ICBrazilProgram

Nilton Morimoto
ICBrazilCoordinator,PSI/USP
EricFabris
CTTechnicalCoordinator,EE/UFRGS
OscarSalviani
CT2LocalCoordinator,CTI/MCTI
Joo Martino
CT3LocalCoordinator,PSI/USP

ICBrazilProgram
 Ocomeodetudo

Discoveryof BipolarTransistorat BellLabs,Dec.1947,BardeeneBrattain

ICBrazilProgram
Inversor CMOS
HighPerformanceTransistorChallenges

Electrode Gate
Resistance NMOS Transistor
Hot
Carrier
Stability

SD Series
Resistance
0.09 m
Thin Oxide
Stability-
Electrical/Phys
Channel
ical
Profile , SCE,
Fluctuations,
Quantum
Effects
Capacitor tipo trincheira
Gates / Chip Vs. No. Levels Of Interconnect
100.00

SIA Roadmap 20 Million

Gates/Chip

10.00 7-Level
Metal
3-Level No. Levels Of
Metal Interconnect
1.00

Gates/Chip (Millions)
0.3 Million
Gates/Chip
0.10
1990 1992 1994 1996 1998 2000 2002 2004 2006 2008
Year Of First Introduction
Increasing Number Of Contacts
And Vias (Nodes) Per Chip

Increasing # Gates / Chip Drives

# Nodes / Chip up Dramatically
e.g.

0.25 m Technology:
10 Million Logic Transistors / Chip
~ 50 Million Nodes / Chip
Increasing Number Of Contacts
And Vias (Nodes) Per Chip
Yield:
5% Loss:
5 Bad Nodes / (100 chips X 50Million Nodes)
1 Bad / 1 Billion Nodes!

Reliability:
10 FIT (0.1% Device Failures In 10 Years):
1 Failed Node / (1000 Chips X 50 Million Nodes)
1 Failure / 50 Billion Nodes!
 Driving Forces
Technical

ICBrazilProgram
Trends: The Network is driving technology

2000...
The Network
1990s
The PC

1980s
Computer/Workstation

1970s
Military/Aerospace
 Networking and Computing
Systems Group Enterprise
Computing
Personal Systems
Computing Division
Systems
Networking
Division
Systems Division

Access
C.O.
N IC

Router Backbone
Switch/Hub C.O.
10/100 Ethernet Telecom
Switch

ATM
Switch
Modems Access
Node
Communications
Transmission & Access Basestations
Systems Division
Wireless Infrastructure Systems
Division

Cellular Wireless local loop

 Trends: Networking Driven Products

Enterprise Routers
Switch/Hub
platforms
Central Office
Switching and
Transmission

ATM Switching
Analog Modems

SOHO Routers POTs line cards

Remote Access
Servers Access Mux
(DSLAM)
Cable Modems
Wireless
Infrastructure
ADSL Modems
Infrastructure
 ULSI Process Roadmap
Dual Inlaid
Copper with SiOF
Low K ILD 1000 MHz
0.10
1.2 volts

Dual Inlaid
Copper
Interconnect
Process Performance

600 MHz
0.13 TFSOI
1.5 volts

400 MHz
0.15
1.8 volts

350 MHz
0.18
1.8 volts
300 MHz
0.27
2.5 volts BuriedOxide
200 MHz
0.35
2.5 volts SiliconSubstrate

120 MHz
0.50
3.3 volts Production Dates
1994 1995 1996 1997 1998 1999 2000 2001
 Driving Forces
Marketand economic

ICBrazilProgram
 WhatisDrivingStrongFDIinward?
Marketsizeandstrongindustrialbase
 Agrowingdomesticelectronicsmarket
BrazilianElectronicsMarket[B$]

Afastgrowingbusinessorientedeconomywithahugeelectronicsmarket
IndustrialPolicyandMarketResponseTimeline
2.ICBrazilProgram
1. Objectives

