MC74HC4851A,

MC74HC4852A

Analog Multiplexers/
Demultiplexers with
Injection Current Effect
Control http://onsemi.com

Automotive Customized MARKING

DIAGRAMS
These devices are pin compatible to standard HC405x and 16
MC1405xB analog mux/demux devices, but feature injection current PDIP16
effect control. This makes them especially suited for usage in N SUFFIX HC485xAN
AWLYYWW
automotive applications where voltages in excess of normal logic CASE 648
voltage are common. 1
The injection current effect control allows signals at disabled analog 16
input channels to exceed the supply voltage range without affecting SOIC16
HC485xAD
the signal of the enabled analog channel. This eliminates the need for D SUFFIX AWLYWW
external diode/ resistor networks typically used to keep the analog CASE 751B
channel signals within the supply voltage range. 1
The devices utilize low power silicon gate CMOS technology. The 16
Channel Select and Enable inputs are compatible with standard CMOS SOIC16 WIDE
HC485xADW
outputs. DW SUFFIX AWLYWW
Injection Current CrossCoupling Less than 1mV/mA (See Figure 9) CASE 751G

Pin Compatible to HC405X and MC1405XB Devices 1

Power Supply Range (VCC GND) = 2.0 to 6.0 V 16

In Compliance With the Requirements of JEDEC Standard No. 7A TSSOP16 HC48

DT SUFFIX
Chip Complexity: 154 FETs or 36 Equivalent Gates CASE 948F
5xA
ALYW

1
A = Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week

ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.

Semiconductor Components Industries, LLC, 2002 1 Publication Order Number:

June, 2002 Rev. 5 MC74HC4851A/D
 MC74HC4851A, MC74HC4852A

FUNCTION TABLE MC74HC4851A

Control Inputs
Select
13
X0 Enable C B A ON Channels
14
X1 L L L L X0
15
X2 L L L H X1
ANALOG 12
INPUTS/ X3 MULTIPLEXER/ 3 COMMON L L H L X2
OUTPUTS X4 1 DEMULTIPLEXER X L L H H X3
OUTPUT/
5 INPUT L H L L X4
X5 L H L H X5
2
X6 L H H L X6
4
X7 L H H H X7
11 H X X X NONE
A
CHANNEL 10
SELECT B
INPUTS 9
C VCC X2 X1 X0 X3 A B C
6
ENABLE 16 15 14 13 12 11 10 9
PIN 16 = VCC
PIN 8 = GND

Figure 1. MC74HC4851A Logic Diagram

SinglePole, 8Position Plus Common Off

1 2 3 4 5 6 7 8
X4 X6 X X7 X5 Enable NC GND
Figure 2. MC74HC4851A 16Lead Pinout (Top View)

FUNCTION TABLE MC74HC4852A

Control Inputs
Select
Enable B A ON Channels
12
X0 L L L Y0 X0
14
X1 13 L L H Y1 X1
15 X SWITCH X
X2 L H L Y2 X2
11 L H H Y3 X3
X3
ANALOG COMMON H X X NONE
INPUTS/OUTPUTS 1 OUTPUTS/INPUTS
Y0 X = Dont Care
5 3
Y1 Y SWITCH Y
2
Y2
4
Y3 VCC X2 X1 X X0 X3 A B
10
CHANNELSELECT A 16 15 14 13 12 11 10 9
9 PIN 16 = VCC
INPUTS B
PIN 8 = GND
6
ENABLE

Figure 3. MC74HC4852A Logic Diagram

DoublePole, 4Position Plus Common Off
1 2 3 4 5 6 7 8
Y0 Y2 Y Y3 Y1 Enable NC GND
Figure 4. MC74HC4852A 16Lead Pinout (Top View)

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 MC74HC4851A, MC74HC4852A

MAXIMUM RATINGS*

Symbol


Parameter Value Unit This device contains protection

VCC Positive DC Supply Voltage (Referenced to GND) 0.5 to + 7.0 V circuitry to guard against damage
due to high static voltages or electric

