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DCAM PART 66 CAT B1.

1
MODULE 4 ELECTRONIC FUNDAMENTALS

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MODULE 4 : ELECTRONIC FUNDAMENTALS

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(DCAM PART 66 CAT B1.1)

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For Training Purposes Only Issue 1 Revision 0 Jan 2011
DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS

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WARNING
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This document is intended for the purposes of training only. The information contained herein is as accurate as

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possible at the time of issue, and is subject to ongoing amendments where necessary according to any

t a e r
regulatory journals and documents. Where the information contained in this document is in variation with other

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official journals and/or documents, the latter must be taken as the overriding document. The contents herein

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shall not be reproduced in any form without the expressed permission of ETD.

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For Training Purposes Only Issue 1 Revision 0 Jan 2011
DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
TABLE OF CONTENTS

4.1 SEMICONDUCTORS.......................................................................................................................................................................................... 1
4.1.1(A) DIODES .........................................................................................................................................................................................................1
4.1.1(B) DIODES .........................................................................................................................................................................................................3
4.1.2(A) TRANSISTORS ..............................................................................................................................................................................................31

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4.1.2(B) TRANSISTORS ..............................................................................................................................................................................................32

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4.1.3(A) INTEGRATED CIRCUITS ..................................................................................................................................................................................55

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4.1.3(B) INTEGRATED CIRCUITS ..................................................................................................................................................................................59

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4.2 PRINTED CIRCUIT BOARDS .......................................................................................................................................................................... 68

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4.3 SERVOMECHANISM ....................................................................................................................................................................................... 72

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4.3(A) SERVOMECHANISM ..........................................................................................................................................................................................72

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4.3(B) SERVOMECHANISM ..........................................................................................................................................................................................73

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For Training Purposes Only Issue 1 Revision 0 Jan 2011
Page i
DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

4.1 Semiconductors (DCAM Ref. 4.1) Level 2 Diodes in Parallel


Where current supplied by one rectifier would exceed its maximum forward
4.1.1(a) Diodes current, or exceed its maximum operating temperature, it is possible to connect
two or more diodes in parallel. The current, therefore, will be divided between the
Application of Semi-conductor P-N Junction Diodes Diodes in Series diodes.

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The voltage across each diode will be the same and the current distribution

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between the diodes will depend on the characteristics of the diodes (again, for

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further information on rectifiers see later notes in this series).

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Figure 1: DIODES IN SERIES

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When diodes are connected in series to a known load then it must be remembered

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that the current will be the same and the maximum forward current must not be

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exceeded for each diode. Because each diode has a small forward resistance

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there will be a volts drop across each diode, which will depend on each diode's

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characteristics. These individual volts drops will subtract from the supply voltage to

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leave a certain voltage across the load (see later notes on rectifiers).

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P S E
Figure 2: DIODES IN PARALLEL

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For Training Purposes Only Issue 1 Revision 0 Jan 2011
Page 1
DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

TESTING OF DIODES
It is essential the diode is connected the correct way round in a circuit, so a
coloured band or spot usually marks the cathode (k) end.

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Figure 3: TESTING OF DIODES

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If it is necessary to verify the connections in the absence of any marking then a

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test meter is used. Using the old AVO-meter it should be remembered, as with any

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ohmmeter, that the BLACK (NEGATIVE) terminal becomes the positive output and

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RED (POSITIVE) terminal is the negative. When a 'FLUKE' is used it has a switch

P S E
selection to test diodes.

The meter displays the forward voltage drop (VF) up to 2 volts and beeps briefly for

A
one diode drop (VF < 0.7V) for the forward bias test. For reverse bias or open
circuit the meter displays OL, and if there is a short circuit the meter emits a

M
continuous tone.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

4.1.1(b) Diodes
At room temperatures the atoms are vibrating sufficiently in the lattice for a few
SEMICONDUCTOR MATERIALS bonds to break, setting free some valence electrons, leaving a "hole" where the
electron was. Free electrons are attracted to the hole as the atom, short of an
Figure 4 shows the structure of the germanium and silicon atoms, two very electron is now positively charged.

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important elements in the manufacture of diodes and transistors

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Figure 4: ATOMIC STRUCTURE

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Bear in mind that the diagrams are only two-dimensional and that in reality the

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orbiting electrons do not rotate in perfect circles or rotate in a flat plane.

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From figure 4 it can be seen that each atom has four electrons in its outer shell, Figure 5: CO-VALENT BONDS

P S E
these electrons are called VALENCE ELECTRONS, they are farthest from the
nucleus and therefore are least tightly bound (less attractive force). It is the If a battery is placed across a pure semiconductor, electrons are attracted to the
valence electrons that play the active part in electrical conduction. positive terminal. These free electrons travel through the semiconductor topping'

A
from one hole to another, and it therefore appears that the positive holes are

M
Silicon and germanium are crystalline substances and the valence electrons of the moving towards the negative terminal. This current flow is very small and is called
individual atom link up and arrange themselves with the valence electrons in INTRINSIC CONDUCTION.
adjacent atoms to form CO-VALENT BONDS. Every atom has a half-share in eight
valence electrons. This gives a very stable arrangement of a regularly repeating
three dimensional structure called a crystal lattice. Figure 5 shows the two
dimensional effect of the covalent bonding. Pure silicon and germanium are
therefore very good insulators.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

To understand the concept of electrons moving one way and holes moving the
other is not easy but it can be likened to an empty seat at the end of a row in a
cinema. Assume the vacant seat to be at the right hand end of the row. If the first
person next to the seat moves into it, then he/she has moved to the right, but the
vacant seat has moved one place to the left. If each person in the row does the

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same (i.e. moves to the empty seat to his/her right) as soon as it becomes empty,

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the vacancy (hole) appears to have moved along the row in one direction while the

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occupants (electrons) have move in the opposite direction.

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If the temperature is raised more bonds break down and conduction increases i.e.,

a
resistance decreases, this means more heat is generated, and more conduction Figure 6: N-TYPE SEMI-CONDUCTOR

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occurs, resistance decreases further, more heat is generated - and so on. This is

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called thermal runaway and will eventually destroy the crystal structure. Note: Although extra electrons have been inserted, it must be remembered that

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each impurity atom is itself neutral and so the whole of the N-type material is also

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Semiconductors have a negative temperature coefficient. In other words their neutral.

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resistance decreases with an increase in temperature. We need now to look at

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how we can change the basic insulator into a conductor. This is achieved by MAJORITY CARRIER - ELECTRONS (NEGATIVE)

a
[N = N-TYPE] MINORITY CARRIER - HOLES (due to intrinsic conduction)

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mixing (doping) a very small quantity of a selected impurity atom into the

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10
semiconductor material. (Typically 1 part in 10 ) The material now becomes an

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extrinsic semiconductor.

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There are two types of extrinsic semiconductors:

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1. N-Type semi-conductor material.

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2. P-Type semi conductor material.

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N-Type Semi-conductor Material

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Doping impurities such as phosphorus or arsenic are used. These have five
(pentavalent) electrons in the outermost orbit. When introduced into the basic

M
material, four of the electrons join up with the co-valent bonding, whilst one
electron is left 'free'. (The number of free electrons can be strictly controlled by this
doping). Figure 7: ELECTRON FLOW IN AN N-TYPE SEMI-CONDUCTOR
The free electrons can migrate through the inter-atomic space and can therefore
act as current carriers when a (very low) voltage is applied.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

P-Type Semi-conductor Material

In this material, impurities such as Indium or Aluminium are used. These have
three (trivalent) electrons in the outermost orbit. When introduced into the basic
material, all three electrons link into the crystal structure but this leaves a 'hole' in

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the structure. This hole is looking for an electron to fill it and so it is a form of

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positive current carrier. If a (very small) voltage is applied, electrons will move to

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fill in the holes but this forms fresh holes and so there is a general drift of holes

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through the material from positive to negative (in the opposite sense to the electron

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flow in the N-type material). Again, the material is neutral.

