MEMS became practical once they could be fabricated using

modified semiconductor device fabrication technologies, normally used to make

electronics. These include molding and plating, wet etching and dry etching,
electro discharge machining , and other technologies capable of manufacturing
small devices.

Fig 2.6 MEMS IC

Features of MEMS:

3mm x 5mm x 1.0mm LGA-14 Package

Sleep Mode: 3 A
High Sensitivity (800 mV/g @ 1.5g)
Selectable Sensitivity (1.5g, 6g)
Fast Turn On Time (0.5 ms Enable Response Time)
Self Test for Freefall Detect Diagnosis
0g-Detect for Freefall Protection
Signal Conditioning with Low Pass Filter
Robust Design, High Shocks Survivability

1
 Environmentally Preferred Product
Low Cost

Specifications:

Temperature Range40 to +85C

Supply Voltage 0.3 to +3.6V
Supply Current 600 A
Storage Temperature Range 40 to +125 C
Maximum Acceleration (all axis) 5000 g
Low Current Consumption: 400 A
Low Voltage Operation: 2.2 V 3.6 V

Applications:

3D Gaming: Tilt and Motion Sensing, Event Recorder

MP3 Player: Freefall Detection
Laptop PC: Freefall Detection, Anti-Theft
Cell Phone: Image Stability, Text Scroll, Motion Dialing, E-Compass
Pedometer: Motion Sensing
Text Scroll
Navigation and Dead Reckoning: E-Compass Tilt Compensation
Robotics: Motion Sensing

2.9.1 MEMS TECHNOLOGY:

Micro-Electro-Mechanical Systems, or MEMS, is a technology that
in its most general form can be defined as miniaturized mechanical and electro-
mechanical elements (i.e., devices and structures) that are made using the
techniques of micro fabrication. The critical physical dimensions of MEMS
devices can vary from well below one micron on the lower end of the
dimensional spectrum, all the way to several millimeters. Likewise, the types of
MEMS devices can vary from relatively simple structures having no
2
movingelements, to extremely complex electromechanical systems with
multiple moving elements under the control of integrated microelectronics. The
one main criterion of MEMS is that there are at least some elements having
some sort of mechanical functionality whether or not these elements can move.
The term used to define MEMS varies in different parts of the world. In the
United States they are predominantly called MEMS, while in some other parts
of the world they are called Microsystems Technology or micro machined
devices.

2.9.2 Components of MEMS:

MicroSensors
Micro actuators
Microelectronics
Microstructures

Fig.2.7componentsofMEMS

While the functional elements of MEMS are miniaturized structures, sensors,

actuators, and microelectronics, the most notable (and perhapsmost interesting)
elements are the micro sensors and micro actuators. MicroSensors and micro
actuators are appropriately categorized as transducers, which are defined as
devices that convert energy from one form to another. In the case of micro
sensors, the device typically converts a measured mechanical signal into an
electrical signal.

3
The real potential of MEMS starts to become fulfilled when these miniaturized
sensors, actuators, and structures can all be merged onto a common silicon
substrate along with integrated circuits (i.e., microelectronics). While the
electronics are fabricated using integrated circuit (IC) process sequences, the
micromechanical selectively etch away parts of the silicon wafer or add new
structural layers to form the mechanical and electromechanical devices.

Microelectromechanical systems (MEMS) are small integrated devices or

systems that combine electrical and mechanical components. They range in size
from the sub micrometer (or sub micron) level to the millimeter level and there
can be any number, from a few to millions, in a particular system. MEMS
extend the fabrication techniques developed for the integrated circuit industry to
add mechanical elements such as beams, gears, diaphragms, and springs to
devices.

These systems can sense, control, and activate mechanical processes on the
micro scale, and function individually or in arrays to generate effects on the
macro scale. The micro fabrication technology enables fabrication of large
arrays of devices, which individually perform simple tasks, but in combination
can accomplish complicated functions.

