Escolar Documentos
Profissional Documentos
Cultura Documentos
1. General description
The 74HC595; 74HCT595 are high-speed Si-gate CMOS devices and are pin compatible
with Low-power Schottky TTL (LSTTL). They are specified in compliance with JEDEC
standard No. 7A.
The 74HC595; 74HCT595 are 8-stage serial shift registers with a storage register and
3-state outputs. The registers have separate clocks.
Data is shifted on the positive-going transitions of the shift register clock input (SHCP).
The data in each register is transferred to the storage register on a positive-going
transition of the storage register clock input (STCP). If both clocks are connected together,
the shift register will always be one clock pulse ahead of the storage register.
The shift register has a serial input (DS) and a serial standard output (Q7S) for cascading.
It is also provided with asynchronous reset (active LOW) for all 8 shift register stages. The
storage register has 8 parallel 3-state bus driver outputs. Data in the storage register
appears at the output whenever the output enable input (OE) is LOW.
3. Applications
Serial-to-parallel data conversion
Remote control holding register
NXP Semiconductors 74HC595; 74HCT595
8-bit serial-in, serial or parallel-out shift register with output latches;
3-state
4. Ordering information
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74HC595N 40 C to +125 C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
74HCT595N
74HC595D 40 C to +125 C SO16 plastic small outline package; 16 leads; SOT109-1
74HCT595D body width 3.9 mm
74HC595DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads; SOT338-1
74HCT595DB body width 5.3 mm
74HC595PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads; SOT403-1
74HCT595PW body width 4.4 mm
74HC595BQ 40 C to +125 C DHVQFN16 plastic dual in-line compatible thermal enhanced SOT763-1
74HCT595BQ very thin quad flat package; no leads; 16 terminals;
body 2.5 3.5 0.85 mm
5. Functional diagram
14 DS
11 SHCP
8-STAGE SHIFT REGISTER
10 MR
Q7S 9
12 STCP
8-BIT STORAGE REGISTER
13 OE
3-STATE OUTPUTS
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
15 1 2 3 4 5 6 7 mna554
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
13
EN3
12
11 12 C2
SHCP STCP 10
R SRG8
9 11
Q7S C1/
15
Q0 14 15
1 1D 2D 3
Q1 1
2
Q2 2
14 3
DS Q3 3
4
Q4 4
5
Q5 5
6
Q6 6
7
Q7 7
MR OE
9
10 13
mna552 mna553
DS D Q D Q D Q Q7S
FF0 FF7
CP CP
R R
SHCP
MR
D Q D Q
LATCH LATCH
CP CP
STCP
OE
mna555
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
6. Pinning information
6.1 Pinning
74HC595
74HCT595
Q1 1 16 VCC
74HC595
Q2 2 15 Q0 74HCT595
Q3 3 14 DS
Q1 1 16 VCC
Q4 4 13 OE Q2 2 15 Q0
Q3 3 14 DS
Q5 5 12 STCP
Q4 4 13 OE
Q6 6 11 SHCP Q5 5 12 STCP
Q6 6 11 SHCP
Q7 7 10 MR
Q7 7 10 MR
GND 8 9 Q7S GND 8 9 Q7S
001aao241 001aao242
Fig 5. Pin configuration DIP16, SO16 Fig 6. Pin configuration SSOP16, TSSOP16
74HC595
74HCT595
16 VCC
Q1
terminal 1
index area
1
Q2 2 15 Q0
Q3 3 14 DS
Q4 4 13 OE
Q5 5 12 STCP
Q6 6 GND(1) 11 SHCP
Q7 7 10 MR
8
9
GND
Q7S
001aao243
(1) This is not a supply pin, the substrate is attached to this pad using conductive die attach material. There is no electrical or
mechanical requirement to solder this pad however if it is soldered the solder land should remain floating or be connected to
GND.