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Figure 9: ELECTRON FLOW IN A P-TYPE SEMI-CONDUCTOR

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Figure 8: P-TYPE SEMI-CONDUCTOR

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MAJORITY CARRIER - HOLES (POSITIVE)
[P = P-TYPE] MINORITY CARRIER - ELECTRONS (due to intrinsic conduction)

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For Training Purposes Only Issue 1 Revision 0 Jan 2011
Page 5
DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

THE P-N JUNCTION

Imagine a piece of N-type material being brought into contact with a piece of P-
type material. Both pieces are, up to the instant of contact, neutral.

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Remembering that the holes are looking for electrons to complete the lattice

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network, it can be seen that electrons will migrate across the junction to fill in the

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holes as soon as the two materials are brought together.

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Figure 11: P-N JUNCTION

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The Barrier Potential is approximately 0.2V for Germanium and 0.6V for Silicon. It
must be remembered that the barrier potential is always present at a P-N junction -

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even if it is sitting in a storage bag on a shelf.

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If an external supply is connected +ve to the P-type material and -ve to the N-type,

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it will oppose the barrier potential. If it is bigger than the barrier potential, the
Figure 10: P-N JUNCTION BEFORE CONTACT

t e
barrier potential will be overcome and current will flow, electrons moving from

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supply negative to positive and holes moving in the opposite direction, as shown in

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As electrons leave the N-type material, it will become positively charged. As figure12. This is known as FORWARD BIASING the junction.

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electrons fill holes in the P-type material, it will become negatively charged.

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A BARRIER POTENTIAL is built up at the boundary, forming what is known as the

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Depletion Layer (figure 8). This build-up in potential will eventually be strong

P S E
enough to stop further migration of electrons across the junction.

M A Figure 12: FORWARD BIAS P-N JUNCTION

The intrinsic conduction, (covalent bonds breaking down at normal temperature)


produces minority carriers and thus small current flows in the same direction as the
majority carriers i.e., it adds to it.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

If the external supply is connected in the other sense, +ve to the N-type and -ve to RECTIFIER ACTION
the P-type, it will reinforce and increase the barrier potential and therefore no If an ac supply is applied to a P-N junction then when 'P' is made positive to 'N'
current will flow, except for any slight leakage current (see below). The depletion then the positive half cycle will flow through the junction as it is forward biased. On
layer will be enlarged as shown in figure 13. This is known as REVERSE BIASING the negative half cycle of the ac 'P' is negative to 'N'.
the junction.

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This is the reversed bias mode and the junction will not conduct on this half of the

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cycle.

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Figure 13: REVERSE BIAS P-N JUNCTION

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At first sight it might appear that there is no current flow, but due to intrinsic

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conduction, which produces minority carriers, which causes a tiny current to flow Figure 14: ACTION OF A DIODE

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across the junction this is known as the LEAKAGE CURRENT.

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The junction passes current through R only when the P material is positive.

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Therefore an output voltage is produced only on the positive input half cycle.

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Raising the temperature of the P-N junction causes a rapid increase in the

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generation of minority carriers, and therefore leakage current increases. At room

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temperature each 10C increase roughly doubles the rate of generation for
germanium.

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For silicon the doubling rate is 5C. It might appear from this that germanium would
be used for higher temperature conditions, however, although the rate of increase

M
is greater for silicon, its actual value is considerably less than that of germanium,
so silicon is used where high temperatures are encountered.

Figure 15: DIODE SYMBOL

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

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Figure 16: DIODES

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The P-N junction is acting as a rectifier and is known as a SEMICONDUCTOR

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DIODE. The symbol is as shown in figure 15.

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It is important to note that the arrow points in the direction of CONVENTIONAL

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Figure 17: DIODE CHARACTERISTIC CURVES

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current flow and the two connections are known as the ANODE (A) and CATHODE

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(K). The cathode (negative end) is often marked with a band as shown in figure 16.

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The left-hand side of the origin of the characteristic curve is where the voltage is

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reversed, i.e. reverse biased. As can be seen the current is extremely small, this is
Diode Characteristics

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the leakage current due to minority carriers. Note that the voltage scale is not

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linear, with the larger divisions on the negative axes of the graph.

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Typical characteristic curves for silicon and germanium diodes at 25C are shown

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in figure 17. When forward biased, a voltage is required to overcome the barrier

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As the voltage is increased at a certain point the current increases rapidly to a high

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voltage before the diode current increases; this is typically 0.2V for germanium and value. This is known as AVALANCHE BREAKDOWN and will cause permanent

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0.6V for silicon. After this, current rises rapidly as the applied voltage increases. damage to the diode if it is allowed to occur.

P S E
It occurs because as the reverse voltage becomes too great, the minority carriers
are accelerated to a point where they heat up the diode and collide with atoms in

A
the depletion layer. This will dislodge further electrons, thus creating more minority
carriers and this effect 'avalanches' to cause a rapid rise in current. The

M
breakdown voltage can have any value from a few volts up to 1000V for silicon and
100V for germanium depending on the construction of the diode and the level of
doping.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Diode Parameters Depending on its use, frequency is also a parameter to be considered, but
generally these are special diodes and will be discussed later.
Diodes are manufactured in a wide range of voltage and current ratings. These
must be taken into account when choosing a diode for a particular circuit. Single Phase Half Wave Rectifier

g
Typical parameters considered are: With reference to figure 18, when terminal A is positive with respect to B the diode

n
conducts, this causes a current to flow around the circuit and a voltage will be

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1. Maximum forward current developed across RL. When the input polarity reverses terminal A will be negative

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2. Peak inverse voltage with respect to B and the diode will switch off.

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Maximum operating temperature

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The diode has a small forward resistance when it is conducting, so power must be

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dissipated as it conducts. This power dissipation causes heat at the junction, this

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local heating must be kept down, as excessive leakage current will occur. There is

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therefore a MAXIMUM FORWARD CURRENT so that the temperature is not

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reached which will cause deterioration of the structure of the diode.

t a e
The PEAK INVERSE VOLTAGE (PIV) is the maximum operating voltage

e e
i
appearing across the terminals of the diode acting in the reverse direction, and

r i n
therefore represents the maximum reverse voltage that may be applied to the Figure 18: HALF WAVE RECTIFICATION

p
diode without reverse breakdown occurring. This may be written as Maximum

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Reverse Voltage instead of PIV.

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The voltage developed across RL is therefore half-sine-waves and is known as a

r
half wave rectifier. The output being DC, albeit variable. The average value being

P S E
MAXIMUM OPERATING TEMPERATURE is a maximum junction temperature half that of the supply, i.e. peak x 0.318. (assuming no losses). The output DC
above, which the structure of the diode deteriorates. The maximum forward ripples have a frequency equal to the input frequency of the AC supply, i.e. ripple
current is so chosen that this temperature is not exceeded in the worst frequency - supply frequency.

A
combination of circumstances.

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However, it should be remembered that the maximum forward current will also
depend on the temperature in which the diode is operating; and maximum forward
current is usually quoted at two or more ambient temperatures.

