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A Capacitive Accelerometer
Joel Voldman
Massachusetts Institute of Technology
Thanks to SDS and Tim Dennison (ADI)
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Outline
History
Structure
Design and modeling
Fabrication and packaging
Noise and accuracy
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Measurement choices
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Accelerometer types
> Open vs. closed loop sensing
Open loop: Measure change due to acceleration
Closed loop: A disturbance in a position control system
Resonant sensing
Measure change in resonant frequency
Due to position-dependent nonlinear spring
Accelerometer fundamentals
> Displacement and acceleration
are coupled together by a
fundamental scaling law
F ma
x= =
k
k
a
x= 2
an ,rms
4 k B T 0
=
mQ
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Accelerometer specifications
> Initial application arena was
automotive crash sensor
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Piezoresistive accelerometers
> Use piezoresistors to convert stress
in suspension beam change in
resistance change in voltage
Bulk micromachined
Glass capping wafers to damp and stop
motion
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Can be nonlinear
Parallel plate
> Differential
capacitors
One capacitor
increases while the
other decreases
Fixed
Interdigital
Fixed
Floating electrode
C1
C2
Differential overlap
Circuit model
>
> Output linear with gap
+Vs
0
C1
C2
V0
C1
C1 C2
V0 = VS +
VS
( 2VS ) =
C1 + C2
C1 + C2
for parallel-plate capacitors where
0
-Vs
Image by MIT OpenCourseWare.
Adapted from Figure 19.5 in Senturia, Stephen D. Microsystem Design.
Boston, MA: Kluwer Academic Publishers, 2001, p. 502. ISBN: 9780792372462.
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Third Mask
A. First silicon etching
Second Mask
Silicon
Third Mask
B. Second silicon etching
Third Mask
Silicon
Adapted from Figure 3 on p. 688 in Sasayama, T., S. Suzuki, S. Tsuch itaii, A. Koide,
M. Suzuki, T. Nakazawa, and N. Ichikawa. "Highly Reliable Silicon Micro-machined Physical
Sensors In Mass Production." The 8th International Conference on Solid-State Sensors and
Actuators and Eurosensors IX: digest of technical papers. June 25-29, 1995, Stockholm, Sweden.
Stockholm, Sweden: Foundation for Sensor and Actuator Technology, 1995, pp. 687-690. ISBN: 9789163034732.
Figure originally from Koide, A., K. Sato, S. Suzuki, and M. Miki. Technical Digest of the 11th Sensor Symposium:
June 4-5, 1992, Arcadia Ichigaya, Tokyo. Tokyo, Japan: Institute of Electrical Engineers of Japan, 1992, pp. 23-26.
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Thermal accelerometer
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Transimpedance circuits
> The simplest type of circuit measures the displacement current
in a capacitor using a transimpedance amplifier
iC
dVS
dQ
C dx
iC =
= C ( x, t )
+ VS
dt
dt
x VS dt
V
C dx
iC = VS
= 0
x VS dt
RF
Vs
+
-
C(x)
CP
V0
V0 = RFVS
C dx
x VS dt
constant
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Transimpedance circuits
CF
iC
Vs
+
-
RF
C(x)
CP
frequency of LP filter
iC =
V0
dV
dQ
C dx
= C ( x, t ) c + Vc
dt
dt
x Vc dt
VS = VS 0 cos(t ) = Re VS 0 e
j t
C dx
iC = C ( x, t ) j +
VS
x Vc dt
iC C ( x, t ) jVs
V0 = ic (C F // RF ) = ic
RF
1 + j C F RF
ic RF
ic
C ( x, t ) jVs
=
V0
jC F RF
j C F
j C F
V0
C ( x, t )
VS
CF
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Vx
C2
+
CP
-Vs
V0
C1 C2
V0 = Vx =
VS
C1 + C2 + CP
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
V0
C ( x, t )
VS (t )
CF
Voltage
0
V0
Time
Adapted from Figure 19.11 in Senturia, Stephen D. Microsystem Design. Boston, MA: Kluwer Academic Publishers, 2001, p. 508. ISBN: 9780792372462.
