Você está na página 1de 24

LAUNCHXL-F28069M Overview

User's Guide

Literature Number: SPRUI11


January 2015

Contents
1
2
3

Introduction ......................................................................................................................... 4
Kit Contents ........................................................................................................................ 5
Installation .......................................................................................................................... 5

7
8

.................................................................................................................... 5
................................................................................................. 5
Getting Started with the LAUNCHXL-F28069M ......................................................................... 6
4.1
Getting Started ........................................................................................................... 6
4.2
Demo Application, Internal Temperature Measurement ............................................................ 6
4.3
Program and Debug the Temperature Measurement Demo Application ......................................... 6
Hardware Configuration ........................................................................................................ 6
5.1
Power Domain ............................................................................................................ 7
5.2
Serial Connectivity ....................................................................................................... 7
5.3
Boot Mode Selection ..................................................................................................... 7
5.4
Connecting a Crystal..................................................................................................... 7
5.5
Connecting a BoosterPack .............................................................................................. 8
5.6
Device Migration Path ................................................................................................... 8
LAUNCHXL-F28069M Hardware ............................................................................................. 9
6.1
Device Pin Out............................................................................................................ 9
6.2
Schematics .............................................................................................................. 11
6.3
PCB Layout .............................................................................................................. 18
6.4
Bill of Materials (BOM) ................................................................................................. 19
References ........................................................................................................................ 22
Frequently Asked Questions (FAQ) ...................................................................................... 23

Table of Contents

3.1

Energia

3.2

Code Composer Studio

SPRUI11 January 2015


Submit Documentation Feedback
Copyright 2015, Texas Instruments Incorporated

www.ti.com

List of Figures
1

LAUNCHXL-F28069M Board Overview................................................................................... 5

LAUNCHXL-F28069_B_1400922 Block Diagram Schematic ........................................................ 11

LAUNCHXL-F28069_B_1400922 USB to JTAG Schematic.......................................................... 12

LAUNCHXL-F28069_B_1400922 F28069_A Schematic

13

LAUNCHXL-F28069_B_1400922 F28069_B Schematic

14

6
7
8
9
10
11
12
13
14

.............................................................
.............................................................
LAUNCHXL-F28069_B_1400922 Connector Schematic .............................................................
LAUNCHXL-F28069_B_1400922 Logic Choice Schematic ..........................................................
LAUNCHXL-F28069_B_1400922 Power Schematic ..................................................................
Top Silk ......................................................................................................................
Top Copper .................................................................................................................
Inner Copper 1 ..............................................................................................................
Inner Copper 2 ..............................................................................................................
Bottom Silk ..................................................................................................................
Bottom Copper..............................................................................................................

15
16
17
18
18
18
18
18
18

List of Tables
1

Serial Connectivity ........................................................................................................... 7

F28069M LaunchPad Pin Out and Pin Mux Options - J1, J3 .......................................................... 9

F28069M LaunchPad Pin Out and Pin Mux Options - J4, J2 .......................................................... 9

F28069M LaunchPad Pin Out and Pin Mux Options - J5, J7 ........................................................ 10

F28069M LaunchPad Pin Out and Pin Mux Options - J8, J6 ........................................................ 10

LAUNCHXL-F28069M Bill of Materials .................................................................................. 19

SPRUI11 January 2015


Submit Documentation Feedback

List of Figures
Copyright 2015, Texas Instruments Incorporated

User's Guide
SPRUI11 January 2015

LAUNCHXL-F28069M Overview

Introduction
The C2000 Piccolo LaunchPad, LAUNCHXL-F28069M, is a complete low-cost development board
for the Texas Instruments Piccolo F2806x devices and InstaSPIN technology. The LAUNCHXL-F28069M
kit features all the hardware and software necessary to develop applications based on the F2806x
microprocessor. The LaunchPad is based on the superset F28069M device, and easily allows users to
migrate to lower cost F2806x devices once the design needs are known. It offers an on-board JTAG
emulation tool allowing direct interface to a PC for easy programming, debugging, and evaluation. In
addition to JTAG emulation, the USB interface provides a UART serial connection from the F2806x device
to the host PC.
Users can download an unrestricted version of Code Composer Studio IDE version 6 to write,
download, and debug applications on the LAUNCHXL-F28069M board. The debugger is unobtrusive,
allowing the user to run an application at full speed with hardware breakpoints and single stepping
available while consuming no extra hardware resources.
As shown in Figure 1, the LAUNCHXL-F28069M C2000 LaunchPad features include:
USB debugging and programming interface via a high-speed galvanically isolated XDS100v2 emulator
featuring a USB/UART connection
Superset F28069M device that allows applications to easily migrate to lower cost devices
Two user LEDs
Device reset pushbutton
Easily accessible device pins for debugging purposes or as sockets for adding customized extension
boards
InstaSPIN library in ROM, allowing implementation of InstaSPIN-MOTION and InstaSPIN-FOC
solutions
Dual 5V quadrature encoder interfaces
CAN Interface with integrated transceiver
Boot selection switches

C2000, Piccolo, LaunchPad, Code Composer Studio are trademarks of Texas Instruments.
Windows is a registered trademark of Microsoft Corporation in the United States and/or other countries.
All other trademarks are the property of their respective owners.
4

LAUNCHXL-F28069M Overview

SPRUI11 January 2015


Submit Documentation Feedback
Copyright 2015, Texas Instruments Incorporated

Kit Contents

www.ti.com

Figure 1. LAUNCHXL-F28069M Board Overview

Kit Contents
The LAUNCHXL-F28069M LaunchPad experimenter kit includes the following items:
C2000 LaunchPad Board (LAUNCHXL-F28069M)
Mini USB-B Cable, 0.5m
Quick Start Guide

Installation
The F28069M LaunchPad is supported in both Code Composer Studio and Energia. Depending on your
tools preference you may wish to install one or the other or both.

3.1

Energia
Go to Energia.nu and and click on the Guide tab. Click on the link for your operating system and follow the
directions to install Energia.

3.2
3.2.1

Code Composer Studio


Download the Required Software
Code Composer Studio IDE is available for free without any restriction when used with the XDS100
emulator on the C2000 LaunchPad. The software can be downloaded from the C2000 LaunchPad page at
ti.com/launchpad. At this site, you can also download a copy of controlSUITE that includes drivers,
examples, and other support software needed to get started.
For InstaSPIN motor control projects, install the latest version of MotorWare.exe (www.ti.com/motorware)
and run MotorWare.exe. In the window that opens, under Resources, follow the Kit Readme and GUI
Quick Start Guide for the LAUNCHXL-F28069M.

SPRUI11 January 2015


Submit Documentation Feedback

LAUNCHXL-F28069M Overview
Copyright 2015, Texas Instruments Incorporated

Getting Started with the LAUNCHXL-F28069M

3.2.2

www.ti.com

Install the Software


Once downloaded, install Code Composer Studio and the controlSUITE package.

3.2.3

Install the Hardware


After Code Composer Studio is installed, plug the supplied USB cable into the C2000 LaunchPad board
and into an available USB port on your computer.
Windows will automatically detect the hardware and ask you to install software drivers. Let Windows run
a search for the drivers and automatically install them. After Windows successfully installs the drivers for
the integrated XDS100v2 emulator, your LaunchPad is now ready for use.

