Escolar Documentos
Profissional Documentos
Cultura Documentos
carmelo.demaria@centropiaggio.unipi.it
+
Before
you
begin
Acrylates
High
reac5vity
Inaccuracy
(shrinkage
and
curling)
Oxygen
inhibi5on
Free-radical
polymeriza5on
+
Types
of
photopolymers
Epoxy
Slow
photo-speed
Bribleness
Accuracy,
harder,
stronger
(lower
dimensional
changes)
Not
Oxygen
inhibi5on
(lower
photoini5ator
concentra5on)
Sensi5vity
to
humidity
Ca5onic
polymeriza5on
+
Types
of
photopolymers
Radical
polymeriza5on
Ca5onic
polymeriza5on
+
PhotopolymerizaKon
Polymeriza5on
is
exothermic,
heats
of
reac5on
around
85
kJ/mol
for
acrylate.
Despite
high
heats
of
reac5on,
a
catalyst
is
necessary
to
ini5ate
the
reac5on.
A
photoini5ator
acts
as
the
catalyst.
Mixtures
of
dierent
types
of
photoini5ators
may
also
be
employed
O H
+
Radical
polymerizaKon
R
Vinylether
initiation of macromonomers.
d (4.2) have important consequences for the SL proce
STEREOLITHOGRAPHY
CONFIGURATIONS
+
Stereolithography
conguraKons
Vector
scan
+
Stereolithography
conguraKons
Mask
projec5on
+
Stereolithography
conguraKons
+
Stereolithography
conguraKons
Note:
care
must
be
taken
to
support
any
overhangs
The
SLA
modeler
uses
a
photopolymer,
which
has
very
low
viscosity
un5l
exposed
to
UV
light.
Unfortunately
this
photopolymer
is
toxic.
Warpage
occurs.
ing, CMET (Mitsubishi), Sony, Meiko Corp., Mitsui Zosen, and Teijin Seiki
(license from Dupont).
+
SL
machine
A schematic of a typical SL machine was illustrated in Fig. 4.1a, which shows
the main subsystems, including the laser and optics, the platform and elevator, the
vat and resin-handling subsystem, and the recoater. The machine subsystem hierar-
chy is given in Fig. 4.5. Note that the five main subsystems are: recoating system,
Machine
platform system, vatssystem,
ubsystems
hierarchy
laser and optics system, and control system.
SL Machine
Scanning
Laser
He-Cd
Lunghezza
donda
0.325
um
Potenza
800
mW
Spessore
minimo
0.025
mm
Volume
vasca
253
Volume
di
lavoro
500
x
500
x
600
mm3
Velocit
di
scansione
Max
9.52
m/s
Diametro
Spot
Da
0.23
a
0.84
mm
PROCESS
PARAMETERS
+
Nomenclature
Wo
Vs
x
r
p
y
line of
p z
r
+
Scan
line
of
a
G
2 aussian
PL $2y2 =Wl02 aser
Ey; 0 e (
p W0 Vs
Fundamental
g this with (4.3) yieldsgthe
eneral
exposure
fundamental generalequa5on
exposure equati
r
2 PL $2y2 =W02 $z=Dp
Ex; y; z e e (
p W 0 Vs
serResin Interaction
y"2 depth
the maximum z" of Ascure, we
2 canP Lsolve (4.14) for z* and set
maximum2 2cure depth
ln
will occur
resin surface; p along the center of the scan (4.1
is probably intuitive, the width of a cured line of resin is the maximum
W0 Dp the i.e.,Wy V
0 E
occurs
max
s c
at z 0. To determine line width, we sta
h, Cd, is given by line shape function, (4.14). Setting z 0 and letting line width, L , equal
w
the line width can be found:
"r #
tion of a parabolic cylinder
2 Pin y* and z*, which can be seen mo
L
C
wing form,d D p ln L (4.16) w
p W0 Vs Ec4 Photopolymerization
X Processes
Y
ay q
"2
bz" "
cof resin (4.1
intuitive, the width of a cured line
Lw W0 2Cd Dp C is the maximum at
d
the (4.17)
, ymax occurs at z 0. To determine line width, we start with
Fig. 4.7 Cured line showing
are (4.14).
