
AD9057
U60
XS11
1
C32
JS-1001-11
XS12
1
101 R601
104 C604
104 C602
AD712JR
U67
74LVC245A
10
15
20
74LVC245A
U65
U66
U72
XS2
D25
34
XS3
33
XS4
V8
15
20
DHB-RB100-S13NN
V9
WW17-215 X 6
25A
DHB-RB100-S13NN
D45
1
GND
WW17-215 X 6
U18
74LVC245A
U20
74LVC245A
U25
50.0000MHz
U19
LIGHT1
LIGHT2
U75
74LVC245A
IS63LV1024L-12H
U27
IS63LV1024L-12H
U26
DAC0800LCM
U24
DAC0800LCM
U23
V4
74LVC245A
V3
V2
74LVC245A
U13
XS15
NS-1*2
JS-1001-10
V1
GND
U16
6
U76
74LVC245A
A1
A49
U32
XCF02S
U6
XCF02S
XC2S200-5PQ208
A61
RJB60DCHN-S578
U4
U8
U9
U10
LM1084
LM1084
LM1084
LM1084
B2
B48
B62
XS1
74LVC245A
U74
74LVC245A
U7
XS7
Fig. 3-6 Component Side of FEP Board
3-6
JS-1001-6
U1
IS63LV1024L-12H
U5
JS-1001-6
XS18
XCF02S
U30
GND
U22
U29
IS61LV12816L
LM1084
DAC0800LCM
U3
XC2S200-5PQ208
IS63LV1024L-12H
XC2S200-5PQ208
GND
LM1084
XC2S200-5PQ208
XS16
NS-1*2
NS-1*2
XC2S200-5PQ208
U11
U12
AD712JR
U2
XS14
U28
IS61LV12816L
U21
10
XS10
U15
XS9
IS63LV1024L-12H
U14
BH-10S
U17
Troubleshooting
Fig. 3-7 Silk Screen Diagram of FEP (1174E) Board
3.1.4 Main Function and Potential Failure of Power Supply Module (ATX power
supply and DC-DC power supply)
The main function of the power supply module is: to transform AC power input into
different DC powers required by the system. The system consists of computer part and
ultrasound part, both of which have their own special requirements, so the power supply is
also divided into ATX power supply and DC-DC power supply. ATX power supply is for the
computer part, one +12V DC power from ATX power supply is for DC-DC power, and the
DC-DC power is transformed to different voltages required by the ultrasound part and
supplied to it. The main output voltages from DC-DC power are: +5VD, +5VA, -5V, +12V,
-12V, +60V, -60V, and HV (controllable high voltage).
If any failure occurs on this PCB, firstly check if voltage of each group is normal. If it is
abnormal, check if the abnormal situation comes from power output itself or from
3-7
Troubleshooting
abnormal loading. The following (but not limited to the following) failures may be found:
a) The system cannot start up (failure comes from ATX power supply);
b) The system can start up, but restart and shut off after starting up;
c) The system can start up, but no display on the screen;
d) The screen has display, but no ultrasound image;
e) Sensitivity of the ultrasound image is very low.
Fig.3-8 Silk Screen Diagram of Power Supply Board
3.1.5 Main Function and Potential Failure of Control Panel (KB Board and KBIF
Board)
The main function of the Control panel is to serve as an end-user operation interface,
providing operation objects such as keys, trackball, knobs and TGC slider. When the user
operates these objects, the control panel will detect these actions, convert them into
agreed signals and send them to the computer module for corresponding processing. On
the other hand, the backlight and the buzzer on the control panel are controlled by
3-8
Troubleshooting
software: When the software sends control commands, the control panel receives these
commands and thus controls the backlight or the buzzer.
may be found:
a) All the operations (including knobs) do not work;
b) Some of the keys do not work;
c) TGC controls do not work;
d) The trackball does not work;
Fig. 3-9 Welding Surface of KB Board
R3
471
R31
510
R16
510
510 R104
510 R108
R119
510
510
R106
510 R107
R120
510
R61
510
R2
471
510 R99
510
R102
510 R109
R131
510
R132
510
R62
510
R63
510
R94
510
510 R105
510
R123
510
R121
R78
510
R80
510
R95
510
510 R79
R77
510
R17
510
R32
510
R33
510
R18
510
R49
510
R65
510
R81
510
R82
510
510 R64
R96
510
R122
510
3-9
R48
510
510
R20
R66
510
510
R50
R35
510
R36
510
510
R51
R83
510
R97
510
510 R34
XS1
R124
510
R129
510
510
R130
R19
510
R1
472
R134
510
R135
510
R21
510
R4
510
R22
510
R52
510
510
R53
R68
510
R98
510
510
R103
510
R127
R126
510
510 R67
R84
510
R87
510
R85
510
R69
510
R54
510
R38
510
R23
510
R5
510
R6
510
R7
510
R39
510
R24
510
R8
510
R55
510
R46
510
203S-3C/B-2X20P-8.5/3.0
R128
510
510
R111
510 R113
510 R116
510 R117
510 R114
510 R115
R118
510
R86 510
R47
510
510 R110
510 R112
R25
510
R41
510
R71
510
R72
510
R88
510
R89
510
R133
510
510 R70
510 R37
R125
510
R137
510
510 R40
510
R56
R42
510
R57
510
R90
510
R91
510
510
R26
R9
510
R10
510
R11
510
R27
510
R28
510
R58
510
510
R59
R74
510
R13
510
R12
510
R44
510
510
R29
R75
510
510 R73
510
R100
R136
510
R101
510
510 R43
R92
510
R93
510
R76
510
R60
510
R45
510
510
R30
R14
510
R15
510
e) The screen has display, but no ultrasound image.
102
102
102
102
102
102
102
102
104
104
104
104
104
104
104
104
C1
C2
C3
C4
C5
C6
C7
C8
R11
102
R21
102
R9
102
R19
102
3-10
R26 C27
330 104
101
C41
R10
102
R20
102
Fig. 3-11 Welding Surface of KBIF Board

