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Stellar - Two supplemental readings posted
Exam Two - Be the first in your living unit to study for it.
go : $ IC $ ID $ ID SI = strong inversion
!
* Only when we want to determine the maximum frequency to which
Clif Fonstad, 10/29/09 Lecture 14 - Slide 2
our designs can usefully operate must we include the capacitors.
LECs: Identifying the incremental parameters in the characteristics
ln iB, ln iC iC
iC
BJT: IC
Q
iB
" "
IC
Q go Inc. i B
vCE vCE
MOSFET: iD (iD)1/2
gm Inc. |v BS |
go Q !
Q
Inc. v GS
vDS
VT vGS = vDS
gm = diD/dvGS|Q; gmb = gm with = -dVT/dvBS|Q; go = diD/dvDS|Q
Clif Fonstad, 10/29/09 Lecture 14 - Slide 3
Building Blocks for Digital Circuits: inverters
A basic
V DD Performance metrics
Transfer characteristic
inverter v IN vOUT
Pull- Logic levels
Device: on or off Up Lo (0) Hi (1) Noise margins
Switch: open or Hi (1) Lo (0) Power dissipation
closed + Switching speed
+ vOUT Fan-in/Fan-out
vIN
Manufacturability
!
Logic gates V DD
Memory cell
V DD V DD
NOR: Pull-
NAND: Up
vA vB vOUT Pull- Pull- Pull-
Up vA vB vOUT
0 0 1 Up Up
+
0 1 0 0 0 1 +
+
1 0 0 + + 0 1 1 vA vOUT
vOUT
vA vB 1 0 1
1 1 0 +
vB
1 1 0
Flip-flop
Clif Fonstad, 10/29/09 Lecture 14 - Slide 4
!
!
V DD
Inverter metrics: Transfer characteristic
The transfer characteristic, vOUT vs vIN, is found Pull-
applying the large signal models at this node Up
iPU
Node equation : iPD = iPU
iPD +
# 0* +
% vOUT
vIN
% when v IN < VT ,PD
(
%%K v " V
)
2
2
iPD = $
PD IN T ,PD
V OUT
% when 0 < [v IN " VT ,PD ] < vOUT
% K (v " V
T ,PD " vOUT 2)vOUT
% PD IN
%& when 0 < vOUT < [v IN " VT ,PD ]
iPU : Depends on the specific pull - up device used.
For simplicity: = 1, = 0
* Note: We can say iPD is zero for the
! purpose of calculating a transfer
characteristic. For power we may V IN
want to use:
iPD,off = IS,s"t e
"VT nVt V DD
Clif Fonstad, 10/29/09 Lecture 14 - Slide 5
Inverter metrics: Transfer characteristic, cont.
V DD # K V 2
2
An example: NMOS % PU T ,PU
PD
PU saturated.
linear
vIN vIN
VT,PD VDD VT,PD VDD
Clif Fonstad, 10/29/09 Lecture 14 - Slide 6
Inverter metrics: Transfer characteristic, cont.
Combine the plots; write the node equation in each region and solve.
vOUT 0 = K PU [ VT ,PU " (VDD " vOUT ) 2](VDD " vOUT )
VDD
K PD (v IN " VT ,PD ) 2 = K PU [ VT ,PU " (VDD " vOUT ) 2](VDD " vOUT )
2
PD off, PD sat,
PU lin. PU lin.
VDD - |VT,PD!
|
K PD (v IN " VT ,PD ) 2 = K PU VT ,PU
2 2
2
PD sat.,
!
PU sat. K PD (v IN " VT ,PD " vOUT 2)vOUT = K PU VT ,PU
2
2
PD off,
PU sat.
! vOUT
PD lin.,
PU sat.
! VDD
vIN
2
0 = K PU VT ,PU 2 VT,PD VDD
VDD - |VT,PD|
vOUT = VDD
K PD
(VDD " vOUT ) " 2VT ,PU (VDD " vOUT ) + (v IN " VT ,PD ) = 0
2 2
! K PU
id,pd
+ gpd d
+ + pd
+ v OUT v gs = v in v ds = v out
v IN gm,pd v in go,pd
spd -- -s
pd
+ +
Stage 1
+ vOUT1 + vOUT2 = vIN1
vIN1 vIN2
- - - -
vOUT
Stable solution
vIN1 V HI
V DD Tipping point
vIN2 45
VM
Tipping point
45
Stable
V LO solution
vOUT2
vIN
V LO V 1L V M V 1H V HI
When the output goes from LO to HI, the load charge store must be
charged through the pull-up device. When the output goes from
HI to LO, it is discharged through the pull-down device.
