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Photodetection
Stavros Iezekiel
Department of Electrical and
Computer Engineering
University of Cyprus
Photocurrent
In optical-to-electrical (O/E) conversion, our aim is to convert an incoming timevarying optical power into corresponding variations of electrical signal (current,
perhaps followed by transimpedance stage).
Slope is given by
responsivity
IP
(A/W)
PO
number of e hpairs
no. of incident photons
I q
= P
PO / hf
Quantum efficiency =
If we elect to use coherent detection, then we may use a local oscillator laser in
order to boost the sensitivity. Power handling will be important.
Responsivi ty =
=R
hc
q
Definitions used here: a photodiode is a one-port electrical device with an optical input
which is based on a semiconductor diode. A photodetector is a circuit containing a
photodiode as the front end followed by electronic amplification.
One consequence of this is that optical loss in dB is double the corresponding electrical loss
in dB (1 dBo = 2 dBe).
Note that the photodiode is actually classified as a square law device, since optical power
varies directly with the square of the electric field magnitude.
When using external modulation, high optical power handling capability may be
important, since increased CW laser power will improve the modulator slope efficiency.
The most obvious application is in multi-Gb/s optical links, based on direct detection of
intensity modulated light:
TX1
TX2
Transimpedance
Amplifier
TX3
Multiplexer
RX1
EDFA
RX2
RX3
DMUX
MUX
1, 2, 3 ..... N
N
Demultiplexer
RXN
1000
1998
100
10
Improving photonics
2008
Number of wavelength channels
2001
2003
2001
1998
2006
2003
1996
1995
1993
1977
1995
1
1986
1991
Improving electronics
0.1
0.01
0.1
10
1
Data rate per channel (Gb/s)
100
1000
Total
capacity
10
Photodiode Requirements
In terms of telecommunication applications, there has been a recent trend toward more
sophisticated techniques such as polarisation multiplexing. So far this hasnt translated
into the microwave photonic domain.
11
12
Vertical illumination
Lumped
Edge
illumination
TAXONOMY
Tapered
waveguide
p
i
n
p
i
n
p
i
n
p
i
n
Distributed
p
i
n
p
i
n
Electrode configuration
p
i
n
p
i
n
14
13
Vertical illumination
Improving
efficiency
PIN PD
TWPD
APD
Improving BW &
WGPD saturation current
Improving
efficiency
Improving
BW & saturation
current
Edge
illuminated
VMDP
UTC PD
Vertically
illuminated
Edge illumination
RCE PD
Distributed
Lumped
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15
Band Diagram
showing carrier
movement in E-field
BASIC PRINCIPLES OF
PHOTODETECTION PIN STRUCTURES
Light intensity as a
function of distance below
the surface
17
18
P( x ) = PO (1 )e ( )x
Id - Dark current
Unwanted component generated under no light
Leads to noise
Incident
optical power
Front-facet reflectivity
Reduced with anti-reflection
coating
19
20
C (m) =
hc
1.24
=
E g E g (eV)
Longer wavelengths do not have high enough photon energies to excite electrons from
the valence to the conduction band.
If the depletion width is w, the total power absorbed is:
PA = PO (1 ) 1 e
( ) w
)(
PA = PO (1 ) 1 + B e ( )w 1 e ( )w
e =
Responsivity
In some devices this can be increased through back reflection from the bottom metal
contact:
R=
I
photocurrent
= P
incident optical power PO
R=
q
hc
Units of A/W
21
22
24
23
absorption region
Bandwidth is limited by both transit time and RC product, which are both dependent
on thickness, as is quantum efficiency.
f 3dB
1
1
= 2 + 2
f
f
T
RC
1
2
2d 2 2A(R + R ) 2
S
L
+
=
3.5veh
d
1
2
n
+ve bias
photon
25
Recent attempts to improve both bandwidth and saturation current have focused on the
dual depletion region approach and the uni-travelling carrier (UTC) photodiode.