Getting Started with the LAUNCHXL-F28069M

4.1

Getting Started
The first time the LAUNCHXL-F28069M is used, a demo application automatically starts when the board is
powered from a USB host. If your board does not start the demo application, try placing S1 in the following
positions and resetting the board: UP - UP - DOWN. To start the demo, connect the LAUNCHXLF28069M with the included mini-USB cable to a free USB port. The demo application starts with the LEDs
flashing to show the device is active.

4.2

Demo Application, Internal Temperature Measurement


The LAUNCHXL-F28069M includes a pre-programmed TMS320F28069M device. When the LaunchPad is
connected via USB, the demo starts with an LED flash sequence. After a few seconds the device switches
into a temperature measurement mode.
A reference temperature is taken at the beginning of this mode and the LEDs of the LaunchPad are used
to display any difference between the current temperature and the reference temperature. If the device
gets warmer than the reference temperature the red LED is lit with an intensity proportional to the
temperature difference. However if the device cools down compared to the reference temperature, a blue
LED is lit in the same fashion.
In addition to the LED display, temperature information is also displayed on your PC through the
USB/UART connection. To view the UART information on your PC, first figure out the COM port
associated with the LaunchPad. To do this in Windows, right click on My Computer and click on
Properties. In the dialog box that appears, click on the Hardware tab and open Device Manager. Look for
an entry under Ports (COM & LPT) titled "USB Serial Port (COMX)", where X is a number. Remember this
number for when you open a serial terminal. The demo applications UART data was written and debugged
using PuTTY, and for the best user experience we recommend you use PuTTY to view the UART data.
PuTTY can be downloaded from the following URL:
http://www.chiark.greenend.org.uk/~sgtatham/putty/download.html
Open your serial terminal program and open the COM port you found previously in device manager with
the following settings: 115200 Baud, 8 data bits, no parity, 1 stop bit. After opening the serial port in your
serial terminal, reset the Launchpad with the reset push button and observe the serial terminal for a
surprise.

4.3

Program and Debug the Temperature Measurement Demo Application


The project and associated source code for the C2000 Piccolo LaunchPad demo is included in the
controlSUITE software package and should automatically be found by the TI Resource Explorer in Code
Composer Studio v6. In the resource explorer, open the controlSUITE folder and then the Development
Tools entry and look for the C2000 LaunchPad line item. Expand this item and LAUNCHXL-F28069M,
then select the LaunchPad Demo Application. Follow the steps in the main pane of the resource explorer
to import, build, debug, and run this application.

Hardware Configuration
The F28069M LaunchPad gives users several options as to how to configure the board.

LAUNCHXL-F28069M Overview

SPRUI11 January 2015


Submit Documentation Feedback
Copyright 2015, Texas Instruments Incorporated

Hardware Configuration

www.ti.com

5.1

Power Domain
The F28069M LaunchPad has several different power domains to enable JTAG isolation. Jumpers JP1,
JP2, JP3, JP4, and JP5 configure where power is passed.
Jumper

5.2

Power Domain

JP1

Enable 3.3 V from USB (disables isolation)

JP2

Enable GND from USB (disables isolation)

JP3

Enable 5 V switcher (powered off 3.3 V supply of target device)

JP4

Connects target MCU 3.3 V to second set of BoosterPack


headers

JP5

Connects target MCU 5 V to second set of BoosterPack headers

Serial Connectivity
The LAUNCHXL-F28069M has a USB to UART adapter built in. This makes it easy to print debug
information back to the host PC even in isolated environments. The F28069M device on this LaunchPad
contains two SCI (UART) peripherals, while the LaunchPad has three places these peripherals need to be
routed. Because of this, a serial connectivity mux has been added to the board to make configuration of
the SCI routing easy. Routing is configured via two jumpers (JP6 and JP7). Configure the jumpers as
shown in Table 1 for the serial connectivity you desire.
Table 1. Serial Connectivity
MUX_SEL
(JP7)

5.3

CH_SEL(JP
6)
Function

ON

ON

USB/UART Disabled; J1.3 and J1.4 GPIO28 and GPIO29; J7.3 and J7.4 GPIO15 and GPIO58

ON

OFF

USB/UART GPIO28 and GPIO29, J1.3 and J1.4 Hi-Z; J7.3 and J7.4 GPIO15 and GPIO58

OFF

ON

USB/UART GPIO15 and GPIO58; FAULT/OCTW GPIO28 and GPIO29; J7.3 and J7.4 Hi-Z

OFF

OFF

USB/UART GPIO15 and GPIO58; FAULT/OCTW GPIO28 and GPIO29; J7.3 and J7.4 Hi-Z

Boot Mode Selection


The LaunchPad's F28069M device includes a boot ROM that performs some basic start-up checks and
allows for the device to boot in many different ways. Most users will either want to perform an emulation
boot or a boot to flash (if they are running the application standalone). S1 has been provided to allow
users to easily configure the pins that the bootROM checks to make this decision. The switches on S1
correspond to:
Switch

Function

GPIO34

GPIO37

TRSTn

Keep in mind that the debugger does not connect if the device is not in the emulation boot mode (TRST
switch in the up position). More information about boot mode selection can be found in the Boot ROM
section of the TMS320x2806x Piccolo Technical Reference Guide (SPRUH18).

5.4

Connecting a Crystal
Although the Piccolo device present on the LAUNCHXL-F28069M has an internal oscillator and for
most applications this is sufficient the LaunchPad offers a footprint for through-hole HC-49 crystals for
users who require a more precise clock. If you wish to use an external crystal, solder the crystal to the Q1
footprint and appropriate load capacitors to the C3 and C4 footprints. You also need to configure the
device to use the external oscillator in software.

SPRUI11 January 2015


Submit Documentation Feedback

LAUNCHXL-F28069M Overview
Copyright 2015, Texas Instruments Incorporated

Hardware Configuration

5.5

www.ti.com

Connecting a BoosterPack
The F28069M LaunchPad is the perfect experimenter board to start hardware development with the
F2806x devices. All of the connectors are aligned in a 0.1-in (2.54-mm) grid to allow easy and inexpensive
development of add on boards called BoosterPacks. These satellite boards can access all of the GPIO
and analog signals. The the pin out of the connectors can be found in Section 5.

5.6

Device Migration Path


Applications developed on the LAUNCHXL-F28069M can easily be migrated to any of these lower cost
devices in the F2806x family:

Part Number

Description

TMS320F28069

32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 100KB RAM

TMS320F28069F

32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 96KB RAM

TMS320F28069M

32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 96KB RAM

TMS320F28068

32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 100KB RAM

TMS320F28068F

32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 96KB RAM

TMS320F28068M

32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 96KB RAM

TMS320F28067

32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 100KB RAM

TMS320F28066

32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 68KB RAM

TMS320F28065

32-Bit Real Time Microcontroller, 90 MHz, 128KB Flash, 100KB RAM

TMS320F28064

32-Bit Real Time Microcontroller, 90 MHz, 128KB Flash, 100KB RAM

TMS320F28063

32-Bit Real Time Microcontroller, 90 MHz, 128KB Flash, 100KB RAM

TMS320F28062

32-Bit Real Time Microcontroller, 90 MHz, 128KB Flash, 52KB RAM

TMS320F28062F

32-Bit Real Time Microcontroller, 90 MHz, 128KB Flash, 52KB RAM

LAUNCHXL-F28069M Overview

SPRUI11 January 2015


Submit Documentation Feedback
Copyright 2015, Texas Instruments Incorporated

LAUNCHXL-F28069M Hardware

www.ti.com

LAUNCHXL-F28069M Hardware

6.1

Device Pin Out


Table 2 through Table 5 lists the pin out and pin mux options for the C2000 LaunchPad.
Table 2. F28069M LaunchPad Pin Out and Pin Mux Options - J1, J3
Mux Value
3

