Escolar Documentos
Profissional Documentos
Cultura Documentos
Secret
2015-10-16
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Secret
No part of this document may be reproduced or transmitted in any form or by any means without
prior written consent of Huawei Technologies Co., Ltd.
Trademark Notice
, HUAWEI, and
are trademarks or registered trademarks of Huawei Technologies Co.,
Ltd. Other trademarks, product, service and company names mentioned are the property of their
respective owners.
General Disclaimer
The information in this document may contain predictive statements including, without limitation,
statements regarding the future financial and operating results, future product portfolio, new
technology, etc. There are a number of factors that could cause actual results and developments to
differ materially from those expressed or implied in the predictive statements. Therefore, such
information is provided for reference purpose only and constitutes neither an offer nor an acceptance.
Huawei may change the information at any time without notice.
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Secret
Index
All rights reserved........................................................................................................................... 1
(for internal use only) ...................................................................................
Copyright Huawei Technologies Co., Ltd. 2015. All rights reserved. .................................... 2
Trademark Notice........................................................................................................................... 2
General Disclaimer ......................................................................................................................... 2
1
Information ............................................................................................................................. 9
1.1
1.2
Q: What is the different for application capability when choose rack server VS blade
server?
1.3
Q: What is the advantages when use blade instead of rack server? ............................ 10
1.4
Chassis ................................................................................................................................... 11
2.1
2.2
blades?
12
Information ................................................................................................................ 12
3.1.1
3.2
Q: Where can I get the detail specification of every kind of E9000 blades?....... 12
Computing ................................................................................................................. 13
3.2.1
3.2.2
3.3
Memory ...................................................................................................................... 13
3.3.1
Q: Which blades can support 1.5 times height DIMMs, is there any restriction? 14
Storage........................................................................................................................ 15
3.4.1
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3.4.2
3.4.3
3.4.4
3.4.5
3.4.6
Q:Do I need to add optional battery when I select RAID card that support Cache?
17
Q: Why I didnt see the RAID option list when I select CH242 in UNISTAR? . 17
3.4.7
3.5
Q:What is low-profile card? FHHL PCIe card? FHFL length card? Dual-slot card?
17
3.5.2
Q: How can CH121 support standard PCIe card? Is there any restrictions? ....... 19
3.5.3
3.5.4
Q: Which blades support standard PCIe card? And the limitation for PCIe cards?
20
3.5.5
3.5.6
Q: Does standard PCIe card on E9000 blades can support connecting cables? .. 22
3.6
Interfaces.................................................................................................................... 22
3.6.1
3.6.2
Q: How many standard USB ports can be support by E9000 blades? ................ 22
Information ................................................................................................................ 23
4.1.1
Q: Where can I get the detail specification of every kind of E9000 IO modules?
23
4.1.2
4.1.3
Q: Where can I get the suggestion for configuration of Mezz card and IO
modules? 23
4.1.4
Q: Where can I get the detail specification for E9000 network adapters? .......... 24
4.1.5
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Secret
4.1.6
4.1.7
4.2
Network Adpater....................................................................................................... 24
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
4.2.6
4.2.7
4.2.8
4.2.9
Q: How can I meet the requirement about IB connection for CH221 in HPC
project? 27
4.3
Q:Does the switch board support stacking? And what about inter-chassis stacking?