R13
102
R23
102
C29
104
R12
102
C10
V115
V116
V130
V118
V117
V114
V113
V123
104
C9
104
R 18
510
151 R17
104 C31
151 R 31
R28
V131
V121
C11
104
151
510
102
102
R29
102
102
R30
R16
R 24
R14
R15
104 C33
102
V132
V111
V127
C 21 104
C32
V122
104
C 25
104
C 39
V105
V126
R25 513
104
C 34 104
104
C38
104
C 35 104
C 37
C40
V120
V107
V124
104
C23
104
C28
104
V119
V109
V125
C24
104
102
R27
102
R 36
C26
V104
V112
V101
V100
V110
V103
V102
V99
V136
V137
V133
V47
V46
V98
V97
V96
V95
V94
V91
V90
V89
V88
V82
V81
V80
V79
V93
V92
V87
V86
V85
V84
V83
V78
V73
V72
V71
V70
V69
V68
V67
V66
V65
V64
V76
V75
V74
V63
V62
V61
V58
V57
V56
V55
V54
V53
V52
V51
V50
V49
V48
V60
V59
V2
V3
V45
V44
V43
V42
V41
V40
V39
V38
V37
V36
V35
V34
V33
V32
V31
V30
V29
V28
V27
V26
V25
V24
V23
V22
V21
V20
V19
V18
V17
V16
V15
V14
V13
V12
V11
V10
V9
V8
V7
V6
V5
V4
V135
V134
V1
C 36 104
104
C22
104
V108
V106
V77
Troubleshooting
V128
V129
Fig. 3-10 Component Side of KB Board
104 C30
R22
102
Troubleshooting
BH-34R
NF1
D6
MIC39100
C12
126-16000
XCS10XL-4VQ100C
50
1
XS6
34
15uF/25v
C20
RP2
15uF/25v
C17
15uF/25v
RS30111A602N
RP3
15uF/25v
RS30111A602N
D3
B1
23
RP4
NS-1*2
GND
ADC0809CCV
22
RS30111A602N
15uF/25V
15uF/25V
C15
C14
AT89C51-24JI
C18
V1
15uF/25V
12
D8
NS-1*2
XS5
LVC245APW
15uF/25v
MAX232
D1
D9
RS30111A602N
D7
C16
C13
D4
RP1
D2
D5
C19
100
XC17S10XLPD8C
N74F14D-T
D12
LM1084IS-ADJ
+3.3V
33
XS4
15uF/25V
34
1
LVC245APW
D10
D11
OBO-13240
BP1
MMBT3904
KNH21473-3AA
MAX709
+5V
GND
(SMD) 11.0592MHz
RP5
15
RP12
DISP
RP13
DEPTH
RP10
MGain
RP9
BGain
RP11
VALUE
RS30111A602N
RP6
RS30111A602N
RP7
RS30111A602N
RP8
RS30111A602N
VFUNC
XS8
JS-1001-4
XS3
1
XS1
JS-1001-6
201S-DL-2x20P(H=5.08)
Fig. 3-12 Component Side of KBIF Board
Fig.3-13 Silk Screen Diagram of KBIF Board
3.1.6 Main Function and Potential Failure of Computer Main Board (Industrial
Control Board)
The main functions of Computer Main Board (Industrial Control Board) include: receive,
conversion and processing of control panel signals, data transmission, image display
measurement & calculation function, storage function, etc. The computer module is the
running platform of the whole system, which is why ultrasound systems in this form being
called PC based ultrasound system. The generality of computer module enables easy
communication with peripheral devices like memory, monitor, printer, keyboard and
mouse. All these devices can be connected to universal ports on a computer. With control
3-11
Troubleshooting
of Windows operating system on these devices, various functions, such as image