Vin DC Input Voltage (Any Pin) (Referenced to GND) 0.5 to VCC + 0.5 V fields. However, precautions must

be taken to avoid applications of any
I DC Current, Into or Out of Any Pin
25 mA
voltage higher than maximum rated

PD Power Dissipation in Still Air, Plastic DIP 750 mW voltages to this highimpedance cir-

SOIC Package 500 cuit. For proper operation, Vin and
TSSOP Package 450 Vout should be constrained to the

range GND  (Vin or Vout)  VCC.
Tstg Storage Temperature Range 65 to + 150 C

Unused inputs must always be
TL Lead Temperature, 1 mm from Case for 10 C tied to an appropriate logic voltage

Seconds 260 level (e.g., either GND or VCC).
Plastic DIP, SOIC or TSSOP Package Unused outputs must be left open.
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
Derating Plastic DIP: 10 mW/C from 65 to 125C
SOIC Package: 7 mW/C from 65 to 125C
TSSOP Package: 6.1 mW/C from 65 to 125C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

Symbol


RECOMMENDED OPERATING CONDITIONS

Parameter Min Max Unit

VCC


Vin

Positive DC Supply Voltage

DC Input Voltage (Any Pin)
(Referenced to GND)
(Referenced to GND)
2.0
GND
6.0
VCC
V
V

VIO*


TA

Static or Dynamic Voltage Across Switch

Operating Temperature Range, All Package Types
0.0
55
1.2
+ 125
V
C

tr, tf



Input Rise/Fall Time

(Channel Select or Enable Inputs)
VCC = 2.0 V
VCC = 4.5 V
0
0
1000
500
ns

VCC = 6.0 V 0 400

*For voltage drops across switch greater than 1.2 V (switch on), excessive VCC current may
be drawn; i.e., the current out of the switch may contain both VCC and switch input compo-

nents. The reliability of the device will be unaffected unless the Maximum Ratings are
exceeded.

DC CHARACTERISTICS Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted
Guaranteed Limit
VCC
Symbol Parameter Condition V 55 to 25C 85C 125C Unit
VIH Minimum HighLevel Input Ron = Per Spec 2.0 1.50 1.50 1.50 V
Voltage, ChannelSelect or Enable 3.0 2.10 2.10 2.10
Inputs 4.5 3.15 3.15 3.15
6.0 4.20 4.20 4.20
VIL Maximum LowLevel Input Ron = Per Spec 2.0 0.50 0.50 0.50 V
Voltage, ChannelSelect or Enable 3.0 0.90 0.90 0.90
Inputs 4.5 1.35 1.35 1.35
6.0 1.80 1.80 1.80
Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 0.1 1.0 1.0 A
on Digital Pins (Enable/A/B/C)
ICC Maximum Quiescent Supply Vin(digital) = VCC or GND 6.0 2 20 40 A
Current (per Package) Vin(analog) = GND
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

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 MC74HC4851A, MC74HC4852A

DC CHARACTERISTICS Analog Section

Guaranteed Limit

Symbol Parameter Condition VCC 55 to 25C 85C 125C Unit

Ron Maximum ON Resistance Vin = VIL or VIH;VIS = VCC to 2.0 1700 1750 1800 
GND; IS 2.0 mA 3.0 1100 1200 1300
4.5 550 650 750
6.0 400 500 600

Ron Delta ON Resistance Vin = VIL or VIH; VIS = VCC/2 2.0 300 400 500 
IS 2.0 mA 3.0 160 200 240
4.5 80 100 120
6.0 60 80 100
Ioff Maximum OffChannel Leakage Vin = VCC or GND A
Current, 6.0 0.1 0.5 1.0
Any One Channel 0.2 2.0 4.0
Common Channel
Ion Maximum OnChannel Leakage Vin = VCC or GND A
ChanneltoChannel 6.0 0.2 2.0 4.0

AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)

