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SERVICE MANUAL
CHASSIS : LP91D
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
CONTENTS .............................................................................................. 2
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION................................................................11
BLOCK DIAGRAM...................................................................................17
Copyright 2009 LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS
Copyright 2009 LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it.
other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500F to 600F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500F to 600F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500F to 600F)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright 2009 LG Electronics. Inc. All right reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.
Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on IC
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright 2009 LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification
4.1 General Specification
No Item Specification Measurement Remark
1 Screen Size 42 wide Color Display Module Resolution:1920*1080
2 Aspect Ratio 16:9
3 LCD Module 42 TFT WUXGA LCD FHD
4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 80 %
5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6 Input Voltage AC100-240V~, 50/60Hz
250 W 42 FHD, 100Hz
7 LDC Module FHD 965.2x558.2x33
(Maker : LGD) 0.4845 x 0.42675
Coating 3H
Copyright 2009 LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. Chroma& Brightness (Optical)
5.1. LCD Module
the Color Coordinates check condition
- 50cm from the surface, Full White Pattern
- Picture mode Vivid
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 400 500 cd/m2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178/ 178 degree LGD CR > 10
3. Color Coordinates White Wx Typ 0.279 Typ LGD 42(FHD)
Wy -0.03 0.292 +0.03 LC420WUD-SBT1
RED Xr 0.637 (100Hz/Slim)
Yr 0.335
Green Xg 0.290
Yg 0.606
Blue Xb 0.145
Yb 0.062
4. Contrast ratio 1000:1 1400:1 LGD 42(FHD)
5. Luminance Variation 1.3
Copyright 2009 LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
7. RGB
9.1 Analog PC, RGB- DTV NOT SUPPORT
Specification
No Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model
8. HDMI Input
8.1 PC Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
Copyright 2009 LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range (2) Download steps
1) Execute ISP Tool program, the main window(Mstar ISP
This specification sheet is applied to all of the LCD TV, utility Vx.x.x) will be opened
LP91A/B/C/D chassis. 2) Click the Connect button and confirm Dialog Box
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 5 C of temperature and 6510% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) ADC Calibration RGB / Component
(3) Input Tool-Option/Area option.
(4) Check SW Version.
4. PCB assembly adjustment method 3) Click the Config. button and Change speed I2C Speed
setting : 350Khz~400Khz
4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
- LH70
Filexxx.bin
1
Filexxx.
Copyright 2009 LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
5) Click (2)Auto tab and set as below 4.2. Adjust tool/area option.
6) Click (3)Run. Adjust tool/area option refer to the BOM.
7) After downloading, you can see the (4)Pass message.
4.3. Adjust tool/area option.
Adjust tool/area option refer to the BOM.
4) After Finished the Download, Automatically DC Off -> On 4.4.3. RS-232C command Method
(1) Command : AE 00 10
* Caution
Dont connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of edid could be
failed.
Copyright 2009 LG Electronics. Inc. All right reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
4.4.4. EDID data 4.5. ADC Calibration
(1) HD MODEL 4.5.1. ADC Calibration - Component (Using External pattern)
<Analog(RGB): 128bytes> (1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
<HDMI 1 : 256Bytes>
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 )
<HDMI 3 : 256Bytes>
OK
Copyright 2009 LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
4.6. Input Tool-Option, Area Option. 5.3. Connecting diagram of equipment for
## TOOL Option, Area Option change and AC off measuring (For automatic adjustment)
Before PCBA check, you have to change the Tool option,
Area option and have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
4.6.1. Profile
: Must be changed the option value because being different
with some setting value depend on module maker, inch and
market
4.6.2. Equipment : adjustment remote control. * LP91A~D Support RS-232C & I2C DDC Communication-White
Balance Mode.
4.6.3. Adjustment method
The input methods are same as other chassis.(Use IN-START (1) Enter the adjustment mode of DDC
Key on the Adjust Remocon.) - Set command delay time : 50ms
(If not changed the option, the input menu can differ the - Enter the DDC adjustment mode at the same time heat-
model spec.) run mode when pushing the power on by power only key
* Refer to Job Expression of each main chassis assy - Maintain the DDC adjustment mode with same condition
(EBTxxxxxxxx) for Option value of Heat-run => Maintain after AC off/on in status of Heat-
* Never push the IN-STOP KEY after completing the function run pattern display)
inspection.
(2) Release the DDC adjustment mode
4.7. Check SW Version - Release the adjust mode after AC off/on or std-by off/on
(1) Method in status of finishing the Hear-run mode
1) Push In-star key on Adjust remote-controller. - Release the Adjust mode when receiving the aging off
2) SW Version check command(F3 00 00) from adjustment equipment.