measurement & calculation, storage and printing, are achieved conveniently. For the
wiring diagram of the Industrial Control Board, please refer to Fig.2-15.
If any failure occurs on this PCB, firstly verify if voltage of each group of power supply is
normal. If it is abnormal, check if the abnormal situation comes from power output or
loading (similar to Section 3.1.4). The following (but not limited to the following) failures
may be found:
a) The system cannot start up;
b) The system can start up, but it restart and shut off after starting up;
c) The system can start up, but has no display;
d) The system can start up and enter Windows, but cannot enter ultrasound interface
(firstly check if it is a software problem);
e) No ultrasound image is displayed;
f)
Sensitivity of ultrasound image is very low.
3.2 Common Failure and Troubleshooting

Due to complexity of the system, certain failures might occur inevitably. Here is an
introduction to some troubleshooting methods and basic consideration, though they may
not cover all the problems. Whenever any failure occurs, it is important to record the
working environment, the working state and the problem of the system with failure. Then
follow the instruction in the manual to deal with the problem. If it does not work, to shoot
the problem as soon as possible, please contact SIUI service team immediately.
3.2.1 System Cannot Start Up
Generally, when such failure occurs, firstly check if the external power supply is normal,
the main power switch of the main unit is on, and the fuse in the main unit is normal. If the
power input requirement is AC220V(230V), then the input power voltage shall be AC220V
3-12
Troubleshooting
(230V)10%; if the power input requirement is AC110V (120V), then the input power
voltage shall be AC110V (120V)10%. Over high voltage may damage the system
(including fuse breakdown), over low voltage may not be sufficient to start up the system.
If the voltage and the fuse are in normal condition, and power supply main switch is on,
follow the steps below to do further inspection:
a) Check if the power indicator is on and the fan is working.
If the indicator is on, inspect if the sound toot, toot is heard after system powerup
for a while (the sound indicates that the Computer Main Board has passed
self-check and the system starts up properly). If the sound is heard, then go to the
next step for further inspection. If you cannot hear the sound, the problem may
come from the Computer Main Board (Industrial Control Board), or if you hear
continuous toot, toot, toot sound, the problem may come from the memory
bank of the Computer Main Board.
b) Check if the ATX voltage is normal
If any abnormal situation occurs, please check if the problem comes from ATX itself
or loading.
When it is not loaded, measure the ATX power supply port. Connect Pin14 PS-ON
to ground short circuit, and switch on the main power. The ATX power supply starts
to work. Test the voltage of each pin on the port, as shown in Table 2-17 and 2-18.
If there is no voltage or abnormal voltage, it means the failure is in ATX power
supply.
c) Check if each group of DC-DC output is normal. When doing this, because the
input of DC-DC power is from ATX power supply, it is necessary to ensure ATX
power supply works normally and all the wires are connected properly.
If any abnormal situation occurs, please check if the problem comes from DC-DC
itself or loading.
d) If all the voltages are normal, the failure might be in the Computer Main Board
3-13
Troubleshooting
(Industrial Control Board) or the hard disk.

3.2.2 Lowered Image Quality
Because ultrasound front-end has direct relation with ultrasound image quality of the
system, if image quality is lowered, it is probably resulted from ultrasound front-end. The
situations of lowered image quality are mainly as follows:
a) Image pixel getting Coarse
The main reason that image pixel getting coarse may be degraded performance of
the amplifier on the ultrasound front-end board. When such problem occurs, it may
be RVA or FEP Board failure.
b) Image Depth decreased
Possible reasons for decreased image depth: decreased imaging channels,
abnormal transmit pulse, lowered transmitting voltage. If the image depth is
decreased, use a small metal stick (small screw driver or coin) to slide along the
surface of the probe to do the test. Under normal situation, a moving left-right
symmetric acute triangle will be shown on the screen. If the acute triangle is
complete except that the depth gets shallower, it may be due to lowered transmit
voltage, failure in a certain level of the amplification circuit on the front-end board,
or abnormal transmit pulse (less than normal pulse number). Check if the transmit
voltage is normal (over +60V) or not, so as to determine where the problem is: in
DC-DC board, PBSW Board, RVA Board or FEP Board; if a certain part in the acute
triangle is lost (black strip), the failure may come from some part of the front-end
board, including PBSW Board, RVA Board or FEP Board. In addition, the problem
in the probe is also possible. if there is any part missing in the acute triangle, and
the missing part varies as the acute triangle moves, the problem may be from RVA
Board.
3.2.3 Abnormal Image
If there is any problem with the ultrasound system, usually it can be found in the image. An
3-14
Troubleshooting
abnormal image usually has the following symptoms:

a) Fixed dark strip in the image;
There are many possible reasons that dark strips are found in the ultrasound image.
The main reasons are: failure in PBSW Board, RVA Board, FEP board or the probe.
There are a few situations that dark strips are found in the image: a black strip
appears at a fixed position in the image; several black strips appear repeatedly in
the image.
As the probe is a precision device, improper use might damage the probe.
Therefore, when black strips appear in the image, first of all please check if the
problem is due to probe damage. It is very easy to figure out. Connect another
good probe (It is not necessarily of the same model) to the system to see if there is
any similar problem in the image. If the problem is still there, the failure is from the
system; otherwise it is the probe problem. Please replace the probe. If the problem
is in the system, usually it is due to the front-end system. Usually breakdown in
high voltage switch of the PBSW board or the pre-amplifier in the front-end system
may result in such failure. Try to replace the PBSW Board first. If the problem still
exists, try to replace the RVA Board. If it does not work, further replace the FEP
Board.
b) Noise in the Image
There are many reasons that may cause noises in the image, for example: external
electromagnetic interference, power interference and interference from system
failure. Therefore, when interference is found in the screen, check if there is any
external
interference
before
further
inspection.
External
electromagnetic
interference generally lead to interference in the whole screen (but not limited to
the ultrasound imaging area). Interference due to front-end system failure usually is
found in the ultrasound imaging area only. Based on this characteristic, we can
distinguish whether the interference source is the external electromagnetic
interference. External power interference may also lead to noises in the ultrasound
3-15
Troubleshooting
imaging area. If external power interference is found, check if the ground terminal
of the system is well connected. In addition, please try to keep away from the
power interference source. It is recommended to use a well-grounded stabilized
voltage supply, so as to reduce power interference effectively.
If the system failure is due to noise, the failure position can be determined roughly
based on the noise features:
1) If there is one or more noise(s) in acute triangle shape, usually the problem is in
the pre-amplifier, the high-voltage switch or the relay of the PBSW Board.
Please replace the PBSW board.
2)
If the noise is in irregular shape and appears in the whole ultrasound imaging
area at random, usually the problem is in the amplification circuit of the
Front-End Board. Please replace the PBSW board or the RVA board.
3)
If the noise is in geometric form and regular, such as black strip, bright line,
black mass, or bright mass. The problem might not be from the front-end. The
failure inspection focus shall be in FEP board, computer part (Industrial Control
Board), and RAM.
In addition to the problems listed above, other failures might occur due to complexity of
the system.
3.2.4 Failure Analysis on Monitor
3.2.4.1 Inspection when the monitor display is not normal
For inspection on the main unit, please refer to other sections in this manual. For
inspection on video output signals, if possible, connect video out of the main unit to an
external monitor to check if the video output signals from the main unit is normal.
3-16
Troubleshooting
Fig. 3-14 Silk Screen Diagram of Monitor Board (1074H)
To determine the failure of monitor assembly, follow the instructions below to perform the
inspection.
Note: Due to high-voltage circuit inside the monitor assembly, all the inspection
shall be performed by a professional engineer.
a) Inspect the circuit board and its components to see if there is any abnormity, burn
or peculiar smell; if any wire is broken; if any connector comes off or gets loose.
3-17
Troubleshooting
Fig. 3-15 Inside View of Wiring
b) Power-up check the power input connector CH6. Measure voltage input +15V (in
yellow) and +30V (in red) with a multimeter. If the voltage is not normal, unplug the
connector, and measure the connector voltage with zero loading. If it is still not
normal, the initial identification is that it is the Power Board failure.
Fig. 3-16 The Picture of the Power Input Interface
3-18
Troubleshooting
c) If the power input and the video out signals of the main unit are working properly,
the initial identification is that it is the Monitor Board failure.
3.2.4.2 Common monitor failures and troubleshooting
a) No display: Adjust brightness and contrast potentiometers on the front panel to see
if there is any change or any scanning grating. If there is grating, usually the failure
is in the video amplification channel; check if the monitor tube filament is on: use a
multimeter to measure the voltage between pin 3 and 4 at the back of the monitor
tube and see if it is DC15V. If it is the normal value 15V, while the filament is off, a
possible cause of the failure is filament blowout or bad contact between the
monitor-end platelet and the monitor tube.
b) Asynchronous display line: Try to adjust the potentiometer 4VR2. If it does not work,
the failure is in the circuit.
c) Asynchronous display field: Try to adjust the potentiometer 5VR1. If it does not
work, the failure is in the circuit.
d) Abnormal brightness: adjust the brightness control potentiometer on the front panel,
or the assistant brightness control potentiometer 4VR4 on the main circuit board. If
it does not work, the failure is in the circuit.
e) Abnormal contrast: adjust the contrast control potentiometer on the front panel, or
the assistant contrast control potentiometer 1VR1 on the main circuit board. If it
does not work, the failure is in the circuit.
f)
Improper grating size: adjust the potentiometer 5VR2 to adjust image size in
vertical direction; adjust the magnetic core of loop 4L2 to adjust image size in
horizontal direction.
g) Fuzzy focus in the image: adjust the potentiometer 4VR3 to see if there is any
change in the image focusing effect.
If the failure is identified from circuit board, if possible, perform corresponding circuit
troubleshooting with reference to circuit schematics and block diagram; otherwise, return
3-19
Troubleshooting
the board to us for service.