Symbol Parameter VCC 55 to 25C 85C 125C Unit
tPHL, Maximum Propagation Delay, Analog Input to Analog Output 2.0 160 180 200 ns
tPLH 3.0 80 90 100
4.5 40 45 50
6.0 30 35 40
tPHL, tPHZ,PZH Maximum Propagation Delay, Enable or ChannelSelect to 2.0 260 280 300 ns
tPLH, tPLZ,PZL Analog Output 3.0 160 180 200
4.5 80 90 100
6.0 60 70 80
Cin Maximum Input Capacitance Digital Pins 10 10 10 pF
(All Switches Off) Any Single Analog Pin 35 35 35
(All Switches Off) Common Analog Pin 130 130 130
CPD Power Dissipation Capacitance Typical 5.0 20 pF

INJECTION CURRENT COUPLING SPECIFICATIONS (VCC = 5V, TA = 55C to +125C)

Symbol Parameter Typ Max Unit Condition
V
out Maximum Shift of Output Voltage of Enabled Analog 0.1 1.0 mV Iin* 1 mA, RS 3,9 k
Channel 1.0 5.0 Iin* 10 mA, RS 3,9 k
0.5 2.0 Iin* 1 mA, RS 20 k
5.0 20 Iin* 10 mA, RS 20 k
* Iin = Total current injected into all disabled channels.

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 MC74HC4851A, MC74HC4852A

1100 1100
1000 1000
900 900

R on , ON RESISTANCE (OHMS)
R on , ON RESISTANCE (OHMS)

-55C
800 800
+25C
700 700
+125C
600 600
500 500
-55C
400 400
+25C
300 300 +125C
200 200
100 100
0 0
0.0 0.4 0.8 1.2 1.6 2.0 0.0 0.6 1.2 1.8 2.4 3.0

Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND

Figure 5. Typical On Resistance VCC = 2V Figure 6. Typical On Resistance VCC = 3V

660 440
600 400
540 360
R on , ON RESISTANCE (OHMS)
R on , ON RESISTANCE (OHMS)

480 320
-55C
420 280
+25C
360 -55C 240
+125C
300 200
+25C
240 160
+125C
180 120
120 80
60 40
0 0
0.0 0.9 1.8 2.7 3.6 4.5 0.0 1.2 2.4 3.6 4.8 6.0

Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND

Figure 7. Typical On Resistance VCC = 4.5V Figure 8. Typical On Resistance VCC = 6V

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 MC74HC4851A, MC74HC4852A

VCC = 5V
Iin

Vin2 < VSS or VCC < Vin2

Any Disabled Channel

VSS < Vin1 < VCC

Enabled Channel Vout = Vin1 V
out
RS

Figure 9. Injection Current Coupling Specification

5V 6V
5V VCC

VCC
HC4051A Microcontroller
Sensor
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
Channel 6
Channel 7
Channel 8
(8x Identical Circuitry) Common Out A/D - Input

Figure 10. Actual Technology

Requires 32 passive components and one extra 6V regulator
to suppress injection current into a standard HC4051 multiplexer

5V VCC

VCC
HC4851A Microcontroller
Sensor
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
Channel 6
Channel 7
Channel 8
(8x Identical Circuitry) Common Out A/D - Input

Figure 11. MC74HC4851A Solution

Solution by applying the HC4851A multiplexer

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 MC74HC4851A, MC74HC4852A

PLOTTER
VCC

PROGRAMMABLE
POWER MINI COMPUTER DC ANALYZER VCC
VEE 16
SUPPLY
OFF
- + VCC VCC A
NC OFF COMMON O/I
DEVICE
UNDER TEST
VIH 6
ANALOG IN COMMON OUT
8

GND

Figure 13. Maximum Off Channel Leakage Current,

Figure 12. On Resistance Test Any One Channel, Test SetUp
SetUp

VCC

VCC VCC VCC

VEE 16 A 16
ANALOG I/O
OFF ON
VCC VEE N/C
OFF OFF COMMON O/I
COMMON O/I
VCC ANALOG I/O

VIH 6 VIL 6

8 8

Figure 14. Maximum Off Channel Leakage Current, Figure 15. Maximum On Channel Leakage Current,
Common Channel, Test SetUp Channel to Channel, Test SetUp

