Work Instruction

Wafer Scrubbing
Document number: RST WI Rev: 1 Page 1

DOCUMENT NUMBER AND REVISION

RST WI POL-

DOCUMENT TITLE

WAFER SCRUBBING

PROPOSING DEPT NAME SIGNATURE DATE

PARTY
ORIGINATOR ENGINEERING NARENDRAN
AFFECTED PARTY SIGNATURE DATE
APPROVED BY OPERATIONS TAN HOO HIN
(DEPT MANAGER)

Confidential For Internal Use Only

*Notice: This document is considered UNCONTROLLED when it exists in any printed form without the
official document control stamp
 Work Instruction
Wafer Scrubbing
Document number: RST WI Rev: 1 Page 2

REVISION HISTORY

REV RELEASE ORIGINATOR REASON FOR CHANGE(S) EXPIRY DATE

DATE
1 New release

Confidential For Internal Use Only

*Notice: This document is considered UNCONTROLLED when it exists in any printed form without the
official document control stamp
 Work Instruction
Wafer Scrubbing
Document number: RST WI Rev: 1 Page 3

1.0 Purpose

1.1 To remove abrasive slurry from lapping wafers that move into cleaning process, WD0

2.0 Safety

2.1 Become familiarized with the Material Safety Data Sheet (MSDS) located in the MSDS folder.
2.2 The following solutions are harmful if swallowed in form of liquid or vapor or if they come in
contact with your eyes: Valtron solutions. However, these will not harm your skin if you come in
contact with them.
2.3 The Operator/ Tech that performing scrubbing need to be really careful during scrubbing the
wafers. The scrubbing machine needs to be hold tight during scrubbing process

3.0 Equipment Required

3.1 4 and 6 ceramic block

3.2 Scrubbing machine and sponge
3.3 Apron
3.4 Water trolley
3.5 Valtron
3.6 Nitrile glove

4.0 Standard Operating Procedure

4.1 Before Scrubbing

4.1.1 Operator must make sure received the wafers from lapping is post lapping wafers and
placed at the designated place for scrubbing
4.1.2 Check the traveler before starting the scrubbing process
4.1.3 Make sure all the scrubbing tools is in good condition to be used
4.1.4 Place the wafers into the ceramic block respectively

4.2 During Scrubbing

4.2.1 Pour in Valtron at sponge and onto the wafers at ceramic

Confidential For Internal Use Only

*Notice: This document is considered UNCONTROLLED when it exists in any printed form without the
official document control stamp
 Work Instruction
Wafer Scrubbing
Document number: RST WI Rev: 1 Page 4

4 wafer ceramic block 6 wafer ceramic block

4.2.2 Scrub the wafers using machine and sponge

Machine and sponge

4.2.3 Scrub around 10 seconds for one side of each wafer. Flip and scrub the other side of
the wafers as well. Scrubbing process must be done at both sides of the wafers.
4.2.4 During scrubbing, the rest of the wafers in the same lot waiting for scrubbing MUST
be soaking into the water trolley and cannot let be dried.
4.2.5 Continue scrub all the wafers as per above instruction.

4.3 After Scrubbing

4.3.1 Once finish scrubbing, place all the lot into the water trolley and move into WD0 room
for Wet Bench cleaning
4.3.2 Scrubbed wafer have to be cleaned by DIW before WD0 cleaning

Confidential For Internal Use Only

*Notice: This document is considered UNCONTROLLED when it exists in any printed form without the
official document control stamp