3.2.5 Other Common Failures and Troubleshooting
a) If the system can start up and enter Windows operation interface , but cannot enter
ultrasound software interface, inspect the connection between the Industrial
Control Board and the FEP board to see if it is normal, or any bad contact due to
connector dislocation; it may also due to oxidation of the contact point on the PCI
port of the Industrial Control Board, which results in bad contact. Use an eraser to
clear off the oxide on contact point surface.
b) If the screen stays in the BIOS initialization screen or Windows logging screen after
system startup, try to recover the system with GHOST. If it does not work, check if
the hard disk data wire and the hard disk power wire get loose, if the data wire is
damaged due to pressure. Lastly, if system recovery and data wire replacement do
not work, it can identified as a hard disk failure. Please replace the hard disk.
3-20
Software Maintenance
Chapter 4
4.1 System Update

System update includes Update System Online and Update System from USB disk.
Press Menu. Select Update System and press Enter. The window below will appear.
Move the trackball up or down to select.
Fig. 4-1 Update System Menu
4.1.1 Update System Online

Select Update System Online and press Enter. The following message will be displayed
on the screen:
Connecting, please waiting
a) If network connection is failed, the following message will be displayed on the
screen:
Network Error! Please press ESC to return menu.
1) Press Esc to return to Fig. 4-1 window and enter Network Setup to check
whether the setting of IP and Port is correct. Then make sure the system is well
connected to the network (e.g. check the connection of netcable);
2) Select Update System Online again. If it still prompts Network Error, it may
be due to the server failure for file download. Please contact SIUI.
b) If network connection is successful, the following message will be displayed on the
4-1
screen:
Network connect successfully.
Please press Enter to copy file or press ESC to return menu.
1) Cancel system update: Press ESC to return to Fig. 4-1 window;
2) Copy file: Press Enter. The window below will appear, and it starts copying
update files. During copying, only Esc key is valid.
Copying files 9%
Press ESC to cancel

Fig. 4-2 Copy file window
3) Cancel copy: Press Esc to cancel copy. The following message will be
displayed on the screen:
Please press Enter to cancel copy or press ESC to return.
Press Esc key to continue copy, or press Enter to cancel copy, and the
following message pops up:
Copy Blackout! Please press ESC to return menu.
4) Copy completes: the following message pops up when copy completes:
The files download successfully.
Please press Enter to update system or press ESC to return menu.
If the user does not want to update the system, press Esc to return to the
window in Fig. 4-1.
5) Update system: If the user wants to update the system, press Enter, and the
system will automatically install the new software and be rebooted to achieve
update.
4-2
4.1.2 Update System from USB disk

Copy the .exe file required for system update to the root directory in the USB disk. Plug in
the USB disk and select Update System from USB Disk.
a) Select Update System From USB disk from the menu and press Enter;
b) If a USB disk containing system update files is plugged in the system, the following
message will be displayed on the screen:
The Udisk file is ready.
Please press Enter to update or press ESC to return menu.
c) Press Enter and the system will install the new software and be rebooted
automatically. System update is successful;
d) If the user does not want to update the system, press Esc to return to Fig. 4-1
window;
e) If a USB disk is not plugged in the system or there is no update file in the disk, the
following message will be displayed on the screen:
The Udisk file is not ready.
Please press ESC to return menu.
Press Esc to return to Fig. 4-1 window. Ensure that a USB disk is plugged in and it
contains update files. Press Enter key again to update the system.
4.1.3 Network Setup
a)
This option is for setting server IP and port for downloading update files. The
system is set up well before delivery. Usually the user does not need to change
the setup.
Correct IP: 218.16.250.64
Port: 1234
4-3
b)
If any modification is required, select Network Setup and press Enter. The
window below will appear:
Fig. 4-3 Upgrade server setup window
c)
Move the cursor to IP or Port. Use Backspace to delete the original IP or Port.
Enter new IP or Port and move the cursor to select OK. Press Enter to return to
Fig. 4-1 window;
d)
If Initialize is selected and Enter is pressed, then IP and Port are initialized to
factory setup;
e)
If IP or Port is not modified, press Esc to return to Fig. 4-1 window.
4.2 Software and System Recovery