27
4.3.2
4.3.3
4.3.4
4.3.5
4.4
FC Switch ................................................................................................................... 29
4.4.1
4.4.2
4.4.3
4.4.4
Q: Does E9000 plan to provide FC switch board based on brocade switch? ...... 29
4.5
4.5.2
4.5.3
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4.5.4
4.6
Secret
4.6.1
4.6.2
4.6.3
5
Management .......................................................................................................................... 32
5.1
5.1.2
What is the username and password when I try to log in on LCD display? ........ 32
Engineering ........................................................................................................................... 33
6.1
PSU ............................................................................................................................. 33
6.1.1
6.1.2
6.2
6.2.2
6.2.3
Q: How can I evaluate the maximum power requirement with definite BOQ
configurations? .................................................................................................................... 34
6.3
Cooling ....................................................................................................................... 34
6.3.1
Q: Do E9000 blades support separate airflow paths for memory and CPU, for
Rack............................................................................................................................ 34
6.4.1
6.4.2
Q: Can we deliver the rack with E9000 chassis and blades installed? ................ 34
6.4.3
Q: How can I get the total weight when I make a BOQ configuration? .............. 35
7.2
Q: Where can I get the E9000 blades official certification record of VMware?........ 35
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7.3
Q: Where can I get the E9000 blades official certification record of XenServer? ..... 35
7.4
Q: Where can I get the E9000 blades official certification record of SUSE? ............ 35
7.5
Q: Where can I get the E9000 blades official certification record of Microsoft
Windows? ................................................................................................................................... 36
7.6
Q: Where can I get the E9000 blades official certification record of Microsoft
Hyper-V?36
7.7
Q: Where can I get the E9000 blades official certification record of Redhat? .......... 36
7.8
Q: Where can I get the E9000 blades official certification record of RHEV? ........... 36
7.9
7.10
7.11
8.2
Q: Where can I learn some basic concept and knowledge about FCOE? ................... 37
8.3
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Secret
Revise Record:
Version
Date
Remark
V1.00
2013-09-27
Initial Version
V1.01
2013-10-24
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Secret
1 Information
1.1
Resource
Type
Internal
or
public
website
Language
Links
Content
3MS
Internal
Chinese/English
http://3ms.huawei.com/mm/docNav/mmNavigate.do?method=showMMLi
st&tree_id=1-2-35626&node_id=1-2-35626&display_type=0
Then click E9000 on left side navigator bar
Marketing/Sales
materials
BG
website
Public
English
http://enterprise.huawei.com/en/products/itapp/server/index.htm?node=2
&child=0
Brochure/Channel
materials
Huawei
Support
Public
English
http://support.huawei.com/enterprise/productsupport?pid=19955022&idA
bsPath=7919749|9856522|9856786|19955022
Then click English on the top when you want to show English version.
Whitepaper/Manual
1.2
Q: What is the different for application capability when choose rack server
VS blade server?
A:
There is no essential difference for application capability when use rack or blades. The main
differences are the density and the physical connection way for communication:
Blade solution: The communication physical paths are physically fixed deployed by chassis and
mid plane
Rack solution: The communication physical paths are flexible deployed with with cables or
fibers
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1.3
Secret
A:
Installed in the chassis, blade servers shared share the network, I/O modules, MMs, PSUs, and heat
dissipation units to implement unified deployment:
Higher Density: Provided high server density, less time and space for server deployment.
More MaintainabilityLess time for installation; Easier cable layout and maintain; Central
management for multiple servers inside one chassis
Higher Availability: Less failure points; shared redundancy infrastructure like powers, fans, etc.
TCO reduce: Fewer number of fans, powers, cables, management access points, reduce the cost;
High efficient usage of shared fans, powers, cables, management boards, reduce the power
consume, and the cost for cooling.
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1.4
Secret
2 Chassis
2.1
A:
The 12U E9000 accommodates eight layers of compute nodes, with each compute node in the height
of 1.5U. This design provides the following advantages:
Provides excellent heat dissipation to support more DIMMs and high-performance processors
and even evolution of processors in the future. Intel's next-generation E5 series processors reach
a maximum power consumption of 145 W (10 W higher than the current ones), and the
next-generation E7 series processors reach a maximum power consumption of 165 W (10 W
higher than the current 155 W processors). In addition, with the same rate and capacity, DDR4
DIMM power consumption is reduced by 35% compared with the DDR3 DIMMs. In the future,
memory capacity of a server may increase by 100% with the memory rate increased by 75%
(1866 vs. 1066). The power consumption of the memory system will be two times that of the
current memory system. As power consumption of processors and DIMMs increase, the power
consumption of a single server blade will increase greatly. Most of the competitors' products
provide only 1U or 1.2U server blade slot space, which cannot meet requirements for processor
evolution in the future. The E9000, with its excellent heat dissipation, can protect customers'
investments.