VCC
VCC
16
VCC
CHANNEL ON/OFF COMMON O/I
50% TEST
SELECT ANALOG I/O
POINT
OFF/ON CL*
GND
tPLH tPHL

6
ANALOG
OUT 50%
8

CHANNEL SELECT

*Includes all probe and jig capacitance

Figure 16. Propagation Delays, Channel Select Figure 17. Propagation Delay, Test SetUp Channel
to Analog Out Select to Analog Out

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 MC74HC4851A, MC74HC4852A

VCC
16
ANALOG I/O COMMON O/I
VCC TEST
ON
ANALOG POINT
IN 50% CL*
GND
tPLH tPHL
6
ANALOG 8
OUT 50%

*Includes all probe and jig capacitance

Figure 18. Propagation Delays, Analog In Figure 19. Propagation Delay, Test SetUp
to Analog Out Analog In to Analog Out

tf tr POSITION 1 WHEN TESTING tPHZ AND tPZH

VCC 1 POSITION 2 WHEN TESTING tPLZ AND tPZL
90%
ENABLE 50% 2
VCC
10%
GND VCC 10k
tPZL tPLZ 16
HIGH 1 ANALOG I/O
IMPEDANCE ON/OFF TEST
ANALOG 50% 2 POINT
OUT 10% CL*
VOL
tPZH tPHZ
ENABLE
VOH 6
90%
ANALOG
OUT 50% 8
HIGH
IMPEDANCE

Figure 20. Propagation Delays, Enable to Figure 21. Propagation Delay, Test SetUp
Analog Out Enable to Analog Out

VCC
A
VCC
16
ON/OFF COMMON O/I
ANALOG I/O NC
OFF/ON

6 VCC

8 11

CHANNEL SELECT

Figure 22. Power Dissipation Capacitance,

Test SetUp

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 MC74HC4851A, MC74HC4852A

Gate = VCC
Disabled Analog Mux Input (Disabled) Common Analog Output
Vin > VCC + 0.7V Vout > VCC

P+ P+

+
+
+

N - Substrate (on VCC potential)