We know as the temperature rises the leakage current increases and as a guide
the leakage current doubles in value for each 10C rise in temperature.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Single Phase Full Wave Rectifier This will act as a reverse voltage across D2 so the peak inverse voltage for the
diodes must be twice the peak voltage on either half of the secondary of the
As the name implies this uses both half cycles of the input wave form. Figure 19 transformer.
shows diodes D1 and D2 used with a transformer, which is centre tapped at C. The
point C can be considered as neutral with terminals A and B swinging alternately Bridge Rectifier

g
positive and negative about it.

n
This is also a single phase full wave rectifier, and has advantages over the

i
When A is positive to C, Diode D1 conducts with D2 switched off. On the other half previous circuit in that the transformer does not need to produce twice the voltage

n
cycle of input, B is positive to C and D2 conducts with D1 switched off. The output required and the secondary is in use all the time. Unlike the previous circuit where

i
is therefore undirectional, with both diodes alternately conducting, giving a full only half the secondary winding was used at any one time.

a
wave output across RL. The average output voltage is 0.637 x peak (assuming no

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losses), i.e. average of the supply. Figure 20 shows a bridge rectifier. Assume the top of the secondary winding of the

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transformer to be positive (positive half cycle), trace the current flow through the

o
load using the arrows shown.

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t a e r
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P S E
Figure 19: FULL WAVE RECTIFICATION Figure 20: BRIDGE RECTIFIER - FIRST HALF CYCLE

The output DC 'ripple is therefore twice the input supply frequency. Having to use

A
the double winding on the transformer makes this component more bulky in size
and therefore more expensive.

M
A point to note about this circuit is that when D1 is conducting, the voltage across
the load resistor RL is the peak voltage. With D2 cut off the voltage across C-B is in
series with this voltage, so these two voltages combine to give a total of twice the
peak voltage.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

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Figure 22: DELTA STAR TRANSFORMER
Figure 21: BRIDGE RECTIFIER - SECOND HALF CYCLE

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Figure 23 shows the waveform of the three-phase supply and the resultant supply
On the next half cycle (figure 21) assume the bottom of the secondary is positive voltage to the load.

f T
and trace the circuit through the load following the arrows. Note the direction of

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current through the load is the same during each half cycle, i.e. it is DC.

y n g
Note that in this circuit the two non-conducting diodes have twice the supply

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voltage across them, (load/supply voltage + supply voltage = twice supply

t a
voltage). However, this voltage is shared between the two non-conducting

e
diodes in series, therefore the peak inverse voltage per diode is the supply

i e e
voltage. As before the ripple frequency is twice the supply frequency.

p r i n
Typically all four diodes are available in one package.

r o n g
Three Phase Half Wave Rectification

P S E
In order to obtain three-phase half wave rectification a diode must be inserted into
each of the supply lines to the load and the return from the load to the supply
Figure 23: WAVEFORMS - THREE PHASE RECTIFIER

A
MUST be to the star point of the three-phase system.

M
Therefore this form of rectification can only be used where there is a star Note that the ripple frequency of this rectifier output is three times the supply
connection using a neutral line. Assume this star connection is the secondary of frequency, with three DC output voltage 'blips' for one sequence of the three-phase
a three phase (DELTA-STAR) transformer as shown in figure 22. AC supply.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Three Phase Full Wave Rectification

This form of connection does not require a neutral line, so can be used on either
Star or Delta connected systems. Figure 24 shows the diode circuit diagram.

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Figure 25: THREE PHASE FULL WAVE WAVEFORM

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Figure 24 FULL WAVE RECTIFIER CIRCUIT

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The arrows show the time in the three phase cycle when phase A is maximum and

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passing peak current to the load (say 10 amps). After passing through the load,

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the current splits into two, of five amps each to return to the B and C lines back to

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the supply.

P S E
The output ripple frequency is six times the supply frequency. We shall now look at
some other uses of diodes.

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Page 12
DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

CLIPPING OR LIMITING

As the name implies it is the limiting' or 'clipping off of part of the voltage waveform
that lies above or below a certain chosen level. This level is called the bias, or
reference level. Some examples are shown in figure 26.

i ng
a i n
Figure 27: SERIES NEGATIVE LIMITER

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In figure 28, assume the input is a sinewave of (say) +20 to -20 volts. When the

o
diode is conducting (assuming negligible resistance) the voltage across it is

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negligible and the output voltage (VOUT) will be equal to VIN. When the diode is cut

r y n
off the output voltage is practically zero. The circuit therefore clips the portion of

r i
the waveform, which goes negative.

e t a e e
p r i i n
r o n g Figure 28 WAVEFORM OF SERIES NEGATIVE LIMITER

P S E
If the diode was to be turned round we then have a series positive limiter and the
diode only conducts on the negative going cycles and so the positive going portion

A
of the input waveform is clipped.

M
Figure 26: EXAMPLES OF LIMITING

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

The resistance R must be some value intermediate between the two diode below some reference voltage other than zero. This can be done using slightly
extremes of resistance. This means R is very large compared to the conducting modified versions of the basic limiting circuits already shown.
resistance (almost zero ohms) and very small compared with the cut-off resistance
(which is almost infinite). A typical value for R in practice will be between 10k Figure 31 shows a shunt negative limiter to -10V.
and 100k. Figure 29 shows a shunt positive limiter with the diode in shunt

g
(parallel) with the component (VOUT) and the resistor is in series.

ni n
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r y i n
Figure 29: SHUNT POSITIVE LIMITER

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Figure 31: SHUNT NEGATIVE LIMITER

t a e
During the positive half cycles, with the diode conducting the voltage developed The waveform may be limited to any positive or negative value by holding the

i e e
across it is practically zero, so output voltage is zero. When the diode is cut off on appropriate electrode of the diode at the required bias or reference level.

r n
the negative half-cycles, practically the whole of the input voltage is across the

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diode and therefore VOUT = VIN. This circuit therefore clips the portion of the input

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waveform, which goes positive.

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P So E n
M A
Figure 30: WAVEFORM OF POSITIVE LIMITER

If we wish to remove the negative cycles of the waveform all that is required us to
turn the diode around; the circuit now becomes a shunt negative limiter.
The circuits so far discussed have all 'clipped' or limited the waveform above zero
volts. In practice it is often necessary to clip the portion of the waveform above or
For Training Purposes Only Issue 1 Revision 0 Jan 2011
Page 14
DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

On one half cycle of the input, the diode is cut off and practically the whole of the If the diodes are turned round then the reverse outputs will occur. The same
input voltage appears as VOUT. On the other half cycle the diode is cut off until it principle can be applied to series limiters. Figure 34 shows a series positive limiter
reaches above the bias level, up to this point VIN = VOUT, when the diode conducts to -10V and figure 35 shows its waveform.
the VOUT is equal to the bias level and clips the negative half cycle as shown in
figure 32.

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If the polarity of the bias was turned around the other way then the output would be

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as shown in figure 33.

a i n
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Figure 34: SERIES POSITIVE LIMITER

i e t e e
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Figure 32: WAVEFORM OF SHUNT NEGATIVE LIMITER

p r g i
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P So E n
M A Figure 35: WAVEFORM OF SERIES POSITIVE LIMITER
Figure 33: REVERSE POLARITY WAVEFORM OF SHUNT NEGATIVE LIMITER

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

If the (10V) battery at the bottom of the resistor was reversed then the output
waveform would be as shown in figure 36.

i ng
i n
Figure 38: WAVEFORM OF COMBINED LIMITER

ra
In practice, reference or bias levels are not provided by batteries, but by a

f
potentiometer connected across a dc supply line.

o g T
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Figure 36: WAVEFORM OF SERIES POSITIVE LIMITER WITH REVERSE

e e
POLARITY BATTERY

r i i n
Again if the diodes were turned around the reverse outputs will occur.

p
o n g
Figure 37 shows the circuit where the two are combined. This 'combined limiter'

r
can be used to take a 'slice' out of an input waveform, as shown in figure 38.