2.10 ANALOG DIGITAL TO CONVERTER - ADC (0809)

Features:

Easy interface to all microprocessors

Operates ratio metrically or with 5 VDC or analog span
No zero or full-scale adjust required
8-channel multiplexer with address logic
0V to 5V input range with single 5V power supply
4
 Standard hermetic or molded 28-pin DIP package
28-pin molded chip carrier package

Key Specifications

Resolution - 8 Bits
Total Unadjusted Error - 12LSB and1 LSB
Single Supply - 5 VDC
Low Power - 15 mW
Conversion Time - 100 s

General Description

The ADC0808, ADC0809 data acquisition component is a

monolithic CMOS device with an 8-bit analog-to-digital converter, 8-channel

multiplexer and microprocessor compatible control logic. The 8-bit A/D
converter uses successive approximation as the conversion technique. The
converter features a high impedance chopper stabilized comparator, a256R
voltage divider with analog switch tree and a successive approximation register.
The 8-channel multiplexer can directly access any of 8-single-ended analog
signals. The device eliminates the need for external zero and full-scale
adjustments. Easy interfacing to microprocessors is provided by the latched and
decoded multiplexer address inputs and latched TTL TRI-STATE outputs.
The design of the ADC0808, ADC0809 has been optimized by incorporating
the most desirable aspects of several A/D conversion techniques. The
ADC0808, ADC0809 offers high speed, high accuracy, minimal temperature
dependence, excellent long-term accuracy and repeatability, and consumes
minimal power. These features make this device ideally suited to applications
from process and machine control toconsumer and automotive applications.

2.10.1 ABOUT IC
5
Pin Diagram:

Fig.2.8 Pin Diagram

Pin Out
CS Chip Select, active low
RD Read Digital data from ADC, H-L edge triggered
WR -- Start conversion, L-H pulse edge triggered
INTR -- end of conversion, Goes low to indicate conversion done
Data bits -- D0-D7
CLK IN & CLK R CLK IN is an input pin connected to an external
clock source when an external clock is used for timing. However, ADC804 has
an internal clock generator. To use the internal clock generator of the
ADC804, the CLK IN and CLK R pins are connected to a capacitor and a
resistor. In that case, the clock frequency is determined by the equation.

6
f = 1/1.1RC
R=10K and C=150Pf f=606Hz

2.10.2INTERFACING ADC809 TO 8051

Signals to be interfaced (on the ADC804) D0-D7, RD, WR, INTR, CS

Fig..2.9Microcontroller Interfacing with ADC

Algorithm
Make CS=0 and send a low-to-high to pin WR to start the conversion.
Keep monitoring INTR
If INTR =0, the conversion is finished and we can go to the next step.
If INTR=1, keep polling until it goes low.
After INTR=0, we make CS=0 and send a high-to-low pulse to RD to get the
data out of the ADC804 chip.

Channel Selection:
7
 Channel CBA

IN0 000
IN1 001
IN2 010
IN3 011
IN4 100
IN5 101
IN6 110
IN7 111

Advantages:

The device eliminates the need for external zero and full-scale
adjustments.
Easy interfacing to microprocessors is provided.
The design of the ADC0808, ADC0809 has been optimized by
incorporating the most desirable aspects of several A/D conversion
techniques.
The ADC0808, ADC0809 offers high speed, high accuracy, minimal
temperature dependence, excellent long-term accuracy and repeatability,
and consumes minimal power.

2.11INTRODUCTION TO ATMEL

8
2.11.1 ATMEL89S52 Features

32 Programmable I/O Lines.

Three 16-bit Timer/Counters.

Operating Range: 4.0V to 5.5V.

Fully Static Operation: 0 Hz to 33 MHz.

Eight Interrupt Sources.

Full Duplex UART Serial Channel.

Low-power Idle and Power-down Modes.

Interrupt Recovery from Power-down Mode.

Watchdog Timer and Dual Data Pointer.

Power-off Flag.

Non-volatile Memory Program And Data Memory

8K Bytes of In-System Programmable (ISP) Flash Memory

Endurance: 1000 Write/Erase Cycles.

Three-level Program Memory Lock.

256 x 8-bit Internal RAM.

Fast Programming Time.

Flexible ISP Programming (Byte and Page Mode).

Green (Pb/Halide-free) Packaging Option.

