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24AA256/24LC256/24FC256
Description
Block Diagram
A0 A1 A2WP
I/O
CONTROL
LOGIC
MEMORY
CONTROL
LOGIC
HV GENERATOR
EEPROM
ARRAY
XDEC
PAGE LATCHES
I/O
SCL
YDEC
SDA
Part
Number
VCC
Range
Max. Clock
Frequency
400 kHz
Temp.
Ranges
(1)
VCC
24AA256
1.8-5.5 V
24LC256
2.5-5.5 V
400 kHz
I, E
24FC256
2.5-5.5 V
1 MHz
SENSE AMP
R/W CONTROL
VSS
Package Types
PDIP/SOIC
A0
SCL
SDA
A1
A2
VSS
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
A0
A1
NC
NC
NC
A2
VSS
1
2
3
4
5
6
7
DFN
14
13
12
11
10
9
8
VCC
WP
NC
NC
NC
SCL
SDA
A0
A1
A2
VSS
8 VCC
24XX256
WP
A0
24XX256
VSS
VCC
24XX256
A2
24XX256
A1
TSSOP
TSSOP/MSOP *
7 WP
6 SCL
5 SDA
*24XX256 is used in this document as a generic part number for the 24AA256/24LC256/24FC256 devices.
Preliminary
DS21203J-page 1
24AA256/24LC256/24FC256
1.0
ELECTRICAL CHARACTERISTICS
1.1
DC Specifications
Param.
No.
Sym
D1
Characteristic
Min
Max
Units
D2
VIH
0.7 VCC
D3
VIL
0.3 VCC
0.2 V CC
V
V
VCC 2.5 V
VCC < 2.5 V
D4
VHYS
0.05 VCC
D5
VOL
0.40
D6
ILI
10
D7
ILO
10
D8
CIN,
COUT
Pin capacitance
(all inputs/outputs)
10
pF
400
ICC Write
mA
VCC = 5.5 V
D9
D10
Note:
ICCS
Hysteresis of Schmitt
Trigger inputs
(SDA, SCL pins)
Standby current
DS21203J-page 2
Preliminary
24AA256/24LC256/24FC256
1.2
AC Specifications
Param.
No.
Sym
FCLK
Characteristic
Min
Max
Units
Conditions
Clock frequency
100
400
1000
kHz
THIGH
4000
600
500
ns
TLOW
4700
1300
500
ns
TR
1000
300
300
ns
TF
300
100
ns
4000
600
250
ns
4700
600
250
ns
ns
(Note 2)
250
100
100
ns
10
4000
600
250
ns
11
4000
600
600
ns
12
4700
1300
1300
ns
13
TAA
3500
900
400
ns
14
TBUF
4700
1300
500
ns
15
TOF
10 + 0.1CB
250
250
ns
16
TSP
50
ns
17
TWC
18
Note
Endurance
ms
1,000,000
cycles
25C (Note 4)
Preliminary
DS21203J-page 3
24AA256/24LC256/24FC256
FIGURE 1-1:
SCL
SDA
IN
D4
10
6
16
14
13
SDA
OUT
WP
DS21203J-page 4
(protected)
(unprotected)
Preliminary
11
12
24AA256/24LC256/24FC256
2.0
PIN DESCRIPTIONS
TABLE 2-1:
2.1
Name
8-pin
PDIP
8-pin
SOIC
8-pin
TSSOP
14-pin
TSSOP
8-pin
MSOP
8-pin
DFN
A0
A1
(NC)
3, 4, 5
1,2
Not Connected
Function
A2
VSS
Ground
SDA
Serial Data
SCL
Serial Clock
(NC)
10, 11, 12
Not Connected
WP
13
VCC
14
2.3
2.2
2.4
3.0
FUNCTIONAL DESCRIPTION
Preliminary
DS21203J-page 5
24AA256/24LC256/24FC256
4.0
BUS CHARACTERISTICS
4.5
4.1
4.2
Note:
4.3
FIGURE 4-1:
(A)
4.4
Acknowledge
(B)
(D)
(D)
(C)
(A)
SCL
SDA
START
CONDITION
FIGURE 4-2:
ADDRESS OR
DATA
ACKNOWLEDGE ALLOWED
VALID
TO CHANGE
STOP
CONDITION
ACKNOWLEDGE TIMING
Acknowledge
Bit
1
SCL
SDA
DS21203J-page 6
Preliminary
24AA256/24LC256/24FC256
5.0
DEVICE ADDRESSING
FIGURE 5-1:
FIGURE 5-2:
CONTROL
CODE
Read/Write Bit
Chip Select
Bits
Control Code
S
A2
A1
A0 R/W ACK
Slave Address
Start Bit
5.1
Acknowledge Bit
CONTROL BYTE
CONTROL BYTE
FORMAT
A
2
A
1
A
0 R/W
A A A A A
14 13 12 11 10
A
9
CHIP
SELECT
BITS
A
8
A
7
A
0
Preliminary
DS21203J-page 7