Mux Value
1

J1 Pin

J3 Pin

+3.3V

21

+5V

ADCINA6

22

GND

J1.3

23

ADCINA7

J1.4

24

ADCINB1

GPIO12

25

ADCINA2

SPISIMOB

SCITXDA

TZ1

ADCINB6

26

ADCINB2

XCLKOUT

SCITXDB

SPICLKA

GPIO18

27

ADCINA0

SCITXDB

MCLKXA

EQEP1S

GPIO22

28

ADCINB0

ADCSOCBO

EPWMSYNCO

SCLA

GPIO33

29

ADCINA1

ADCSOCAO

EWPMSYNCI

SDAA

GPIO32

10

30

NC

Table 3. F28069M LaunchPad Pin Out and Pin Mux Options - J4, J2
Mux Value
3

Mux Value
1

J4 Pin

J2 Pin

Rsvd

Rsvd

EPWM1A

GPIO0

40

20

GND

COMP1OUT

Rsvd

EPWM1B

GPIO1

39

19

GPIO19

SPISTEA

SCIRXDB

ECAP1

Rsvd

Rsvd

EPWM2A

GPIO2

38

18

GPIO44

MFSRA

SCIRXDB

EPWM7B

COMP2OUT

SPISOMIA

EPWM2B

GPIO3

37

17

NC

Rsvd

Rsvd

EPWM3A

GPIO4

36

16

RESET#

ECAP1

SPISIMOA

EPWM3B

GPIO5

35

15

GPIO16

SPISIMOA

Rsvd

TZ2

SPISOMIB

Rsvd

TZ2

GPIO13

34

14

GPIO17

SPISOMIA

Rsvd

TZ3

NC

33

13

GPIO50

EQEP1A

MDXA

TZ1

DAC1

32

12

GPIO51

EQEP1B

MDRA

TZ2

DAC2

31

11

GPIO55

SPISOMIA

EQEP2A

HRCAP1

SPRUI11 January 2015


Submit Documentation Feedback

LAUNCHXL-F28069M Overview
Copyright 2015, Texas Instruments Incorporated

LAUNCHXL-F28069M Hardware

www.ti.com

Table 4. F28069M LaunchPad Pin Out and Pin Mux Options - J5, J7
Mux Value
3

COMP1OUT

Mux Value
1

MDXA

EQEP1A

J5 Pin

J7 Pin

+3.3V

41

61

+5V

NC

42

62

GND

J7.3

43

63

ADCINB7

J7.4

44

64

ADCINB4

GPIO20

45

65

ADCINA5

NC

46

66

ADCINB5

SPICLKB

SCITXDB

TZ3

GPIO14

47

67

ADCINA3

COMP2OUT

MDRA

EQEP1B

GPIO21

48

68

ADCINB3

SCIRXDB

MFSXA

EQEP1I

GPIO23

49

69

ADCINA4

HRCAP1

EQEP2A

SPISIMOA

GPIO54

50

70

NC

Table 5. F28069M LaunchPad Pin Out and Pin Mux Options - J8, J6
Mux Value
3

Mux Value
1

J8 Pin

J6 Pin

Rsvd

Rsvd

EPWM4A

GPIO6

80

60

GND

COMP1OUT

Rsvd

EPWM4B

GPIO7

79

59

GPIO27

HRCAP2

EQEP2S

SPISTEB

Rsvd

Rsvd

EPWM5A

GPIO8

78

58

GPIO26

ECAP3

EQEP2I

SPICLKB

COMP2OUT

Rsvd

EPWM5B

GPIO9

77

57

NC

Rsvd

Rsvd

EPWM6A

GPIO10

76

56

RESET#

ECAP1

Rsvd

EPWM6B

GPIO11

75

55

GPIO24

ECAP1

EQEP2A

SPISIMOB

NC

74

54

GPIO25

ECAP2

EQEP2B

SPISOMIB

NC

73

53

GPIO52

EQEP1S

MCLKXA

TZ3

DAC3

72

52

GPIO53

EQEP1I

MFSXA

Rsvd

DAC4

71

51

GPIO56

SPICLKA

EQEP2I

HRCAP3

10

LAUNCHXL-F28069M Overview

SPRUI11 January 2015


Submit Documentation Feedback
Copyright 2015, Texas Instruments Incorporated

SPRUI11 January 2015


Submit Documentation Feedback

Copyright 2015, Texas Instruments Incorporated

REV1.1

20140922

DATA
20140806

REV

REV1.0

NOTE

Sheet 2

SERIAL 1&2

CAN
Sheet 5

TMS320F28069

LEDS
Sheet 4

FT2232H

Sheet 3&4

Add pullup resistances and filter capacitors for QEP net on sheet 5.

ORIGINAL RELEASED

Sheet 2

Micro USB type B

Sheet 2

Power management

BLOCK DIAGRAM

Roy Yaung

Note: DNP = Do Not Populate

BoosterPack 2 Connector
Sheet 5

BoosterPack 1 Connector
Sheet 5

QEP Connector
Sheet 5

5
6

1.1

6.2

www.ti.com

LAUNCHXL-F28069M Hardware

Schematics
Figure 2 shows the F28069M LaunchPad schematic.