2.11.2BLOCK DIAGRAM:

9
 Fig.2.10 Block Diagram

DESCRIPTION:

10
 The AT89s52 is a low-power, high-performance CMOS 8-bit
Microcomputer with 4K bytes of Flash programmable and erasable read only
memory (PEROM). The device is manufactured using Atmels high-density
nonvolatile memory technology and is compatible with the industry-standard
MCS-51 instruction set and pin out. The on-chip Flash allows the program
memory to be reprogrammed in-system or by a conventional nonvolatile
memory programmer. By combining a versatile 8-bit CPU with Flash on a
monolithic chip, the Atmel AT89s52 is a powerful microcomputer which
provides a highly-flexible and cost-effective solution to many embedded control
applications

2.11.3PIN DIAGRAM:

Fig.2.11 Pin Diagram

PIN DESCRIPTION:

VCC - Supply voltage.

11
GND - Ground.

PORT 0(P0.0/AD0.P0.7/AD7)

Port 0 is an 8-bit open-drain bi-directional I/O port. As an output port, each pin
can sink eight TTL inputs. When 1s are written to port 0 pins, the pins can be
used as high impedance inputs. Port 0 may also be configured to be the
multiplexed low order address/data bus during accesses to external program and
data memory. In this mode P0 has internal pull-ups. Port 0 also receives the
code bytes during Flash programming, and outputs the code bytes during
program verification. External pull-ups are required during program
verification.

PORT 1(P1.0.P1.7)

Port 1 is an 8-bit bi-directional I/O port with internal pull-ups. The Port 1 output
buffers can sink/source four TTL inputs. When 1s are written to Port 1 pins they
are pulled high by the internal pull-ups and can be used as inputs. As inputs,
Port 1 pins that are externally being pulled low will source current (IIL) because
of the internal pull-ups Port 1 also receives the low-order address bytes during
Flash programming and verification.

PORT 2(P2.0/A8.P2.7/A15)

Port 2 is an 8-bit bi-directional I/O port with internal pull-ups. The Port 2 output
buffers can sink/source four TTL inputs. When 1s are written to Port 2 pins they
are pulled high by the internal pull-ups and can be used as inputs. As inputs,
Port 2 pins that are externally being pulled low will source current (IIL) because
of the internal pull-ups. Port 2 emits the high-order address byte during fetches
from external program memory and during accesses to external data memory
that uses 16-bit addresses (MOVX @ DPTR). In this application, it uses strong
internal pull-ups when emitting 1s. During accesses to external data memory
that uses 8-bit addresses (MOVX @ RI), Port 2 emits the contents of the P2

12
Special Function Register. Port 2 also receives the high-order address bits and
some control signals during Flash programming and verification.

PORT 3(P3.0.P3.7)

Port 3 is an 8-bit bi-directional I/O port with internal pull-ups. The Port 3 output
buffers can sink/source four TTL inputs. When 1s are written to Port 3 pins they
are pulled high by the internal pull-ups and can be used as inputs. As inputs,
Port 3 pins that are externally being pulled low will source current (IIL) because
of the pull-ups. Port 3 also serves the functions of various special features of the
AT89s52 as listed below: Port 3 also receives some control signals for Flash
programming and verification.

RST:Reset input. A high on this pin for two machine cycles while the oscillator
is running resets the device.

ALE/PROG

Address Latch Enable output pulse for latching the low byte of the address
during accesses to external memory. This pin is also the program pulse input

13
(PROG) during Flash programming. In normal operation ALE is emitted at a
constant rate of 1/6 the oscillator frequency, and may be used for external
timing or clocking purposes. Note, however, that one ALE pulse is skipped
during each access to external Data Memory. If desired, ALE operation can be
disabled by setting bit 0 of SFR location 8EH. With the bit set, ALE is active
only during a MOVX or MOVC instruction. Otherwise, the pin is weakly pulled
high. Setting the ALE-disable bit has no effect if the microcontroller is in
external execution mode.

PSEN

Program Store Enable is the read strobe to external program memory. When the
AT89s52 is executing code from external program memory, PSEN is activated
twice each machine cycle, except that two PSEN activations are skipped during
each access to external data memory.

