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DATA SHEET
BFG135
NPN 7GHz wideband transistor
Product specification 1995 Sep 13
File under discrete semiconductors, SC14
Philips Semiconductors Product specification
DESCRIPTION PINNING
NPN silicon planar epitaxial transistor PIN DESCRIPTION
in a plastic SOT223 envelope, age 4
1 emitter
intended for wideband amplifier
applications. The small emitter 2 base
structures, with integrated 3 emitter
emitter-ballasting resistors, ensure 4 collector
high output voltage capabilities at a
low distortion level.
The distribution of the active areas
across the surface of the device gives
an excellent temperature profile. 1 2 3
Top view MSB002 - 1
Fig.1 SOT223.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter 25 V
VCEO collector-emitter voltage open base 15 V
VEBO emitter-base voltage open collector 2 V
IC DC collector current 150 mA
Ptot total power dissipation up to Ts = 145 C (note 1) 1 W
Tstg storage temperature 65 150 C
Tj junction temperature 175 C
Note
1. Ts is the temperature at the soldering point of the collector tab.
1995 Sep 13 2
Philips Semiconductors Product specification
THERMAL CHARACTERISTICS
THERMAL
SYMBOL PARAMETER CONDITIONS
RESISTANCE
Rth j-s thermal resistance from junction to soldering up to Ts = 145 C (note 1) 30 K/W
point
Note
1. Ts is the temperature at the soldering point of the collector tab.
CHARACTERISTICS
Tj = 25 C unless otherwise specified.
Notes
1. dim = 60 dB (DIN 45004B); IC = 100 mA; VCE = 10 V; RL = 75 ; Tamb = 25 C;
Vp = Vo at dim = 60 dB; fp = 445.25 MHz;
Vq = Vo 6 dB; fq = 453.25 MHz;
Vr = Vo 6 dB; fr = 455.25 MHz;
measured at f(p+qr) = 443.25 MHz.
2. dim = 60 dB (DIN 45004B); IC = 100 mA; VCE = 10 V; RL = 75 ; Tamb = 25 C;
Vp = Vo at dim = 60 dB; fp = 795.25 MHz;
Vq = Vo 6 dB; fq = 803.25 MHz;
Vr = Vo 6 dB; fr = 805.25 MHz;
measured at f(p+qr) = 793.25 MHz.
1995 Sep 13 3
Philips Semiconductors Product specification
,,
,
VCC
handbook, full pagewidth
L6 C4 C5
VBB L5
C3 L3
C6
output
R1 R2
75
C1 L1 L2 L4
input
75 DUT
C7
C2
R3 R4
MBB284
Fig.2 Intermodulation distortion and second order intermodulation distortion test circuit.
Note
1. Components C4, L3, L6 and R2 are mounted on the underside of the PCB.
The circuit is constructed on a double copper-clad printed circuit board with PTFE dielectric (r = 2.2); thickness
1
16 inch; thickness of copper sheet 32 inch.
1
1995 Sep 13 4
Philips Semiconductors Product specification
R1 L5
R3
C1 L3 C6
75 75
L1 L2 L4
input output
C2 C7
R4 C4
R2 L6
MBB299
80 mm
andbook, full pagewidth
60 mm
MBB298
MBB297
1995 Sep 13 5
Philips Semiconductors Product specification
MBB300 MBB294
1.2 160
handbook,
P halfpage handbook, halfpage
tot
(W)
1.0 h FE
0.8 120
0.6
0.4 80
0.2
0 40
0 50 100 150 200 0 40 80 120 160
Ts ( o C) I C (mA)
VCE = 10 V; Tj = 25 C.
MBB295 MBB296
3 8
handbook, halfpage handbook, halfpage
fT
C re
(GHz)
(pF)
6
1
2
0 0
0 4 8 12 16 20 0 40 80 120 160
VCB (V) I C (mA)
1995 Sep 13 6
Philips Semiconductors Product specification
MBB292 MBB293
45 45
handbook, halfpage handbook, halfpage
d im d im
(dB) (dB)
50 50
55 55
60 60
65 65
70 70
20 40 60 80 100 120 20 40 60 80 100 120
I C (mA) I C (mA)
MBB291 MBB290
45 45
handbook, halfpage handbook, halfpage
d2 d2
(dB) (dB)
50 50
55 55
60 60
65 65
70 70
20 40 60 80 100 120 20 40 60 80 100 120
I C (mA) I C (mA)
Fig.10 Second order intermodulation distortion as Fig.11 Second order intermodulation distortion as
a function of collector current. a function of collector current.
1995 Sep 13 7
Philips Semiconductors Product specification
MEA951 MEA952
60 50
handbook,
Z halfpage handbook, halfpage
L ZL
()
50 ()
40
RL
40
RL
30
30
20
20
10
10
0
XL XL
10 0
0 0.25 0.50 0.75 1.0 0 0.5 1
POUT (W) 1.5
POUT (W)
Fig.12 Load impedance as a function of output Fig.13 Load impedance as a function of output
power. power.
MEA953 MEA948
60 10
handbook, halfpage handbook, halfpage
ZL
Zi
()
()
50
8
ri
RL
40 xi
6
30
4
20
XL 2
10
0 0
0 0.5 1 P (W) 1.5 0 0.25 0.50 0.75 1.0
OUT P (W)
OUT
Fig.14 Load impedance as a function of output Fig.15 Input impedance as a function of output
power. power.
1995 Sep 13 8
Philips Semiconductors Product specification
MEA949 MEA950
10 10
handbook, halfpage handbook, halfpage
Zi Zi
() ()
8 8
ri ri
6 6
xi xi
4 4
2 2
0 0
0 0.5 1 1.5 0 0.5 1 1.5
POUT (W) POUT (W)
Fig.16 Input impedance as a function of output Fig.17 Input impedance as a function of output
power. power.
MEA947 MEA945
80 1.5
handbook, halfpage handbook, halfpage V CE =
12.5 V
P OUT
(%)
(W)
70 V CE =
10 V
12.5 V
1
10 V
7.5 V 7.5 V
60
0.5
50
40 0
0 0.5 1 POUT (W) 1.5 0 100 200 300
P IN (mW)
Fig.18 Efficiency as a function of output power. Fig.19 Output power as a function of input power.
1995 Sep 13 9
Philips Semiconductors Product specification
MEA946 MBB289
10 40
handbook, halfpage handbook, halfpage
Gp G UM
(dB) (dB)
V =
8 CE
12.5 V 30
6
10 V
20
7.5 V
4
10
2
0 0
0 0.5 1 POUT (W) 1.5 10 102 103 104
f (MHz)
1995 Sep 13 10
Philips Semiconductors Product specification
50
handbook, full pagewidth
25 100
10 250
+j
10 25 50 100 250
0
j
10 250
25 100
MBB288
50
IC = 100 mA; VCE = 10 V; Tamb = 25 C; Zo = 50 ..
90 o
handbook, full pagewidth
120 o 60 o
150 o 30 o
50 40 30 20 10
180 o 0o
150 o 30 o
120 o 60 o
90 o MBB286
1995 Sep 13 11
Philips Semiconductors Product specification
90 o
handbook, full pagewidth
120 o 60 o
150 o 30 o
150 o 30 o
120 o 60 o
90 o MBB285
50
handbook, full pagewidth
25 100
10 250
+j
10 25 50 100 250
0
j
10 250
25 100
MBB287
50
IC = 100 mA; VCE = 10 V; Tamb = 25 C; Zo = 50 ..
1995 Sep 13 12