2. Organization

3. TrainingCenters

4. DesignHouses

5. ExamplesofIC

ICBrazilProgram
 2.1BrazilICProgram Start

July2005

LaunchedbyCATI/SEPIN/MCT

InitiativeofAcademy,GovernmentandIndustry

ICBrazilProgram
 2.1ICBrazil Vision&Objectives
Topromotethedevelopmentofanecosystemin
microelectronicsinBrazilandtheinsertionofBrazilinthe
semiconductormarket
PromotelocalICcompanies
Attractionofinternationalcompanies
Promoteelectronicsinnovation:RFID,DTV,instrumentation,
automation,
Synergywithothergovernmentalincentives:
Informaticslaw
PADIS programforsemiconductors anddisplays
PDP
SubventionprogramsbyFINEPandBNDES

ICBrazilProgram
 2.1FocusonICDesign
DemandfornewICs:
Growingmarkets
Newapplications
GrowingopportunityforFabless(since2006:>20%)
Fertilefieldforinnovation
SomeTechnicalChallenges:
Growingcomplexity&functionality
Powerconsuptionandheatremoval
SoCandSIP
Growingparametervariability redundancyand
routeautocorrection
ICBrazilProgram
ICBrazilOrganizationChart

ICBrazilProgram
 2.3TrainingCenters
Objectives:
IncreasespecializedhumanresourcesinICdesign

AttracttalentpeopleforR&Doncommercial
applications

Create,inshorttime,acriticalmassofIC
designerstopromotesemiconductoractivitiesin
Brazil
ICBrazilProgram
 2.3TrainingCenters
CT1 UFRGS,PortoAlegre start:April2008
CT2 CTI,Campinas start:August2008
CT3 USP,SoPaulo Start:August2014
Structure:PhasesI,IIeIII
PhaseI:theoryandEDAtools 5months
PhaseII:ICdesignproject 7months
PhaseIII:internshipatDHsorcompanies 12months

ICBrazilProgram
2.4DesignHouses

Total=19

Perseptia
STISemiconductors

ICBrazilProgram
GeneralTendenciesandChallenges
New products and applications
Cloud computing
Convergences of functions: notebook or
smartphone?
Mobility and easy to use
Universal access, connectivity, interoperability
Wireless sensor network
Ambient energy harvesting
Ecological correctness
ICBrazilProgram
 Some specific opportunity fields
RFID: cattle, vehicles, food, goods, documents,
health items (blood, drugs, vaccines), etc.
Brazilian Digital TV
Low cost education tools, Tablet,
Wireless sensor networks: agriculture, environment,
energy, health, etc
Energy: smart grid, deep water oil exploration,
ethanol production chain
Embedded electronics: agriculture implements, cars,
avionics
ICBrazilProgram
 Ecologicalchallenges GreenICT
Norms:
RoHS RestrictionofHazard
toxidade
Substance

WEEE WasteofElectroElectronic
Equipment reciclagem

EcodesignConceptsandLifeCycle
Analysis energia

ICBrazilProgram
 Energy
IncreasingenergyconsumptionbyICT(10%of
electricalenergy)
Demandforcarbonfreeenergy(green)
Alternativeenergies:
Eolic
Photovoltaic CAGR>40%
Otherformsofenergyharvesting
Reduce/optimizeenergyconsumption:
Smartgrid
LightanddisplaysbyLEDandOLED
Ecodesign ofproducts(includesenergyefficiency)

ICBrazilProgram
 PhotovoltaicEnergy
Installedperyear:2009=7,3GW,2010=17,5GW

(ITAIPU=14GW)

HeadedbyGermany:2009= 3,8GW,2010=7,3GW

PVenergycost:2009=$2.15Wp;2010=$1.75Wp

cSiwillcontinuetodominatethenext~10years (in

2020:consumptionof51.000tpolysilicon,with3g/W)
ICBrazilProgram
 Thank You
Obrigado
morimoto@LSI.USP.BR
www.cibrasil.gov.br

ACKNOWLEDGMENTS

ICBrazilProgram