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PC494
SWITCHING REGULATOR CONTROL CIRCUIT
DESCRIPTION
The PC494 is an inverter control unit which provides all the control circuitry for PWM type switching regulators.
Included in this device is the voltage reference, dual error amplifiers, oscillator, pulse width modulator, pulse
steering flip flop, dual alternating output switches and dead-time control.
FEATURES
Complete PWM power control circuit.
Adjustable dead-time (0 to 100%).
No double pulsing of same output during load transient condition.
Dual error amplifiers have wide common mode input voltage capability (0.3 V to VCC2 V).
Circuit architecture provides easy synchronization.
Uncommitted outputs for 250-mA sink or source.
With miss-operation prevention circuit for low level supply voltage.
Full pin-compatible TL494C.
PC494C 16-pin plastic DIP (7.62 mm (300)) Inv. Input 2 15 Inv. Input
CT 5 12 VCC
RT 6 11 C2
GND 7 10 E2
C1 8 9 E1
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. G12649EJ4V0DS00 (4th edition) The mark shows major revised points. 1988,2000
(Previous No. IC-1299)
Date Published November 2000 NS CP(K)
Printed in Japan
PC494
BLOCK DIAGRAM
GND 7 F 8 C1
T/ 9 E1
F 11 C2
RT 6
Oscillator
CT 5 10 E2
Dead-Time
+ Comparator
Dead-Time
Control 4
+
EA I
Non-Inv. Input 1 +
PWM
Inv. Input 2 Comparator
EA II
Non-Inv. Input 16 +
Inv. Input 15
Feed-Back 3
Error Amplifier Input Voltage VICM 0.3 to VCC + 0.3 0.3 to VCC + 0.3 0.3 to VCC + 0.3 V
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions that
ensure that the absolute maximum ratings are not exceeded.
Caution The recommended operating range may be exceeded without causing any problems provided that
the absolute maximum ratings are not exceeded. However, if the device is operated in a way that
exceeds the recommended operating conditions, the margin between the actual conditions of use
and the absolute maximum ratings is small, and therefore thorough evaluation is necessary. The
recommended operating conditions do not imply that the device can be used with all values at
their maximum values.
(1/2)
Block Characteristics Symbol Conditions MIN. TYP. MAX. Unit
Remark The TYP. values are values at TA = 25C, except for the characteristics of temperature.
(2/2)
Block Characteristics Symbol Conditions MIN. TYP. MAX. Unit
Output Collector Cut-off Current ICER VCE =#40 V, VCC =#40 V, 100 A
Section Common Emitter
Emitter Follower
Output Voltage Rise Common tr1 VCC =#15 V, RL = 150 , 100 200 ns
Time Emitter IC 100 mA, TA = 25C,
Output Voltage Fall tf1 see Figure 1. 70 200 ns
Time
Remark The TYP. values are values at TA = 25C, except for the characteristics of temperature.
Notes 1. The short circuit output current flows for no more than 1 second. Repeat operation is possible if the internal
heat accumulation is not within a harmful range.
2. Standard deviation is a measure of the statistical distribution about the mean as derived from the formula ;
N
(Xn X)
2
=
n=1
N1
1
fOSC (Hz) [RT] = , [CT] = F
0.817 RTCT + 1.4210
6
VCC = 15 V
(12) RL RL
V CC 150 150
(4) Dead-Time
(8) 2 W 2W
Test Input (3) Control C1 (9) Output 1
Feed-Back E1
12 k (6) (11)
R T C2 (10) Output 2
0.01F Note (5) E2
CT
(1)
Non-Inv. Input
(2)
Inv. Input
(16)
(15) Non-Inv. Input
Inv. Input
(13)
Output Control (14)
Ref Out
50 k GND
(7)
Caution When the emitter follower is output, connect C1 and C2 to VCC and E1 and E2 to
GND via RL.
VCC
C1 Output Voltage
0V
VCC
C2 Output Voltage
0V
CT Voltage
Threshold Voltage
Dead-Time Control
Input
0% MAX.
Threshold Voltage
0%
Feed-Back Input
(E.A. Output) 0.7 V
MISS-OPERATION PREVENTION
MAXIMUM POWER DISSIPATION CIRCUIT CHARACTERISTICS
1.2 6
PT - Maximum Power Dissipation - W
0.2 1
0 0
25 50 75 100 125 4 5 6 7
TA - Ambient Temperature - C VCC - Supply Voltage - V
5 IREF = 1 mA
20
4
0
3
20
2
40
1
0 60
5 10 15 20 25 30 35 40 25 0 25 50 75 100
VCC - Supply Voltage - V TA - Ambient Temperature - C
FREQUENCY vs.