ction, constants, immediately
Setting 0 and
zparabolic derivable
letting
shape, cure depth, from
line width, Lw,(4.14).
equal 2yFigure
Z
max, 4
portant aspects become and lineclear.
width First, line width is proportional
owing form,
+
Scan
line
of
a
Gaussian
Laser
where a, b, and c are constants, immediately derivable from (4.14). Figu
illustrates the parabolic shape of a cured scan line.
ay"2 y* To
bz "
determine
c the maximum depth of cure, we can solve (4.14) for z* a
(4.15)
0, since the maximum cure depth will occur along the center of th
vector. Cure depth, Cd, is given by
c are constants, immediately derivable from "(4.14). Figure
# 4.7
The
line
width
is
propor5onal
Cd Dp ln
t o
r
t2he
PLbeam
abolic shape of a cured scan line.
spot
sdepth
ize.
of cure, we can solve (4.14) for z* and set
p W0 Vs Ec
the maximum
If
a
greater
resincure
doccur
epth
is
occurs
desired,
0. Toline
ofwthe
idth
As is probably intuitive, the width of a cured line of resin is the maximum
maximum cure depth will
surface; along
i.e., ymax atthe
z center determine line scan
width, we sta
h, Cd, ismust
given iby ncrease,
all
else
remaining
the
same.
the line shape function, (4.14). Setting z 0 and letting line width, Lw, equal
the line width can be found:
"r #
2 PL
Cd Dp ln L (4.16) w
p W0 Vs Ec4 Photopolymerization
X Processes
Y
q
" line of resin is the maximum at the
intuitive, the width of a
Lw W0 2Cd Dp cured C d (4.17)
, ymax occurs at z 0. To determine line width, we start with
Fig. 4.7 Cured line showing
0 and
ction, (4.14). Setting zparabolic depth, line width, Lw, equal 2ymax,
letting
shape, cure
Z
portant aspects become and lineclear.
width First, line width is proportional
stants,
ept to be Dpclearly
and Ecin
presented . At inthe
the resin
following
this surface
subsection form,isand in the center
fundamental of the
to commer-
+
eed Working
curve
working curve, which relates exposure to cure depth, and includes
"2 "
constants, Dp and Ec. At r ay
the resin surface and in the center bz c of the
2 PL
ally usedE0;as0an$intuitive
where E
a,max b, approximation
and cpare of SL photosensitivity.
constants, immediately (4.18) fr
derivable
at it relatesillustrates
to the speed r Wthe0 Vlaser
s
the parabolic shapecan
at which of be scanned
a cured scanacross
line.
e to give E0;a specified cure depth. 2 P
The L faster the laser can be
expression within $ the
To0determine the maximum
Emaxlogarithm term depth
in (4.16).of cure, we (4.18)
Substituting can solve
desired cure y*depth,
0, the sincehigher thepphotospeed.
the maximum W0 Vs cure Photospeed
depth will isoccur a along
ds the working
e resin and does not curve equation:
depend upon the specifics of the laser or
vector. Cure depth, Cd, is given by
In
theparticular,
expressionphotospeed
within#the is indicated
logarithm by term
the resin
in constants
(4.16). Ec
Substituting
$
yields the working curve Emax equation: "r #
an velocity C ford adesired
Dp ln cure depth, it is straightforward to2 solve P(4.19)
L
E#c Cd Dp ln
$ exposure
l that80at the maximum cure depth, Emax the received pequals W0 Vs Ec4 Photop
Ec. Scan velocity Cdisgiven Dp lnby (4.20). (4.19)
r of power PL scans across E thec resin surface at qsome speed Vs
"
r iscure
depth Cd, As the probably
depth,
2 PL "Cd =Dp
intuitive,
assuming the
L w
width
that W 0
of
the a2C cured
total
d D line of resin
energy
p
nlaser
vector resin
Vs surface;
of power
exceeds PL ascans i.e.,
eacross
critical ymax
value theoccurs
resin surface
called 0.