V DD V DD
Pull- Pull-
iPU Up i
Up PU
iDischarge
+ ON +
OFF LO CL HI CL
+ + to
to LO to HI
HI to LO LO
HI iPD
! !
Inverter metrics: Power
Total Power:
Two components - static and dynamic (switching)
PTotal = PStatic + PDynamic
Static: V DD V DD
iPD + iPD +
+ vOUT + vOUT
vIN vIN
Dynamic: V DD V DD
1 2 1 2 1 2
CLVDD Dissipated, CLVDD Stored CLVDD Dissipated
2 2 2
2
Energy dissipated per cycle : CLVDD
PDynamic,ave = f CLVDD
2
( PD,off PU ,on ) DD
1
Total: PTotal = I + I V + f C V 2
L DD
2
!
Clif Fonstad, 10/29/09
! Lecture 14 - Slide 12
V DD V DD
MOS
inverters:
Pull- RL
5 pull-up Up Resistor
choices pull-up
+ +
CL
+ v OUT + v OUT
Generic v IN v IN
inverter
V DD V DD V DD V DD
V GG
(>>V DD )
+ + + + +
+ v OUT + v OUT + v OUT v IN v OUT
v IN v IN v IN
Charge i
Charging CL:
The charging
! Bigger current
current for the
CMOS, I ON = 0 faster vOUT change
various MOSFET
pull-up options
n-ch, d-mode
ION
resistor and n-ch, e-mode
w. V GG on gate
n-ch, e-mode
V DD on gate
vOUT
Clif Fonstad, 10/29/09 V DD Lecture 14 - Slide 15
V DD
Switching transients, cont.
Discharging CL: Pull-
Up i
This depends on the pull-up device,
PU
iDischarge
as well as the pull-down
ON +
The discharging current for the
HI CL
+ to
various pull-up options
LO to HI LO
iPD
i i PD = i Discharge + iPU
Discharging cycle:
iDischarge = iPD iPU
The discharge
n-ch, d-mode current (iDischarge)
ION is the difference
resistor and n-ch, e-mode
iPU!s w. V GG on gate between the upper
n-ch, e-mode curve (iPD) and the
V DD on gate appropriate lower
vOUT
V DD curve (iPU).
CMOS (i PU = 0)
Clif Fonstad, 10/29/09 * The input capacitance is 3x larger, but the interconnect capacitance Lecture 14 - Slide 21
is the same, so it depends on which of the two is dominant.
Switching transients: summary of charge/discharge currents
V DD V DD iPU = iCharge iPD = iDischarge + iPU
Resistor and E- RL V GG
mode pull-up (>>V DD ) iDischarge
ION ION
+ +
(VGG on gate) + v OUT iCharge v OUT v OUT
+ v OUT
v IN v IN
V DD V DD
V DD iPU = iCharge iPD = iDischarge + iPU
E-mode pull-up
(VDD on gate)
ION ION iDischarge
+
+
v IN
v OUT iCharge v OUT v OUT
V DD V DD
V DD iPU = iCharge iPD = iDischarge + iPU
D-mode pull-up
iDischarge
(called "NMOS")
+
ION ION
+ v OUT
iCharge v OUT v OUT
v IN
V DD V DD
V DD iPU = iCharge iPD = iDischarge + iPU
CMOS
iCharge iDischarge
+ +
v IN v OUT v OUT I v OUT
ION ON
V DD V DD
Clif Fonstad, 10/29/09 ION = 0 Lecture 14 - Slide 22
Comparisons made with same pull-down MOSFET, VHI, and ION.
MOS Technology: An abbreviated history
p-MOS:
In the beginning (mid-60s) there were only metal-gate p-channel e-
mode MOSFETs; n-channel MOSFETs came out d-mode. p-MOS
logic relied on saturated and linear e-mode pull-ups.
n-MOS:
With the development of <100> substrates, e-beam deposition, self-
aligned poly-Si gates, and ion implantation, initially to improve p-
MOS, it became possible to also reliably fabricate e-mode n-chan-
nel FETs. NMOS, with d-mode pull-ups, then took off (ca 1970).
CMOS:
It was clear for many years that CMOS inverters were superior, but
fabricating them reliably in high density and at low cost was a big
challenge. Eventually manufacturers learned how to make n- and
p-channel MOSFETS together in close proximity and economically
(ca 1980); CMOS then soon became the dominant IC technology
because of its superior low power and high speed.
For the past decade the industry has been fixated on systematically
making FETs smaller, circuits more dense, and wafers larger.*
Clif Fonstad, 10/29/09 Lecture 14 - Slide 23
* And with good reason; more next week in Lecture 17.
6.012 - Microelectronic Devices and Circuits
Lecture 14 - Digital Circuits: Inverter Basics - Summary
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