4.2.1 Software Recovery
Because the keyboard of the system is locked in default, an external USB keyboard via
the USB port is required for the following operation.
a) Exit the software to Windows interface:
z Method 1: Press CtrlAltDelete to pop up Windows Task Manager,
select Processes | 7700.exe |End Process to return to Windows interface as
shown in Fig. 4-4.
z Method 2: Press AltF4 to close the software directly and return to Windows
interface.
b) Copy CD folder under the root directory of D drive to the folder Ultrasound under
the root directory of C drive. Software recovery is completed.
4-4
Fig. 4-4 Windows Task Manager Window
4.2.2 System Recovery and Backup

4.2.2.1 System Recovery
The software Ghost is required for system recovery. Ghost is a tool for system, data
backup and recovery released by Symantec, which can be downloaded from Internet.
There are two system recovery methods available for user selection: automatic and
manual recovery.
a) Boot up via USB Startup Disk and Automatic System Recovery
Plug the USB startup disk in the USB port, and press F7 when the system is
booting up. The screen as shown in Fig. 4-5 is displayed.
Select First Boot Device

USB RMD-FDD: Sigmatel MSCM
IDE-0: Maxtor6e030L0
Up/Dn: Select
RETURN: Boot
ESC: Cancel
Fig. 4-5 Startup Selection Menu
Use the up/down direction keys to select USB RMD-FDD: Sigmatel MSCM to boot
4-5
up the system (The descriptions following USB RMD-FDD and IDE-0 are
dependant to the actual situation).
If the USB startup disk contains a batch file (AUTOEXE.BAT) for automatic
recovery, the system will be recovered automatically after successful startup, and
then restart.
b) Manual System Recovery
Follow step a) to start up from the USB startup disk. If there is no batch file
(AUTOEXE.BAT) for automatic recovery in the USB disk, after successful startup
the system will go to DOS prompt A:\>. Input the commands below to enter Ghost
interface as shown in Fig. 4-6:
A:\D:
(press Enter)
D:\ghost (pre
ss Enter)
Fig. 4-6 Startup Screen of Ghost8.0
4-6
Fig. 4-7 Select Recovery Menu
1) Select Local |Partition| From Image (Shown in Fig. 4-7) and press Enter to
confirm and go to the screen shown in Fig. 4-8.
Fig. 4-8 Select Partition of Image File
2) Select the partition of the image file. The image file SIUI.GHO is saved in the
root directory in D drive (the second partition of the first disk). Select D:1:2 []
FAT drive and press Enter.
3) After selecting the partition, the directory and files of this partition are displayed
in the second box (the biggest one). Use the direction keys to select the image
4-7
file SIUI.GHO, and press Enter to confirm. See Fig. 4-9. It displays backup
information of the selected image file when performing backup. Select OK to
confirm.
Fig. 4-9 Backup Information of the Selected Image File
4) Select to restore the image file to the hard disk. Since there is only one hard
disk available on the system, press Enter key directly and it displays Fig. 4-10.
Fig. 4-10 Select Destination Drive
5) Select the destination partition for recovery. The image file is to be recovered to
C drive (the first partition). Select the first item (the first partition). The display is
as shown in Fig. 4-11.
4-8
Fig. 4-11 Select Destination Partition
6) After selecting the destination partition for recovery, press OK. A prompt
message pops up: Proceed with partition restore? Destination partition will
be permanently overwritten. See Fig. 4-12.
Fig. 4-12 Prompt Message
4-9
7) Select Yes to start restoring. See Fig. 4-13.
Fig. 4-13 System Restoring

8) When the system is restored successfully, it displays as shown in Fig.4-14.
Press Enter to restart the system and finish recovery.
Fig. 4-14 Recovery Succeeds

4-10
4.2.2.2 System Backup

a) Select Local| Partition| To Image as shown in Fig. 4-15, and press Enter key.
Fig. 4-15 Select Backup Menu
b) It pops up a hard disk select window as shown in Fig. 4-16. There is only one hard
disk available in the system, so press Enter directly.
Fig. 4-16 Select Source Drive

4-11
c) Use the direction keys to select the first partition (C drive) as the backup partition.
See Fig. 4-17.
Fig. 4-17 Select Source Partition for Backup
d) Then select OK to confirm. It displays as shown in Fig. 4-18.
Fig. 4-18 Dialog Box

4-12
e) Select the desired storage partition, directory path and input the image file name.
First select the partition for storing the image file: Use Tab key to switch to Look in
box and use the direction keys to select desired partition as shown in Fig. 4-19.
Fig. 4-19 Switch to Look in Box
f)
Use the down direction key to select D:1:2[]FAT drive (the second partition of the
first disk), the color of which will turn white (see Fig. 4-20).
Fig. 4-20 Select Desired Partition for Storing Image File
4-13
g) Having selected the desired partition, press Tab key to switch to image file name
input box (see Fig. 4-21).
Fig. 4-21 Switch to Image File Name Input Box
h) Input the image file name. To back up the system, input the image file name
SIUI.GHO as shown in Fig. 4-22.
Fig. 4-22 Input Image File Name
4-14
i)
Having inputted the image file name, press Save, and it displays Compress image
file? See Fig.4-23.
Fig. 4-23 Query on Whether to Compress Image File
Three options are available for selection: No means no compression; Fast means
fast backup speed with a low percentage of compression (Recommended); High
means slow backup speed with a high percentage of compression. Use the right
direction key to select High. See Fig. 4-24.
Fig. 4-24 Select High