Check SW VER : V3.xx LH70 - Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
Copyright 2009 LG Electronics. Inc. All right reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
Copyright 2009 LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
TROUBLESHOOTING
Fail
Check 24V, 12V, 5,2V Check short of Main B/D
of Power B/D or Change Power B/D
Pass
Fail
Check LED Assy Change LEDAssy
Pass
No Raster
[B]: Process
Pass
Pass
Pass
Pass
Pass
Copyright 2009 LG Electronics. Inc. All right reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
No Raster on PC Signal
Pass
Pass
Pass
Re-soldering or
Check the Input/Output
Change the defect part,
Of P401 Fail Check FFC cable
Pass
Pass
Pass
Pass
Pass
Check Input source
Cable And Jack
Check Input source
Cable And Jack
Pass
Re-soldering or
Check The input/Output Change the defect part
Of P401 Pass
Fail Check FFC Cable
Re-soldering or
Check the Input/Output
Pass Of IC300, IC301, JK302 Change the defect part
Fail
Check HDMI EDID Data
Re-download HDCP
Pass
Check the Input/Output Re-soldering or
Of IC800 Fail Change the defect part
Check the Input/Output Re-soldering or
Of IC800 Fail Change the defect part
Pass
Repeat [A], & [B] Process
Repeat [A], & [B] Process
Copyright 2009 LG Electronics. Inc. All right reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Pass Pass
Pass
Pass
Pass
Pass
Re-soldering or
Check the Input/Output Re-soldering or
Change the defect part Check the Input/Output
Of P401 Fail Check FFC Cable Change the defect part
Of P401 Fail Check FFC Cable
Pass
Pass
Check the Input/Output Re-soldering or
Of IC800 Change the defect part Check the Input/Output Re-soldering or
Fail
Of IC800 Fail Change the defect part
Pass
Pass
Repeat [A], & [B] Process
Repeat [A], & [B] Process
No Sound
Pass
Pass
Pass
Copyright 2009 LG Electronics. Inc. All right reserved. - 16 - LGE Internal Use Only
Only for training and service purposes
EEPROM DDC_SCL1/SDA1
IR TX
HDMI1 TMDS 24C02
HDMI_DATA_1 Serial Flash
HDMI2 TMDS
HDMI3 EEPROM HDMI_DATA_2 ( 8MByt e)
24C02 DDC_SCL1/SDA2
TMDS EEP_SCL/ SDAEEPROM
EEPROM
DDC_SCL1/SDA3 HDMI_DATA_3 f o r HDCP
24C02
( 8K)
- 17 -
COMP1_Y/ Pb / Pr:1/ 0. 7Vp p MEMC_RXC
COMP1_Y/ Pb / Pr: 1/ 0. 7Vp p MEMC_RXC3
COMP2_Y/ Pb / Pr:1/ 0. 7Vp p MEMC_RXE4 FRC IC
FULL HD LVDS co nnector
AV1_LIN/ RIN
MEMC_RXO4
AV1_VIN : 1Vp p
AV1_VIN
MNT_OUT AV2_LIN/ RIN :500mVrm s Serial Flash
AV2_LIN/ RIN URSA_[C~D]
AV1 AV2_VIN : 1Vp p
AV2_VIN
AV 2 MNT_VOUT: 1Vp p
MNT_VOUT M_SCL/ SDA
FRC LVDS c onnect or
400
900
541
570
540
571
804
800
805
803
530
550
200N
910
802
801
200
200T
A10
120
200N
LV2
122
121
500
LV1
310
300
560
580
A2
510
Copyright 2009 LG Electronics. Inc. All right reserved. - 18 - LGE Internal Use Only
Only for training and service purposes
Copyright
+5V_USB
R202 0
Non_OCP
OCP_READY
USB C
JK200 Pin to Pin with AC A
EAN43439401
KJA-UB-0-0037 KDS226
D213 R238
READY
0 R200 R203
A1 WP 2 4 FAULT/ ENABLE 3
2 7 R110 100 USB_DN
DDC_WP It s possibel D207 30V R204
A2 SCL READY 1KOCP_READY
3 6 R119 100
DSUB_SCL to 27~47ohm
VSS SDA 3 USB_DP
4 5 R120 100 0 R201
DSUB_SDA D208 30V
READY
5
SCHEMATIC DIAGRAM
A2
A1
A2
A1
+5V_HDMI_3
D301 D302