24AA256/24LC256/24FC256
6.0
WRITE OPERATIONS
6.1
Byte Write
6.2
6.3
Write Protection
Page Write
The write control byte, word address and the first data
byte are transmitted to the 24XX256 in much the same
way as in a byte write. The exception is that instead of
generating a stop condition, the master transmits up to
63 additional bytes, which are temporarily stored in the
on-chip page buffer and will be written into memory
once the master has transmitted a stop condition. Upon
receipt of each word, the six lower address pointer bits
are internally incremented by one. If the master should
FIGURE 6-1:
BYTE WRITE
BUS ACTIVITY
MASTER
S
T
A
R
T
CONTROL
BYTE
AA
S1 0 1 0A
2 10 0
SDA LINE
BUS ACTIVITY
MASTER
SDA LINE
AAA
S10 1 0 2 1 00
DS21203J-page 8
S
T
O
P
DATA
P
A
C
K
A
C
K
A
C
K
PAGE WRITE
S
T
A
R
T
BUS ACTIVITY
ADDRESS
LOW BYTE
X
A
C
K
BUS ACTIVITY
FIGURE 6-2:
ADDRESS
HIGH BYTE
CONTROL
BYTE
ADDRESS
HIGH BYTE
ADDRESS
LOW BYTE
DATA BYTE 0
S
T
O
P
DATA BYTE 63
X
A
C
K
P
A
C
K
Preliminary
A
C
K
A
C
K
A
C
K
24AA256/24LC256/24FC256
7.0
ACKNOWLEDGE POLLING
FIGURE 7-1:
ACKNOWLEDGE
POLLING FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Did Device
Acknowledge
(ACK = 0)?
NO
YES
Next
Operation
Preliminary
DS21203J-page 9
24AA256/24LC256/24FC256
8.0
READ OPERATION
8.2
8.1
The 24XX256 contains an address counter that maintains the address of the last word accessed, internally
incremented by 1. Therefore, if the previous read
access was to address n (n is any legal address), the
next current address read operation would access data
from address n + 1.
Upon receipt of the control byte with R/W bit set to 1,
the 24XX256 issues an acknowledge and transmits the
8-bit data word. The master will not acknowledge the
transfer but does generate a stop condition and the
24XX256 discontinues transmission (Figure 8-1).
FIGURE 8-1:
8.3
S
T
A
R
T
SDA LINE
S 1 0 1 0 A A A 1
2 1 0
CONTROL
BYTE
FIGURE 8-2:
BUS ACTIVITY
MASTER
SDA LINE
P
A
C
K
BUS ACTIVITY
S
T
O
P
DATA
BYTE
Sequential Read
Sequential reads are initiated in the same way as a random read except that after the 24XX256 transmits the
first data byte, the master issues an acknowledge as
opposed to the stop condition used in a random read.
This acknowledge directs the 24XX256 to transmit the
next sequentially addressed 8-bit word (Figure 8-3).
Following the final byte transmitted to the master, the
master will NOT generate an acknowledge but will generate a stop condition. To provide sequential reads, the
24XX256 contains an internal address pointer which is
incremented by one at the completion of each operation. This address pointer allows the entire memory
contents to be serially read during one operation. The
internal address pointer will automatically roll over from
address 7FFF to address 0000 if the master acknowledges the byte received from the array address 7FFF.