Uses DIMMs at 1.5 times the usual height to provide high cost-effectiveness for large-memory
applications.
Provides sufficient space for installing standard PCIe cards, facilitating application acceleration.
Supports the design for accommodating three 2.5" or two 3.5" hard disks to support large-storage
applications, such as the HDFS.
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2.2
Secret
A: Yes. But there is a little restriction: Every 4 blades form a slot group, inside a slot group, same
form factor size blades are needed ,that means either 4 half-width blades or 2 full-width blades.
Different form factor size blades can deployed between different groups.
3 Blade specification
3.1
Information
3.1.1 Q: Where can I get the detail specification of every kind of E9000 blades?
A:
You can check the detail specification from the whitepaper of E9000 blades from Huawei Enterprise
Website:
http://support.huawei.com/enterprise/productsupport?pid=19955022&idAbsPath=7919749|9856522|9856786|19
955022
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Then click English on the top when you want to show English version.
WORD version was provided on 3MS website:
http://3ms.huawei.com/mm/docMaintain/mmMaintain.do?method=showMMDetail&f_id=SV130104
32030017
3.2
Computing
3.3
Memory
3.3.1 Q: Does E9000 blades support memory RAS features like ECCMemory
mirroringMemory Sparingchipkill4-bit error correction?
A:
First we should clarify the concepts:
Chipkill is proprietary memory RAS feature name for multiple-bit error correction in IBM
power-series CPU, the corresponding feature name on INTEL CPU is SDDC
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All these memory RAS features are supported by INTEL CPU originally, we just do some related
support during server mainboard design and BIOS development. E9000 have consider that during
design and have test these features, you can check the detail with table below:
Blade
ECC
SDDC
(Chipkill)
Memory
Sparing
Memory
Mirroring
CH121
Yes
Yes
Yes
Yes
CH220
Yes
Yes
Yes
Yes
CH221
Yes
Yes
Yes
Yes
CH222
Yes
Yes
Yes
Yes
CH240
Yes
Yes
Yes
Yes
3.3.2 Q: Which blades can support 1.5 times height DIMMs, is there any restriction?
A:
CH242 and CH140(Released soon) dont support 1.5 times height memory, other blades support
that.
There are restrictions for 1.5 times height DIMM:
You must make supply forecast planning before PO, since it need longer supply time than
normal DIMMs.
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3.4
Secret
Storage
is that hot-swappable ?
A: Yes, every single disk on CH222 is hot-swappable, since the disk-drawer is still power-connected
when draw out.
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Secret
3.4.4 Q: Does CH121 /CH220/CH221 support RAID card with RAID 5 function?
A: Yes.
CH121/CH220/CH221 can support RAID cards with LSI 2208 chip that provide RAID 5
function(This type RAID cards include RU320,SR320). But that is waste since there are only 2
HDD/SSD in these blades; so, this RAID card is not in option list for these blades by default. If you
actually need it, you can replace the RAID card option in BOQ with option from CH240s list.
Note: RAID cards with LSI2308 chip did not support RAID 5, this type RAID cards include RU120
and SR120.
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Secret
3.4.6 Q:Do I need to add optional battery when I select RAID card that support Cache?
A: Yes.
You must select the option with battery in normal scenarios, otherwise customer will lost the cache
data when blade power off in unexpected situation.(There is cached-RAID card option without
battery in UNISTAR, it is there because we have definite requirement from some few customers,
since their application was so special that not care about the lost of cache data, but they care about
money, so we give them the low-cost choice)
3.4.7 Q: Why I didnt see the RAID option list when I select CH242 in UNISTAR?
A: In the UNISTAR, there are 2 options for CH242 blade: one option already integrated RAID card
that support RAID 0/1, another option already integrated RAID card that support RAID
0/1/10/5/50/6/60 and 1GB cache. So no need to choose RAID card separately.