KDS184S KDS184S
R303 1K R314 1K
C
C
IC301 C IC302
CAT24C02WI-GT3 B CAT24C02WI-GT3
R301 10K C R312 10K
HPD_MST_2 B E
Q301
HPD_MST_3 Q302
2SC3875S R309 R311 C301 E2SC3875S A0 VCC R319 R320 C300
A0 1 8 VCC 10K 10K 0.01uF 1 8 10K 10K 0.01uF
A1 WP
A1 2 7 WP R327 100 2 7 R329 100
DDC_WP DDC_WP
A2 SCL
20 A2 3 6 SCL R304 100 20 3 6 R317 100
20 20
VSS SDA
VSS 4 5 SDA R305 100 4 5 R318 100
HPD 19 HPD 19
+5V_POWER 18 +5V_POWER 18
JP304
DDC/CEC_GND 17 DDC/CEC_GND 17
JP305
SDA 16 SDA 16
DDC_SDA2 DDC_SDA3
SCL 15 SCL 15
DDC_SCL2 DDC_SCL3
NC 14 NC 14
CEC 13 CEC 13
CEC CEC
CLK- 12 CLK- 12
TMDS2_RXC- TMDS3_RXC-
+5V_HDMI_1
HDMI1 +5V_MULTI +3.3V_MST
+5V_HDMI_1
A2
A1
D300
R302 1K KDS184S R315 R316
C
68K 56000
IC300 READY
CEC_READY
CAT24C02WI-GT3
R300 10K B C
HPD_MST_1 E Q303
Q300
2SC3875S A0 VCC R308 R310 C302 BSS83
1 8 10K 10K 0.01uF D303
CEC_READY MMBD301LT1G
30V CEC_READY
A1 WP
2 7 R331 100 D
DDC_WP CEC_C
A2
B R313
SCL 0
20 3 6 R306 100
G S CEC
20
VSS SDA
4 5 R307 100 D304
HPD 19 CDS3C30GTH
30V CEC_READY
+5V_POWER 18
JP302
DDC/CEC_GND 17
JP303
SDA 16
DDC_SDA1
SCL 15
DDC_SCL1
NC 14
CEC 13
CEC
CLK- 12
TMDS1_RXC-
CLK_SHIELD 11
CLK+ 10
TMDS1_RXC+
DATA0- 9
TMDS1_RX0-
DATA0_SHIELD 8
DATA0+ 7
TMDS1_RX0+
DATA1- 6
TMDS1_RX1-
DATA1_SHIELD 5
DATA1+ 4
TMDS1_RX1+
DATA2- 3 TMDS1_RX2-
DATA2_SHIELD 2
DATA2+ 1 TMDS1_RX2+
JK301
YKF45-7054V
EAG59023301
1 L411 500-ohm
ZD401
SUB_SCL
ESD_READY
2 L410 500-ohm
ZD402
SUB_SDA
ESD_READY
3 +3.3V_MST
R420 R421
4.7K 4.7K
4 L403 120ohm
C404
KEY1
C408
470pF 0.1uF
5 L406 120ohm
C412 C411
KEY2
470pF 0.1uF
9 +3.3V_MULTI_MST +3.3V_MST
11 R402 0
12 R403 0
13
15
P401
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
502500-7011
TXD
RXD
PC_G
PC_B
PC_R
PC_VS
PC_HS
SIDE_V
M_SCL
SIDE_C
M_SDA
+3.3V_MST
SIDE_Y
IR_OUT
+5V_MULTI
+5V_TUNER
COMP1_L
COMP1_R
COMP2_L
COMP2_R
SIDE_RIN
CVBS_VIN
MNT_VOUT
SIDE_LIN
MNT_LOUT
MNT_ROUT
CVBS_LIN
CVBS_RIN
PC_AUD_L
PC_AUD_R
TV_MAIN
COMP1_Y
COMP2_Y
MAIN_SIF
MUTE_LINE
DSUB_SCL
COMP1_PB
COMP1_PR
COMP2_PB
COMP2_PR
DSUB_SDA
S_VIDEO_DET
C615
0.1uF
C617
0.1uF
R604
3.3 C612
68uF35V
C620
68uF35V
C622
68uF35V
C627
68uF35V
AMP :GAIN X 4
+12V_AUDIO
C613
0.01uF IC701
+1.8V
L606 120-ohm +1.8V_AVDD C707
0.1uF
BST1B 44
VDR1B 43
R609 0 0.1uF
OUT1A_2 54
OUT1A_1 53
OUT1B_2 48
OUT1B_1 47
SW_RESET
PGND1A_2 56
PGND1A_1 55
PVDD1A_2 52
PVDD1A_1 51
PVDD1B_2 50
PVDD1B_1 49
PGND1B_2 46
PGND1B_1 45
R612 C R703 1K 7 OUT2 OUT3 8
READY 1 BST1A NC 42 B
22K
Q701 E
2 VDR1A VDR2A 41 RT1C3904-T112 C701
C608 C624 MNT_ROUT 6800pF
R601 100 1uF 1uF
MULTI_PW_SW R682 0 3 RESET BST2A 40 R701
C606 4.7K
READY 1000pF 4 AD PGND2A_2 39
15 DVSS_2
16 DVDD
17 SDATA
18 WCK
19 BCK
20 SDA
21 SCL
22 MONITOR_0
23 MONITOR_1
24 MONITOR_2
25 FAULT
26 VDR2B
27 BST2B
28 PGND2B_1
+3.3V_MULTI_MST P700
12507WR-06L
R744
0
+1.8V_DVDD C623 22000pF 1
C609 C610
10uF 16V 0.1uF 2
R733 0 3
BLT_DP
4
R734 0 5
0
0
0
100
100
0
SMAW250-04Q
6
R676
R677
R678
R602
R603
R656 0
READY
R673
7
1
SPK_R-
2
SPK_R+
3
SPK_L-
M_SCL
M_SDA
I2S_WS
4
I2S_SCK
I2S_SDO
SPK_L+
5
MULTI_PW_SW
C639
C638
33pF 33pF
50V 50V
READY READY
DDR2_A[3]
DDR2_A[7]
DDR2_A[9]
DDR2_A[5]
DDR2_A[1]
DDR2_A[8]
DDR2_A[6]
DDR2_A[4]
DDR2_A[2]
DDR2_A[0]