Figure 2. LAUNCHXL-F28069_B_1400922 Block Diagram Schematic

LAUNCHXL-F28069M Overview

11

4
5

FTDI_CLK

FTDI_CS
CS

CLK

U8

DD+

2.2uH

GND

DO 1

VCC

TP14TP15TP16TP17

AGND

93LC56BT-I/OT

AGND

2.2k

R31

AGND

0.1u

C43

P$49

C18
36p

C17
36p

12M

FTDI_DATA

Q3

P$6
P$14

P$8

P$7

P$13

P$3

P$2

P$63
P$62
P$61

AGND
FTDI_CS
FTDI_CLK
FTDI_DATA

1K

R22

D+

D-

FTDI_3V3 P$50

FTDI_1V8

0.1u 0.1u 0.1u 3.3u

TP11

FTDI_3V3

100K22uF
R47 C45

C12 C13 C14 C15

0R
0R

USBVCC

P$8

P$5

P$7
P$6

AGND AGNDAGNDAGND

FTDI_3V3

AGND

R15
R33

PG

FB

SW
VOS

AGND

GND
PGND

EN

VIN

500mA

F1

P$4
P$1

0.1u FTDI_DATA 3
DI

C16

1
2
3
4
5

Mini USB

AGND

C44

10uF

P$3

P$2

L7

CDRH2D18/HPNP-2R2NC

AGND

USBVCC

EEPROM
Array

4.7u

U17
TPS62162DSGR

10K

3
Vout = 3.3V
Iout = 1A

TEST

OSCO

OSCI

EECS
EECLK
EEDATA

REF
RESET#

USBDP

USBDM

VREGIN
VREGOUT

L2
BLM15AG601SN1D

C10

P$9 EX_PAD
6
2

R12

AGND
R24

4.7u

FT2232H

U6

AGND

PWREN#
SUSPEND#

BCBUS0
BCBUS1
BCBUS2
BCBUS3
BCBUS4
BCBUS5
BCBUS6
BCBUS7

BDBUS0
BDBUS1
BDBUS2
BDBUS3
BDBUS4
BDBUS5
BDBUS6
BDBUS7

ACBUS0
ACBUS1
ACBUS2
ACBUS3
ACBUS4
ACBUS5
ACBUS6
ACBUS7

ADBUS0
ADBUS1
ADBUS2
ADBUS3
ADBUS4
ADBUS5
ADBUS6
ADBUS7

P$60
P$36

P$48
P$52
P$53
P$54
P$55
P$57
P$58
P$59

P$38
P$39
P$40
P$41
P$43
P$44
P$45
P$46

TP30

D8
PWREN#
SUSPEND#

330

R27

D7

FTDI_3V3

AGND

AGND

P$26
P$27
P$28
P$29
P$30
P$32 R23
P$33 1K
P$34

P$16
P$17
P$18
P$19
P$21
P$22
P$23
P$24

FTDI_3V3

FTDI_3V3

AGND

12k

L1
BLM15AG601SN1D
P$9
P$4
VPLL
VPHY
TH
TH

C11
P$12
P$37
P$64
VCORE1
VCORE2
VCORE3

AGND

P$20
P$31
P$42
P$56

R46

R26

VCCIO1
VCCIO2
VCCIO3
VCCIO4

P$10

Copyright 2015, Texas Instruments Incorporated


GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8

LAUNCHXL-F28069M Overview
P$1
P$5
P$11
P$15
P$25
P$35
P$47
P$51

820
D4
330

JP1

JP3

0
R20

0
R19

0
R18

R16

VCC1
GND1
INA
INB
INC
IND
NC
GND1

0
U5

R21

VCC2
GND2
OUTA
OUTB
OUTC
OUTD
EN
GND2

VCC2
GND2
OUTA
OUTB
INC
NC2
EN2
GND2

0
R32

0
R30

R28

R25

USB TO JTAG

1
2
3
4
5
6
7
8

GND

6
+5V

GND
+3V3
TP13

16
15
14
13
12
11
10
9

+3V3
TP12

TP10

ISO7231

VCC1
GND1
INA
INB
OUTC
NC1
EN1
GND1

Roy Yaung

AGND

16
15
14
13
12
11
10
9

ISO7240
AGND
FTDI_3V3
U7

1
2
3
4
5
6
7
8

FTDI_3V3

LP_5V

1
2
1
2

12
1 JP2
2

1.1

TDO
SCI_TX
JTAG_TRST

TCK
TDI
TMS
SCI_RX

LAUNCHXL-F28069M Hardware
www.ti.com

Figure 3. LAUNCHXL-F28069_B_1400922 USB to JTAG Schematic

SPRUI11 January 2015


Submit Documentation Feedback

Copyright 2015, Texas Instruments Incorporated

L3
BKP1005HS221-T

25

5
13
38
61
79
93

R4

TDO
x
0
0
1
1

1
0
0
0
0
x
0
1
0
1

1
2
3

S1

GND

VDDA

VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7

VSSA

26

GND

4
15
36
47
62
80
92

GPIO34
TDO
TRST

BOOT

VDDIO1
VDDIO2
VDDIO3
VDDIO4
VDDIO5
VDDIO6

VDD1
VDD2
VDD3
VDD4
VDD5
VDD6

GND GND GND

Emulation Boot
Parallel I/O
SCI
Wait
GetMode

204-3ST

GPIO34

6
5
JTAG_TRST 4

R5
820

+3V3 +3V3

820

TRST

GND

2.2u 2.2u 2.2u2.2u2.2u2.2u2.2u2.2u

C21 C19 C20C26C27C28C29C30

GND

ON

L4
BLM15PD600SN1D

2.2u
3
C2 2.2u 14
C22 2.2u
37
C23 2.2u 63
C5 2.2u
81
C6 2.2u 91
C1

R10
2.2k

TP19

2.2k

U1G$3
TMS320F28069MPZT

R8

GND

GND

0.1u

C40

+3V3

+3V3

GND

DNP

GPIO19

GPIO18

TRST
TCK
TMS
TDI
TDO

RESET#

36p

TP20TP21TP22TP23TP24

820

46

59

60

64

51

12
67
72
71
70

11

45

90

GND

+3V3

24

35
34
33
32
31
30
29
28

16
17
18
19
20
21
22
23

27

F28069_A

GND

0.1u

GND

Roy Yaung

TP18
RESET#

ADC_INB7
ADC_INB6/COMP3B/AIO14
ADC_INB5
ADC_INB4/COMP2B/AIO12
ADC_INB3
ADC_INB2/COMP1B/AIO10
ADC_INB1
ADC_INB0

TP-1138K9-BE1125C39

S2

RESET

X2

X1

XCLK_I/GPIO19

XCLK_O/GPIO18

VREFLO

VREFHI

ADC_INA7
ADC_INA6/COMP3A/AIO6
ADC_INA5
ADC_INA4/COMP2A/AIO4
ADC_INA3
ADC_INA2/COMP1A/AIO2
ADC_INA1
ADC_INA0

U1G$1
TMS320F28069MPZT

TRST
TCK/GPIO38
TMS/GPIO36
TDI/GPIO35
TDO/GPIO37

XRS

TEST2

VREGENZ

VDD_FL

ADC

+3V3

R9
2.2k

C3
C4

36p
R1

Q1

JTAG
CLOCK

R6

2 1
3

SPRUI11 January 2015


Submit Documentation Feedback
D1

2.2k

ADCINB7
ADCINB6
ADCINB5
ADCINB4
ADCINB3
ADCINB2
ADCINB1
ADCINB0

ADCINA7
ADCINA6
ADCINA5
ADCINA4
ADCINA3
ADCINA2
ADCINA1
ADCINA0

1.0

PWM

www.ti.com

LAUNCHXL-F28069M Hardware

Figure 4. LAUNCHXL-F28069_B_1400922 F28069_A Schematic

LAUNCHXL-F28069M Overview

13

R7 1M

Copyright 2015, Texas Instruments Incorporated

6
7
2
98
89
69
75
85

GPIO20
GPIO21
GPIO23
GPIO22
GPIO57
GPIO54
GPIO55
GPIO56

R40 1K
R41 1K

GPIO43

GPIO42

GPIO41

GPIO40

GPIO57/SPISTEA/EQEP2S/HRCAP4
GPIO54/SPISIMOA/EQEP2A/HRCAP1
GPIO55/SPISOMIA/EQEP2B/HRCAP2
GPIO56/SPICLKA/EQEP2I/HRCAP3

GPIO20/EQEP1A/MDXA/COMP1OUT
GPIO21/EQEP1B/MDRA/COMP2OUT
GPIO23/EQEP1I/MFSXA/SCIRXDB
GPIO22/EQEP1S/MCLKXA/SCITXDB

GPIO12/TZ1/SCITXDA/SPISIMOB
GPIO13/TZ2/SPISOMIB
GPIO14/TZ3/SCITXDB/SPICLKB

GPIO8/EPWM5A/ADCSOCAO
GPIO9/EPWM5B/SCI_TXDB/ECAP
GPIO10/EPWM6A/ADCSOCBO
GPIO11/EPWM6B/SCI_RXDB/ECAP1
GPIO40/EPWM7A/SCI_TXDB
GPIO41/EPWM7B/SCI_RXDB
GPIO42/EPWM8A/TZ1/COMP1OUT
GPIO43/EPWM8B/TZ2/COMP2OUT