EA/VPP(External Access Enable/ Voltage Programming Enable Voltage)

EA must be strapped to GND in order to enable the device to fetch code from
external program memory locations starting at 0000H up to FFFFH. Note,
however, that if lock bit 1 is programmed, EA will be internally latched on
reset. EA should be strapped to VCC for internal program executions. This pin
also receives the 12-volt programming enable voltage (VPP) during Flash
programming, for parts that require 12-volt VPP.

XTAL1:Input to the inverting oscillator amplifier and input to the internal clock
operating circuit.

XTAL2:Output from the inverting oscillator amplifier.

OSCILLATOR CHARACTERISTICS

XTAL1 and XTAL2 are the input and output, respectively, of an

inverting amplifier which can be configured for use as an on-chip oscillator.

14
Either quartz crystal or ceramic resonator may be used. To drive the device
from an external clock source, XTAL2 should be left unconnected while
XTAL1 is driven. There are no requirements on the duty cycle of the external
clock signal.

2.12 LIQUID CRYSTAL DISPLAY(LCD):

Fig.2.12 LCD display

Liquid Crystal Display (LCD) have materials which combine the

properties of both liquids and crystals. Rather than having a melting point, they
have a temperature range within which the molecules are almost as mobile as
they would be in a liquid but are grouped together in an ordered form similar to
a crystal.
An LCD consists of rod-shaped tiny molecules sandwiched between a flat
piece of glass and an opaque substrate. These rod-shaped molecules in between
the plates align into two different physical positions based on the electric charge
applied to them. When electric charge is applied they align to block the light
entering through them, where as when no-charge is applied they become
transparent. Light passing through makes the desired images appear. This is the
basic concept behind LCD displays.

2.12.1 INTERFACING WITH MICROCONTROLLER

15
Fig.2.13Interfacing With Microcontroller

PIN DESCRIPTION

Pin-1 Vss- Ground

Pin-2 VDD- Power 5V
Pin-3 VEE- LCD Contrast Adjustment

Vdd- Power 5V

Vss- GND

RS- Register Select

There are 2 very important registers in LCD

Command Code register

Data Register

IfRS=0 Instruction command Code register is selected, allowing user to send

command

RS=1 Data register is selected allowing to send data that has to be displayed.

R\W- Read\Write

16
R\W input allows the user to write information to LCD or read information
from it

If R\W=0 Reading

R\W=1 Writing

E- Enable

The enable Pin is used by the LCD to latch information at its data pins. When
data is supplied to data pins, a high to low pulse must be applied to this pin in
order for the LCD to latch the data present in the data pins.

Data Bus- D0-D7

Advantages

Consumes less power and generates less heat.

Saves lot of space compared picture tubes due to its flatness.
Due to less weight and flatness LCDs are highlyportable.
No flicker and fewer screens glare in LCDs reduceeyes strain.

2.13 DC-DC BOOSTER

Features

Available in 8-Bump micro SMD chip sized package.

Large dc voltage gain: 100 dB.

Wide bandwidth (unity gain):1 MHz.

Temperature compensated.

Wide power supply range.

Single supply: 3V to 32V

Dual supplies: 1.5V to 16V.

Very low supply current drain (500 A)essentially.

17
 independent of supply voltage.

Low input offset voltage: 2 mV.

Description

A DC-DC Booster or boost converter is a power converter with an output

DC voltage greater than its input DC voltage. Power comes from DC sources
such as batteries, solar panels, rectifiers and DC generators. A process that
changes one DC voltage to a different DC voltage is called DC to DC
conversion. A boost converter is a DC to DC converter with an output voltage
greater than the source voltage. A boost converter is sometimes called a step-up
converter since it steps up the source voltage. The DC-DC Switching Boost
Converter is designed to provide an efficient method of taking a given DC
voltage supply and boosting it to a desired value. In addition, DC-to-DC
converters are used to provide noise isolation, power bus regulation, etc.
A boost converter is a class of switched-mode power supply
(SMPS) containing at least two semiconductor switches (a diode and a
transistor) and at least one energy storage element, a capacitor, inductor, or the
two in combination. Filters made of capacitors (sometimes in combination with
inductors) are normally added to the output of the converter to reduce output
voltage ripple.