DDR2_A[12]
DDR2_A[10]
DDR2_A[11]
SERIAL FLASH 8M MX25L6405DMI-12G
POWER_SW
100HZ X 4.7K X 4.7K I2S_OUT
+3.3V_MULTI_MST
R867 1K
DDR2_CKE
DDR2_BA0
DDR2_BA1
DDR2_WEZ
DDR2_CASZ
DDR2_RASZ
DDR2_ODT
1 HOLD SCLK 16 +3.3V_MULTI_MST +3.3V_MULTI_MST +3.3V_MST R8020 10K
R8016:DSP_BSY
R8017:DSP_IRQ
SPI_CLK C811
C807 0.1uF
+3.3V_MST
+5VST_MST
0.01uF 2 VCC SI.SIO015 R8011 R898
AR812
56
AR813
56
AR814
56
AR815
56
AR800
56
SPI_DI 4.7K 4.7K
0.1uF
0.01uF
1K
SYS_RESET
CEC_C
PC_VS
PC_HS
IR
DSUB_SDA
RXD
TXD
KEY2
KEY1
MODEL_OPT1
MODEL_OPT2
BLT_DP
BLT_DN
TXD
RXD
EEP_SCL
EEP_SDA
RL_ON
I2S_SDO
I2S_SCK
I2S_WS
I2S_MCLK
PANEL_STATUS
3 NC_1 NC_8 14 +3.3V_LPLL_VDDP
10K
MODEL_OPT1 MODEL_OPT2
C844
C863
R868
R8010 R896
4.7K 4.7K
C817 15pF
C816 15pF
4 NC_2 NC_7 13 READY READY
R8003
+3.3V_MULTI_MST +1.8V
5 NC_3 +1.2V_VDDC_MST
NC_6 12
X801
12MHz
+3.3V_MULTI_MST
0
0
100
100
100
100
100
100
0
100
100
100
100
0.1uF
100
100
100
100
100
R878
56
4.7K
6 NC_4 NC_5 11
R877
R839
1M
R8035
R8034
R824
R825
R894
R8022
R8021
R826
R827
C883
R828
R829
R8012
R8016
R8017
4.7K
7 CS GND 10 C R8031
SPI_CZ B DDC_WP
E 10K +3.3V_AVDD_33_DM
HWRESET
CEC
VSYNC1
HSYNC1
VSYNC0
HSYNC0
IRIN
GPIO140 R895
GPIO139 R849
GPIO138
GPIO135 R850
GPIO134 R893
XIN
XOUT
AVDD_MPLL
SAR3
SAR2
SAR1
SAR0
USB0_DP
USB0_DM
GND_18
GND_17
UART1_TX/GPIO87
UART1_RX/GPIO86
UART2_TX/I2CM_SCK
UART2_RX/I2CM_SDA
SPDIFO
I2S_OUT_SD
I2S_OUT_BCK
VDDC_7
GND_16
VDDP_5
I2S_OUT_WS
I2S_OUT_MCK
I2S_IN_SD
I2S_IN_BCK/GPIO68
I2S_IN_WS/GPIO67
VDDC_6
A_MCLKE R852
A_MADR[3]
A_MADR[7]
A_MADR[12]
A_MADR[9]
A_MADR[5]
AVDD_DDR_6
A_MADR[10]
A_MADR[1]
A_BADR[0]
A_BADR[1]
A_WEZ
A_MADR[11]
A_MADR[8]
A_MADR[6]
GND_15
A_MADR[4]
A_MADR[2]
A_MADR[0]
A_CASZ
A_RASZ
A_ODT
MVREF
AVDD_MEMPLL
GND_14
8 SO/SIO1 WP/ACC 9 Q805
SPI_DO RT1C3904-T112
256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
R851 10RXBCKN 1 192 B_MCLKZ R843 33
TMDS2_RXC- DDR2_MCLKZ DDR2_D[0-15]
HDMI_2
IC801 L800 TMDS2_RX1+
MLB-201209-0120P-N2 AVDD_33_1 8 185 B_MDATA[13] AR806 DDR2_D[13]
24LC256-I/SM +3.3V_MULTI_MST +3.3V_AVDD_33_DM B_MDATA[10]
+3.3V_MULTI_MST C833 0.1uF TMDS2_RX2- R869 10 RXB2N 9 184 56 DDR2_D[10]
C866 C867 R871 10 RXB2P 10 183 GND_13 DDR2_D[8]
L801 TMDS2_RX2+
A0 VCC 16V 10uF 0.1uF MLB-201209-0120P-N2 RXACKN B_MDATA[8]
1 24C64_Normal 8 +3.3V_AVDD_AU TMDS1_RXC- R872 10 11 182 DDR2_D[15]
R873 10RXACKP 12 181 B_MDATA[15]
C803 TMDS1_RXC+ AVDD_DDR_4
A1 WP 0.01uF L802 TMDS1_RX0- R874 10 RXA0N 13 180
2 7 R8027 R8028 +3.3V_LPLL_VDDP B_DDR2_DQSB[1]
TMDS1_RX0+ R879 10 RXA0P 14 179 DDR2_DQS1M
4.7K 4.7K MLB-201209-0120P-N2 AVDD_33_2 B_DDR2_DQS[1]
15 178 DDR2_DQS1P
A2 SCL GND_12
3 6 R812 0 C815 0.1uF TMDS1_RX1- R880 10 RXA1N 16 177
EEP_SCL
HDMI_1
R890 10 RXA1P 17 176 VDDP_4 C849 0.1uF
TMDS1_RX1+
VSS SDA GND_1 18 175 AVDD_DDR_3
4 5 R813 0 B_DDR2_DQSB[0]
EEP_SDA TMDS1_RX2- R891 10 RXA2N 19 174 DDR2_DQS0M
R892 10 RXA2P 20 173 B_DDR2_DQS[0]
TMDS1_RX2+ DDR2_DQS0P
HOTPLUGA 21 172 GND_11
HPD_MST_1
R840 390 REXT 22
IC800 171 B_DDR2_DQM[0]
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
C839 0.01uF
RESET R845 22K
SDI
SCZ
SCK
SDO
AUL0
AUL1
AUL2
AUL3
AUL4
AUR0
AUR1
AUR2
AUR3
AUR4
C841 0.01uF
PWM0
PWM1
PWM2
PWM3
RXC0P
RXC1P