atthez critical To
at some determine
(4.20) speed Vs line
exposure,
p W0 E c
totooa depth the
quickly,Cline
d , shape
the curefunction,
no polymerization depth, (4.14).
assuming Setting
reaction thatz
the 0
takes clear. and
total letting
place;First,energy line
i.e., line
As a result, two important aspects
the line width can be found: become
+
Working
curve
The
cure
depth
is
propor5onal
to
the
natural
logarithm
of
the
maximum
exposure
on
the
centerline
of
a
scanned
laser
beam.
A
semilog
plot
of
Cd
vs.
Emax
should
be
a
straight
line.
This
plot
is
known
as
the
working
curve
for
a
given
resin.
The
slope
of
the
working
curve
is
precisely
Dp
at
the
laser
wavelength
being
used
to
generate
the
working
curve.
The
x-axis
intercept
of
the
working
curve
is
Ec,
the
cri5cal
exposure
of
the
resin
at
that
wavelength.
Theore5cally,
the
cure
depth
is
0
at
Ec,
but
this
does
indicate
the
gel
point
of
the
resin.
Since
Dp
and
Ec
are
purely
resin
parameters,
the
slope
and
intercept
of
the
working
curve
are
independent
of
laser
power.
In
prac5ce,
various
Emax
values
can
be
generated
easily
by
varying
the
laser
scan
speed
+
Working
curve
4.5 SL Resin Curing Process 81
20
15
Cure Depth (mils)
Dp
10
Ec
5
10
100 101 102 103
Exposure (mJ/cm2)
TECHNICAL DATA
Somos ProtoGen 18120 Somos ProtoGen 18120 Somos ProtoGen 18120
Mechanical Properties
UV Postcure at HOC -2 UV Postcure at HOC +3 UV & Thermal Postcure
ASTM Property
Metric Imperial Metric Imperial Metric Imperial
Method Description
Tensile 51.7 - 54.9 56.9 - 57.1 68.8 - 69.2
D638M 7.5 - 8.0 ksi 8.2 - 8.3 ksi 9.9 - 10.0 ksi
Strength MPa MPa MPa
Tensile 2,620 - 2,740 2,540 - 2,620 2,910 - 2,990
D638M 381 - 397 ksi 370 - 380 ksi 422 - 433 ksi
Modulus MPa MPa MPa
Elongation at
D638M 6 - 12% 6 - 12% 8 - 12% 8 - 12% 7 - 8% 7 - 8%
Break
Poissons
D638M 0.43 - 0.45 0.43 - 0.45 N/A N/A 0.43 0.43
Ratio
Flexural 81.8 - 83.8 83.8 - 86.7 88.5 - 91.5
D790M 11.9 - 12.2 ksi 12.2 - 12.6 ksi 13.2 ksi
Strength MPa MPa MPa
Flexural 2,360 - 2,480 2,400 - 2,450 2,330 - 2,490
D790M 343 - 359 ksi 350 - 355 ksi 361 ksi
Modulus MPa MPa MPa
Hardness
D2240 84 - 85 85 - 87 N/A N/A 87 - 88 87 - 88
(Shore D)
Izod Impact 0.14 - 0.26 0.13 - 0.25
D256A 0.26 - 0.49 ft-lb/in N/A N/A 0.24 - 0.47 ft-lb/in
(Notched) J/m J/m
Water
D570-98 0.77% 0.77% N/A N/A 0.75% 0.75%
Absorption
+
Materials
cont:
SLA
Somos
7120
-
A
high
speed
general
use
resin
that
is
heat
and
humidty
resistant.
Somos
9120
-
A
robust
accurate
resin
for
func5onal
parts.
For
more
informa5on
on
this
material
please
read
the
material
Somos
9920
-
A
durable
resin
whose
proper5es
mimic
polypropylene.
Oers
superior
chemical
resistance,
fa5gue
proper5es,
and
strong
memory
reten5on.