Fig 7. Pin configuration for DHVQFN16
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
7. Functional description
Table 3. Function table[1]
Control Input Output Function
SHCP STCP OE MR DS Q7S Qn
X X L L X L NC a LOW-level on MR only affects the shift registers
X L L X L L empty shift register loaded into storage register
X X H L X L Z shift register clear; parallel outputs in high-impedance OFF-state
X L H H Q6S NC logic HIGH-level shifted into shift register stage 0. Contents of all
shift register stages shifted through, e.g. previous state of stage 6
(internal Q6S) appears on the serial output (Q7S).
X L H X NC QnS contents of shift register stages (internal QnS) are transferred to
the storage register and parallel output stages
L H X Q6S QnS contents of shift register shifted through; previous contents of the
shift register is transferred to the storage register and the parallel
output stages
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
SHCP
DS
STCP
MR
OE
Z-state
Q0
Z-state
Q1
Z-state
Q6
Z-state
Q7
Q7S
mna556
8. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +7 V
IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V - 20 mA
IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V - 20 mA
IO output current VO = 0.5 V to (VCC + 0.5 V)
pin Q7S - 25 mA
pins Qn - 35 mA
ICC supply current - 70 mA
IGND ground current 70 - mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation
DIP16 package [1] - 750 mW
SO16 package [2] - 500 mW
SSOP16 package [3] - 500 mW
TSSOP16 package [3] - 500 mW
DHVQFN16 package [4] - 500 mW
[1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C.
[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
[3] For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
[4] For DHVQFN16 package: Ptot derates linearly with 4.5 mW/K above 60 C.
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
capacitance
12. Waveforms
1/fmax
VI
SHCP input VM
GND
tW
t PLH t PHL
VOH
Q 7S output VM
VOL
mna557
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
VI
SHCP input VM
GND
t su 1/fmax
VI
STCP input VM
GND
tW
t PLH t PHL
VOH
Q n output VM
VOL
mna558
VI
SHCP input VM
GND
t su t su
th th
VI
DS input VM
GND
VOH
Q 7S output VM
VOL
mna560
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
VI
MR input VM
GND
tW t rec
VI
SHCP input VM
GND
t PHL
VOH
Q 7S output VM
VOL
mna561
tr tf
90 %
OE input VM
10 %
tPLZ tPZL
Qn output
LOW-to-OFF VM
OFF-to-LOW 10 %
tPHZ tPZH
Qn output 90 %
HIGH-to-OFF VM
OFF-to-HIGH
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
tW
VI
90 %
negative
pulse VM VM
10 %
0V
tf tr
tr tf
VI
90 %
positive
pulse VM VM
10 %
0V
tW
VCC VCC
VI VO RL S1
G DUT open
RT CL
001aad983
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
D ME
seating plane
A2 A
L A1
c
Z e w M
b1
(e 1)
b b2
16 9 MH
pin 1 index
E
1 8
0 5 10 mm
scale
UNIT
A A1 A2
b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 1.25 0.36 19.50 6.48 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 0.76
1.30 0.38 0.85 0.23 18.55 6.20 3.05 7.80 8.3
inches 0.068 0.021 0.049 0.014 0.77 0.26 0.14 0.32 0.39
0.17 0.02 0.13 0.1 0.3 0.01 0.03
0.051 0.015 0.033 0.009 0.73 0.24 0.12 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
95-01-14
SOT38-4
03-02-13
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
D E A
X
y HE v M A
16 9
Q
A2
(A 3) A
A1
pin 1 index
Lp
1 8 L
e w M detail X
bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
99-12-27
SOT109-1 076E07 MS-012
03-02-19
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1
D E A
X
c
y HE v M A
16 9
Q
A2 A
A1 (A 3)
pin 1 index
Lp
L
1 8 detail X
w M
e bp
0 2.5 5 mm
scale
mm 2
0.21 1.80 0.38 0.20 6.4 5.4 7.9 1.03 0.9 1.00 8o
0.25 0.65 1.25 0.2 0.13 0.1 o
0.05 1.65 0.25 0.09 6.0 5.2 7.6 0.63 0.7 0.55 0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT338-1 MO-150
03-02-19
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
D E A
X
y HE v M A
16 9
Q
A2 (A 3)
A
A1
pin 1 index
Lp
L
1 8
detail X
w M
e bp
0 2.5 5 mm
scale
mm 1.1
0.15 0.95 0.30 0.2 5.1 4.5 6.6 0.75 0.4 0.40 8o
0.25 0.65 1 0.2 0.13 0.1 o
0.05 0.80 0.19 0.1 4.9 4.3 6.2 0.50 0.3 0.06 0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT403-1 MO-153
03-02-18
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
16 terminals; body 2.5 x 3.5 x 0.85 mm SOT763-1
D B A
A
A1
E c
terminal 1 detail X
index area
terminal 1 C
e1
index area
e b v M C A B y1 C y
w M C
2 7
1 8
Eh e
16 9
15 10
Dh
X
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
A(1)
UNIT
max.