CURRENT ADDRESS
READ
BUS ACTIVITY
MASTER
Random Read
N
O
A
C
K
RANDOM READ
S
T
A
R
T
CONTROL
BYTE
ADDRESS
HIGH BYTE
S1 0 1 0 AAA0
2 1 0
X
A
C
K
A
C
K
BUS ACTIVITY
S
T
A
R
T
ADDRESS
LOW BYTE
A
C
K
CONTROL
BYTE
S 1 0 1 0 A A A1
2 1 0
S
T
O
P
DATA
BYTE
P
N
O
A
C
K
A
C
K
FIGURE 8-3:
BUS ACTIVITY
MASTER
SEQUENTIAL READ
CONTROL
BYTE
DATA (n)
DATA (n + 1)
S
T
O
P
DATA (n + X)
DATA (n + 2)
SDA LINE
BUS ACTIVITY
DS21203J-page 10
A
C
K
A
C
K
Preliminary
A
C
K
A
C
K
N
O
A
C
K
24AA256/24LC256/24FC256
9.0
PACKAGING INFORMATION
9.1
Example:
24AA256
I/P017
0110
XXXXXXXX
XXXXXNNN
YYWW
Example:
XXXXXXXX
XXXXYYWW
NNN
24LC256
I/SN0110
017
Example:
XXXXXXXX
XXXXXXXX
YYWWNNN
24LC256
I/SM
0110017
Example:
8-Lead TSSOP
XXXX
XYWW
NNN
Legend:
Note:
XX...X
Y
YY
WW
NNN
4LD
I101
017
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard device marking consists of Microchip part number, year code, week code, and traceability
code. For device marking beyond this, certain price adders apply. Please check with your Microchip
Sales Office.
Preliminary
DS21203J-page 11
24AA256/24LC256/24FC256
Package Marking Information (Continued)
8-Lead MSOP
Example:
XXXXXX
4L256I
YWWNNN
101017
Example :
8-Lead DFN
XXXXXXXX
XXXXXXXX
YYWWNNN
24LC256
XXXXXXXX
0110017
14-Lead TSSOP
Example :
24LC256I
0110
017
XXXXXXXX
YYWW
NNN
Legend:
Note:
XX...X
Y
YY
WW
NNN
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard device marking consists of Microchip part number, year code, week code, and traceability
code. For device marking beyond this, certain price adders apply. Please check with your Microchip
Sales Office.
DS21203J-page 12
Preliminary
24AA256/24LC256/24FC256
8-Lead Plastic Dual In-line (P) 300 mil (PDIP)
E1
D
2
n
A2
A1
B1
p
eB
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
L
c
B1
B
eB
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
Preliminary
DS21203J-page 13
24AA256/24LC256/24FC256
8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
45
A2
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
h
L
f
c
B
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21203J-page 14
Preliminary
24AA256/24LC256/24FC256
8-Lead Plastic Small Outline (SM) Medium, 208 mil (SOIC)
E
E1
p
D
2
n
A2
f
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
L
f
c
B
MIN
.070
.069
.002
.300
.201
.202
.020
0
.008
.014
0
0
INCHES*
NOM
8
.050
.075
.074
.005
.313
.208
.205
.025
4
.009
.017
12
12
A1
MAX
.080
.078
.010
.325
.212
.210
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.78
1.97
1.75
1.88
0.05
0.13
7.62
7.95
5.11
5.28
5.13
5.21
0.51
0.64
0
4
0.20
0.23
0.36
0.43
0
12
0
12
MIN
MAX
2.03
1.98
0.25
8.26
5.38
5.33
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
Drawing No. C04-056
Preliminary
DS21203J-page 15
24AA256/24LC256/24FC256
8-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm (TSSOP)
E
E1
p
2
1
n
B
A
c
A1
A2
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
L
c
B
MIN
INCHES
NOM
MAX
8
.026
.033
.002
.246
.169
.114
.020
0
.004
.007
0
0
.035
.004
.251
.173
.118
.024
4
.006
.010
5
5
.043
.037
.006
.256
.177
.122
.028
8
.008
.012
10
10
MILLIMETERS*
NOM
MAX
8
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
2.90
3.00
3.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005 (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
DS21203J-page 16
Preliminary
24AA256/24LC256/24FC256
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E1
D
2
B
n
A2
A
c
A1
(F)
Units
Number of Pins
Pitch
Dimension Limits
n
p
Overall Height
NOM
MAX
8
0.65
.026
.044
.030
Standoff
A1
.002
.184
MIN
A2
Overall Width
MAX
NOM
MILLIMETERS*
INCHES
MIN
.034
1.18
.038
0.76
.006
0.05
.193
.200
0.86
0.97
4.67
4.90
.5.08
0.15
E1
.114
.118
.122
2.90
3.00
3.10
Overall Length
.114
.118
.122
2.90
3.00
3.10
Foot Length
.016
.022
.028
0.40
0.55
0.70
Footprint (Reference)
.035
.037
.039
0.90
0.95
1.00
Foot Angle
Lead Thickness
.004
.006
.008
0.10
0.15
0.20
Lead Width
.010
.012
.016
0.25
0.30
0.40
*Controlling Parameter
Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Drawing No. C04-111
Preliminary
DS21203J-page 17
24AA256/24LC256/24FC256
8-Lead Micro Leadframe Package (MF) 6x5 mm Body (DFN-S) (Formerly MLF-S)
E1
n
L
R
D1 D
D2
PIN 1
ID
EXPOSED
METAL
PADS
E2
TOP VIEW
BOTTOM VIEW
A2
A3
A
A1
INCHES
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
A
A2
A1
A3
E
E1
E2
D
D1
D2
B
L
R
MIN
.000
.152
.085
.014
.020
NOM
8
.050 BSC
.033
.026
.0004
.008 REF.