P S E
M A
Figure 37: COMBINED LIMITER

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Clamping The voltage to which the bottom ends of the resistor or diode are returned is again
known as the bias or reference level. It may be of either polarity including zero
These circuits are widely used in radar and communications equipment to change volts.
the reference level of a waveform without reducing its amplitude. Circuits which
move waveforms up or down in this way are known as Clamping Circuits because

g
their effect is to fix or clamp the top or bottom level of the waveform. Figure 39

n
shows the difference between a limiter/clipping circuit and a clamping circuit. The

i
limiter circuit simply 'cuts off a part of the waveform, whilst a clamping circuit

n
moves the whole waveform up or down.

ra i
o f g T
Figure 40: CLAMPING CIRCUIT

r y i n
The circuit is clamped to this bias level. In the previous drawing the output

a r
waveform is clamped to zero volts. The two types of clamping circuits are:

e t e e
1. Positive clamping - the bottom of the output waveform is clamped to the bias

i n
voltage, so the output waveform is positive to the bias level.

r i
2. Negative clamping - the top of the waveform is clamped to the bias voltage,

p g
so the output waveform is negative to the bias level.

r
P So E n
M A Figure 39: LIMITING/CLAMPING

The simplest form of clamping circuit is a diode circuit that consists of a capacitor
and resistor, forming a long CR circuit to the input waveform.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Figure 41 shows a circuit with positive clamping to zero volts and figure 42 shows A to B The input rises to 100V from zero. The capacitor is initially
the waveforms. uncharged and cannot charge immediately. VR therefore rises instantly to 100V
and since this voltage is applied to the cathode of the diode, the diode is cut-off.
B to C With the diode cut-off, C charges on a long time constant CR
seconds and VC (voltage across the capacitor) rises by a small amount. Thus VR

g
falls by the same amount.

n
C to D The input falls by 100V to zero and since VC cannot change

i
immediately VR also falls to 100V to a small negative potential which causes the

n
diode to conduct.

i
D to E With the diode conducting, C discharges on a short time constant

a
CRD seconds. RD is diode resistance. Both VC and VR quickly return to zero volts

r
and the diode is cut off.

f T
Figure 41: POSITIVE CLAMPING CIRCUIT E to F The input rises again by 100V and the cycle is repeated.

o g
Except for small negative 'pips' the output VR is clamped to a base level of zero

y n
volts and is positive going from this level.

t a r e r i A similar action takes place with a negative going square wave.

i e e
Figure 43 shows a negative clamping circuit and figure 42 shows the waveforms.

p r g i n
r
P So E n
M A
Figure 42: WAVEFORM - POSITIVE CLAMPING

With reference to figure 41, since R and the diode are in parallel the output voltage
always equals the voltage developed across R. In any CR circuit the input voltage
Figure 43: NEGATIVE CLAMPING CIRCUIT TO ZERO VOLTS

VIN = VC+ VR at all times.

The description of the waveforms (figure 42) is as follows:


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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

C to D VIN changes instantaneously from +100v to zero volts and this


step appears in full across R. Thus vr becomes immediately -100V, the diode is
non-conducting and VC is unchanged.

D to E The circuit is now a long CR and C discharges slowly, VR rises

g
slowly towards zero volts. (In a very long CR circuit the change of D to E is only a

n
very small proportion of the input waveform amplitude).

ni
E to F VIN instantly becomes 100V again, and this rise causes VR jump

i
from -98V (say) to +2V, which causes the diode to conduct.

ra
After F C quickly charges back to +100V on the short CR circuit and the process

f T
repeats itself.

o g
Thus after the initial spike is over, the waveform VOUT is a very slightly distorted

y n
version of the input waveform, but negatively clamped to zero volts.

t a r e r i
r i e n e
Figure 44: WAVEFORM OF NEGATIVE CLAMPING CIRCUIT TO ZERO VOLTS

p g i
Assuming a square wave of 0V and +100V (figure 44).

r o E n
Prior to A - the capacitor is initially uncharged and since VIN equals zero volts,

P S
VOUT equals zero volts.

A to B The input voltage rises from zero, and since C cannot change its

A
state of charge instantaneously, the rise appears in full across R (VOUT). Since VR

M
is the same as the voltage across the diode the diode conducts.

B to C Capacitor C and the conducting diode form a short CR circuit and


so the capacitor quickly charges to +100v. VOUT falls to zero volts.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

i ng
i n
Figure 47 POSITIVE CLAMPING TO POSITIVE BIAS

ra
Figure 45: NEGATIVE CLAMPING TO NEGATIVE BIAS

f T
In the examples shown the output waveform is clamped to either positively or

o g
negatively to zero volts. If it was necessary, as in some radar circuits, to clamp to

y
a level other than zero, then the bias voltage is placed in the resistor rectifier line

r i n
as shown in figures 45, 47 and 49. The waveforms produced are shown

a r
respectively in figures 46, 48 and 50.

i e t e e
p r g i n
r
P So E n Figure 48: WAVEFORM OF POSITIVE CLAMPING TO POSITIVE

M A
Figure 46: WAVEFORM OF NEGATIVE CLAMPING TO NEGATIVE
BIAS

BIAS
Figure 49: POSITIVE CLAMPING TO NEGATIVE BIAS
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

VOLTAGE DOUBLER

Another application of a diode is in a voltage doubler circuit, which is typically used


in a High Energy Ignition Unit, (HEIU). Figure 51 shows the basic principle of a
voltage doubler circuit.

i ng
a i n
f T r
y o g
Figure 50: WAVEFORM OF POSITIVE CLAMPING TO NEGATIVE BIAS

n
t a r e r i
i e e
Figure 51: VOLTAGE DOUBLING CIRCUIT - 1

p r i n
On one half cycle of the supply capacitor C1 will charge up to V volts, on the other

g
half cycle C2 will charge up to V volts. As the two capacitors are in series then the

r o n
output is approximately 2V volts. Figure 52 shows another type of voltage doubling

E
circuit.

P S
M A
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

FLY WHEEL DIODE

Sometimes a diode is connected across a relay coil. When the supply is switched
off the collapse of current causes a self-induced emf in the coil which by Lenz's
Law tries to keep the current flowing and may cause arcing across the control

g
switch contacts. The diode allows a path for the dissipation of this voltage and

n
prevents this possible arcing. This may also be called a free-wheel diode.

i ni
ra
Figure 52 VOLTAGE DOUBLING CIRCUIT - 2

f T
With reference to figure 52, C3 is charged to V volts during the negative half cycle

o
of the supply voltage. The potential between C3 now acts as a battery in series

y g
with the supply. In the positive half cycle of the supply, C4 is charged to a voltage

r i n
equal to the sum of the peak supply voltage and the voltage across C3, i.e.

a r
approximately 2V.

t e
Figure 53: FREE-WHEEL DIODE

e e
By connecting the output of one multiplying circuit onto the input of the next

i
(cascading) the dc voltage output can be four times the ac input.

r n
ZENER DIODE

op g i You will remember that, with a P-N diode under reverse bias conditions, the only

r n
current flowing is due to the minority carriers passing across the depletion layer.

P S E
As can be seen from the graph if the reverse bias is increased, there is little effect
on the flow at the minority carriers, if the reverse bias is continually increased the
point of breakdown is reached and the current increases rapidly. In the rectifier

A
diodes discussed so far we make sure we do not get anywhere near this value of

M
reverse voltage because the diode would be destroyed. However, the zener diode
makes use of this breakdown or avalanche condition.