2.13.1 Circuit & Waveforms

While the transistor is ON Vx =Vin, and the OFF state the inductor current
flows through the diode giving Vx =Vo. For this analysis it is assumed that
the inductor current always remains flowing (continuous conduction). The
voltage across the inductor is shown and the average must be zero for the
average current to remain in steady state

18
 Fig 2.14 Circuit of DC-DC Booster

This can be rearranged as

And for a lossless circuit the power balance ensures

Fig.2.15. Voltage and current waveforms

Since the duty ratio "D" is between 0 and 1 the output voltage must always
be higher than the input voltage in magnitude. The negative sign indicates a
reversal of sense of the output voltage.

19
Advantages:
Efficiency, size, and cost are the primary advantages of switching power
converters when compared to linear converters.
Switching power converter efficiencies can run between 70-80%,
whereas linear converters are usually 30% efficient.
It can provide ride-through for sags up to 50%.
The DC-link voltage can be regulated as required by the inverter, and is
user adjustable.

2.14 SUPERCAPACITOR

Super capacitors The next big breakthrough in energy storage, and perfect
for solar power.

Energy storage is one of the major irritants of all sources of electrical power.
Batteries are limited by definition. They have a certain amount of capacity, and
so many recharges. Electrical design tends to be like home insurance, working
with these known factors as the power source scenarios and just dealing with
storage accordingly. They have limited capacity to handle electrical charges.
Batteries also arent Green, in any sense. Theyre full of toxic materials, they
explode in fires and as waste, theyre a pest.

Super capacitors, however, are a different ball game. Theyre capacitors made
ofnano porous carbon. They can contain huge amounts of charge, and theyre
chemically manageable at the end of their life cycles. They also have from
1,000 up to 10,000 times the power of regular capacitors. The advantage is high
current delivery capacity, and its likely to put batteries out of business, as well
as provide solar energy with a good economic storage system.

Electrical double-layer capacitors (EDLC) are, together with pseudocapacitors,

part of a new type of electrochemicalcapacitors called Supercapacitors.Double-

20
layer capacitance and pseudocapacitance both contribute to the total capacitance
value of aSupercapacitors.

Supercapacitors have the highest capacitance values per unit volume and have
the greatest energy density of all capacitors. Supercapacitors are manufactured
with capacitance values up to 12,000 F/1.2 V, having specific capacitance
values up to 10,000 times that of electrolytic capacitors. With this high
capacitance values supercapacitors otherwise are bridging the gap between
capacitors and batteries. In terms of specific energy as well as in terms of
specific power this gap covers several orders of magnitude. However, this high
capacitance will in comparison with batteries only about 10% of the capacity of
batteries. While existing supercapacitors have energy densities that are
approximately 10% of a conventional battery, their power density is generally
10 to 100 times as great. Power density combines the energy density with the
speed at which the energy can be delivered to the load.

Advantages Compare With Battery:

This energy storage with fast charge-transfer makes charging and

discharging of supercapacitors much faster than batteries.
Additionally, supercapacitors will tolerate large numbers of rapid charge
and discharge cycles.
This makes them well-suited for parallel connection with batteries, and
may improve battery performance in terms of power density.

2.14.1 Classification of Supercapacitors:

Supercapacitors, the generic term stands also for electrochemical capacitors

with double-layer electrodes having a high rate of double-layer capacitance as
well as an appreciable rate of pseudocapacitance, are divided into three different
families, based on the design of the electrodes:

21
 Fig.2.16 Hierarchical classification of supercapacitors

Double-layer capacitors Electrochemical capacitors in which the static

double-layer capacitance is much higher than the faradaic
pseudocapacitance
Pseudocapacitors Electrochemical capacitors in which the faradaic
pseudocapacitance is much higher than the static double-layer
capacitance
Hybrid capacitors Capacitors with special electrodes that exhibit
significant double-layer capacitance and pseudocapacitance. These
capacitors include some new developments with special electrodes (e.g.
lithium-ion capacitors).