-ve bias
photon
absorption region
p
i
n
+ve bias
26
f 3dB =
f CR
f
1 + CR
ft
For the UTC, the absorption layer is constructed from p-type material followed by a
wide bandgap intrinsic layer, creating a barrier to hole transport. The UTC transit-time
limited bandwidth is governed by the electron diffusion time in the absorption p-layer.
Bandwidths into the THz range are now being reported.
28
27
Photodetector Noise
Photodiodes must detect very weak optical signals. Must
maintain an adequate signal to noise ratio:
SNR =
Photodiode noise is caused by statistical nature of photonelectron conversion process, while the amplifier noise is due
to thermal noise
30
29
photodiode
dark current noise
multiplication noise (only for APDs)
output
quantum noise
AMP
RL
thermal noise
amplifier noise
31
32
AMP
A
B
Comparator
vout B
C
RL
VREF
IP = Im + ip
mean value (DC)
signal component
33
34
iD2 = 2qBID
B = bandwidth
q = electron charge
iT2 = 4kTB / RL
k = Boltzmanns constant = 1.38110-23 J/K
T = absolute temperature in K
35
ip2
2qB(Im + ID) + 4kTBFn / RL
36
38
37
Typical SNR
plots for APDs
and PINs
APD = avalanche
photodiode
AVALANCHE PHOTODETECTION
40
39
Device is operated under reverse bias; relatively high voltages (20 V or more) needed to achieve the high
electric field in the avalanche region.
Most photons are absorbed in the depletion region, where they generate electron-hole pairs in much
the same way as in a pin photodiode. The resulting photocurrent is known as the primary photocurrent.
In the high field region, photogenerated carriers are accelerated and gain enough energy to ionise
covalent in the valance band if they collide, thus releasing more e-h pairs. This process of carrier
multiplication is termed impact ionisation. Newly created carriers are also accelerated by the high
electric field, gaining enough energy to cause further impact ionisation. This phenomenon leads to the
avalanche effect. In most devices, impact ionisation is confined to electrons alone.
The multiplication factor M for all carriers generated in the photodiode is:
M=
IM
IP
R=
q
M = R0 M
hf
41
42
Both a PIN and APD will have contributions from shot noise, dark current noise and
thermal noise, while an APD will also exhibit excess noise. However, for high values of
multiplication M, an APD will achieve the shot noise limit (or quantum limit).
m = M + mn
Mean gain
t
m1
m2
m3
Variable gain m:
Random variable,
zero mean
m5
m4
t
Photocurrent
Quantum and shot noise
are increased by excess noise
of APD (multiplication noise)
SNRAPD =
M 2 i p2
2qB(I m + I D ) M 2+ x +
SNRPIN =
4kTBFn
RL
i p2
2qB(I m + I D ) +
4kTBFn
RL
44
43
e ex L1 + r22 e ex L2 c L
2 c L
c L
cos(2 L + 1 + 2 ) + (r1r2 ) e
1 2r1r2 e
= (1 1 ) (1 e d )
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46
= (1 1 ) (1 e d )
1 + 2 e d
1 1 2 e
c d 2
= (1 R1 )d
1 + R2 e d
1 R1 R2 e c d
Compared to a conventional PIN PD, a higher quantum efficiency can be achieved for a
smaller absorption region.
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48
Responsivity: = (1 R )L
vh
L
IBM
BWtransit = 0.45
vh + ve
L+d
EDGE-COUPLED DEVICES
49
50
absorption region
photon
-ve bias
p
photon
absorption region
n
+ve bias
n
+ve bias
f 3dB =
f CR
f
1 + CR
ft
51
Optical Signal
Optical signal guided along device length and leaked into absorption region
(confinement factor )
Device is electrically and optically long, i.e. distributed:
Contact inductance and device capacitance forms transmission line structure
No longer limited by lumped RC time constants but velocity mismatch
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53
Electrical
Signal
Optical
Input
Discrete Devices
Allows much higher optical power handling than individual devices
Individual device capacitances act as periodic loads on transmission line
Optical waveguide and transmission line design may be optimised separately