A1 b c D (1) Dh E (1) Eh e e1 L v w y y1
02-10-17
SOT763-1 --- MO-241 ---
03-01-27
14. Abbreviations
Table 10. Abbreviations
Acronym Abbreviation
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
LSTTL Low-power Schottky Transistor-Transistor Logic
MM Machine Model
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term short data sheet is explained in section Definitions.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Limited warranty and liability Information in this document is believed to Limiting values Stress above one or more limiting values (as defined in
be accurate and reliable. However, NXP Semiconductors does not give any the Absolute Maximum Ratings System of IEC 60134) will cause permanent
representations or warranties, expressed or implied, as to the accuracy or damage to the device. Limiting values are stress ratings only and (proper)
completeness of such information and shall have no liability for the operation of the device at these or any other conditions above those given in
consequences of use of such information. the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
In no event shall NXP Semiconductors be liable for any indirect, incidental,
repeated exposure to limiting values will permanently and irreversibly affect
punitive, special or consequential damages (including - without limitation - lost
the quality and reliability of the device.
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale NXP Semiconductors
damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial
contract or any other legal theory. sale, as published at http://www.nxp.com/profile/terms, unless otherwise
Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual
whatsoever, NXP Semiconductors aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective
customer for the products described herein shall be limited in accordance agreement shall apply. NXP Semiconductors hereby expressly objects to
with the Terms and conditions of commercial sale of NXP Semiconductors. applying the customers general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes NXP Semiconductors reserves the right to make
changes to information published in this document, including without No offer to sell or license Nothing in this document may be interpreted or
limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant,
notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or
to the publication hereof. other industrial or intellectual property rights.
Suitability for use NXP Semiconductors products are not designed, Export control This document as well as the item(s) described herein
authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior
safety-critical systems or equipment, nor in applications where failure or authorization from competent authorities.
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
Non-automotive qualified products Unless this data sheet expressly NXP Semiconductors specifications such use shall be solely at customers
states that this specific NXP Semiconductors product is automotive qualified, own risk, and (c) customer fully indemnifies NXP Semiconductors for any
the product is not suitable for automotive use. It is neither qualified nor tested liability, damages or failed product claims resulting from customer design and
in accordance with automotive testing or application requirements. NXP use of the product for automotive applications beyond NXP Semiconductors
Semiconductors accepts no liability for inclusion and/or use of standard warranty and NXP Semiconductors product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer 16.4 Trademarks
(a) shall use the product without NXP Semiconductors warranty of the
Notice: All referenced brands, product names, service names and trademarks
product for such automotive applications, use and specifications, and (b)
are the property of their respective owners.
whenever customer uses the product for automotive applications beyond
74HC_HCT595 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
18. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Functional description . . . . . . . . . . . . . . . . . . . 5
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Recommended operating conditions. . . . . . . . 7
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
11 Dynamic characteristics . . . . . . . . . . . . . . . . . 10
12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21
15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22
16.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23
17 Contact information. . . . . . . . . . . . . . . . . . . . . 23
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.