Somos
10120
WaterClear
-
A
general
purpose
resin
with
mid
range
mechanical
proper5es.
Transparent
parts
are
possible
if
nished
properly.
Somos
11120
WaterShed
-
Produces
strong,
tough,
water-resistant
parts.
Many
of
its
mechanical
proper5es
mimic
that
of
ABS
plas5c.
Somos
14120
White
-
A
low
viscosity
liquid
photopolymer
that
produces
strong,
tough,
water-resistant
parts.
Somos
ProtoTool
-
ProtoTool
is
a
high
density
material
that
transcends
currently
available
stereolithography
resins
by
oering
superior
modulus
and
temperature
resistance.
+
Time
scales
160
140 EP
hs
120
Emax
Percent of Emax
100
80
60
40
20
0.05
0.1
Cure Depth [mm]
0.15
0.2
Cd0
0.25
0.3
Cd1
0.35
0.4
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
Y [mm]
Fig. 4.13 Cure depth and exposure for the ACES scan pattern
MASK
PROJECTION
+
Layer
at
a
Time
SolidicaKon
(Mask)
Clear Glass
Plate Mask
Photo-
polymer
Pinhole Filter
Digital Micromirror
Broadband Device
UV lamp
Collimating Bitmaps
lens computer
Imaging lens
Translation
stage
Resin vat
UV Lamp
Optics DMD
+
PhotosolidicaKon
Layer
at
a
Time
Incident beam
Model of thechatacteristics
MPSL process
Irradiance
Imaging system IRRADIANCE received by every
parameters MODEL point on resin
rror on theBitmap
DMD surface
to the resin. As a result, a point on the resin may receive
displayed
on DMD
n from several micromirrors. Standard ray-tracing methods can be used to
the irradiance field that results from a bitmap [61].
computing the irradiance distribution on the vat surface, the cured shape
predicted. The depth of cure can be computed in a manner similar to that
Lateral
Sect. 4.5. Cure depth
dimensions of is computed asCURE Layer
the product of the resins Dp value and
thickness
onential of the exposure received MODEL
the cured layer
divided by the resins Ec value, as in
Time of
The exposure received is simply the product of the irradiance exposure at a point and
of exposure, T.
Fig. 4.17 Model of the MPSL process
+ Commercial system surface, enabling more precise layers to be fabricated. Third, they have devi
+
Cons
Requires
post-curing.
Long-term
curing
can
lead
to
warping.
Parts
are
quite
brible
and
have
a
tacky
surface.
Support
structures
are
typically
required.
Supports
must
be
removed
by
hand
Uncured
material
is
toxic.
Lible
material
choice
Costs
Material
trained
operator
Lab
environment
necessary
(gasses!)
Laser
lasts
2000hrs,
costs
$20000!
Slow
process
+
Link
uKli
hbp://www.acucast.com/rapid_prototyping.htm
hbp://www.milparts.net/sla.html
hbp://www.protocam.com/html/materials-
sla.html
hbp://www.3dsystems.com
hbp://www.dsm.com/products/somos/en_US/
oerings/oerings-somos-proto-gen.html#
Layerless
3D
prin5ng
CARBON
3D
+
Carbon
3D
+
Carbon
3D
TWO
PHOTON
STEREOLITHOGRAPHY
need for recoating.
+
Two
photon
stereolithography
Photosensitivity of a 2p-SL resin is measured in terms of the two-photon
sorption cross section (D) of the initiator molecule corresponding to the wave-
gth used to irradiate it. The larger the value of D, the more sensitive is the resin to
o-photon polymerization, possibly enabling lower power lasers.
Wax
Solid Wax
Wax Mill wax &
workpiece
+
SGC:
pros
and
cons
Parametro
Valore
Plamorm
adhesion
type
(Brim)
SI
No
Layer
thickness
(mm)
Shell
thickness
(mm)
Fill
density
(%)
20%
50 70%
%
Top/boaom
thickness
(mm)
Print
speed
(mm/s)
PrinKng
temperature
(C)
Filament
diameter
(mm)