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BTA416Y-800C
3Q Hi-Com Triac
10 June 2014
1. General description
Planar passivated high commutation three quadrant triac in a SOT78D (TO-220AB)
internally insulated plastic package intended for use in circuits where high static and
dynamic dV/dt and high dI/dt can occur. This "series C" triac will commutate the full RMS
current at the maximum rated junction temperature without the aid of a snubber. This
device has high Tj operating capability and an internally isolated mounting base.
3. Applications
Symbol
Parameter
VDRM
Conditions
Min
Typ
Max
Unit
800
ITSM
160
Tj
junction temperature
150
IT(RMS)
16
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BTA416Y-800C
NXP Semiconductors
3Q Hi-Com Triac
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
35
mA
35
mA
35
mA
Static characteristics
IGT
Tj = 25 C; Fig. 7
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 C; Fig. 7
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 C; Fig. 7
5. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
Simplified outline
T1
main terminal 1
T2
main terminal 2
gate
mb
n.c.
mb
Graphic symbol
T2
sym051
T1
G
1 2 3
TO-220AB (SOT78D)
6. Ordering information
Table 3.
Ordering information
Type number
BTA416Y-800C
BTA416Y-800C
Package
Name
Description
Version
TO-220AB
SOT78D
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7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VDRM
IT(RMS)
Min
Max
Unit
800
16
160
176
Fig. 2; Fig. 3
ITSM
I t
I t for fusing
tp = 10 ms; SIN
128
A s
dIT/dt
100
A/s
IGM
PGM
PG(AV)
Tstg
storage temperature
-40
150
Tj
junction temperature
150
003aab819
60
IT(RMS)
(A)
003aab820
20
IT(RMS)
(A)
50
16
40
12
30
8
20
4
10
0
10- 2
10- 1
0
- 50
1
10
surge duration (s)
Fig. 2.
BTA416Y-800C
50
100
150
T mb (C)
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003aab816
20
Ptot
(W)
16
12
conduction
angle
(degrees)
form
factor
a
30
60
90
120
180
4
2.8
2.2
1.9
1.57
= 180
120
90
60
30
0
0
10
12
14
16 I
18
T(RMS) (A)
= conduction angle
a = form factor = IT(RMS) / IT(AV)
Fig. 3.
ITSM
(A)
180
150
120
90
30
0
ITSM
IT
60
1/f
Tj(init) = 25 C max
102
10
n (number of cycles)
103
f = 50 Hz
Fig. 4.
Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
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003aab818
103
ITSM
(A)
(1)
102
ITSM
IT
10
10-5
tp
Tj(init) = 25 C max
10-4
10-3
10-2
tp (s)
10-1
tp 20 ms
(1) dIT/dt limit
Fig. 5.
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8. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-mb)
thermal resistance
from junction to
mounting base
1.9
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
60
K/W
003aab821
10
Zth(j-mb)
(K/W)
1
10- 1
P
10- 2
Fig. 6.
tp
10- 3
10- 5
10- 4
10- 3
10- 2
10- 1
10
tp (s)
Transient thermal impedance from junction to mounting base as a function of pulse duration
9. Isolation characteristics
Table 6.
Isolation characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Visol(RMS)
2500
Cisol
isolation capacitance
10
pF
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10. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
35
mA
35
mA
35
mA
50
mA
60
mA
50
mA
Static characteristics
IGT
Tj = 25 C; Fig. 7
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 C; Fig. 7
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 C; Fig. 7
IL
latching current
IH
holding current
VD = 12 V; Tj = 25 C; Fig. 9
35
mA
VT
on-state voltage
IT = 20 A; Tj = 25 C; Fig. 10
1.2
1.5
VGT
VD = 12 V; IT = 0.1 A; Tj = 25 C;
0.7
0.25
0.4
VD = 800 V; Tj = 125 C
0.1
0.5
mA
VD = 800 V; Tj = 150 C
0.4
mA
500
V/s
300
V/s
10
A/ms
A/ms
Fig. 11
ID
off-state current
Dynamic characteristics
dVD/dt
dIcom/dt
rate of change of
commutating current
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001aag165
3
IGT
IGT(25C)
2
001aag166
3
IL
IL(25C)
(1)
(2)
(3)
0
- 50
50
100
Tj (C)
0
- 50
150
Fig. 8.
50
100
Tj (C)
150
003aab822
50
IT
(A)
IH
IH(25C)
40
30
(1)
20
(2)
(3)
10
0
- 50
Fig. 9.
50
100
Tj (C)
150
0.5
1.5
VT (V)
Vo = 1.086 V; Rs = 0.017
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001aag168
1.6
VGT
VGT(25C)
1.2
0.8
0.4
- 50
50
100
Tj (C)
150
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SOT78D
A
A1
p
mounting
base
q
D1
L1
Q
b2
b1
b
e
10 mm
scale
A1
b1
b2
D1
ref
L1
ref
mm
4.7
4.3
1.40
1.25
0.9
0.6
1.4
1.1
1.72
1.32
0.6
0.4
16.0
15.2
6.5
10.3
9.7
2.54
14.0
12.8
3.0
3.7
3.5
2.6
2.2
3.0
2.7
0.2
OUTLINE
VERSION
SOT78D
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
07-04-04
07-07-10
TO-220
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BTA416Y-800C
NXP Semiconductors
3Q Hi-Com Triac
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Document
status [1][2]
Product
status [3]
Objective
[short] data
sheet
Preliminary
[short] data
sheet
Qualification
Product
[short] data
sheet
Production
[1]
[2]
[3]
Definition
12.2 Definitions
Preview The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
BTA416Y-800C
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3Q Hi-Com Triac
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards,
customer (a) shall use the product without NXP Semiconductors warranty
of the product for such automotive applications, use and specifications, and
(b) whenever customer uses the product for automotive applications beyond
NXP Semiconductors specifications such use shall be solely at customers
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors
standard warranty and NXP Semiconductors product specifications.
Translations A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
12.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, IC-bus logo, ICODE, ICODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight,
MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug,
TOPFET, TrenchMOS, TriMedia and UCODE are trademarks of NXP
Semiconductors N.V.
HD Radio and HD Radio logo are trademarks of iBiquity Digital
Corporation.
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13. Contents
1
Applications ........................................................... 1
10
Characteristics ....................................................... 7
11
12
12.1
12.2
12.3
12.4
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