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Code: 12D86102
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3. (a) Differentiate the processing techniques of physical etching and plasma etching.
(b) Write notes on ion etching and ion-beam milling techniques.
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5. (a) Write notes on wet isotropic and anisotropic etching techniques.
(b) What are the problems that arise with wet bulk micro matching? Explain.
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6. (a) Write notes on mechanical properties of thin films.
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(b) Explain the technical aspects of synchrotron orbital radiation.
7. (a) Differentiate top-down approach and bottom-up approach with respect to various parameters.
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(b) What are all the considerable parameters in substrate choice? Explain them, in brief.
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