Just to look at the breakdown mechanism in a little more detail. As the reverse bias
increases the acceleration of the electrons increases and they dislodge other
electrons as they collide with the atoms.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

The zener diode symbol is shown in figure 55.

g
Figure 55: ZENER DIODE SYMBOL

i n
The zener diode can be used as a voltage stabilizer, i.e. to keep the voltage

i n
constant across a circuit irrespective of load current or supply voltage variations.
With reference to figure 56:

f
Figure 54: GRAPH OF REVERSE BIAS
a)

T ra
If the load current IL increases, the zener current decreases by the amount, if
IL decreases then the zener current increases by the same amount thus

o g
maintaining a constant voltage across the load at all times.

y
b) If the supply voltage should increase, then the current through the zener

r i n
More electrons are now created to cause more collisions and so on, and a increases while the increase in voltage appears across rd not across the

a r
situation is reached which is uncontrollable (avalanche) and the diode is zener. The zener voltage remains at breakdown value irrespective of the

t e
destroyed. However, if a resistor of a suitable value is placed in series with the increase in current through it. If the input voltage falls, zener current

e e
diode the current can be limited which ensures no overheating and does not cause decreases and the voltage across rd falls, but again the voltage across the

i
damage to the diode.

n
zener and the load remains constant.

p r g i
The zener diode is always connected in REVERSE BIAS, i.e. cathode to positive,

o
anode to negative. At the required breakdown voltage, determined by the doping

r n
levels the zener will breakdown, but if the reverse voltage is reduced then the

P S E
zener will again become a blocking diode.

If you look at the graph again you will see that the Voltage across the diode

A
remains virtually constant at the breakdown voltage value even though the current
through it can increase. The zener is therefore a CONSTANT VOLTAGE,

M
VARIABLE CURRENT device. They are made in a wide range of breakdown
voltages 2 - 200v being a typical and also a wide range of power ratings from half
Figure 56: VOLTAGE STABILISER CIRCUIT
a watt to many watts.
The property of the zener means it can also be used as a reverse voltage switch,
i.e. it can be arranged to breakdown at a certain reverse voltage to activate a
switch, as used in aircraft transistorized regulators and protection systems.
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

If the two centre regions of the SCR are regarded as being split, diagonally as
SILICON CONTROLLED RECTIFIER (THYRISTOR) shown in figure 58. It becomes two interconnected transistors TR1 and TR2. TR1
is a PNP transistor and TR2 is an NPN transistor. With the anode positive to the
The SCR is a P-N-P-N semiconductor switching device, which has three terminals cathode, the base collector junctions' (J2) are reverse biased and apart from a
ANODE, CATHODE and GATE. small leakage current no current flows.

ng
If a pulse of current is injected into the gate terminal this turns TR2 on, this base

i
current produces a larger collector current in TR2 which also forms the conduction

n
path for the base current of TR1, which increases its collector current and forms

i
the base current of TR2. The SCR is now self-sustaining and the gate supply can

a
be removed. Typically a few microseconds of a small current applied to the gate

r
will turn the SCR 'ON'.

o f T
The device will remain in its conducting state until:

g
Figure 57: SCR SYMBOL & CONSTRUCTION

y n
1. The device is reverse biased, i.e. positive to cathode, negative to anode.

r r i
An explanation of the operation of the SCR can be carried out using the two- 2. The supply is removed.

t a
transistor analogy. 3. The voltage across the device is reduced so that the current falls below its

e
"holding value" (see characteristic).

r i e i n e
r op n g
P S E
M A Figure 58: SCR OPERATION

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

The SCR can be made to carry a wide range of currents from 1A to 1000A. Figure
60 shows different types of SCR.

i ng
a i n
f T r
y o n g
r i
Figure 60: SCRs

t a e r
In aircraft systems, the SCR would be typically used in firewire control,

e e
windscreen-heating control, etc. In windscreen heat control, the SCR can be

i
Figure 59: GRAPH OF SCR CHARACTERISTICS

n
gated at the beginning or at any point through out the half cycle. The earlier it is

r i
gated then more current will flow to the windscreen, the later it is gated then less

p
Figure 59 shows a graph of the characteristics for an SCR for different values of

g
gate voltage. The points a, b and c represent values at which the junction reverse current will flow.

r o n
bias is overcome and the SCR conducts, known as 'breakover', 'a' represents the

E
highest voltage and 'c' the lowest gate voltage. Once the SCR is conducting the

P S
voltage across it is typically 1 volt.

M A
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Page 25
DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

An LED consists of a junction diode made from the semiconductor compound


gallium arsenide phosphide. It emits light when forward biased, the colour of the
light emitted is in direct proportion to the current flow. Light emission in the red,
orange, green and yellow regions of the spectrum is obtained depending on the

g
composition and impurity content of the compound.

ni n
ra i
o f g
Figure 61: GRAPHS OF SCR INPUTS & OUTPUTS
T
r y r i n
The basic SCR, when fed with ac, will switch off after- one half cycle as the other

a
half cycle will reverse bias the SCR. So it only allows half power through. Figure 63: LIGHT EMITTING DIODE

i e t e e
A TRIAC consists of two SCR's connected in parallel but in opposition and When a P-N junction is forward biased electrons move across the junction from the

r n
controlled by the same gate. It is triggered on both half cycles and therefore one N-type side to the P-type side where they recombine with holes near the junction.

p i
conducts on one half cycle and the other one conducts on the other half cycle. The same occurs with holes going across the junction from the P-type side. Every

g
recombination results in the release of a certain amount of energy, causing, in

o
Figure 62 shows the symbol.

r n
most semiconductors, a temperature rise. In gallium arsenide phosphide some of

E
the energy is emitted as light that gets out of the LED because the junction is

P S
formed very close to the surface of the material.

In applying this to aircraft displays either the 7 segment or dot matrix

A
configurations may be used.

M Figure 62: TRIAC SYMBOL

The TRIAC is therefore used in windscreen heat control and domestically as a


lamp dimmer or motor speed control for an electric drill.
LIGHT EMITTING DIODE (LED)
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

SCHOTTKY DIODE

This diode is a rectifying metal to semiconductor junction. Several metals may be


used, including gold and aluminum, which are fused directly to a semiconductor
material.

ng
Since the mobility of electrons is greater than holes an N-type semi-conductor is

i
used. Current flow in this diode differs from current flow in conventional P-N

n
junction diodes in that the minority carriers do not take any part in the process. The

i
diode has very low capacitance and high switching speeds, produces less noise

a
and has a smaller forward conducting voltage (0.2 to 0.4v) then conventional P-N

r
diodes.

f
Figure 64: SEVEN SEGMENT LED DISPLAY

o g
In the 7 segment display for numerical indication as shown in figure 64, each

T
y
segment is an LED mounted within a reflective cavity with a plastic overlay.

a r r i n
When used on with an ac supply should be protected against reverse breakdown,

t e
this can be done with a conventional diode connected in shunt across the LED. On Figure 65: SCHOTTKY DIODE SYMBOL

e e
reverse voltage the diode will conduct at about 0.4v protecting the LED which

i
The basic construction, as already mentioned, is a piece of aluminium fused to an

n
would breakdown at about 3-11 volt reverse voltage.

r i
N type semiconductor. Some of the aluminium atoms diffuse into the silicon

p g
because aluminium has a valency of 3. This makes a very small P region. The

o
current carrier is almost 100% electrons due to free electrons in the N type

r n
semiconductor and the metal.

P S E
The Schottky diode is used in the making of logic gates as the switching time is
high.

