A

PRACTICAL TRAINING

REPORT

ON

PCB

Submitted for the partial fulfillment of Degree

Bachelor of Technology

ELECTRONICS AND COMMUNICATION ENGINEERING

Submitted By: - Submitted To:-

Praveen Kumar Wadia Dr. L Solanki
12EBKEC071 Principal (Academics)

DEPARTMENT OF ELECTRONICS AND COMMUNICATION

B.K. BIRLA INSTITUTE OF ENGINEERING & TECHNOLOGY PILANI (RAJ)
(Affiliated to Rajasthan Technical University, Kota)
2014-15
 ACKNOWLEDGEMENT

I would like to express my sincere gratitude indebtedness to Mr. A.P. Padarha for allowing
me to undergo the summer training of 45/60 days at INSTRUMENTATION LIMITED
KOTA RAJASTHAN
I am grateful to Mr. J.S. Solanki for the help provided in completion of the training, which
was assigned to me. Without his friendly help and guidance it was difficult to develop this
project.
I am also thankful to Dr P S Bhatnagar (Director BKBIET,Pilani) his true help & providing
the resources on completion of Training. Last but not least, I pay my sincere thanks and
gratitude Dr. L .Solanki (Principal Academics,BKBIET Pilani) for his valuable suggestions &
encouragement.
I would also like to thanks Mr. Santosh Jangid (Assistant Professor BKBIET Pilani) and Mr.
Rajesh Singh Shekhawat (Assistant Professor BKBIET Pilani) for timely giving the support
and suggestions during the training period.

PRAVEEN KUMAR WADIA 01.09.2015

12EBKEC071

i
 TABLE OF CONTENTS

S No. TOPIC PAGE No.

1. Acknowledgement I
2. Table of Content Ii
3. List of Figures Iii
4. List of Tables Iv
5. Organization Profile 1
6. 1. Printed Circuit Board (PCB) 2
1.1 Introduction to Printed Circuit Board 2
1.2 History of Printed Circuit Board 3
7. 2. PCB Manufacturing 6
2.1 Materials 8
2.2 Laminates 8
2.3 Panelization 9
2.4 Etching 11
2.5 Chemical Etching 12
2.6 Lamination 13
2.8 Drilling 13
8. 3. Exposed Conductor Plating & Coating 14
3.1 Solder Resist 14
3.2 Silk Screen 15
15
3.3 Printed circuit Assembly
17
3.4 Protection &Packaging
9. 4. Design 18
4.1 Copper Thickness 19
4.2 Cordwood Construction 20
4.3 Multi wire Boards 21
10. 5. Component Mounting Technology 22
5.1 Through Hole Technology 22
5.1.1 History 22
5.1.2 Characteristics 23
5.2 Surface Mounting Technology 23
5.2.1 Introduction 23
5.2.2 History 24
5.2.3 Terms 25
5.2.4 Assembly Techniques 25
5.2.5 Advantages 27
5.2.6 Disadvantages 27
5.2.7 Rework 28
11. 6. Soldering 29
6.1 History 29
6.2 Applications 29
6.3 Soldering Iron 30
6.4 Types of Iron 30
 6.4.1 Simple Iron 30
6.4.2 Cordless Iron 30
6.4.3 Temperature Controlled Soldering Iron 31
6.5 Cleaning 31

12. 7. Solder 33
7.1 Flux 34
7.2 Processes 35
7.3 Soldering & Brazing 36
7.4 Silver Soldering 37
7.5 Induction Soldering 37
7.6 De-soldering 38
7.7 Soldering defects 39
13. 8. References 40

ii
 LIST OF FIGURES

S No. NAME OF FIGURE PAGE No.

1. Fig 1.1 Printed Circuit Board 3
Fig 1.2 The component side of a PCB in 5
a computer mouse; Some examples
for common components and their
reference designation in the legend.
2. Fig 2.1 Panelization of PCBs 10
Fig 2.2 The two processing methods used 11
to produce a double-sided PWB
with plated through holes.
Fig 2.3 PCBs in process of having copper 12
pattern plated, notice the blue dry
film resist.
3. Fig 3.1 PCB with test connection pads 16
Fig 3.2 Antistatic bags for PCB 17
4. Fig 4.1 A board designed in 1967; the sweeping curves 18
in the traces are evidence of freehand design using self-
adhesive tape
Fig 4.2 A cordwood module 20
5. Fig 5.1 Through-hole devices mounted on circuit board. 23
Fig 5.2 Surface mount components including resistors, 24
transistors and an integrated circuits
Fig 5.3 Assembly line with SMT placement machines 28
Fig 5.4 Removal of surface mount device using soldering 28
tweezers
6. Fig 6.1 Soldering 29
7. Fig 7.1 An Improperly soldered joint 35
Fig 7.2 Solder 36

iii
 LIST OF TABLE

S No. NAME OF TABLE PAGE No.

1. Tab. 2.1.1 PCB Manufacturing Process Steps 6
Tab. 2.1.2 Process Sequences for Single, Double and 7
Multi-layer PCB 8
Tab .2.1.3 Standard laminate thickness per
ANSI/IPC-D- 275

2. Tab 5.2.1 Expanded form of SMP terms 25

iv