R36 1K

0.1u 0.1u 0.1u 0.1u

TMS320F28069MPZT

C24

GPIO39

GPIO34

2Y

1Y

UART

+3V3 +3V3

SN74LVC2G07

Roy Yaung

GND

2A

1A

U9

F28069_B

0.1u
GND

+3V3

GPIO16
GPIO17

GPIO44
GPIO50
GPIO51
GPIO52
GPIO53
GPIO24

GPIO44/MFSRA/SCIRXDB/EPWM7B 56
GPIO50/EQEP1A/MDXA/TZ1 42
GPIO51/EQEP1B/MDRA/TZ2 48
GPIO52/EQEP1S/MCLKXA/TZ3 53
GPIO53/EQEP1I/MFSXA 65
GPIO24/ECAP1/EQEP2A/SPISIMOB 97
GPIO16/SPI_SIMO_A/TZ2 55
GPIO17/SPI_SOMI_A/TZ3 52

GPIO39

GPIO34

GPIO32
GPIO33

GPIO30
GPIO31

GPIO28
GPIO29
GPIO15
GPIO58

GPIO25
GPIO26
GPIO27

66

GPIO39

GPIO34/COMP2OUT/COMP3OUT 68

GPIO32/SDA_A/EPWMSYNCI/ADCSOCAO99
GPIO33/SCL_A/EPWMSYNCO/ADCSOCBO100

GPIO30/CAN_RXA/EQEP2I/EPWM7A 41
GPIO31/CAN_TXA/EQEP2S/EPWM8A 40

GPIO25/ECAP2/EQEP2B/SPISOMIB 39
GPIO0/EPWM1A
GPIO26/ECAP3/EQEP2I/SPICLKB/USB0DP78
GPIO1/EPWM1B/COMP1OUT
GPIO27/HRCAP2/EQEP2S/SPISTEB/USB0DM77
GPIO2/EPWM2A
GPIO3/EPWM2B/SPISOMIA/COMP2OUT
GPIO28/SCI_RXDA/SDAA/TZ2 50
GPIO4/EPWM3A
GPIO29/SCI_TXDA/SCLA/TZ3 43
GPIO5/EPWM3B/SPISIMOA/ECAP1
GPIO6/EPWM4A/EPWMSYNCI/EPWMSYNCOGPIO15/ECAP2/SCI_RXDB/SPISTEB 88
GPIO58/MCLKRA/SCI_TXDB/EPWM7A94
GPIO7/EPWM4B/SCIRXDA/ECAP2

R37 1K

C35 C34 C33 C36

TP6

TP7

GND GND GND GND

DAC4

DAC3 TP5

DAC2

DAC1

TP8

44
95
96

GPIO12
GPIO13
GPIO14

PWM_DAC

PWM

87
86
84
83
9
10
58
57
54
49
74
73
82
76
1
8

GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
GPIO11
GPIO40
GPIO41
GPIO42
GPIO43