RXC2P
LVA4P
LVA3P
LVA2P
LVA1P
LVA0P
GND_4
GND_5
GND_6
RXC0N
RXC1N
RXC2N
GPIO20
AUVRP
AUVAG
AUCOM
VDDP_1
VDDP_2
VDDC_2
VDDC_3
RXCCKP
LVACKP
RXCCKN
USB1_DP
R8037
USB1_DM
DDCA_CK
DDCA_DA
AVDD_AU
AVDD_DM
UART2_TX
UART2_RX
0
HOTPLUGC
DDCDB_CK
DDCDC_CK
DDCDA_CK
DDCDB_DA
DDCDC_DA
DDCDA_DA
100
100
100
100
0 READY
0
0
100
10
10
100
10
10
2.2uF
2.2uF
2.2uF
2.2uF
2.2uF
2.2uF
2.2uF
2.2uF
0.1uF
2.2uF
2.2uF
0.01uF
D801
POWER_DET
KDS181 +5VST_MST
R885 150 D802
C823
C824
C801
C872
C802
C873
C874
C875
C808
C821
C822
C840
KDS181
C882
R822
R823
C876
R841
R848
R899
R8013
R8030
R8023
R8024
R8025
R8026
R8033
R806
R870
R8039
R801
R805
R8040
R820
R821
R860 1K
AR818
33
R855
R8036 10K
10K C870
READY 47uF 25V MULTI_PW_SW
C
R853 Close to IC as close as possible
I-DIM
1K
E-DIM
B Q803
SPI_DI
SPI_CZ
SPI_DO
+1.2V_VDDC_MST
USB_DP
RT1C3904-T112
SPI_CLK
Q800
COMP1_L
COMP2_L
COMP1_R
COMP2_R
+5VST_MST
CVBS_LIN
CVBS_RIN
DDC_SCL1
DDC_SCL2
DDC_SCL3
PC_AUD_L
DSUB_SCL
POWER_DET
PC_AUD_R
DDC_SDA1
DDC_SDA2
DDC_SDA3
DSUB_SDA
1K C8000 E
TMDS3_RX0-
TMDS3_RX1-
TMDS3_RX2-
TMDS3_RXC-
TMDS3_RX0+
TMDS3_RX1+
TMDS3_RX2+
E 16V
MEMC_RXE0-
MEMC_RXE1-
MEMC_RXE2-
MEMC_RXE3-
MEMC_RXE4-
TMDS3_RXC+
MEMC_RXEC-
MEMC_RXE0+
MEMC_RXE1+
MEMC_RXE2+
MEMC_RXE3+
MEMC_RXE4+
READY
MEMC_RXEC+
B +1.2V_VDDC_MST
C HDMI_3
SW800 SYS_RESET C857 C859 C879 C880 C881
R886
USB PART USB_DN
2
0 R8043
2K
R8000 SPK_N +3.3V_MULTI_MST
3 1
4
10K 0 MEMC_RESET R8008 0 +1.8V
10uF 16V
0.1uF
1000pF
4.7uF
C812 R8045
READY R863 4.7K R811 R883
4.7uF 1K 1K
R888 100 R864 4.7K READY
+3.3V_MULTI_MST
C809
C813
C818
C820
SPK_N
0 R8044 0
R8046 R889 R884
C864 C858 C860 C862 C865
Close to IC
with width trace
[MODE SELECTION]
Close to DDR2 IC
1K
VREF J2 G8 DQ0
DQ1
R907
G2
J2 VREF DQ0 G8 DDR2_D[0] DQ2
C904 C905 C918 A0 H7
M8
1K
0.01uF 1000pF 0.1uF H3 DQ3
DQ1 G2 DDR2_D[1] A1 M3
50V DQ4
R908
A2 H1
M7 DQ5
A3 H9
DQ2 H7 DDR2_D[2] N2 DQ6
DDR2_A[0] A4 F1
M8 A0 N8 DQ7
A5 F9
DQ3 H3 DDR2_D[3] N3 DQ8
DDR2_A[1] A6 C8
M3 A1 N7 DQ9
A7 C2
DQ4 H1 DDR2_D[4] P2 DQ10
DDR2_A[2] A8 D7
M7 A2 P8 DQ11
A9 D3
DQ5 H9 DDR2_D[5] P3 DQ12
DDR2_A[3] A10/AP D1
N2 A3 M2 DQ13
A11 D9
DQ6 F1 DDR2_D[6] P7 DQ14
DDR2_A[4] A12 B1
N8 A4 R2 DQ15
B9
DDR2_A[5] DQ7 F9 DDR2_D[7]
N3 A5 BA0 L2
DQ8 C8 DDR2_D[8] BA1
DDR2_A[6] L3 VDD5
N7 A6 A1
DQ9 C2 DDR2_D[9] E1 VDD4
DDR2_A[7] CK J8 VDD3
P2 A7 J9
DQ10 D7 DDR2_D[10] CK K8 M9 VDD2
DDR2_A[8] CKE VDD1
K9 ODT J7
DDR2_ODT F2 VSSQ4
F8 VSSQ3
L8 CS VDDQ10 A9 C908 0.01uF H2 VSSQ2
VDDL J1 H8 VSSQ1
K7 RAS VDDQ9 C1 C909 0.01uF
DDR2_RASZ
DDR2_CASZ L7 CAS VDDQ8 C3 C910 0.01uF
VSSQ10 B2
A2 NC1
VSSQ9 B8
E2 NC2
VSSQ8 A7
R8 NC3
VSSQ7 D2
VSSQ6 D8
J7 VSSDL VSSQ5 E7
VSSQ4 F2
VSSQ3 F8
+1.8V_DDR VSSQ2 H2
J1 VDDL VSSQ1 H8
C900 C919
0.01uF 10uF 10V DDR2 MEMORY
R1000
2.2K
1 NC Power_On 2 VCC 2 7 PVCC
+5V_MULTI
3 GND GND 4 3 ITH SW OUT:1.27V
R1003 10K RL_ON C1004 C1018 R1008 12K 3 6 L1002 2.2uH +1.2V_VDDC_MST
12 10uF 16V 10uF 16V
5 GND GND 6 C1012 R1009
Q1000 560pF GND 4 5 PGND
C1013 C1025 2K R2 C1014 C1041
7 5.2V 5.2V 8 2SC3875S 10uF 16V 10uF 16V 0.1uF 1uF 25V
P_5V R1010 READY
MAX 2A 3.3K R1
9 5.2V 5.2V 10 P_5V
11 GND GND 12 V0 = 0.8*(1+(R2/R1))
P_12V 13 12V 12V 14 P_12V
15 GND GND 16 +5V_MULTI
R2 R1007