.194 BSC
.184 BSC
.158
.236 BSC
.226 BSC
.091
.016
.024
.014
MILLIMETERS*
MAX
MIN
.039
.031
.002
0.00
.163
3.85
.097
.019
.030
2.16
0.35
0.50
12
NOM
8
1.27 BSC
0.85
0.65
0.01
0.20 REF.
4.92 BSC
4.67 BSC
4.00
5.99 BSC
5.74 BSC
2.31
0.40
0.60
.356
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010 (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113
DS21203J-page 18
Preliminary
24AA256/24LC256/24FC256
8-Lead Micro Leadframe Package (MF) 6x5 mm Body (DFN-S) (Continued)
M
SOLDER
MASK
p
B
PACKAGE
EDGE
L
Units
Pitch
Dimension Limits
p
INCHES
MIN
NOM
MILLIMETERS*
MAX
MIN
.050 BSC
NOM
MAX
1.27 BSC
Pad Width
.014
.016
.019
0.35
0.40
0.47
Pad Length
.020
.024
.030
0.50
0.60
0.75
.005
.006
0.13
0.15
*Controlling Parameter
Drawing No. C04-2113
Preliminary
DS21203J-page 19
24AA256/24LC256/24FC256
14-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
A
c
A1
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
L
f
c
B
MIN
.033
.002
.246
.169
.193
.020
0
.004
.007
0
0
INCHES
NOM
14
.026
.035
.004
.251
.173
.197
.024
4
.006
.010
5
5
A2
MAX
.043
.037
.006
.256
.177
.201
.028
8
.008
.012
10
10
MILLIMETERS*
NOM
MAX
14
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
4.90
5.00
5.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005 (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
DS21203J-page 20
Preliminary
24AA256/24LC256/24FC256
ON-LINE SUPPORT
013001
Preliminary
DS21203J-page 21
24AA256/24LC256/24FC256
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this Data Sheet.
To:
RE:
Reader Response
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Application (optional):
Would you like a reply?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this data sheet easy to follow? If not, why?
4. What additions to the data sheet do you think would enhance the structure and subject?
5. What deletions from the data sheet could be made without affecting the overall usefulness?
8. How would you improve our software, systems, and silicon products?
DS21203J-page 22
Preliminary
24AA256/24LC256/24FC256
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
Examples:
/XX
Temperature
Range
a)
Package
b)
c)
Device:
24AA256:
24AA256T:
24LC256:
24LC256T:
24FC256:
24FC256T:
d)
a)
b)
c)
d)
Temperature Range:
Package:
I
E
=
=
P
SN
SM
ST
ST14
MF
MS
-40C to +85C
-40C to +125C
=
=
=
=
=
=
=
a)
b)
c)
24AA256-I/P:
Industrial Temperature,
PDIP package.
24AA256T-I/SN: Tape and Reel,
Industrial Temp., SOIC package.
24AA256-I/ST: Industrial Temperature,
TSSOP package.
24AA256-I/MS: Industrial Temperature,
MSOP package.
24LC256-E/P: Extended Temperature,
PDIP package.
24LC256-I/SN: Industrial Temperature,
SOIC package.
24LC256T-I/SN: Tape and Reel,
Industrial Temperature, SOIC package.
24LC256-I/MS: Industrial Temperature,
MSOP package.
24FC256-I/P:
Industrial Temperature,
PDIP package.
24FC256-I/SN: Industrial Temperature,
SOIC package.
24FC256T-I/SN: Tape and Reel,
Industrial Temperature, SOIC package
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
Preliminary
DS21203J-page23
24AA256/24LC256/24FC256
NOTES:
DS21203J-page 24
Preliminary
24AA256/24LC256/24FC256
NOTES:
Preliminary
DS21203J-page25
24AA256/24LC256/24FC256
NOTES:
DS21203J-page 26
Preliminary
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
DS21203J - page 27
M
WORLDWIDE SALES AND SERVICE
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05/16/02
DS21203J-page 28