U1G$2

R38

330
R39

5
VCC
GND

LAUNCHXL-F28069M Overview
2

330
D9

14
D10

1
6

1.1

LAUNCHXL-F28069M Hardware
www.ti.com

Figure 5. LAUNCHXL-F28069_B_1400922 F28069_B Schematic

SPRUI11 January 2015


Submit Documentation Feedback

J1

J8

J5

A
B
I
PWR
GND

GND

QEP_A

1
2
3
4
5

+5V

J4

PWM_DAC
PWM_DAC

1PWM_AH
1PWM_AL
1PWM_BH
1PWM_BL
1PWM_CH
1PWM_CL
GPIO

PWR
ANA
FAULTn
OCTWn
GPIO
ANA
1SPI_CLK
GPIO

PWM_DAC
PWM_DAC

2PWM_AH
2PWM_AL
2PWM_BH
2PWM_BL
2PWM_CH
2PWM_CL

SCL
SDA

ANA
2SPI_CLK

40
39
38
37
36
35
34
33
32
31

1
2
3
4
5
6
7
8
9
10

DAC3
DAC4

GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
GPIO11

DAC1
DAC2

GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO13

ADCINA6
J1.3
J1.4
GPIO12
ADCINB6
GPIO18
GPIO22
GPIO33
GPIO32

+3V3

80
79
78
77
76
75
74
73
72
71

GPIO14
GPIO21
GPIO23
GPIO54

J7.3
J7.4
GPIO20

R13 1K
C50

J7

J3

+3V3

EQEP1A
EQEP1B
EQEP1I

GND

QEP_B

1
2
3
4
5

+5V

J2

RESET
1SPI_SI
1SPI_SO
1EN_GATE
1DC_CAL

GND
1SPI_CS
GPIO

PWR
GND
Vdc
V_A1
V_B1
V_C1
I_A1
I_B1
I_C1

J6

RESET
2SPI_SI
2SPI_SO
2EN_GATE
2DC_CAL

GND
2SPI_CS
GPIO

PWR
GND
Vdc
V_A2
V_B2
V_C2
I_A2
I_B2
I_C2
61
62
63
64
65
66
67
68
69
70

JP5

20
19
18
17
16
15
14
13
12
11

21
22
23
24
25
26
27
28
29
30

GND

EQEP2A
EQEP2B
EQEP2I

RESET#
GPIO16
GPIO17
GPIO50
GPIO51
GPIO55

GPIO19
GPIO44

GND

ADCINA7
ADCINB1
ADCINA2
ADCINB2
ADCINA0
ADCINB0
ADCINA1

GND

RESET#
GPIO24
GPIO25
GPIO52
GPIO53
GPIO56

GPIO27
GPIO26

GND

+5V

60
59
58
57
56
55
54
53
52
51

ADCINB7
ADCINB4
ADCINA5
ADCINB5
ADCINA3
ADCINB3
ADCINA4

+5V

GND

0R

GPIO30 R44

GND

P$4

P$1

P$5

P$8

EN

RS

GND
EQEP1A
EQEP1B
EQEP1I
EQEP2A
EQEP2B
EQEP2I

+5V

P$16
P$14
P$13
P$12
P$11
P$10

P$9

P$15

GND

B1
B2
B3
B4
B5
B6

GND

CANL

GPIO20
GPIO21
GPIO23
GPIO54
GPIO55
GPIO56

Roy Yaung

P$1
P$3
P$4
P$5
P$6
P$7

CANH

+3V3
P$8 R2 2.2k

P$6

P$7

GND

0.1u

CONNECTOR

A1
A2
A3
A4
A5
A6

OE

VCCA

P$2

CANL

U2
TXB0106PWR
VCCB

C37

CANH

+3V3
U3
SN65HVD234D

LEVEL SHIFT

0R

1
2
3

+3V3

GPIO31 R43

CAN

J9

C32

JP4

0.1u

41
42
43
44
45
46
47
48
49
50

R29 1K
0.001u
C51

R35
GND

1
2

R48 1K
0.001u
C52

10K
10K

PWR
ANA
FAULTn
OCTWn

0.001u

R42

P$3
VCC
GND
P$2

R49 1K
C53

1
2
3

J12
PGND

GND

R34
C31

R50 1K

120
0.1u

1
2

R51 1K
0.001u
C54

Copyright 2015, Texas Instruments Incorporated


0.001u

SPRUI11 January 2015


Submit Documentation Feedback
0.001u
C55

1.1

www.ti.com

LAUNCHXL-F28069M Hardware

Figure 6. LAUNCHXL-F28069_B_1400922 Connector Schematic

LAUNCHXL-F28069M Overview

15

ORG

GPIO58

GPIO29

GPIO15

GPIO28

GPIO58

GPIO15

MUX2

GPIO29

GPIO28

GND

TP29

TP28

TP27

GND

TP9

0.1u
0.1u

GND
+3V3

GND

P$3
P$4

P$1

P$8

P$3
P$4

P$1

P$8

P$5
P$6

P$1
P$10

P$1
P$5
P$2
P$4

P$12
P$14
P$15
P$11

P$6

IN
EN

NC

NO

2Y0
2Y1
2Y2
2Y3

1Y0
1Y1
1Y2
1Y3

INH

GND

U10

P$3

P$13

P$10
P$9

P$4
P$7

P$2
P$9

TP26

TP25

CH_SEL

SCI_TX

SCI_RX

MUX_SEL

J7.4

J7.3

SN74LV4052APW

2COM

1COM

+3V3

S0
S1

NO2
NC2

GND

IN2
COM2

IN1
COM1

EN

J1.4

P$5
P$2

OCTW_O

P$7

MUX_SEL

J1.3

FAULT_O

P$6

P$5
P$2

P$7

P$6

U16
TS5A23159DGSR

IN
EN

NC

NO

NO1
NC1

+3V3

GND1
GND2

COM

V+

U15
TS5A3153DCUR

GND1
GND2

COM

V+

0
1

GND
4

+3V3

GND
+3V3

GND

GND

+3V3

CH_SEL
U18A
SN74LVC1G04DCKR

GND
MUX_SEL

1
4

J7.4

0.1u

J1.4

U18P

Channel Description

J7.3

C9

J1.3

U14
SN74AHC1G32

U13
SN74AHC1G32

U4
SN74AHC1G02DBVR

+3V3

GND

Logic Choice

Roy Yaung

1.1

U16 Disable ; GPIO28&29 Fault & Octw ; GPIO15&58 UART.

U16 Disable ; GPIO28&29 Fault & Octw ; GPIO15&58 UART.

U11 & U15 Disable ; GPIO15&58 J7.3 & J7.4 ; GPIO28&29 UART .

UART Disable ; GPIO28&29 J1.3 & J1.4 ; GPIO15&58 J7.3 & J7.4 .

GND
TP1
4

OCTW_O TP4

FAULT_O TP3

MUX_SELCH_SEL

EN

R11

GND

2
1

GND

2
1

MUX_SEL

CH_SEL

+3V3

10K

U11
TS5A3153DCUR

JP6

C48
C49
GND

R3
JP7

+3V3

MUX_SEL

10K

0.1u
0.1u

MUX1

C7

0.1u

C46
C47

5
GND VCC
3
5
GND VCC
3

VCC

0.1u
C38

GND
0.1u

C42
P$8
V+

P$3 VP$16
VCC

Copyright 2015, Texas Instruments Incorporated


GND1
GND2

LAUNCHXL-F28069M Overview
P$8
P$7

5
GND VCC
3

5
3

16
GND

LAUNCHXL-F28069M Hardware
www.ti.com

Figure 7. LAUNCHXL-F28069_B_1400922 Logic Choice Schematic

SPRUI11 January 2015


Submit Documentation Feedback

LAUNCHXL-F28069M Hardware

GND

C41

10uF

D3

3
FB

1
SWITCH

SD

VIN
5

3.3uH

U12
LMR62421XMFE/NOPB

L6

GND

CDRH3D16/HPNP-3R3NC

820p

LP_5V

C25

30.1K

10K

1N5819HW-7-F

R17

R45
2

TP2

Vout = 5V
Iout = 0.5A

Power

Roy Yaung

1.1

www.ti.com

R14

GND

C8

4.7u

+3V3

10K

Figure 8. LAUNCHXL-F28069_B_1400922 Power Schematic

SPRUI11 January 2015


Submit Documentation Feedback

LAUNCHXL-F28069M Overview
Copyright 2015, Texas Instruments Incorporated

17

LAUNCHXL-F28069M Hardware

6.3

www.ti.com

PCB Layout
Figure 9 through Figure 14 shows the LAUNCHXL-F28069M PCB layout.

18

Figure 9. Top Silk

Figure 10. Top Copper

Figure 11. Inner Copper 1

Figure 12. Inner Copper 2

Figure 13. Bottom Silk

Figure 14. Bottom Copper

LAUNCHXL-F28069M Overview

SPRUI11 January 2015


Submit Documentation Feedback
Copyright 2015, Texas Instruments Incorporated

LAUNCHXL-F28069M Hardware

www.ti.com

6.4

Bill of Materials (BOM)


Table 6 lists the LAUNCHXL-F28069M bill of materials.
Table 6. LAUNCHXL-F28069M Bill of Materials

S No

Category

MPN

Per

Mfg.

Description

Package

PCB

LAUNCHXL-F28069M PCB

MCU

TMS320F28069MPZT

TI

MCU 32-bit C2000 C28x RISC 128KB Flash 3.3 V


100-Pin LQFP, customer supply

LQFP-100

Memory

93LC56BT-I/OT

Microchip

IC, EEPROM Serial-Microwire 2K-Bit 128 x 16 2 MHz,


93LC56BT-I/OT,SOT-23-6, SMD

SO-23-6

DC-DC

LMR62421XMFE/NOPB

TI

Conv DC-DC Single Step Up 2.7 V to 5.5 V 5-Pin SOT-23 SOT23-5


T/R, customer supply

DC-DC

TPS62162DSGR

TI

Conv DC-DC Single Step Down 3 V to 17 V 8-Pin WSON


EP T/R, customer supply

Logic

SN74AHC1G32DBVR

TI

Logic

TXB0106PWR

Logic

SN74LV4052APW

Logic

10

Value

Working
Voltage

Reference

4 layers PCB,Red Soldermask, white Silkscreen,


Immersion gold, 51 mm*130.5 mm,
LAUNCHXL-F28069M PCB
1.71~1.995 V

U1

2.5~5.5 V

U8

2.7 V to 5.5 V

U12

WSON-8

3 V to 17 V

U17

IC, Single 2-Input Positive-OR Gate,


SN74AHC1G32DBVR, SOT23-5, SMD, customer supply

SOT23-5

2~5.5 V

TI

IC, 6-BIT Bidirectional Voltage-Level Translator with


Auto-Direction Sensing and 15-kV ESD Protection,
TXB0106PWR, TSSOP-16, SMD, cusomer supply