+5VST_MST +5V_MULTI 150 V0 = 1.25*(1+(R2/R1))
C1027
68uF Q1003
35V R1049 C1047
READY 33K 1uF 25V SI4925BDY
Close to Q1003 EBK32753101
R1065
33K S1
1 8
D1_2
L1007 120-ohm +12V_LCD
C C1005 R1050 R1051 R1052 C1009 C1010
B Q1001 G1 0.1uF 2.2K 2.2K 2.2K 100uF16V 0.01uF
R1048 10K 2 7 D1_1
RT1C3904-T112
*ST 5V->3.3V PANEL_ON
R1045 E S2 D2_2
10K 3 6
IC1007 G2
AP2121N-3.3TRE1 P_5V 4 5 D2_1 +5V_MULTI
C1019 C1021
3 VIN VOUT 2 10uF 16V 0.01uF
+5VST_MST +3.3V_MST
C1052 C1053 R1070 C1048
GND C1037 22K 1uF
10uF 16V 0.01uF 1uF 25V
1 READY
R1069
1.6K
C
R1068 10K B Q1004
POWER_SW RT1C3904-T112
E
+5V_MULTI
**DC-DC CONVERTER_READY
12V->5V_TUNER/USB OUT:5V L1010 120-ohm +5V_TUNER
R1059 R1019 C1017
10
100uF 16V
IC1006 10K
MP2212DN +5V_USB
R1057 C1026
30K R1056 0.1uF
0
1 FB EN/SYNC 8 L1014 120-ohm +5V_MEMC
R1018 READY
MEMC
R1058 700mA + 415mA
5.6K MAX 3A 2K
2 GND SW_2 7
R1055
0
MEMC_RXE0+
MEMC_RXE0-
MEMC_RXE1+
MEMC_RXE1-
MEMC_RXE2+
MEMC_RXE2-
MEMC_RXEC+
MEMC_RXEC-
MEMC_RXE3+
MEMC_RXE3-
MEMC_RXE4+
MEMC_RXE4-
MEMC_RXO0+
MEMC_RXO0-
MEMC_RXO1+
MEMC_RXO1-
MEMC_RXO2+
MEMC_RXO2-
MEMC_RXOC+
MEMC_RXOC-
MEMC_RXO3+
MEMC_RXO3-
MEMC_RXO4+
MEMC_RXO4-
2
X1101 12MHz
2
M_XTALO M_XTALI 3
R1146 R1152 4
10uF 10V
10uF
0.1uF
0.1uF
0.1uF
0.01uF
0.1uF
1uF
M_XTALO
M_XTALI
URSA_A0P
URSA_A0M
URSA_A1P
URSA_A1M
URSA_A2P
URSA_A2M
URSA_ACKP
URSA_ACKM
URSA_A3P
URSA_A3M
URSA_A4P
URSA_A4M
URSA_B0P
URSA_B0M
URSA_B1P
URSA_B1M
BLM18PG121SN1D URSA_BCKM 16
R1110 820 C1139 22uF 17
URSA_BCKP
C1126
C1127
C1101
C1129
C1131
C1133
C1134
C1135
+1.26V_MEMC L1102 120-ohm C1115 22uF 16V C1140 10uF
18
C1117 10uF C1146 0.1uF
URSA_B2M 19
C1118 0.1uF C1141 0.1uF
B1
A1
C1
C2
A2
B2
B3
A3
C3
C4
A4
B4
F11
H8
B5
A5
C5
C6
A6
B6
B7
A7
C7
C8
A8
B8
G11
H7
K15
K16
D4
D3
B14
A14
D5
D6
N7
E11
D13
D11
G8
F10
B9
A9
C9
C10
A10
B10
B11
A11
C11
C12
A12
B12
D9
D7
B13
A13
C13
C14
ISP_RXD_TR R1105 0
R1106 0 URSA_B1M 21
XIN
ISP_TXD_TR
RE4P
RE3P
RE2P
RE1P
RE0P
RO4P
RO3P
RO2P
RO1P
RO0P
RE4N
RE3N
RE2N
RE1N
RE0N
RO4N
RO3N
RO2N
RO1N
RO0N
REXT D12
SCLM
XOUT
D8
SDAM
LVB0P
LVB1P
LVA0P
LVA1P
LVA2P
LVA3P
LVA4P
GND_6
GND_5
GND_2
R1107 100 E1 SDAS GPIO_5
RECKP
ROCKP
GPIO_2
GPIO_1
GPIO_9
GPIO_8
GPIO_6
GPIO_4
RECKN
LVB0M
LVB1M
LVA0M
LVA1M
LVA2M
LVA3M
LVA4M
ROCKN
M_SDA 22
GPIO_13
GPIO_14
GPIO_12
GPIO[25]
LVACKP
URSA_B1P
LVACKM
R1108 100 D1 SCLS GPIO_7 D10
AVDD_PLL
M_SCL
R1101 1K F1 GPIO[8] GPIO_11 E10 URSA_B0M 23
AVDD_LVDS_1
AVDD_LVDS_2
+3.3V_MEMC
G1 GPIO[9] GPIO_10 E3
R1102 URSA_B0P 24
1K C1119 0.1uF K8 GND_14 [E1] GPIO_3 D2
READY E5 VDDC_1 [D1] LVB2P C15 +3.3V_MEMC R1129 4.7K 25
URSA_B2P READY
E2 GPIO[10] LVB2M B15
LED_DEMO URSA_B2M LED_DEMO R1132 0 R1130 0 26
A15 READY READY
+3.3V_MEMC
LVDS_SEL F2 GPIO[11] LVBCKP URSA_BCKP
F3 GPIO[12] LVBCKM A16 URSA_A4M 27
B16
URSA_BCKM
AFLC_EN G2 GPIO[13] LVB3P URSA_B3P 28
M4 GPIO[22] LVB3M C16 URSA_A4P
URSA_B3M
M5 GPIO[23] LVB4P D15 URSA_A3M 29
R1100 R1159 D16
URSA_B4P
1K 1K G3 GPIO[14] LVB4M URSA_B4M 30
F9 URSA_A3P
READY READY E4 GPIO[15] AVDD_33_2
F4 GPIO[16] GND_4 G10 C1143 0.1uF 31
R1158 R1160 G4 GPIO[17] LVC0P E15
1K 1K URSA_C0P URSA_ACKM 32
H4 GPIO[18] LVC0M E16
URSA_C0M
J4 GPIO[19] LVC1P E14 URSA_ACKP 33
L1103 120-ohm C1120 10uF 10V URSA_C1P