4-15
j)
Having selected compression percentage, press Enter key to start backup. The
When it completes, it displays as shown in Fig. 4-25.
Fig. 4-25 Backup Completed
k) It prompts that the operation is completed. Press Enter key to return to the
program main screen. See Fig. 4-26.
Fig. 4-26 Exit to Program Main Interface
l)
To exit Ghost, use the down direction key to select Quit and press Enter key. See
Fig. 4-27. It queries: Are you sure you want to quit? Select Yes to exit Ghost and
go back to DOS prompt A:\ >. Press Ctrl + Alt +Del to restart the system. So
4-16
far the system backup is completed.
Fig. 4-27 Exit Ghost
4.3 Creation of USB Startup Disk and Batch File (AUTOEXEC.BAT)

4.3.1 Creation of USB Startup Disk
The software HP USB Disk Storage Format Tool (HUDSFT) is required for the creation of
USB Startup Disk. It is recommended to back up information in the USB disk before
creating the USB startup disk.
a) Plug the USB disk in the computer and run HUDSFT. After starting up, it displays
as in Fig. 4-28.
Fig. 4-28 HUDSFT Running Screen

4-17
b) Select Create a DOS startup disk, and the followed Using DOS system files
located at ::will be activated. See Fig. 4-29.
Fig. 4-29
c) If you click Start, the following message will show up: Missing location of DOS
system filesSee Fig. 4-30.
OK
Fig. 4-30 Error Message
d) The files COMMAND.COM and IO.SYS are required for DOS system files, which
are usually stored under the root directory of system drive (C drive). Input C:\ in
the input box, and click Start. See Fig. 4-31.
Fig. 4-31 Select Directory of DOS System File

4-18
e) Having clicked Start key, if COMMAND.COM and IO.SYS files are missing from
the root directory of system drive C drive, the message will display: There are no
valid DOS system files at the specified location. See Fig. 4-32.
Fig. 4-32
f)
If COMMAND.COM and IO.SYS files are not missing, it will prompt: All data on
the USB flash drive will be lost! Do you really want to proceed with format?
Fig. 4-33
g) Click Yes to continue creation of startup disk. The process is shown in Fig. 4-34.
Fig. 4-34
4-19
h) When formatting is completed, it prompts the following message (see Fig. 4-35).
Now the USB startup disk is created.
Fig. 4-35
Note: The software in use in the above case is for reference only. The user can
download the software from Internet, or use other software.
4.3.2 Create Batch File ( AUTOEXEC.BAT)
a) Click the right button of the mouse, and select New| Text Document to create a
new text document. Double click the document to open it. Add the following
command in the document: (See Fig. 4-36 and Fig. 4-37)
GHOST -clone, mode=pload,src=1:2\siui.GHO,dst=1:1 fx sure rb
Fig. 4-36
4-20
Fig. 4-37
b) Save the text document as AUTOEXEC.BAT. Save as type shall be All Files (see
Fig. 4-38).
Fig. 4-38
c) Copy AUTOEXEC.BAT file to the root directory of the USB startup disk.
4.4 Troubleshooting
4.4.1 After Windows starts up, ultrasound software cannot start up
Solution: Select Start |Programs |Startup, and check if there is an item Shortcut to 7700
in the startup menu as shown in Fig. 4-39.
4-21
Fig. 4-39
If there is no Shortcut to 7700 in the startup menu, create a shortcut to 7700 under the
startup menu as shown in Fig. 4-40.
Fig. 4-40
4.4.2 After Windows starts up, ultrasound software enters its interface but returns
to Windows interface immediately
Solution: Select Start |Settings |Control Panel |System. Select Hardware and click
Device Manager to open Device manager to open it (see Fig. 4-41, Fig. 4-42 and Fig.
4-43).
4-22
Fig. 4-41
Fig. 4-42 Control Panel
Fig. 4-43 System Properties
4-23
Check if there is an item SIUI PCITest: PCITest Driver,checked build under Sound,
video and game controller menu, and if this item works properly (Fig. 4-44).
Fig. 4-44 Device Manager
If the driver was not installed successfully, or the contact between the Industrial Control
Board and the slot is not good, it may result in failure.
If the failure is due to unsuccessful installation of the driver, reinstall the driver and restart
the system.
If the failure is due to poor contact between the Industrial Control Board and the slot,
follow the procedure described in Chapter 2 to open the system housing, re-plug the
Industrial Control Board an ensure that it is fixed properly.
4.4.3 Error message pops up when running ultrasound software (see Fig. 4-45)
Fig. 4-45 Error Message

