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1 PRINTED CIRCUIT BOARDS

Aircraft electronic systems necessitate the interconnection of many components;


in the past this was done by soldered or crimped terminations. With the
development of circuit technology and micro miniaturisation, weight saving and
simplification of installation and maintenance became needful and these needs
were met by the development of the printed circuit board.

1.1 CONSTRUCTION

Printed circuit board is a laminated paper or fibreglass board coated on one side
with a thin layer of copper. The areas of copper, called 'lands', required to
connect the components are marked out by painting over the copper, and the
remaining copper is etched away by a solution of ferric chloride. Holes are then
drilled in the board for the component leads. The advantage is that the copper
strips can be any shape and few additional wires are required. Industry can
produce printed circuit boards in large numbers very cheaply so they have
become the standard circuit construction method. Figure 1 shows the front face
of a PCB, with Figure 2 showing the rear face.

BASE
BOARD
FRONT

Printed Circuit Board


Figure 1
CIRCUIT MODULE
DESIGNATION
(E.G. SIGNAL
IC1 IC2 IC5
SELECTOR)

CIRCUIT
REFERENCE
C2
IC3 IC4
INTEGRATED
CIRCUIT CHIPS IC6

FINGER OR
REAR EDGE CONNECTOR

Printed Circuit Board


Figure 2
1.2 MULTI-LAYER CIRCUITS

In order to save weight and space, and to provide for the interconnection of
integrated circuits (which are a feature of a large majority of electronic equipment)
the relevant circuits are assembled as a multi-layer moulded package. This
consists of three or more single and/or double-sided printed boards and insulating
layers of impreg material.

1.3 HANDLING PRINTED CIRCUIT BOARDS

Since various types of semi-conductor components are mounted on printed circuit


boards, care must always be taken in handling techniques.

General techniques are as follows: -

a) Do not remove or replace units with electrical power applied.

b) Do not touch the connectors, leads or edge connectors of circuit boards


unnecessarily.

c) Use conductive packaging, shorting plugs, bands or wire when provided or


prescribed by the relevant aircraft Maintenance Manual.

d) Pay strict attention to stores procedures to ensure that protective


packaging is not removed during any goods-inwards inspection.

Module 5 details procedures for handling Static Sensitive Devices.


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JAR 66 CATEGORY B1 MODULE 4.2
MODULE 4 PRINTED CIRCUIT

uk ELECTRONIC
FUNDAMENTALS
BOARDS

engineering