3.5
3.5.1 Q:What is low-profile card? FHHL PCIe card? FHFL length card? Dual-slot
card?
A: PCIe specification developed by PCI-SIG organization has prescribed the size of standard PCIe
card form factor:
PCIe Card Type
Height
Length
Slots
Low Profile
<=2.731 Inches
(<=68.90 mm)
<=6.6 Inches
(<=167.65 mm)
Single Slot
FHHL
Full Height Half Length
<=4.376 Inches
(<=111.15 mm)
<=6.6 Inches
(<=167.65 mm)
Single Slot
FHFL
Full Height Full Length
<=4.376 Inches
(<=111.15 mm)
<=12.283 Inches
(<=312 mm)
Single Slot
OR
Double Slots
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One example for FHFL single slot card: Huawei ES2000 SSD card
One example for FHFL dual-slot card: NVIDIA Tesla K20 GPU card
3.5.2 Q: How can CH121 support standard PCIe card? Is there any restrictions?
A: If standard PCIe card will be deployed inside CH121 or CH222, then you must add an optional
PCIe Riser card for CH121/CH222. You can see how the riser card and the PCIe card will be
installed inside the CH121/CH222.
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When PCIe riser card was added to CH121/CH222, there are restrictions:
The maximum memory DIMMs number that CH121/CH222 supported will reduce 6 (Spread on
2 memory channels), CH121/CH222 can support maximum 18 DIMMs with PCIe riser card.
The Standard PCIe card size will be limit to : Full height half size, single slot card.
3.5.4 Q: Which blades support standard PCIe card? And the limitation for PCIe cards?
A:
Blade
CH121
Stand PCIe
slots number
1 (option)
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Restriction
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CH220
4(Fixed)
CH221
2(Fixed)
CH222
1 (option)
CH240
Not support
--
--
CH242
1(Fixed)
No yeah
Note
R&D test one kind of PCIe card before official announcement of support that card, you can
check the current support list in UNISTAR, if the PCIe card you want to deploy didnt in the
list , please contact R&D to confirm.
Size
Application
Area
Blades that
support
Max Number
can be
deployed in
single blade
Compatibility
Verification
FH 7 length
single slot
VDI
CH220
CH221
4 per CH220
2 per CH221
Done
FH 9.5length
single slot
VDI
CH220
CH221
2 per CH220
2 per CH221
Done
Nvidia Grid K1
FHFL dual
slot
VDI
CH221
1 per CH221
Nvidia Grid K2
FHFL dual
slot
VDI
CH221
1 per CH221
FHFL dual
slot
HPC
CH221
1 per CH221
FHFL dual
HPC
CH221
1 per CH221
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slot
Note
FHFL: Full Height Full Length
3.5.6 Q: Does standard PCIe card on E9000 blades can support connecting cables?
A:Not support.
3.6
Interfaces
16MB graphics memory, maximum resolution is 1280*1024 under 60HZ with 16M true color
display.
3.6.2 Q: How many standard USB ports can be support by E9000 blades?
A:
There are 3 USB 2.0 interface with high density cable on blade panel, and there is 1 standard
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4 Network Specification
4.1
Information
4.1.1 Q: Where can I get the detail specification of every kind of E9000 IO modules?
A: You can check the detail specification from the whitepaper of E9000 IO modules from Huawei
Enterprise Website:
http://support.huawei.com/enterprise/productsupport?pid=19955022&idAbsPath=7919749|9856522|9856786|1
9955022
Then click English on the top when you want to show English version.