4-24
Solution: The error may be due to lack of the file 2k8HdCrlInit.dat, or lack of a data file
matching the corresponding probe type. To fix this issue, copy the lacked file to the
corresponding directory.
The file 2k8HdCrlInit.dat is backed up in the directory: D:\CD\7700\. Just copy the file
2k8HdCrlInit.dat to the directory for starting up the ultrasound software.
Fig. 4-46
Fig. 4-47
To open the directory of the startup ultrasound software, follow the procedure in Fig. 4-46
4-25
to open the properties of the startup software and click Find Target (Fig. 4-47).
Each probe has its corresponding folder (see Table 4-1). Each folder usually has three
files: data0.dat, data1.dat and data2.dat. An error message will show up when these files
are missing (see Fig. 4-45). To fix this issue, please copy the corresponding probe files to
the matched folder.
Table4-1
Probe
Corresponding Folder
C3L60B
D:\C3I60F\
L7I50B
D:\L7I50F\
C3I20B
D:\C3I20F\
V6L11B
D:\V6I11F\
U5L50B
D:\U5I50F\
C3L40B
D:\C3I40F\
L7I38B
D:\L7I38F\
C5I20B
D:\C5I20F\
V5I11WB
D:\V5I11F\
4.5 Collect Information

In order to provide good and fast service to fix the possible failures, whenever a failure
occurs, please collect relevant information and send to us.
a) Mark down the time when the failure occurred. It would be better to mark down the
failure time as accurate as minute, and see if the clock in the system stops.
b) If there is any sound like di, di from the probe, record the situation in details.
c) Press Freeze and Probe Select respectively to check if there is any
improvement or any new status, and record the situation in details.
d) Unplug the probe, observe the system; re-plug the probe and observe the system
again. Record the system status in details, and see if the failure is improved or
fixed.
e) Send us one copy of the file Error.ini under the folder C:\ Ultrasound\ Cd\ 7700\
files\ and the folder D:\test\.
4-26
Shantou Institute of Ultrasonic Instruments

SIUI Service Link
Mailing:
Shantou Institute of Ultrasonic Instruments (SIUI)
77 Jinsha Road, Shantou, Guangdong 515041, China

Tel: 86-754-88250150
Fax: 86-754-88251499
E-mail: siui@siui.com or service@siui.com
October, 2004

CTS-7700 Service Manual

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DCY2.782.

SHANTOU INSTITUTE OF ULTRASONIC INSTRUMENTS, INC.

System Composition and Technical Specifications..

System Working Principle........

Brief Introduction of Working Principle..

Digital Processing Board.....

Order and Amplification Board...

Probe Interface Board..

Interconnection Signal List Between PCBs......

Probe Interface Board...

Order and Amplification Board....

Industrial Control Board.......

Connection Diagram Between PCBs.

Disassemble Plastic Housing..

Disassemble Rear Panel.

Disassemble industrial control board.....

Disassemble PR board and RVA board.

Disassemble Power Supply and Hard Disk...

Disassemble MONIT Board.

Disassemble FEP Board..

2.5.10 Assemble Schematic of Main Unit..

Installation Instruction for Computer Main Board (Industrial Control Board)..

Appearance of Computer Main Board..

Interface Position Map....

Installation of System Memory..

Floppy Disk Port...

Keyboard and Mouse Port.....

Power Supply Port..

Status Indication Port..

PCB Function and Potential Failure...

Main Function and Potential Failure of Probe Interface Board...

Main Function and Potential Failure of Order and Amplification Board

Main Function and Potential Failure of Digital Processing Board..

Main Function and Potential Failure of Power Supply Module..

Main Function and Potential Failure of Control Panel

Main Function and Potential Failure of Computer Main Board...

Common Failure and Troubleshooting..

System Cannot Start Up...

Lowered Image Quality.

Failure Analysis on Monitor..

Other Common Failures and Troubleshooting..

Update System Online..

Update System from USB disk

Software and System Recovery..

System Recovery and Backup....

Creation of USB Startup Disk and Batch File..

Creation of USB Startup Disk...

Create Batch File ( AUTOEXEC.BAT)

System Composition & Technical Specifications

1.1 System Composition

Fig. 1-1 Block Diagram of System Composition

1.2 Technical Specifications

System Working Principle

2.1 Brief Introduction of Working Principle

System Working Principle

7 PS/2 and Start-up Wire

13 +12V Fan Wire

19 5V, 12V, HVC Power Wire

2 Extended Network Card Wire

14 +5V, +12V Power Wire

20 Contrast & Brightness Adjust Control Wire

3 Extended USB Wire

9 Print Control Wire

15 60V Power Wire