PCB DESIGNING

A printed circuit box is a sheet of insulating material usually

Bakelite. On this sheet small holes are provided for
accommodating the different components of the circuit to be
assembled. The components are automatically connected
with the each other through copper strips embedded within
the sheet.

Each circuit has its

own PCB but the method of manufacturing is more or less the
same. The printed circuit boards consists of an insulating
substrates metallic circuit photo chemically formed upon that
substrate. Thus PCB provides sufficient mechanical support
and necessary electrical connection for an electrical circuit.
Inter-connection between components is achieved by means
of conductivity paths running on or through the substrate
called TRACK. Track meet components to which they are to be
connected by means of larger conductor area called a LAND
or PAD. The electrical connection between a land components
terminal is achieved by means of a solder. So, it means PCB
has two main parts:

(1) Track side

(2) Components side

PCB has mainly two types

(1) Single side PCB
(2) Double side PCB
 ADVANTAGES

1. Circuit characteristics can be maintained without

introducing variation in inter-circuit capacitance.
2. Components wiring and assembly can be mechanized
by ware soldering.
3. Mass production can be achieved at lower cast.
4. The size components assembly can be reduced with
corresponding decreases in weight.
5. Inspection time is reduced as probability of error is
eliminated.

DISADVANTAGES

1. As the copper strips are very thin they can carry little
hence PCB cannot be used
For heavy currents, because in that case the strips will
be heated and can cause problem.
2. Soldering need precautions as the risk of strips being
over heated and destroyed
is always there.
3. For big circuits, PCB cannot be used because it cannot
carry heavy components
the case and size of PCB in that case will be in tolerate.
 CHARACTERSTICS OF PCB
MATERIAL:-

Characteristics of copper lead laminated depend

on the characteristics of resin and filter used in its
manufacturing. Their various characteristics are described
below:

ELECTRICAL CHARACTERISTICS:

The impartial electrical characteristic are:-

Insulation resistance
Dielectric strength
Dielectric loss
Dielectric constant

PHYSICAL CHARACTERSTICS:

The impartial characteristics are:

Flexural strength
Water absorption
Wrap and theist
Punchabilty
Non inflammability or flame resistant.
 SURFACE TREATMENT OF PCB

For protection from harsh environment, surface

treatment of PCB is carried out. For the following is
done.

1. GREEN MASKING:
A mask of some green
lacquer is provided on the whole copper tracts except
the solder point. This has following advantages:

a) It is no hygroscopic and protects the PCB against

moisture and dampness.
b)It is fire retardant.
c) It has high working temperature and high insulation
resistance.

2. In place of Bakelite, glass or epoxy may be used,

it help in the protection of PCB against harsh
environment.

3. The copper tract is dipped into the solution of

Fe2, CI2, with few drops of HCL.

PRECAUTIONS WHILE SOLDERING A PCB

 The copper strips of a PCB are very thin during soldering
they may burn away due to over heating therefore the
following precaution should be kept in the mind.

1.Erase out the layer of insulation if any from the PCB.

2. For the wiring, use a soldering iron of lower voltage.
Usually 35W soldering iron is preferred.
3.Do not keep iron on strip for a time more than
required.
4.Use little solder so that the risk of short-circulating of
the joints with each with tinned wire.
5. If a trip break out do not fill it with solder but joints its
two ends with tinned wire

PCB FABRICATION

There are different type of processes are

used to fabricate a PCB but in this project we use
manual process. The step required for fabricating PCB
as follow:-

1. Firstly a piece of copper clad is selected and cut in a

size, which is being required with the help of hacksaw.
2. With the help of steel wool rub it on the PCB to avoid
an oxidation, which is due to temperature.
3. Draw a PCB layout of circuit on a paper .The trace a
layout on the PCB with the help of carbon paper.
 4. Then before etching with the help of photo resist
material is coated on the printed layout for removing
extra copper from the PCB instead of layout.
5. The etching process is performed by exposing the
surface of board to an etch ant solution which dissolve
away the exposed copper area there by leaving the
desired conductor pattern on the board. By using a
solution Ferric Chloride Cupric Chloride Chromatic
Acid and Alkaline Ammonia.
6. To remove photo resists material from the PCB we will
use Acetone and kerosene oil.
7. After that we check the continuity by using a by using
a multi-meter (DIGITAL MULTI-METER)
8. After that continuity process drilling process is started
after that we drill out the hole on PCB with the help of
hand-drill.
9. After the drilling process, solder the components on
PCB by using soldering iron , soldering wire and flux.

Precautions

1. Size of PCB must be accurate.

2. Draw PCB layout correctly before tracing
3. A layer of photo resist material should be accurate
and fine so that no short cut takes place.
4. Be careful when dip the PCB into the etch ant
solution.
5. Check the continuity carefully.

SOLDERING AND DESOLDERING

 For well over 50
years, using basically the some materials and essentially the
same procedure, technician have employed soldering as the
TIME THAT KINDS

In electronics
circuits. For a secure electrical and mechanical joints between
wires and components, nothing has replaced it, or is lightly to
in the foreseeable future, as an electronic technician, you will
need to know how to solder and do it well solder a liquid
bond.

Solder is an alloy of tin and lead. The idea nature

is 63% TIN & 37% dead with exact combination of tin and
lead. Result is good. Any movement of the components being
soldered while the soldered while the solder is in the range
will result in cold or bad solder joint. In electrical soldering the
alloy mixture is usually 60% tin & 40% dead. With this
mixture result will become accurate and solder is heated to
370 degree foraminate and molten upon solidifying the solder
from rigid, condition bond with the metal to which it has been
applying solder must be used with flux. Flux helps the solder
alloy flow around the joint being soldered. It also acts as
cleaning agent, decontaminating the components lead and
oily film.

SOLDER CONNECTION:

To solder in electronic project we

need solder iron, flux, solder. The purpose of iron is to heat
the joint to be fixed which melts the solder frequently and
connection takes place. After cleaning the joint to be
soldered, flux follows and then four steps complete soldering
connections:-

1. With iron apply heat to the connections.

2. Apply solder to the heated section.
3. Remove the solder after heating the connection.
4. Generally soldering is done on the printed circuit
board.

DESOLDERING:

Some times components are incorrectly

placed or no longer function, circuit changes are required. In
such case, desoldering reheating the joint. When the solder
reaches a molten state, it is withdrawn, leaving a solder free
connection. The three most common ways to withdraw molten
solder. Involve the use of desoldering bulb, pump, braid. The
desoldering bulb can be used with any soldering iron. The
bulb which has heat resistant Teflon tip, is squeezed and then
applied directly to reheated solder connection. When the
pressure is released, vaccum action sucks the solder up into
the bulb. The bulb can be disassembled and emptied at any
time.
 The desoldering pump is operated with
one hand. A spring-leaded piston creates a vacuum that
removes molten solder, desoldering braid is loosely woven.
Stranded braid of copper wire. A strip of braid of copper wire.
A strip of braid is placed over the solder joint and soldering
iron placed is also required to eliminate potential shorts
caused by solder balls, blobs, bridges further more poor
quality connection resulting from fractured overheated or
contaminated solder a necessitate desoldering. Desoldering
braid is widely employed for desoldering because it can be
used in practically any type of equipment.

The techniques for removing solder from

OC boards using desoldering braid are simple and
straightfortyard .to remove a solder bridge, place the braid
first on trace and heat, then on the opposite trace and heat
again.

To desolder a connection from a terminal

post. It is necessary to distribute heat from soldering iron
throughout the connection. Rock the soldering iron back and
forth over the braid to gain maximum solder absorption