RASZ
CASZ
MADR[0]
MADR[2]
MADR[4]
GND_12
MADR[6]
MADR[8]
MADR[11]
WEZ
BADR[1]
BADR[0]
MADR[1]
MADR[10]
AVDD_DDR_7
MADR[5]
MADR[9]
MADR[12]
MADR[7]
MADR[3]
MCLKE
GND_16
VDDC_3
MDATA[4]
MDATA[3]
GND_13
MDATA[1]
MDATA[6]
AVDD_DDR_3
MDATA[11]
MDATA[12]
MDATA[9]
MDATA[14]
AVDD_DDR_1
DQM[1]
DQM[0]
MDATA[7]
MDATA[0]
MDATA[2]
MDATA[5]
MCLK[1]
MCLKZ[1]
GPIO[26]
GPIO[27]
GND_17
RESET
C1108 0.1uF EEPROM HIGH HIGH LOW
URSA_C3P 22
J7
P3
P4
P5
P6
P7
P8
F7
P9
T3
T4
T5
T6
T7
T8
T9
R3
R4
R5
R6
R7
R8
R9
N8
K7
N9
G6 VDDC_4
GND_9
J10
J11
P10
P11
P12 DQSB[0]
P13 MDATA[15]
P14 MDATA[13]
P15
P16
L11
T10
T11
T12
T13 DQS[1]
T14 MDATA[8]
T15
T16
SPI HIGH HIGH HIGH
R10
R11
R12 DQS[0]
R13 DQSB[1]
R14 MDATA[10]
R15
R16
K10
K11
H11 VDDP_1
N10
N11
M11
C1109 0.1uF
R1111 23
C1110 0.1uF 10K
URSA_CCKM 24
0
C1111 0.1uF MEMC_RESET
C1112 0.1uF URSA_CCKP 25
C1116 10uF 26
R1109
+1.8V_MEMC L1101 120-ohm C1104 22uF 16V 27
URSA_C2M
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
URSA_C2P 28
URSA_C1M 29
C1113
C1114
C1132
C1128
C1130
C1136
C1137
C1138
URSA_C1P 30
URSA_C0P 32
33
IC1101 C1149
0.1uF 34
W25X20AVSNIG
35
MEMC_BA1
MEMC_BA0
MEMC_WEZ
MEMC_DQS0
MEMC_DQS1
MEMC_RASZ
MEMC_CASZ
MEMC_DQM1
MEMC_DQM0
R1120 56 CS 1 8 VCC 36
MEMC_DQSB0
MEMC_DQSB1
MEMC_MCLK1
MEMC_MCLKE
M_SPI_CZ
MEMC_MCLKZ1
37
MEMC_A[0]
MEMC_A[2]
MEMC_A[4]
MEMC_A[6]
MEMC_A[8]
MEMC_A[11]
MEMC_A[1]
MEMC_A[10]
MEMC_A[5]
MEMC_A[9]
MEMC_A[12]
MEMC_A[7]
MEMC_A[3]
MEMC_DQ[4]
MEMC_DQ[3]
MEMC_DQ[1]
MEMC_DQ[6]
MEMC_DQ[11]
MEMC_DQ[12]
MEMC_DQ[9]
MEMC_DQ[14]
MEMC_DQ[15]
MEMC_DQ[8]
MEMC_DQ[10]
MEMC_DQ[13]
MEMC_DQ[7]
MEMC_DQ[0]
MEMC_DQ[2]
MEMC_DQ[5]
R1121 56 DO 2 7 HOLD
M_SPI_DO 38
MEMC_A[0-12] MEMC_DQ[0-15] 39
R1122 10K WP 3 6 CLK R1125 56
M_SPI_CK
40
IC1205
+5V_MEMC IC1204
MP2212DN +3.3V_MEMC IC1203 APE8953MP
BD9130EFJ-E2
R1236 R1234
+5V_MEMC
R1 C1246
39K 10 0.1uF ADJ EN
P_12V 1 FB EN/SYNC 8 R1235 10K 233 mA+400mA+600mA 1 8 R1227 10K 8 EN GND 1
L1206
R1237 500 C1264 R2
L1205 12K R2 2 GNDMAX 3ASW_2 7 L1204 3.6uH +3.3V_MEMC VCC
2 7
PVCC
R1233 0 400mA + 600mA 1uF 7 POK 2A FB 2 R1232 17.4K 1%
500
C1257 C1258 SW 2.2uH C1259
3 IN SW_1 6 10uF 16V 10uF 16V C1243 C1244 C1267 R1225 18K
ITH 3 6 +1.8V_MEMC +1.8V_MEMC 6 VCNTL VOUT_1 3 10K 1%
R1 R1231 18nF 16V 600 mA
100uF 22uF 0.1uF L1203
C1253 C1254 R1228
10uF 25V 10uF 25V 4 BS VCC 5 C1245
GND 4 5 PGND
C1247
R1 39K 1% C1248 5 VIN VOUT_2 4 +1.26V_MEMC
C1255 C1256 330pF 22uF R1229 0.1uF
1uF 25V 10nF R2 30K 1% C1250 C1249
MAX 2A 0.1uF 10uF 10V C1251 C1252 C1260
Vo=0.8(1+R1/R2) V0 = 0.8(1+R1/R2)
+1.8V_MEMC_DDR +1.8V_MEMC_DDR
R1221 R1223
1K 1% 1K 1%
B_URSA_CASZ A_URSA_CASZ
0.1uF
C1221
10V
C1213 0.1uF VDDQ_7 C7 K3 WE B_URSA_WEZ A_URSA_WEZ WE K3 C7 VDDQ_7 C1232 0.1uF
0.1uF
0.1uF
C1201
VDDQ_5 E9 E9 VDDQ_5
C1202
C1215 0.1uF F7 LDQS R1205 56 R1214 56 LDQS F7 C1234 0.1uF
VDDQ_4 G1 MEMC_DQS2 MEMC_DQS0 G1 VDDQ_4
10uF
C1216 0.1uF B7 UDQS R1206 56 R1215 56 UDQS B7 C1235 0.1uF
VDDQ_3 G3 MEMC_DQS3 MEMC_DQS1 G3 VDDQ_3
C1217 0.1uF C1236 0.1uF
C1218 0.1uF VDDQ_2 G7 G7 VDDQ_2 C1237 0.1uF
VDDQ_1 G9 F3 LDM R1207 56 R1216 56 LDM F3 G9 VDDQ_1
C1219 0.1uF MEMC_DQM2 MEMC_DQM0 C1238 0.1uF
B3 UDM R1208 56 R1217 56 UDM B3