Very special for supercapacitors are the multitudinous different used trade
names manufacturers used for their supercapacitor products:APowerCap,
BestCap, BoostCap, CAP-XX, DLCAP, EVerCAP, DynaCap, Faradcap,
GreenCap, Goldcap, HY-CAP, Kapton capacitor, SuperCap, PAS Capacitor,
PowerStor, PseudoCap, Ultracapacitor.

22
2.15 INVERTER:

An inverter is an electrical device that converts direct current (DC) to

alternating current (AC). Inverters are commonly used to supply AC power
from DC sources such as solar panels or batteries. Early AC-to-DC converters
used an induction or synchronous AC motor directly connected to a generator
(dynamo) so that the generator's commutator reversed its connections at exactly
the right moments to produce DC. A later development is the synchronous
converter, in which the motor and generator windings are combined into one
armature, with slip rings at one end and a commutator at the other and only one
field frame. The result with either is AC-in, DC-out.

Apowerinverter, or inverter, is an electrical power converter that changes direct

current (DC) to alternating current (AC); the converted AC can be at any
required voltage and frequency with the use of appropriate transformers,
switching, and control circuits.

Solid-state inverters have no moving parts and are used in a wide range of
applications, from small switching power supplies in computers, to large
electric utilityhigh-voltage direct current applications that transport bulk power.
Inverters are commonly used to supply AC power from DC sources such as
solar panels or batteries.

The inverter performs the opposite function of a rectifier. The electrical inverter
is a high-power electronic oscillator. It is so named because early mechanical
AC to DC converterswere made to work in reverse, and thus were "inverted", to
convert DC to AC.

23
 Fig.2.17 Inverter Power Source Basics

Features

Inverters convert low frequency main AC power to higher frequency for

use in induction heating.
If the inverter is designed to provide power at a fixed frequency, A
resonant filter can be used.
For an adjustable frequency inverter, the filter must be tuned to a
frequency that is above the maximum fundamental frequency.
An inverter provides the controlled power

2.16 RELAY

2.16.1 Features

Switching capacity available by 10A in spite of small size design for

highdensity P.C. board mounting technique.
UL,CUL,TUV recognized.

24
 Selection of plastic material for high temperature and better chemical
solution performance.
Simple relay magnetic circuit to meet low cost of mass production.
75 characteristic impedance.
2.5 GHz bandwidth.
Insertion loss at 2.5 GHz <1.1 dB (typical <0.7 dB).
VSWR at 2.5 GHz <1.6 (typical <1.3).
Onboard relay counting.
Use NI Switch Executive for calibrating losses on each PXI-2558
channel.

Specifications

Operating Voltage: 12 Volts DC Nominal.

Current Draw: 30 milliamps.
Minimum Pull-in Voltage: 9 Volts DC.
Diode Protection Across Relay Coil.
Contact Ratings:

7 Amps @ 30 Volts DC
10 Amps @ 125 Volts AC
Size: 1.1" X1.55 " (28mm X 39mm)

Description

A relay is an electrically operated switch. Current flowing through the coil of

the relay creates a magnetic field which attracts a lever and changes the switch
contacts. The coil current can be on or off so relays have two switch positions
and they are double throw (changeover) switches. Many relays use an

25
electromagnet to operate a switching mechanism mechanically, but other
operating principles are also used. Relays are used where it is necessary to
control a circuit by a low-power signal or where several circuits must be
controlled by one signal. The first relays were used in long distance telegraph
circuits, repeating the signal coming in from one circuit and re-transmitting it to
another. Relays were used extensively in telephone exchanges and early
computers to perform logical operations. A type of relay that can handle the
high power required to directly control an electric motor is called a contactor.
Solid-state relays control power circuits with no moving parts, instead using a
semiconductor device to perform switching. Relays allow one circuit to switch a
second circuit which can be completely separate from the first. For example a
low voltage battery circuit can use a relay to switch a 230V AC mains circuit.
There is no electrical connection inside the relay between the two circuits; the
link is magnetic and mechanical.