M A
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

VARACTOR DIODE VARISTOR

Under reverse bias conditions, a junction diode can be regarded as a parallel plate The metal oxide varistor (MOV) is a semiconductor resistor made of zinc oxide
capacitor having two plates (the P and N regions) that are separated by a dielectric semiconductor crystals. When the voltage across this specialised resistor becomes
(depletion layer). The capacitance will vary according to the area and width of the two high, the resistor breaks down and becomes a conductor. The action of the

g
depletion layer. The narrow depletion layer gives a higher capacitance than a varistor can be compared to a pair of zener diodes wired back to back in series.

n
wider depletion layer.

i ni
f T ra
o g
Figure 66: SYMBOL - VARACTOR DIODE

r y i n
If this reverse bias can be varied then we have a variable capacitor typically

a r
between 2-10pf. These diodes are used to tune TV and VHP radio sets in special

t e
circuits, which allow the set to lock on to the desired station automatically. Figure

e e
66 shows the symbol for the varactor (varicap) diode.

p r i i n
Figure 67: TYPICAL MOV VOLT-AMPERE CHARACTERISTIC GRAPH

r o n g
They are used for transient voltage suppression, voltage stabilisation and switch

E
contact protection.

P S Figure 68 shows the symbol used in drawings and figure 69 shows how a varistor
reduces noise spikes in an ac voltage.

M A
Figure 68: MOV SYMBOL

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

i ng
a i n
f T r
y o n g
Figure 69: VARISTOR NOISE SPIKE CLIPPING ACTION

a r r i
The varistor is connected across the secondary of the transformer and at normal

t e
voltage has a very high resistance and takes a very small current. However when

e e
the voltage spikes exceed the breakdown voltage, it conducts and clips off the

r i n
noise spikes. The varistor switches extremely fast, unlike zener diodes that are

p i
slow switching. The principle described here could also be used for switch contact

g
protection.

r
P So E n
M A
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

PHOTO CONDUCTIVE DIODE

The photodiode is a P-N junction that is reversed biased in normal operation. Its
case has a transparent window through which light can enter.

g
As it operates in reverse bias there will be leakage current (minority carriers) which

n
increases in proportion to the amount of light falling on the junction. The light

i
energy breaks the bonding in the crystal lattice of the semiconductor and produces

n
electrons and holes to increase the leakage current. Figure 70 shows the drawing

i
symbol and figure 71 shows the characteristics of the photodiode.

f T ra
y o n g
t a r e r i
e e
Figure 70: SYMBOL - PHOTO CONDUCTIVE DIODE

i
Figure 71: CHARACTERISTICS OF THE PHOTODIODE

p r i n
Typically silicon diodes are used, as their leakage current with no light (dark

o g
current) is much lower than germanium. The sensitivity lies between 10mA/lm to

r n
about 50mA/lm (lm = lumen which is the amount of light emitted from a light source

P S E
1 candela strong) and the spectral response covers the visible to the infrared
range. Photodiodes used with laser systems can operate at very high frequencies.
They are very fast operating and are used in laser gyros and as an optical receiver

A
for laser systems.

M
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

4.1.2(a) Transistors

i ng
a i n
f T r
y o g
Figure 72: TYPICAL TRANSISTORS

n
a r r i
The transistor can be used as an AMPLIFIER circuit and also as a SWITCH. The

t e
amplifier action is based on applying a low current to the base-emitter with a higher

e e
current flowing through the collector-emitter.

r i i n
The switching action is the effect of applying a small current to the base for the unit

p g
(NPN) to 'switch on' allowing current to flow between the collector-emitter.

o n
Removing the base-emitter current will cause the unit to switch off. These

r
switching times can be very fast (say 2ns or 2 x 10-9 seconds or 0.000000002

P S E
seconds) (ns = nano seconds). Fast switching times are needed in computing.

M A
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

4.1.2(b) Transistors

TRANSISTORS Construction and Theory of Operation

The bi-polar or junction transistor consists of two P-N junctions in the same crystal.

g
If two P-N junctions were fused together so that the two 'N' regions form a very thin

n
(0.1 to 1mm thick) lightly doped layer between the two more heavily doped 'P'

i
regions a P N P transistor is formed. Figure 73 shows the layout of the transistor

n
and its symbol. Note the electrodes are called COLLECTOR, BASE and

i
EMITTER (emitter - the one with the arrow in the symbol). The emitter is more

a
heavily doped than the collector.

r
Figure 74: NPN TRANSISTOR

o f T
Note. For both the PNP and NPN transistors the arrows show the direction of

g
conventional current flow.

a r y r i n
i e t e e
p r g i n
o n
Figure 73: PNP TRANSISTOR

r
P S E
Similarly if two heavily doped 'N' regions are separated by a very thin lightly doped
'P' region then an N P N transistor is formed. Figure 74 shows the layout and its
symbol. The emitter is again more heavily doped than the collector.

M A
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Action of NPN Transistor The small amount of electron-hole combination in the base gives it a momentary
negative charge, which is immediately corrected by battery Ee supply holes, or can
For transistor action to occur the BASE-EMITTER junction must be forward biased be considered as electron flow. Remember conventional current flow is in the
(POSITIVE to 'P', NEGATIVE to 'N') and the COLLECTOR-BASE junction must be opposite direction.
reverse biased (POSITIVE to 'N', NEGATIVE to 'P').

g
So transistor action is the controlling of a large current in the high resistance

n
It should be noted that the battery Ee is much smaller than the battery Ec, it must (reverse biased) collector-base junction by a small current through the low

i
also be of sufficient voltage to overcome the barrier potential of 0.6v for silicon. resistance (forward biased) base-emitter junction.

a i n
f T r
y o n g
t a r e r i Figure 76: CONVENTIONAL CURRENT FLOW NPN TRANSISTOR

r i e i n e
r op n g
P S E
Figure 75: NPN OPERATION

A
Under the influence of the electric field due to battery Ee electrons cross the
junction into the base. Only a small proportion (about 1 to 2%) of the electrons

M
combine with holes in the base due to it being very thin and lightly doped. Most of
the electrons (98 to 99%), under the very strong positive influence of the battery
Ec, are swept through the base to the collector to Ec to form the collector current in
the external circuit.

Electrons are the majority carriers in the NPN transistor.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Action of P N P Transistor

Again the base-emitter junction is forward biased and the collector-base junction is
reverse biased.

g
Under the influence of the electric field due to battery Ee, holes cross the junction

n
into the base. Only 1 to 2% of holes recombine with free electrons in the base due

i
to it being very thin and lightly doped. The majority of the holes 98 to 99% are

n
accelerated towards the very strong negative influence of battery Ec. Holes are the Figure 78: CONVENTIONAL CURRENT FLOW PNP TRANSISTOR

i
majority carriers in the P N P transistor.

a
Since the carriers in the NPN and PNP transistors originate at the emitter and

r
distribute themselves between base and collector, the sum of the base and

f T
collector currents must always be equal to the emitter current, therefore:

Ie Ic Ib

y o n g
t a r e r i
r i e i n e
r op n g
P S E
Figure 77: PNP OPERATION

A
Due to recombination of holes and electrons in the base, the base loses free
electrons and will therefore exhibit a positive charge. The electrons will be

M
attracted by battery Ec into the base to 'make-up' for those lost by recombining with
holes. Figure 78 shows the conventional current flow through the transistor.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Testing Transistors TRANSISTOR AS AN AMPLIFIER


First of all we need to look at how the bias is applied in a practical circuit. In our
Using an analogue multimeter switched to the ohms range. On most analogue previous discussions batteries were used for the bias.
multimeters on the ohms range the negative (-) terminal has a positive polarity and
the positive terminal (+) has a negative polarity. This is an important point with

g
regards to identifying NPN and PNP transistors. If a digital multimeter is used then

n
check the polarities of the terminals on the ohms range.

ni
Figure 79 shows the readings you would expect using an analogue multimeter.

ra i
f T
Figure 80: AMPLIFIER CIRCUIT - 1

o g
If DC only is applied to the circuit shown figure 81 then R1 and R2 will divide the

y n
supply voltage into the same ratio as that of the resistors. So if the resistor values

r i
were 80k and 20k then with a supply voltage of 10V the voltages across R1 and

a r
R2 would be 8v and 2v respectively.

i e t e e
r i n
Figure 79: TESTING TRANSISTORS USING A MULTIMETER

op n g
LINEAR circuits are amplifying-type circuits. They will have analogue inputs and

r
the output will vary continuously and be more or less an exact but amplified copy

P S E
of the input, i.e. the output is a linear representation of the input. Many class A
transistor amplifiers, e.g. audio frequency and radio frequency amplifiers, are linear
circuits.