Figure 23. Diagram of Bipolar Coupling Mechanism

Appears if Vin exceeds VCC, driving injection current into the substrate

INJECTION 13
11 CURRENT X0
A CONTROL

INJECTION 14
CURRENT X1
CONTROL

10 INJECTION
B 15
CURRENT X2
CONTROL

INJECTION 12
CURRENT X3
CONTROL

9 INJECTION
C 1
CURRENT X4
CONTROL

INJECTION 5
CURRENT X5
CONTROL

INJECTION 2
6 CURRENT X6
ENABLE CONTROL

INJECTION 4
CURRENT X7
CONTROL

INJECTION 3
CURRENT X
CONTROL

Figure 24. Function Diagram, HC4851A

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 MC74HC4851A, MC74HC4852A

INJECTION 13
10 CURRENT X0
A CONTROL

INJECTION 14
CURRENT X1
CONTROL

9 INJECTION 15
B
CURRENT X2
CONTROL

INJECTION 12
CURRENT X3
CONTROL

INJECTION 13
CURRENT X
CONTROL

6 INJECTION
ENABLE 1
CURRENT Y0
CONTROL

INJECTION 5
CURRENT Y1
CONTROL

INJECTION 2
CURRENT Y2
CONTROL

INJECTION 4
CURRENT Y3
CONTROL

INJECTION 3
CURRENT Y
CONTROL
Figure 25. Function Diagram, HC4852A

ORDERING & SHIPPING INFORMATION

Device Package Shipping
MC74HC4851AN PDIP16 500 Units / Unit PAK
MC74HC4851AD SOIC16 48 Units / Rail
MC74HC4851ADR2 SOIC16 2500 Units / Tape & Reel
MC74HC4851ADW SOIC16 WIDE 48 Units / Rail
MC74HC4851ADWR2 SOIC16 WIDE 1000 Units / Tape & Reel
MC74HC4851ADT TSSOP16 96 Units / Rail
MC74HC4851ADTR2 TSSOP16 2500 Units / Tape & Reel
MC74HC4852AN PDIP16 500 Units / Unit PAK
MC74HC4852AD SOIC16 48 Units / Rail
MC74HC4852ADR2 SOIC16 2500 Units / Tape & Reel
MC74HC4852ADW SOIC16 WIDE 48 Units / Rail
MC74HC4852ADWR2 SOIC16 WIDE 1000 Units / Tape & Reel
MC74HC4852ADTR2 TSSOP16 2500 Units / Tape & Reel

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 MC74HC4851A, MC74HC4852A

PACKAGE DIMENSIONS

A PDIP16 NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
N SUFFIX Y14.5M, 1982.
16 9
CASE 64808 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
ISSUE R FORMED PARALLEL.
B
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 8 5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
F DIM MIN MAX MIN MAX
C L A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
S C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
SEATING F 0.040 0.070 1.02 1.77
T PLANE G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
K M J 0.008 0.015 0.21 0.38
H J
G K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
D 16 PL
M 0 10 0 10
0.25 (0.010) M T A M S 0.020 0.040 0.51 1.01

SOIC16
D SUFFIX
A
CASE 751B05 NOTES:
ISSUE J 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
16 9 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
B MOLD PROTRUSION.
P 8 PL 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

1 8 0.25 (0.010) M B M PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
G MAXIMUM MATERIAL CONDITION.

MILLIMETERS INCHES
DIM MIN MAX MIN MAX
F A 9.80 10.00 0.386 0.393
K R X 45 B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
C F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
T
J J 0.19 0.25 0.008 0.009
SEATING
M
PLANE K 0.10 0.25 0.004 0.009
D16PL M 0 7 0 7
0.25 (0.010) M T B S A S P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019

SOIC16 WIDE
DW SUFFIX
CASE 751G03
A ISSUE B NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
16 9 Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
B 8X P 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
0.010 (0.25) M B M
5. DIMENSION D DOES NOT INCLUDE DAMBAR
1 8 PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
J MATERIAL CONDITION.
16X D
MILLIMETERS INCHES
0.010 (0.25) M T A S B S DIM MIN MAX MIN MAX
A 10.15 10.45 0.400 0.411
F B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
R X 45
F 0.50 0.90 0.020 0.035
G 1.27 BSC 0.050 BSC
J 0.25 0.32 0.010 0.012
C K 0.10 0.25 0.004 0.009
T M 0
7
0
7

SEATING M P 10.05 10.55 0.395 0.415
14X G K PLANE R 0.25 0.75 0.010 0.029

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 MC74HC4851A, MC74HC4852A

PACKAGE DIMENSIONS

TSSOP16
DT SUFFIX
CASE 948F01
ISSUE O
16X K REF

0.10 (0.004) M T U S V S
NOTES:
0.15 (0.006) T U S
K 1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.
K1 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.

16 9 PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
2X L/2 J1 GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
B SECTION NN FLASH OR PROTRUSION. INTERLEAD FLASH OR
L PROTRUSION SHALL NOT EXCEED
U 0.25 (0.010) PER SIDE.
J
PIN 1 5. DIMENSION K DOES NOT INCLUDE DAMBAR
IDENT. PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
1 8 DIMENSION AT MAXIMUM MATERIAL CONDITION.
N 6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
0.25 (0.010) 7. DIMENSION A AND B ARE TO BE DETERMINED AT
0.15 (0.006) T U S DATUM PLANE -W-.
A M
MILLIMETERS INCHES
V
DIM MIN MAX MIN MAX
N A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
F C --- 1.20 --- 0.047
D 0.05 0.15 0.002 0.006
DETAIL E F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
C W K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
0.10 (0.004) M 0
8
0
8

T SEATING H DETAIL E
PLANE D G

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