2.16.2 Relay Operation

Fig.2.18 Relay Operation

26
Relays (and switches) come in different configurations. Single Pole Single
Throw (SPST) is the simplest with only two contacts. Single Pole Double
Throw (SPDT)has three contacts. The contacts are usually labeled Common
(COM), Normally Open (NO), and Normally Closed (NC). The Normally
Closed contact will beconnected to the Common(2) contact when no power is
applied to the coil. The Normally Open contact will be open (i.e. not connected)
when no power is applied to the coil. When the coil is energized the Common is
connected to the Normally Open contact(4) and the Normally Closed contact is
left floating. The Double Pole versions are the same as the Single Pole version
except there are two switches that open and close together.

Advantages of relays:

Relays can switch AC and DC, transistors can only switch DC.
Relays can switch high voltages, transistors cannot.
Relays are a better choice for switching large currents (> 5A).
Relays can switch many contacts at once.

2.17 LOAD

If an electric circuit has a well defined output terminal, the circuit

connected to this terminal ( or its input impedance) is the load. The term load
also referred to as the power consumed by the circuit.

The lamp load is used for our project. Obtained green energy is utilized for this
load circuit. Lamp load is connected to the inverter through the relay circuit.

27
2.18 SOFTWARE REPORT
2.18.1 THE KEIL:

Keil software is the leading vendor for 8/16-bit development tools the
Keil C51 compiler supports more than 500 current 8051 device variants,
currently Keil software offers development tools for ARM. Keil software
makes C compilers, macro assemblers, real-time kernels, debuggers, simulators,
integrated environments, and evaluation boards for 8051, 251, ARM and
XC16x/C16x/ST10 microcontroller families. The Keil C51 C Compiler for the
8051 microcontroller provides more features than any other 8051 C compiler
available today. The C51 Compiler allows the user write 8051 microcontroller
applications in C that, once compiled, have the efficiency and speed of
assembly language. Language extensions in the C51 Compiler give you full
access to all resources of the 8051. The C51 Compiler translates C source files
into relocatable object modules which contain full symbolic information for
debugging with the Vision Debugger or an in-circuit emulator. In addition to
the object file, the compiler generates a listing file which may optionally
include symbol table and cross reference.

2.18.1.1 Features OfKeil:

Nine basic data types, including 32-bit IEEE floating-point,

Flexible variable allocation with bit, data, bdata, idata, xdata, and pdata
memory types,
Full use of the 8051 register banks,
Complete symbol and type information for source-level debugging,
Use of AJMP and ACALL instructions,
Bit-addressable data objects,
Built-in interface for the RTX51 real time kernels,
Support for the Philips 8xC750, 8xC751, and 8xC752 limited instruction
28
 Support for the Infineon 80C517 arithmetic unit.
It is used to program 89S51, 89S52, 89S53.
It reads and programs hex files into microcontroller.
Running the Software: Your code needs to be in Intel Hex
Format.AEC_ISP will open the file you specify and load it into a buffer.
You can specify a default file in the command line; e.g.: To specify
TEST.HEX as the default file; start by typing AEC_ISP TEST.HEX.

Fig. 2.19Keil 2 Vision

29
2.18.2 ATMEL FLASH PROGRAMMER:

It is used to load the Hexadecimal code into the microcontroller

Introduction:

This programmer was designed in view of to be flexible, economical and

easy to build, the programmer hardware utilizes the standard TTL series parts
and no special components are used. The programmer is interfaced with the PC
parallel port and there is no special requirement for the PC parallel port, so the
older computers can also be used with this programmer.

Figure 2.20 Flash programmer

30
Supported Devices:

The programmer software supports the following Atmel devices

AT89C51 AT89S51 AT89C51RC AT89C1051U

AT89C52 AT89S52 AT89C55WD AT89C2051

AT89C55 AT89S53 AT89S8252 AT89C4051

Table Atmel 89 series microcontroller

The Main Features:

Read and Write the Intel Hex File

Read Chip info
Clear, Fill & Edit Program Buffer
Verify with Program Buffer
Reload current Hex File
Display Data Checksum
Program selected Lock Bits & ISP fuse
Parallel Port Selection LPT1, 2 & 3.