M A Figure 81: AMPLIFIER CIRCUIT - 2

The voltage across must be 0.6V to overcome the barrier potential. This could be
achieved by removing RE and making R2 of such a value so that 0.6V is dropped
across it, however, the problem here would be R2 would have to be quite low and
the amplification would be restricted.
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SEMICONDUCTORS (DCAM 4.1 L2)

The voltage across the base emitter junction (VBE) must be 0.6V and is the
difference between the voltage across R2 and RE. VBE = VR2-VRE. We now need to look at applying a signal to the amplifier. This will be a small ac
signal (which may be superimposed on a dc level), so only ac must be applied to
the amplifier. Capacitor C1 will block any DC component, and also the output
amplified AC value must only be passed onto the next stage if again C2 blocks a

g
DC component. These capacitors are known as COUPLING CAPACITORS.

i n
It is also essential that the voltage across RE remains constant, and therefore VBE

n
remains constant so that the AC input signal adds to and subtracts from the steady

i
VBE bias.

a
Figure 82: AMPLIFIER CIRCUIT - 3

f T r
So RE must be of a value that when the standing dc current is flowing 1.4v will be

o
dropped across RE leaving VBE to be 0.6v.

y n g
So in the static condition, i.e. DC only applied, a standing current (quiescent

r i
current) flows through the circuit and TR1, R1, R2 and RE provide the bias

a r
necessary to operate TR1 and allow current to flow.

i e t e e
p r i n
Figure 84: AMPLIFIER CIRCUIT WITH COUPLING/ DECOUPLING

g
CAPACITORS

r
P So E n
To ensure this, a capacitor is connected across RE. This capacitor will have a
capacitive reactance at the operating frequency very much lower than re This
means that if the ac "bypasses" RE it will leave a steady DC across RE. This
capacitor C3 is known as a DECOUPLING CAPACITOR.

M A Figure 83: AMPLIFIER CIRCUIT - 4

With current flow through RL and TR1 there will be a voltage drop across RL. Let us
assume this voltage drop is 5v so that the standing voltage is 10 5 = 5V. This is
Please note the figures quoted are purely explanatory, and actual values will
depend on the individual circuits. Also, the transistor used is an NPN but
everything applies equally as well when using a PNP transistor except the positive
rail would be at the bottom.

the condition that when DC is applied to the amplifier, all bias voltages are applied
and a standing voltage is at the collector of TR1.
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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Action with an AC Signal So you can see with an input voltage of 2.5mV we get an output swing of 0.25V so
output 0.25V 100
input 2.5mV
Assume that with DC applied the voltage at the collector is 5V. If a 2.5mV signal is therefore there is a gain
applied as the input then when the AC signal goes positive it will add to the DC
bias. The transistor will switch on more and the current through the transistor will

g
increase and the voltage drop across RL will increase, so the collector voltage will Please note again the values used are for explanatory purposes only.

n
fall. Assume if falls to by 0.25V.

i
Also note the function of RL (load resistor) without it there would be no voltage

n
changes at the collector and no amplification.

a i
Another purpose, (probably its more well known one) for RE, the resistor in the

r
emitter lead, is as a temperature compensating resistor.

o f T
If the temperature increases, the resistance of the transistor decreases, this

g
causes greater current through the transistor and therefore a greater voltage drop

y n
across re. If you remember the voltage across the base-emitter junction is VR2

r r i
VBE and this will decrease thus reducing the forward bias, reducing the current,

t a
compensating for the original increase.

e e e
Figure 85: AMPLIFIER ACTION 1

i
This amplifier configuration is known as a COMMON EMITTER AMPLIFIER. As

r i n
When the AC voltage goes negative, it opposes the bias and the transistor Vout

p
you have seen it has a VOLTAGE GAIN typically 100 600.

g
conducts less, the current through RL is less so the volts drop is less and the Vin

o n
collector voltage rises.

r
P S E
I out I c
It also has a CURRENT GAIN typically 50 300.
I in Ib

A
So it is a current amplifier as well as a voltage amplifier.

M Figure 86: AMPLIFIER ACTION 2

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

If there is a current gain and voltage gain then there must be a power gain.
Power out typically several thousands. Current gain I e I c less than 1, typically 0.98
Power in Voltage gain typically 500 800
V Power gain medium compared to common emitter
The input impedance is Z in in typically 600 2000 Input impedance low typically 50 to 200

g
I in Output impedance high typically 100k to 1M

i n
Vout
And the output impedance is Z out typically 10 50 k. Input and Output signals are in phase. Because of their very low input impedance

n
I out

i
and high output impedance they are used as impedance matching devices.
Also note the phase relationship between the input and the output is 180.

ra
Common Collector Amplifier (Emitter Follower)
The COMMON EMITTER amplifier is used for the majority of amplifier

f T
applications. There are two other amplifier configurations, the COMMON BASE

o
When the input goes positive this will increase the bias, the transistor will conduct

g
and the COMMON COLLECTOR. more and the volts drop across RE will increase and the top of RE will go more

y n
positive. When the signal goes negative the bias will decrease, the transistor will

r i
Common Base Amplifier conduct less the voltage across RE will decrease and the top of R goes more

a r
negative.

t e
With reference to figure 88; If the input goes positive then the emitter is positive to

e e
the base and this reduces the bias voltage and the current through the transistor

i n
falls. The volts drop across RL falls and the voltage at the collector rises When the

r i
input goes negative the emitter is negative with respect to the base and the bias

p g
increases, the current increases and the volts drop across RL will increase and the

o n
collector voltage falls.

r
P S E
M A Figure 88: COMMON COLLECTOR AMPLIFIER

Figure 87: COMMON BASE AMPLIFIER


Other characteristics of the common base amplifier are:
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Other characteristics are:

Current gain I e I c typically 20 200


Voltage gain less than 1
Power gain low compared to CB and CE

g
Input impedance high 20k to 100k

i n
Output impedance low 20 to 500

i n
The input and output signals are in phase. Because of its high input impedance COMMON COMMON
COMMON BASE

a
and low output impedance it again is used for impedance matching. EMITTER COLLECTOR

r
CURRENT <1
20 to 200 20 to 200

f T
Figure 89 shows the comparison between the three amplifiers. GAIN (0.95 to 0.995)

o
VOLTAGE

g
Each amplifier has the word common in front. This means that the input and output 100 to 600 500 to 800 <1
GAIN

y n
signals are common to whichever electrode is stated.

