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The Internet of Things (IoT) is now at its onset as a result of a global effort to
enable massively distributed integrated circuits and systems with sensing,
processing, communication and energy management capabilities (the IoT
nodes). The vision towards 1 Tera connected IoT nodes poses several
challenges in the broad area of circuits and systems, including:
(i) the need for unprecedentedly high energy efficiency and low standby
power,
(ii) ultra-low voltage operation and inexpensive resiliency-enhancement
techniques,
(iii) very low cost across the entire chain from design to verification, and
manufacturing,
(iv) systematic over-design margin elimination from the circuit to the
application level,
(v) cyber-security assurance down to single chip level despite highly-
constrained resources,
(vi) the need for early extraction of essential information from physical data
within the IoT nodes themselves, to enable distributed learning/sensemaking
and hence true IoT scalability.
Due to the gargantuan scale of the IoT, the above challenges need to be
addressed through holistic approaches that embrace multiple levels of
abstraction (verticality) and building blocks of the on-chip
sensing/sensemaking chain (transversality). Nowadays, vertical approaches
are progressively becoming more customary to exceed the artificial
boundaries created by levels of abstraction, and enable advances that
transcend their traditional limits. On the other hand, more research is needed
to devise transversal methods that leverage the interaction within the
sensing/sensemaking chain, from analog interfaces to processing, power
delivery, wireless communications and HW/SW-level information security,
while expanding into systems, data representation and algorithmic
frameworks.
Authors are invited to submit Regular papers following the IEEE Transactions
on Circuits and Systems I: Regular Papers (TCAS-I) guidelines, within the
remit of this Special Issue call. Topics within the remit of circuits and systems
for IoT include (but are not limited to):
Submission Guidelines
All submitted manuscripts must
(i) conform to TCAS-Is formatting requirements and page-count limit (at no
more than 14 pages);
(ii) incorporate no less than 50% of new (previously unpublished) material;
(iii) be submitted online at https://mc.manuscriptcentral.com/tcas1.
Please note that you need to select Special Issue on IoT when you submit
a manuscript to this Special Issue.
Deadlines
Paper Submission: December 7, 2016
Completion of First Review: February 7, 2017
Completion of Final Review: April 7, 2017
Target Publication: June 2017
Guest Editors
Prof. Massimo Alioto
National University of Singapore (Singapore)
E-mail: malioto@ieee.org