EE 5344 Introduction to MEMS

CHAPTER 6 Mechanical Sensors

I. Mechanical Measurands:

1. Classification of main types:

1. Position Displacement x,
dx d
2. Velocity, speed Kinematic v= , =
dt dt
3. Acceleration (Linear, angular)
d 2 x dv
a= ,
dt 2 dt
d 2 d
= =
2 dt
dt

v v v v
4. Force, torque F , T = r xF

5. Stress, pressure F/A force/unit area

6. Strain L/L Deflection/unit length

7. Stiffness, compliance detection subject to force.

8. Mass, density

9. Flow-rate

10. Shape, roughness (friction)

11. Viscosity (fluid friction)

12. Other (acoustic, ultrasonic)

2. Principles of Mechanical Microsensors:

Mechanical quantity Sensing Element Mechanical

quantity

Electrical signal

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We sense by utilizing special properties of materials.

Ex: piezoelectric material

PE
Charge
Material
Deformation
Sensor mode Actuator mode

See table 7.4

Capacitive

charge

II. Mechanical Properties of Silicon Microstuctures

Most commonly used building material for microsensors. Also, it is also used for
microelectronics => widely available for manufacturing technologies.

1. Mechanical Structures
Key mechanical parameters and properties in design:
1. Physical dimensions: width, height, thickness, radius
2. Material properties: Elastic Modulus, Yield Strength, Poissons ratio, Density,
viscosity
3. Calculable parameters: mass, spring constant, damping coefficient, strain, Natural
frequency, Moment of inertia
4. Load Parameters: Applied (external) force, Applied (external) torque, stress, pressure,
Impulse
5. Response parameters: Lateral deflection, Angular deflection, Sensitivity, resonance,
Band-width

Hookes Law:
Linear elastic theory: F = k m x distributed loads: m = E m m
F: force, km: spring constant, x: linear displacement,
m: stress, Em; Youngs modulus, m: strain

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3. Micromechanical Scaling:

Does size affect the physical laws/parameters?

We may perform dimensional analysis to get our answer!

Macro Micro
L KL

Scale Factor

Cantilever beam:
m, Mass ~ Volume => Factor K3
x, Displacement => Factor K
F, Beam Force => Factor K2
m , stress ~ F/A ~ Factor K2/K2=1
km, Spring constant F/x, ~ K
L3 L3
Deflection y = F= 2
F ~ K , Here I is the moment of inertia in kg/m2
3E m I 3E m ( m L )
0, Natural frequency ~ km m ~ K K 3 = 1 K

So K => m y km 0

lower less stiller

cost sensitive

Frictional Phenomena
Viscous damping (K2)
Mass Coulomb damping (K 3)
Elastic Coulomb damping (K 2)
Surface adhesion (K 2)

In atomic scale, the theories of scaling break-down, decreased viscous damping,

increased surface adhesion etc.

4. Silicon Micromechanical Structures

Single crystal silicon =>steel, iron in Youngs modulus.

But more brittle => no elastic deformation, snaps!

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Polishing Silicon or coating with SiNx improves its mechanical endurance.

Polycrystalline Silicon is also used. Typical grain size should be much smaller than
smallest structure dimension. (>about 80 nm)

*Microflexural Structures:
These are mechanical structures that deflect under force, => sensing elements.
Motion => electricity

Ex: Cantilever beam

cantilever beam.

F, y
electrodes You can drive the system
electrostatically

Electricity Motion

Characteristic Differential Equation:

d2y dy
m + bm + k m y = F (t ) Here, m: mass; bm: damping coefficient; km: spring
dt dt
constant.

Go over Figure 7.5 and Table 7.10

General Outline: Displacement microsensors; Velocity and Flow Microsensors;

Acceleration Microsensors; Force, Pressure and Strain Microsensors, Mass Microsensors,
Other Microsensors (Acoustic, viscosity etc.)

III. Displacement Microsensors

To measure the position at an item of interest.

Contacting (the sensor is in contact
with the item of interest),
Displacement sensor potentiometers, piezo-accelerometer)
{capacitive, resistive, inductive,
Proximity sensor magnetic, optical}

Non-contacting (the sensor is

remote) {capacitive, inductive,
magnetic, infrared, ultrasonic,
optical)

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1. Capacitive and inductive displacement sensors
The cantilever example

We may measure the gap.

We may use this to indirectly measure force/torque, pressure/stress,

deflection force

2. Optical displacement sensors

They are based on: i) Interruption of a direct beam
ii) Specular reflection off a surface
iii) Diffuse scattering off a surface

Ex: Diffuse Sensor 1.

LED
d = f (Vs, Id)
Id Drive
Current non-linear
Object
Better for
detecting the
Vs Sense
presence of an
Voltage
object

Photo d= 1mm
transistor

Light Source
Array of
detectors
Ex. 2

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3. Ultrasonic displacement sensors

Send a wave

in the medium is known. t

t is known => s =
2
Receive a wave

Commonly piezo-ceramics (Lead titanate or lead zirconate) are used to generate and
capture the wave. Applications: measure proximity, distance, level of liquids etc.

Advantages:
can be used on conducting as well as non-conducting materials.
Ultrasound is high frequency 50KHz, so low interference and less susceptible to dirty
environments.
Can be used up to 5m.

Go over Figure 7.7.

LVDT
Another common type of is the linear Variable Differential Transformer, also known as
the LVDT. The LVDT is basically a series of inductors in a hollow cylindrical shaft and
a solid cylindrical core, See figure below. The LVDT produces an electrical output
proportional to the position of the core. The physical position to an electrical output.
The lack of friction between the hollow shaft and the core prolong the life of the LVDT
and enable very good resolution. In addition, the small mass of the core allows for good
sensitivity in dynamic tests.

Primary Coil

Core

Secondary Coils

CROSS SECTION OF A LVDT

The LVDT is constructed with two secondary coils placed symmetrically on either side
of a primary coil contained within the hollow cylindrical shaft. Movement of the

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magnetic core causes the mutual inductance of each secondary coil to vary relative to the
primary, and thus the relative voltage induced from the primary coil to the secondary coil
as well.

These LVDTs may also be calibrated by varying the position of the core and measuring
the corresponding output voltages. Then Calibration curve or calibration constant may be
determined and applied to arrive at the engineering units of position.

III. Velocity & Flow Microsensors:

Basic Relationships

Quantity Linear Angular

displacement x
velocity v
acceleration a

d
t t
dx
= = x = vdt = dt
dt dt to to

t
dv d 2 x d d 2 v =
t
a= = = = 2 adt = dt
dt dt 2 dt dt to to

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