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2.19 PROJECT ANALYSIS:
EXISTING SYSTEM:

Energy harvesting is a promising technology to realizea ubiquitous society

based on wireless sensor networks. The networks consist of a lot of small sensor
terminals.To dispense with maintenanceor refill of batteries in the sensor
terminals, energy harvestersas power sources are desired. However, the increase
of outputpower is still a challenge under the condition that the size ofenergy
harvesters is kept to be less than the size of sensorterminals. This is because
output power gets smaller as the sizeof energy harvester is smaller, and
effectiveness is a key metric.

PROPOSED SYSTEM:
In this study, a proposed systemis to minimize the energy harvester size at the
same time output efficiency will be improvedby using MEMS sensor.
Enhancement of output power does not depend upon the harvester size.MEMS
sensor converts the mechanical energy into electrical energy. Among available
energy-harvesting methodologies, MEMS based approach was chosen because
of abundant vibration accessibility and energy-harvesting productivity.
In the proposed system, AC motor is fixed with cantilever beam .When a
MEMS sensor is placed on the beam, it converts the mechanical energy
generated from the movement of the beam into electrical energy. The output of
MEMS is given to the ADC for analog to digital conversion and then to
microcontroller in order to monitor the value of energy generated. The output of
MEMS is also given to boost controller. The obtained energy is boosted up
using Boost Controller and given to DC-DC converter. The output of the DC-
DC converter is stored in a storage device. The stored energy is inverted to AC

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voltage and is given to the relay and is utilized for purposes like lighting lamps,
powering a remote sensor, extending the rechargeable battery lifetime etc.
COMPARISON BETWEEN EXISTING SYTEM AND PROPOSED
SYSTEM:

EXISTING SYSTEM PROPOSED SYSTEM

Size of the energy harvester is large. Energy harvester size is small.

Waste much available energy due to Wastage of energy is less and
impedance mismatch. cantilever beam appears to produce
more power.
Output efficiency depends upon the Harvester effectiveness does not
harvester size. depends upon the harvester size.
Less storage. Storage capacity is high.
Complexity is high and it is not easy to Easymethod and Portable
handle because of the large size technologies.
It takes up precious I/O resources for No need of more precious external
control and it does not work when sources.
MCU is asleep.

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CHAPTER - 3

34
 CONCLUSION

The need of the hour is to save power. Green energy sources are the
solution to the environmental, political and social problems of this lifetime. By
spending more on these technologies, no country will have to depend on another
or even a corporation for their power needs because green energy sources are
self-dependent and free.

Thus, ahighly reliable and versatile system has been designed and
developed to convert vibrations into electrical energy. Green energy harvesting
is encouraged because it causes no negative impact to the environment. Also,
this method of power generation saves the cost spent for other renewable
sources of energy and the biggest advantage of green energy is that we will
never run out of it. Ambient vibrations are converted to electrical energy with
the help of MEMS sensor. The sensor used is very sensitive and can sense the
slightest of motion. Thus, energy is conserved effectively.

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ANNEXURE:

The setup of the hardware section is shown below:

Fig. Hardware implementation

36
REFERENCES

IEEE PAPERS:

1. Development Of A Vibration Powered Micro Generator&Its

Application To Harvest The Vibration Energy Of The KRI KKP-
811S ENGINE,Harus L.G., WiwiekHendrowati and RahmatSusanto
Lecturer,Department of Mechanical Engineering, Faculty of Industrial
Technology.
2. Development of an Electro-Magnetic Transducer for Energy
Harvesting of Kinetic Energy and its Applicability to a MEMS-scale
Device Richard L. Waters(Senior Member IEEE),Lumedyne
Technologies Inc,Nanopower Forum 2008 Costa Mesa, California.
3. A Laser-micro machined Multi-Modal Resonating Power Transducer
for Wireless Sensing Systems N.H.Ching, H.Y.Wong, PhilipH.W.Leong
for Micro and Nano Systems, The Chinese University of Hong Kong,
Hong Kong SAR.
4. Energy Scavenging for Wireless Sensor Networks.S. Roundy, P. K.
Wright, and J. M. Rabaey, Boston, MA: Kluwer, 2004
5. Energy harvesting vibration sources for microsystems applications
S P Beeby, M J Tudor and N M WhiteSchool of Electronics and
Computer Science, University of Southampton, SO17 1BJ, UK.

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