TSSOP-16

1.2~5.5 V

U2

TI

Analog Multiplexer Dual 4:1 16-Pin TSSOP Tube,


customer supply

TSSOP-16

2~5.5 V

U10

SN74LVC2G07DBVR

TI

Buffer/Driver 2-CH Non-Inverting Open Drain CMOS


6-Pin SOT-23 T/R, customer supply

SOT23-6

1.65~5.5 V

U9

Logic

SN74LVC1G04DCKR

TI

IC, Single Inverter Gate, SN74LVC1G04DCKR, SC70-5,


SMD

SC70-5

1.65 V ~ 5.5 V

U18

11

Logic

SN74AHC1G02DBVR

TI

"IC, NOR Gate 1-Element 2-IN CMOS,


SN74AHC1G02DBVR,SOT23-5, SMD

SOT23-5

2 V ~ 5.5 V

U4

12

Interface

SN65HVD234D

TI

IC, 3.3 V CAN Transceiver with Sleep Mode,


SN65HVD234D,SOIC-8, SMD, customer supply

SO-8

3.3V

U3

13

Interface

FT2232HQ-REEL

FTDI

IC, Dual High Speed USB to Multipurpose UART/FIFO


IC,FT2232HQ-REEL, QFN-64, SMD

QFN-64

1.62 V to 1.98
V

U6

14

Interface

TS5A3153DCUR

TI

Analog Switch Single SPDT 8-Pin VSSOP T/R, customer


supply

VSSOP-8

1.65~5.5 V

U11, U15

15

Interface

TS5A23159DGSR

TI

Analog Switch Dual SPDT 10-Pin VSSOP T/R, customer


supply

VSSOP-10

1.65~5.5 V

U16

16

Isolator

ISO7231CDWR

TI

IC DGTL ISO 3CH CMOS 16SOIC, customer supply

SO-16

3.15~5.5 V

U7

17

Isolator

ISO7240CDWR

TI

IC DGTL ISO 4CH CMOS 16SOIC, customer supply

SO-16

3.15~5.5 V

U5

18

Thick film Resistor

RC0402JR-070RL

YAGEO

RES, 0R, 5%,1/16W, SMD0402

0402

0R

50 V

R15, R33, R43,


R44

19

Thick film Resistor

RC0402JR-07120RL

YAGEO

RES, 120R, 5%, 1/16W, SMD0402

0402

120R

50 V

R34

20

Thick film Resistor

RC0402JR-07330RL

YAGEO

RES, 330R, 5%, 1/16W, SMD0402

0402

330R

50 V

R26, R27, R38,


R39

SPRUI11 January 2015


Submit Documentation Feedback

2Kb

U13,U14

LAUNCHXL-F28069M Overview
Copyright 2015, Texas Instruments Incorporated

19

LAUNCHXL-F28069M Hardware

www.ti.com

Table 6. LAUNCHXL-F28069M Bill of Materials (continued)


Mfg.

Description

Package

Value

Working
Voltage

YAGEO

RES, 820R, 5%, 1/16W, SMD0402

0402

820R

50 V

R1, R4, R5,


R46

RC0402JR-071KL

YAGEO

RES, 1K, 5%, 1/16W, SMD0402

0402

1K

50 V

R22, R23, R36,


R37, R40, R41

Thick film Resistor

RC0402JR-072K2L

YAGEO

RES, 2K2, -5%, 1/16W, SMD0402

0402

2K2

50 V

R2, R6, R8,


R9, R10, R31

24

Thick film Resistor

RC0402JR-0710KL

YAGEO

RES, 10K 5%, 1/16W, SMD0402

0402

10K

50 V

R3, R11, R12,


R14, R35, R42,
R45

25

Thick film Resistor

RC0402FR-0712KL

YAGEO

RES, 12K, 1%,1/16W, SMD0402

0402

12K

50 V

R24

26

Thick film Resistor

RC0402FR-0730K1L

YAGEO

RES, 30K1, 1%, 1/16W, SMD0402

0402

30K1

50 V

R17

27

Thick film Resistor

RC0402JR-07100KL

YAGEO

RES, 100K, 5%, 1/16W, SMD0402

0402

100K

50 V

R47

28

Ceramic Capacitor

GRM1555C1H821JA01D

Murata

CAP, 820PF, 5%, C0G, 50 V, SMD0402

0402

820PF

50 V

C25

29

Ceramic Capacitor

GRM155R71C104KA88D

23

Murata

CAP, 100 NF, 10%, X7R,16 V, SMD0402

0402

100 NF

16 V

C7, C9, C12,


C13, C14, C16,
C24, C31, C32,
C33, C34, C35,
C36, C37, C38,
C39, C40, C42,
C43, C46, C47,
C48, C49

30

Ceramic Capacitor

GRM155R60J225ME15D

14

Murata

CAP, 2.2 F, 20%, X5R, 6.3 V, SMD0402

0402

2.2 F

6.3 V

C1, C2, C5,


C6, C19, C20,
C21, C22, C23,
C26, C27, C28,
C29, C30

31

Ceramic Capacitor

GRM32DR71E106KA12L

Murata

CAP, 10 F, 10%, X7R, 25 V, SMD1210

1210

10 F

25 V

C41, C44

32

Ceramic Capacitor

CC1210KKX5R7BB226

YAGEO

CAP, 22 F, 10%, X5R, 16 V, SMD1210

1210

22 F

16 V

C45

33

Ceramic Capacitor

GRM155R60J475ME47

Murata

CAP, 4.7 F, 20%, X5R, 6.3 V, SMD0402

0402

4.7 F

6.3 V

C8, C10, C11

34

Ceramic Capacitor

CL05A335MR5NNNC

Samsung

CAP, 3.3 F, 20%, X5R, 4 V, SMD0402

0402

3.3 uF

4V

C15

35

Ceramic Capacitor

GRM1555C1H360JA01D

Murata

CAP, 36 pF, 5%, C0G, 50 V, SMD0402

0402

36 pF

50 V

C17, C18

36

Inductor

CDRH2D18/HPNP-2R2NC

Sumida

Power Inductor, Magnetic shielded, 2.2 H, 1.6A, 0.06 ,


3.0 x 3.0 x 1.8 mm, SMD

3.0X3.0mm

2.2 H

L7

37

Inductor

CDRH3D16/HPNP-3R3NC

Sumida

Power Inductor, Magnetic shielded, 3.3 H,1.4A, 0.085 , 3.8X3.8mm


3.8 x 3.8 x 1.6 mm, SMD

3.3 H

L6

38

Ferrite Bead

BLM15AG601SN1D

Murata

Ferrite Bead, 60 @100 MHz, 25%, 300 mA,0.6 ,


SMD0402

0402

600

L1, L2

39

Ferrite Bead

BLM15PD600SN1D

Murata

Ferrite Bead, 60 @100 MHz, 25%,1700 mA, 0.06


,SMD0402

0402

60

L4

40

Ferrite Bead

BLM15AG221SN1D

Murata

Ferrite Bead, 220 @100 MHz, 25%, 300 mA, 0.6 ,


SMD0402

0402

220

L3

41

LED

19-217/R6C-AL1M2VY/3T

Everlight

LED, Brilliant Red, Water Clear, 20 mA, SMD0603

0603

S No

20

Category

MPN

21

Thick film Resistor

RC0402JR-07820RL

22

Thick film Resistor

23

Per

LAUNCHXL-F28069M Overview

1.7~2.3 V

Reference

D8, D9

SPRUI11 January 2015


Submit Documentation Feedback
Copyright 2015, Texas Instruments Incorporated

LAUNCHXL-F28069M Hardware

www.ti.com

Table 6. LAUNCHXL-F28069M Bill of Materials (continued)