Editable WORD version was provided on 3MS website:
http://3ms.huawei.com/mm/docMaintain/mmMaintain.do?method=showMMDetail&f_id=SV130104
32030017
4.1.3 Q: Where can I get the suggestion for configuration of Mezz card and IO
modules?
A: You can get the typical configuration suggestion from the EXCEL table from 3MS link for E9000
IO guide in previous question.
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Secret
4.1.4 Q: Where can I get the detail specification for E9000 network adapters?
A: You can check the specification from the EXCEL table from 3MS link for E9000 IO guide in
previous question.
4.1.5 Q:Is there any clarification info for 15.6Tbps bandwidth of E9000
high-performance mid-plane?
A: Please refer to the presentation slide of E9000 IO guide (Link was provided in previous
question)
4.2
Network Adpater
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Secret
You may notice that there is 4 RJ45 GE ports on the panel of CX911, these ports are reserved for
with LOM, but no LOM now, so these GE ports is not usable now, it is reserved for future planning.
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Secret
1:NIC Mode: Every port could be splitted to 4 NICs.In this mode, 1 MZ510 can support up
to 8 NPARs, and 1 MZ512 can support up to 16 NPARS.
2:FCOE Mode: Every port could be splitted to 3*NIC + 1* FCOE. In this mode, 1 MZ510
can support up to 8 NPARs(Include 2 NPARs dedicated to FCOE), and 1 MZ512 can
support up to 16 NPARS(Include 4 NPARs dedicated to FCOE).
3: iSCSI Mode: Every port could be splitted to 3*NIC + 1*iSCSI. In this mode, 1 MZ510
can support up to 8 NPARs(Include 2 NPARs dedicated to iSCSI), and 1 MZ512 can
support up to 16 NPARS(Include 4 NPARs dedicated to iSCSI).
Bandwidth of each NPAR can be adjusted. The step is 100 Mbps, the maximum bandwidth is 10
Gbps, and the minimum bandwidth is 0 Gbps.All the bandwidth of 4 NPARs for a port can not be
over 10Gbps. For detail configruations steps to support NPARs, please refer to user guide about
MZ510/MZ512 on Huawei enterprise website.
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Secret
for standard PCIe card expansion slot) , so only Mezz1 of CH221 can be used to deploy network
mezz module by default.
Note:But in HPC projects, when used CH221 to support GPGPU/co-processors, customized
-configuration by PO of CH221 can be provided, the customized-CH221 can use Mezz2 to deploy IB
card. (Note: Customized CH221 need to be tracked by R&D now)
4.2.9 Q: How can I meet the requirement about IB connection for CH221 in HPC
project?
A: Please refer to the answer in previous question.
4.3
Ethernet Switch
4.3.1 Q:Does the switch board support stacking? And what about inter-chassis
stacking?
A: Please check the table below:
Switch Board
Stacking
Inter-chassis Stacking
CX110
Yes
CX310
Yes
CX311
Yes
CX312
Yes
CX911
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Not support yeah, planned to support L3 switch on new software version on 2013.12.
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4.4
Secret
FC Switch
4.4.4 Q: Does E9000 plan to provide FC switch board based on brocade switch?
A: E9000 plan to provide CX912 on 2013.12, and CX912 will integrated FC switch ODM from
brocade.
4.5
FCOE Switch
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remark
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Support
No
CX311
Support
Support
CX312
Support
No
Secret
The FCOE network that CX311 support (No need for rack FCOE switch):
Normal Ethernet Flow
FCOE Flow
FC Flow
CX311
10GE Switch
(FSB)
VN_port
CNA
10GE
Ethernet
10GE/FCOE
VF_port
Blade
FCF
8G FC
FC SAN
/Storage
F/E/N_port
Chassis
The FCOE network that CX310/CX312 support (Rack FCOE switch is needed):
CX310/312
10GE
VN_port
CNA
10GE
10GE/FCOE
SWTICH
(FSB)
Ethernet
Rack FCOE
Switch
VF_port
(FCF)
8G FC
Blade
F/E/N_port
FC SAN
/Storage
Chassis
FCOE Flow
FC Flow
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No any additional license, all features of FCOE Gateway switch module integrated on CX311
4.6
InfiniBand Switch
4.6.2 Q: What kind of fiber should I provide for IB? Single-mode or Multiple-Mode?
A:
No need.