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Synchronous Demodulation
> Use a nonlinear circuit to multiply V0 by an in-phase sinusoid
> This demodulates to baseband
> Relative phase is important
Differential capacitor
Vs0 cos(t)
A
Signal
source
V0
Vd
LPF
Output
Vout
-1
Inverter
C ( x, t )
V0
VS
CF
Low-pass filter
Amplifier
Synchronous
demodulator
C ( x, t )
V0
VS 0 cos(t )
CF
Vd = V0 Vs = V0 Vs 0 cos(t + )
Allow phase shift
Vd =
Vout
C ( x, t ) 2
Vs 0 [cos( ) + cos(2t + )]
2C F
C ( x, t ) 2
=
Vs 0 cos( )
2C F
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Signal-to-noise Issues
V0
C ( x, t )
VS (t )
CF
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
> BUT
Entailed large infrastructure costs that essentially hemmed
future opportunities
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Fixed electrodes
Folded spring
Self-test region
(12 cells)
Anchor
Closer views
Image removed due to copyright restrictions. Figure 19.18 in Senturia, Stephen D. Microsystem
Design. Boston, MA: Kluwer Academic Publishers, 2001, p. 514. ISBN: 9780792372462.
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Even closer
Image removed due to copyright restrictions. Figure 19.19 in Senturia, Stephen D. Microsystem
Design. Boston, MA: Kluwer Academic Publishers, 2001, p. 515. ISBN: 9780792372462.
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Fabrication sequence
BPSG
LPCVD
Nitride
Ox
p
p- substrate
Circuit area
BPSG
n+
n+ runner
Sacrifical oxide
LPCVD
Nitride
Gate oxide
Ground plane
Sensor poly
Ox
p
n+ runner
Circuit area
Sensor area
p- substrate
n+
Sensor area
PECVD Nitride
Metallization
PECVD Oxide
BPSG
Ox
p
n+ runner
p- substrate
Circuit area
n+
Sensor area
Packaging
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Packaging
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
System diagram
V-
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Stiffness of springs
> Parallel-plate approximation to
C sense
y
42
60fF1
g0 y
g0
0 HL0
L1
L2
Folded
Motion
Unfolded
k2
5.6 N/m
3
3
6 ( 2 L1 ) + ( 2 L2 )
4
EWH
0 = 24.7 kHz
L1
L2
L2
L1
Almost rigid
Motion
Image by MIT OpenCourseWare.
Adapted from Figure 19.22 in Senturia, Stephen D. Microsystem Design. Boston,
MA: Kluwer Academic Publishers, 2001, p. 518. ISBN: 9780792372462.
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
accurately
Squeezed film damping between
fingers
Couette drag beneath proof mass
Complex actual geometry
Rough model gives Q =34, a poor
estimate
stationary
finger
proof mass
fluid
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
ADXL50
K ( s ) = K 0 (1 + s )
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
ADXL50
> Use feedback to get both
Critical damping (when ON)
Insensitivity to material
properties
K0
(1 + s )
F (s)
m
=
K k + K0
D( s)
b
s 2 + + 0 s +
m
m
m
K0
b
k + K0
4
+
=
m
m
m
K0
K0
b
2
+
m
m
m
0
K0
K0
+
Q
m
m
o.l .
K0
K0
1
2
m
m Qo.l .
K0
k
2
m
m
m
K0
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Vout
VS
=
+ aVS
2
offset
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Newer designs
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Figure 1 on p. 637 in Brosnihan, T. J., J. M. Bustillo, A. P. Pisano, and R. T. Howe. "Embedded Interconnect and Electrical Isolation for High-aspect-ratio,
SOI Inertial Instruments. In Transducers '97 Chicago: 1997 International Conference on Solid State Sensors and Actuators: digest of technical papers, June
16-19, 1997. Vol. 1. Piscataway, NJ: IEEE, 1997, pp. 637-640. ISBN: 9780780338296. 1997 IEEE.
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
> MEMS
Higher-aspect ratio structures lead to more squeezed-film
damping Q=1
ADXL40
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Summary
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].