MEMC_DQM3 MEMC_DQM1
TU500 TU500-*1
TAFT-Z203D TAFT-H203F PC_HS 2 1 PC_VS
PC_G 4 3
PC_R 6 5 PC_B
NC_1 8 7
1 NC_1 1 COMP1_PB
+5V_TUNER GND_1 10 9
INTERFACE
COMP1_PR COMP1_Y
2 GND_1 2 12 11
COMP2_PB
Near the pin +B[5V] 14 13
3 +B[5V] 3 COMP2_PR COMP2_Y
C501 C508 C509 C510 C511 16 15
0.01uF 10uF 16V 100uF 16V 100uF 16V 100uF 16V NC_2 SIDE_C
4 NC_2 4 18 17
SIDE_Y
C
C
C
A
A
A
[GN]CONTACT-L 6J 3A [GN]CONTACT-S ZD103
2.ENKMC2837-SUB:0DS226009AA
ZD109 SD05 ESD_READY
D126
D127
D128
SD05 ESD_READY 6 RED_GND [KDS226]
AC
AC
AC
9K [BL]E-LUG GND_2
ENKMC2837-T112
ENKMC2837-T112
ENKMC2837-T112
1 11 RED
COMP2_PB [BL]C-LUG-L 7K 8B [BL]C-LUG-S COMP1_PB R101
PC_R
R126 ZD107 ZD101 R108 GREEN_GND 75
75 SD05 ESD_READY SD05 75 7
9L [RD]E-LUG_1 ESD_READY DDC_DATA
2 12 ESD_READY
DSUB_SDA
COMPONENT2
GREEN D107
COMP2_PR [RD]C-LUG_L 7L 8C [RD]C-LUG-S COMP1_PR PC_G CDS3C30GTH
30V
R102
R125 ZD106 ZD100 R107 8 BLUE_GND 75
75 SD05 ESD_READY SD05 75 R110
9M [WH]E-LUG_1 ESD_READY 68
H_SYNC
PC_HS
COMPONENT1
ZD104 R111
4.7K 68pF
R133 R114 BLUE SD05
COMP2_L [WH]C-LUG-L_1 7M 8D [WH]C-LUG-S_1 COMP1_L R103
PC_B ESD_READY
R137 10K R122 D115 D101 R104 10K R118 9 NC 75
12K 220K 30V ESD_READY 30V 220K 12K R116
9N [RD]E-LUG_2 ESD_READY 68
V_SYNC
4 14 R112 C102
PC_VS
ZD105 68pF
R132 GND_1 4.7K
COMP2_R [RD]O-SPRING-L_1 5N 4E [RD]O-SPRING-S_1 SD05
R136 10K ESD_READY
R121 D114 10 SYNC_GND
12K 220K 30V ESD_READY R113
[RD]CONTACT-L_1 6N 3E [RD]CONTACT-S_1 COMP1_R DDC_CLOCK
D100 R100
10K R117 5 15 ESD_READY
DSUB_SCL
30V 12K DDC_GND CDS3C30GTH D110
9P [YL]E-LUG ESD_READY 220K 30V
CDS3C30GTH
AV1
MNT_LOUT CVBS_LIN
C200 D200 D204 R214 10K R218
Q201 100pF 30V 30V 220K 12K
RT1C3904-T112 C READY NON_HOTEL_OPT 9R [RD]E-LUG_3 ESD_READY
MUTE_LINE B E
POP NOISE
MNT_OUT
10K
D203 R211 R219
PC SOUND
30V 220K 12K JK102
C202 10uF 16V R206 0 [RD]CONTACT-L_2 6R 3H [RD]CONTACT-S_2 ESD_READY
MNT_ROUT NON_HOTEL_OPT PEJ024-01
D201
30V 3 E_SPRING
NON_HOTEL_OPT
C
PC_AUD_R
B
MUTE_LINE 6A T_TERMINAL1 R138
POP NOISE Q200
RT1C3904-T112 E 10K
D119 R130 R140
30V 220K
7A B_TERMINAL1 12K
CDS3C30GTH
ESD_READY
4 R_SPRING
PC_AUD_L
RS-232C (CI ITEM) JK103 AV2 5 T_SPRING R139
KCN-DS-1-0088 10K
1 [YL]GND D120
R131
R141
30V 12K
7B B_TERMINAL2 220K
CDS3C30GTH
+3.3V_MST ESD_READY
2 [YL]O-SPRING SIDE_V
5.6B
TP131
1 ZD202 R227 6B T_TERMINAL2
ESD_READY 75
5.6B
IC101
3 [YL]CONTACT ZD203
6 ESD_READY
ST3232CDR SHIELD_PLATE
C109 8
0.1uF
C1+ 1 R144 100 2 4 [WH]GND
16 VCC
D121
C107 V+ 2
CDS3C30GTH
15 GND 30V ESD_READY
0.1uF 7 5 [WH]C-LUG-L R224 10K
C1- 3 T1OUT D206
SIDE_LIN
14 30V
R223 R226
3 220K 12K
ESD_READY READY
C2+ R1IN R145 100 JK105
4 13 6 [RD]GND S-VIDEO(LH30(China)) PSJ014-01
C106 D122
CDS3C30GTH
8 C-LUG1
0.1uF C2- 5
12 R1OUT IR_OUT READY
30V ESD_READY
1
IR_OUT 4 7 [RD]O-SPRING R225 10K C-LUG2
V- 6
11 T1IN D205
SIDE_RIN 2 SIDE_C
R222 R228 R105
C108 30V 220K 12K GND 0-SPRING D102
READY
ESD_ESD_READY 6 3 30V 75 +3.3V_MST
0.1uF T2OUT 9
7 10 T2IN +3.3V_MST READY
8 [RD]CONTACT C-LUG3 R115
4 10K
R2IN R2OUT
8 9 R123 R124 5 5 C-LUG4
4.7K 4.7K S_VIDEO_DET
D103 C101
10 30V OPT
RXD PPJ148-07 7 SHIELD READY READY
JK201 ZD110
SIDE_Y
TXD SD05 R106
READY 75
ZD111
SD05
READY