IB is different than Ethernet, IB cables is provided with definite length and integrated
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5 Management
5.1
LCD display
5.1.2 What is the username and password when I try to log in on LCD display?
A: Use the username and password for MM910 management board.
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6 Engineering
6.1
PSU
Yes. All the power from 6 PSUs will be merged on the power mid-plane, then provide to
6.2
Power Supply
Plug Number
Max Chassis
supported
2*220V@32A,Single
phase
2 *220V@32A,Single phase
PDU
6.4KW
4*220V@32A,Single
phase
4 *220V@32A,Single phase
PDU
12.8KW
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2*380V@32A,three phase
PDU
19.2KW
Secret
6.2.3 Q: How can I evaluate the maximum power requirement with definite BOQ
configurations?
A: Use the power calculation tool to evaluate:
http://3ms.huawei.com/mm/docMaintain/mmMaintain.do?method=showMMDetail&f_id=SV121122
00360108
6.3
Cooling
6.3.1 Q: Do E9000 blades support separate airflow paths for memory and CPU, for
high efficient heat dissipation?
A:
Yes, inside the blade there are plastic airflow shields to construct separate airflow paths for
6.4
Rack
6.4.2 Q: Can we deliver the rack with E9000 chassis and blades installed?
A:
Not support. When E9000 delivered, the Rack/Chassis/blade will be packed separately.
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Secret
(CPUs/Memory DIMMs/HDDs will be installed on the blades before delivered, but the PCIe cards
will be packed separately.)
6.4.3 Q: How can I get the total weight when I make a BOQ configuration?
A: When you finish the configuration, please click on the statistic tab, then you can get the
information of weight.
A:
http://3ms.huawei.com/mm/docMaintain/mmMaintain.do?method=showMMDetail&f_id=SV130104
33470019
7.2
7.3
7.4
Q: Where can I get the E9000 blades official certification record of SUSE?
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7.5
7.6
Q: Where can I get the E9000 blades official certification record of Redhat?
7.7
Q: Where can I get the E9000 blades official certification record of RHEV?
7.8
A: RedHat confirm that no RHEV certification, so there is no official certification record for RHEV,
only RHEL certification record.
7.9
A:
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E9000 has done operational vibration and shock test, you can check the specification in E9000
whitepaper:
Operational vibration
Operational shock
But these testes cannot replace the earthquake resistance test (For example, the test that NEBS
required), so we cannot declare that what kind of grade earthquake that E9000 can resist.
Q: What is DCB?
A: DCB(Data Center Bridge) Enhanced lossless Ethernet, IEEE standards developed (IBM likes to
call it CEE instead, Cisco likes to use DCE instead). DCB network is a necessary prerequisite to
support FCOE networking. E9000's CX310/CX311/CX312 support DCB features. CX911 planned to
support DCB on 2013.12 with software upgrade. DCB network is: high bandwidth, low-latency,
lossless network with ethernet Jumbo frame support.
8.2
Q: Where can I learn some basic concept and knowledge about FCOE?
A:
You can learn some basic concepts and knowledge about FCOE from the slide from below 3MS link:
like FCOE, CNA,FSB, FCF, NPV,etc
http://3ms.huawei.com/mm/docMaintain/mmMaintain.do?method=showMMDetail&f_id=CIP12112
712340089
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8.3
Secret
A: A high-speed cluster communication network technology, commonly used in the field of HPC, the
technology in this field is leading by Mellanox company. The network has developed multiple
generations, the commond requirements in RFQ now is to support QDR(40Gbps), FDR(56Gbps) rate,
E9000 support QDR and FDR.
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