S No

Category

MPN

42

LED

19-217/G7C-AN1P2/3T

43

LED

44

Diode

45

Per

Description

Package

Everlight

LED, Super Yellow Green, Water Clear, 20 mA,


SMD0603

0603

1.75~2.35 V

D1, D4

19-217/BHC-AN1P2/3T

Everlight

LED, Blue, Water Clear, 20 mA, SMD0603

0603

1.7~2.2 V

D7, D10

1N5819HW-7-F

Diodes

Diode,Schottky Diode, 1N5819HW-7-F, 40 V, 1A, SOD123,SMD

SOD-123

40 V

D3

Polyswitch

SMD1812P050TF

PTTC

Polyswitch, SMD1812P050TF, 15 V, Ihold=0.5A, Itrip=1A,


0.5 , SMD1812

1812

15 V

F1

46

Crystal

7D12000182BTAF60Q5

Interquip

Crystal, 7D12000182BTAF60Q5, 12 MHz, 20 PPM,


18PF, HC-49S, SMD

HC-49SMD

47

Pin Header

P6E02A-602530-B1

CHI-BAN

Connector, Pin Header, Straight, Male,1 x 2 Pin, 2.54 MM DIP


pitch, 6.06, 3.00, Gold Flash 1, black, DIP

JP1,JP2,JP3,J
P4,JP5,JP6,
JP7

48

Pin Header

P6E03A-602530-B1

CHI-BAN

Connector, Pin Header, Straight, Male, 1 x 3 Pin, 2.54


MM pitch, 6.06, 3.00, Gold Flash 1, black, DIP

DIP

J9,J12

49

Pin Header

P101-1*05SGF-116A-NX

Townes

Connector, Pin Header, Straight, Male, 1 x 5 Pin, 2.54


MM pitch, 6.06, 3.00, Gold Flash 1, black, DIP

DIP

QEP_A,
QEP_B

50

Pin Socket

CRD-081413-A-G

Major League

Connector, Pin Socket, Straight, Female, 2 x 10 Pin, 2.54


MM pitch, 8.5, 9.92, Gold Flash 1, black, DIP

DIP

J1,J2,J3,J4,J5,
J6,J7,J8

51

USB Connector

UBF11-03

JXT

Connector, MiniUSB AB port, 5 Position, Right Angle,


Gold Flash 1, black, SMD

SMD

CON1

52

Shunt

MJ501-EOGF-B-K

Townes

Connector, Shunt, 2Pin, 2.54 MM Pitch, 6 MM Height,


Gold Flash 1, black

53

Tacticle Switch

TP-1138K9-BE1125

Toneparts

Switch, Tacticle, 160gf 50gf, black housing, black


plunger, 6*6*4.3 MM, SMD

SMD-4

S2

54

DIP Switch

DSIC03LSGET

KE

Switch, DIP SWITCH, 3 Position, 2.54 MM Pitch, black


housing, white plunger, SMD

SMD

S1

55

Thick Film Resistor

RC0402FR-071KL

YAGEO

RES, 1K, 1%, 1/16W, SMD0402

0402

1K

50 V

R13,R29,R48R51

56

Ceramic Capacitor

GRM155R71H102KA01D

Murata

CAP ,1NF, 10%, X7R, 50 V, SMD0402

0402

1NF

50 V

C50-C55

57

ESD bag

Anti-static bag 180*130mm ,

Anti-static bag 180*130 mm

58

Label

700/SCH, Label,11mm*7mm

700/SCH Label,11 mm*7 mm

SPRUI11 January 2015


Submit Documentation Feedback

Value

Working
Voltage

Mfg.

12 MHz

Reference

Q3

U$1, U$2, U$9,


U$10, U$11,
U$12, U$13,

LAUNCHXL-F28069M Overview
Copyright 2015, Texas Instruments Incorporated

21

References

www.ti.com

References
The following documents describe the C2000 devices. Copies of these documents are available on the
Internet at http://www.ti.com/c2000 and www.ti.com/c2000-launchpad, or click on the links below:
TMS320F2806x Piccolo Microcontrollers Data Manual (SPRS698)
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066, TMS320F28065,
TMS320F28064, TMS320F28063, TMS320F28062 Piccolo MCU Silicon Errata (SPRZ342)
TMS320x2806x Piccolo Technical Reference Guide (SPRUH18)
TMS320C28x Extended Instruction Sets Technical Reference Manual (SPRUHS1)
TMS320C28x Instruction Set Simulator Technical Overview (SPRU608)
TMS320C28x Optimizing C/C++ Compiler v6.1 User's Guide (SPRU514)
TMS320C28x Assembly Language Tools v6.1 User's Guide (SPRU513)

22

LAUNCHXL-F28069M Overview

SPRUI11 January 2015


Submit Documentation Feedback
Copyright 2015, Texas Instruments Incorporated

Frequently Asked Questions (FAQ)

www.ti.com

Frequently Asked Questions (FAQ)


1. Can other programming and debug tools (such as an XDS510 emulator) be used with the C2000
LaunchPad?
While a user could potentially connect an external emulator to the F28069M device present on the
LaunchPad, it would require some rework of the board. It is recommended that users who want to use
an external emulator purchase a controlCard and docking station that includes an external JTAG
connector.
2. What versions of Code Composer Studio can be used to develop software for the C2000 LaunchPad?
It is highly recommend that novice users develop applications with Code Composer Studio v6. The
drivers, examples, and other associated software are tailored to make the user experience as smooth
as possible in Code Composer Studio v6.
3. Why cant I connect to the LaunchPad in Code Composer Studio?
There are a number of things that could cause this and they all have an easy fix.
Is S1 switch 3 in the down position?
This is the TRST pin that enables and disables JTAG functionality on the chip. This switch must be
in the up position for the emulator to be able to connect.
Are both power LEDs lit?
The board has two power domains because of the isolated JTAG interface. For low-voltage
application development, JTAG isolation is not needed and the power domains can be combined to
allow for convenience (that is, the board can be powered completely through the USB). Ensure that
jumpers are placed on the posts of JP1 and JP2.
Are drivers correctly installed for the XDS100v2 present on the LaunchPad?
Right click on My Computer and select properties. Navigate to the Hardware tab in the dialog box
and open the device manager. Scroll to the bottom of the list and expand the USB Serial Bus
controllers item. Are there two entries for TI XDS100 Channel A/B? If not, try unplugging and
replugging in the board. Does Windows give you any messages in the system tray? In Device
Manger, do either of the entries have a yellow exclamation mark over their icon? If so, try
reinstalling the drivers.
4. Why is the serial connection not working?
The most common cause of this is the serial muxing being set incorrectly. Ensure that JP7 has a
jumper placed on it while JP6 does not have a jumper before proceeding further.
Are you using the correct COM port?
Right click on My Computer and select properties. Navigate to the Hardware tab in the dialog box
and open the device manager. Scroll to Ports (COM & LPT) and expand this entry. Is there a USB
Serial Port listed? If so, read the COM number to the right of the entry; this is the COM number you
should be using.
Are you using the correct baud rate?
Most, if not all, of the examples are configured for a baud rate of 115200 when the CPU is running
at 60 MHz. If you have changed the PLL settings or written your own application you may have to
recalculate the baud rate for your specific application. For information on how to do this, see the
TMS320x2802x, 2803x Piccolo Serial Communications Interface (SCI) Reference Guide
(SPRUGH1).

SPRUI11 January 2015


Submit Documentation Feedback

LAUNCHXL-F28069M Overview
Copyright 2015, Texas Instruments Incorporated

23

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products

Applications

Audio

www.ti.com/audio

Automotive and Transportation

www.ti.com/automotive

Amplifiers

amplifier.ti.com

Communications and Telecom

www.ti.com/communications

Data Converters

dataconverter.ti.com

Computers and Peripherals

www.ti.com/computers

DLP Products

www.dlp.com

Consumer Electronics

www.ti.com/consumer-apps

DSP

dsp.ti.com

Energy and Lighting

www.ti.com/energy

Clocks and Timers

www.ti.com/clocks

Industrial

www.ti.com/industrial

Interface

interface.ti.com

Medical

www.ti.com/medical

Logic

logic.ti.com

Security

www.ti.com/security

Power Mgmt

power.ti.com

Space, Avionics and Defense

www.ti.com/space-avionics-defense

Microcontrollers

microcontroller.ti.com

Video and Imaging

www.ti.com/video

RFID

www.ti-rfid.com

OMAP Applications Processors

www.ti.com/omap

TI E2E Community

e2e.ti.com

Wireless Connectivity

www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2015, Texas Instruments Incorporated