FREQUENCY vs. RT AND CT AMBIENT TEMPERATURE
4
VCC = 15 V VCC = 15 V
f/fOSC - Frequency Change - %
500 RT = 12 k
2
CT = 0.01 F
fOSC - Frequency - kHz
200
100 0
50 CT
= 2
10 47
20 00 0 p
pF F
10 0. 4
01
5 0. F
04 6
7
2 F
1
2 5 10 20 50 100 200 500 25 0 25 50 75 100
RT - Timing Resistance - k TA - Ambient Temperature - C
C
C
85
25
C
Duty Cycle - %
0
10 80
2
=
TA
20 60
30 40
VCC = 15 V
40 20
RT = 12 k
CT = 0.01 F
50 0
0 1 2 3 1 10 100 1 k 10 k 100 k 1 M 10 M
Dead-Time Control Input Voltage - V f - Frequency - Hz
(Common Emitter) - V
(Emitter Follower) - V
0.4 0
0 40 80 120 160 200 10 20 30 40
IC, IE - Output Current - mA VCC - Supply Voltage - V
VOUT
VCC 12 V
VR3
R13 +
100 C1 C6 R12 R11
7.5 k 5 k JP1 47 F
Iosense R14 110 110
R15 C2
+Iosense
0.01 F 100 E2
E1
C2 16 15 14 13 12 11 10 9 C1
Vosense
+
REFERENCE
R9 R10
110 110
ERROR
R17 AMP
2 REGULATOR
R16
R3 C7 100 k
3.9 k R1 F/F
5.1 k
ERROR
AMP
+ OSCILLATOR
VR1 1
0.1 V
2 k 1 2 3 4 5 6 7 8
R4 240 k 2 k C5 R8
R2 5.1 k
5.1 k
R5 VR2 24 k
C3 R6 C4
+ R7 7.5 k
0.01 F 24 k
10 F
+5 V (VREF)
CONNECTION DIAGRAM
VR3
R11
R12
VCC
R10
R9
JP1
R13
R14
R15
C2
E2 Iosense
JP2
E1 +Iosense
R16
R17
C6
9 IC1 16
C1 8 1 Vosense
C7
GND GND
VR1
C3
C4
C1
VR2
R8
R3
R6
R5
R2
R7
R1
C5
R4
C2
1) Forward Type
+VCC +
+
+12 V VOUT
(12)
VCC
(8)
C1
(13) Output
Control To EA II To EA I
(9) (Over Current (Vosense)
E1
Protection )
(14) (7) GND
Ref Out GND
2) Push-pull Type
(Isolated)
+VCC
+
+
VOUT
GND
+12 V
To EA II To EA I
(12)
(11)
C2 VCC
(10)
E2
(9)
E1
(8)
C1 Output
(7) (13)
GND Control
(14)
Ref Out
(Non Isolated)
(12)
VCC (11)
C2 +
(10) +
E2 VOUT
(13) Output (9)
E1
Control
(14) (8)
Ref Out C1
GND
(7)
GND To EA II To EA I
3) Step-down Chopper
(12) +
VCC (11) VOUT
C2
(10)
E2
(9)
E1
(13) Output (8)
Control C1
GND
To EA II To EA I
(7) (Over Current
Protection)
Remark The dotted line indicates the connection in case of large current.
SYNCRONIZED OPERATION
If synchronized operation is needed, muster-slave circuit can be used. This circuit is shown below.
Initially, RT terminal of slave IC is connected to pin 14(Ref Out) and internal oscillator is stopped.
+VCC
(12) (14)
VCC Ref Out
(6) RT
(M) RT
(7) CT
(5)
GND CT
(12) (14)
VCC Ref Out
(6)
(S) RT
(M) : Master
(7) (5)
GND CT (S) : Slave
16 9
1 8
J K
I P L
F C B
H
M R
G D N M
M 0.25 +0.10
0.05
N 0.25
P 1.1 MIN.
R 015
P16C-100-300B-2
16 9
1 8
F H
G I J
B L
C N S
K
D M M
K 0.17 +0.08
0.07
L 0.80.2
M 0.12
N 0.15
P 3 +7
3
P16GM-50-375B-6
16 9
1 8
F H
G I J
B L
N S K
C
D M M
D 0.42 +0.08
0.07
E 0.10.1
F 1.650.15
G 1.55
H 7.70.3
I 5.60.2
J 1.10.2
K 0.22 +0.08
0.07
L 0.60.2
M 0.12
N 0.10
P 3 +7
3
P16GM-50-300B-6
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL"(C10535E).
Process Conditions
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
Infrared Ray Reflow Peak temperature: 230C or below (Package surface temperature), IR30-00-1
Reflow time: 30 seconds or less (at 210C or higher),
Maximum number of reflow processes: 1 time.
Vapor Phase Soldering Peak temperature: 215C or below (Package surface temperature), VP15-00-1
Reflow time: 40 seconds or less (at 200C or higher),
Maximum number of reflow processes: 1 time.
Wave Soldering Solder temperature: 260C or below, Flow time: 10 seconds or less, WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120C or below (Package surface temperature).
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
[MEMO]
[MEMO]
[MEMO]
The information in this document is current as of November, 2000. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
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redundancy, fire-containment, and anti-failure features.
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developed based on a customer-designated "quality assurance program" for a specific application. The
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Customers must check the quality grade of each semiconductor product before using it in a particular
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The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
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(Note)
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(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
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M8E 00. 4
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