r i
POWER GAIN High Medium Low

a r
INPUT BETWEEN BASE & EMITTER OUTPUT BETWEEN COLLECTOR & INPUT

t e
EMITTER 500 to 2000 50 to 200 20k to 100k
IMPEDANCE

e e
INPUT BETWEEN EMITTER & BASE

i
OUTPUT

r n
OUTPUT BETWEEN COLLECTOR & BASE 10k to 50k 100k to 1M 20 to 500

i
INPUT BETWEEN BASE & COLLECTOR IMPEDANCE

p g
OUTPUT BETWEEN EMITTER & FOLLOWER INPUT

o n
OUTPUT

r
180 out of phase In phase In phase
PHASE

P S E
Identify SIGNAL OUT RELATIONSHIP
Impedance Impedance
WHATS LEFT IS WHAT ITS ALL ABOUT!! TYPICAL USE Normal amplifier matching (low to matching (high to

A
e.g. SIGNAL IN on base high) low)

M
Whats left is emitter Figure 89 TABLE OF COMPARISONS
SIGNAL OUT on collector

Hence COMMON EMITTER

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

In many cases the amplifications of a single stage amplifier is insufficient and


several stages have to be used. If this is so the output at one stage is the input to
the next, i.e. they are connected in cascade.

i ng
a i n
f T r
o g
Figure 91: TRANSFORMER & RC COUPLED RESPONSE CURVES

y n
Figure 91: TWO STAGE RC COUPLED AMPLIFIER

a r r i
Figure 90 shows a resistor (R3) and a capacitor (C2) coupled two stage common
emitter amplifier.

t e
r i e i n e
Another method of coupling stages of an amplifier is by using transformers. Using

p
the correct turns ratio the high output impedance of stage 1 can be matched to the

o g
low input impedance of stage 2, thus giving a considerable increase in gain over

r n
RC coupled stages. However, due to the change in impedance with frequency, its

P S E
frequency response is poor compared with the RC coupled amplifier. The uneven
response that is shown in figure 91 causes distortion.
Figure 92: TWO STAGE TRANSFORMER COUPLED AMPLIFIER

A
However, they are often used between the output stage and a loudspeaker load.
If the gain of stage 1 is 5 and the gain of stage 2 is 20 then the overall gain is 100
(High to low impedance matching)
(5 x 20). The overall gain is the product of the individual gains.

M
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

DIRECTLY-COUPLED AMPLIFIERS Direct Coupling with Zener Diode Bias

Coupling amplifier stages to one another via capacitors or transformers makes it A Zener diode in the emitter circuit of TR2 (figure 94) maintains a constant voltage
easy to couple together points with differing DC voltage levels. However, this at the emitter and thus increases the overall gain of the amplifier. It also goes
form of amplifier will only amplify an alternating signal, completely ignoring dc some way towards decreasing the effects of any variation in supply voltage.

g
voltages and will respond poorly to signals of very low frequencies.

i n
Many control systems found in aircraft produce signals that vary only infrequently

n
and this makes it necessary to use directly-coupled amplifiers in order to amplify

i
those variations. Careful matching of transistors and associated components is

a
essential if these amplifiers are to perform correctly. They are particularly sensitive

r
to voltage and temperature variations.

o f T
Simple Direct Coupling of two Bi-polar Transistor Amplifiers

y n g
The emitter bias resistor in TR2's circuit (R) produces a series current negative

r r i
feedback, reducing the overall gain of the amplifier to a minimum. (Figure 93)

e t a e e
r i i n
Figure 94: DIRECT COUPLING WITH ZENER DIODE BIAS

op g
DIFFERENTIALLY CONNECTED AMPLIFIERS

r
P S E n
If two identical directly-coupled amplifiers have the same power source, then a
change in supply voltage will not cause a change in the difference of their outputs.
There is similarly no change in the difference of their outputs if the ambient

A
temperature changes.

M
The only thing that will produce a change in the difference at their output is a
Figure 93: DIRECT COUPLED BI-POLAR TRANSISTOR AMPLIFIER variation in their signal inputs.

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

The 'Long-Tailed Pair' Differential Amplifier The Darlington Pair

Figure 95 shows the arrangement of the 'long tailed pair'. Note the output is across This arrangement (figure 96) gives a high current gain. It can also be used in the
the collectors of the two transistors, and that they have a common emitter via a Common Collector or Emitter Follower configuration with currents in the order of
resister (R). milliamps, in which case its main benefit is the increase in input impedance due to

g
the reduction of current taken by the first transistor.

i n
Classes of Amplification

i n
When a transistor is used as an amplifier the input circuit is normally biased to

a
some particular working point. There are three basic classes of bias, named

r
according to the working point chosen.

o f T
Class A

y n g
The amplitude of the input signal and bias are such that there is an output current

r r i
for the full cycle of the input signal. This is the most commonly used class of bias

t a
in amplifier circuits.

i e e e
Figure 95: THE LONG TAILED DIFFERENTIAL AMPLIFIER Class B

p r i n
The bias is such that current flows for only half of the cycle of input signal, for the

o g
other half of the input cycle the transistor is "cut off. This is usually employed in

r n
power amplifiers.

P S E
Class C

A
The bias and amplitude of input signal are such that current flows for less than half
of each cycle. Used in oscillators and selective amplifiers.

M
Efficiency
AC power output to load
This is defined by 100%
Figure 96: THE DARLINGTON PAIR DC power taken from supply

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

An amplifier which produces low power output has an efficiency which is no Push-Pull Amplifier
greater than 50%. This is because it is working under Class A conditions and the
DC standing (no input) current is large and produces wasted DC power. Figure 98 shows a simple push-pull power amplifier using an NPN type and PNP
type transistors. The load is a loudspeaker and is connected to both emitters via a
To overcome this problem in power amplifiers the push-pull amplifier was dc blocking capacitor.

g
introduced.

ni n
ra i
o f g T
a r y r i n
i e t e e
r n
Figure 98: PUSH PULL AMPLIFIER

op g i Operation

r E n
When an input is applied, assuming at this moment in time that the input at A is

P S
positive to B (positive half cycle), the base emitter junction of TR1 is forward
biased. There is therefore an output to the loudspeaker (positive half cycles).

A
During this time TR2 is reverse biased (base negative with respect to emitter).

M
Negative half cycles of the input (B positive to A) will reverse bias TR1 and it will
cut off and forward bias TR2, this time there is again an output; this time on the
Figure 97: GRAPHS OF INPUTS AND OUTPUTS FOR CLASSES A, B, & C negative half cycles.
AMPLIFIERS
As each transistor conducts for one half of each complete input cycle, the amplifier
is working in Class B conditions.

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

When there is no input, neither transistor conducts, therefore no DC power is This is overcome by forward biasing the base-emitter junctions of both transistors.
wasted. The maximum efficiency of a Class B power amplifier is high (78%) when Figure 100 shows a push-pull amplifier with this biasing to the two transistors being
compared with a Class A amplifier (50%). provided by resistors R1, R2 and R3 via the secondary winding of transformer T1.

One disadvantage of the simple circuit is that each transistor does not turn on until

g
the input is about 0.6V. As a result there is a dead zone producing 'cross-over'

n
distortion (see figure 99).

i ni
f T ra
y o n g
a r r i
Figure 100: PUSH-PULL AMPLIFIER

e t e e
Operation

r i i n
Under static (no input signal) conditions, equal currents will flow through the two

p g
halves of T2's primary winding and through the two transistors and R3 to the -ve

o
rail. There will therefore be no resultant flux in T2 from this DC source. Therefore

r n
no dc power is wasted and its efficiency is high (78%).

P S E
Transformer T1 is a phase-splitter, providing inputs to the transistors which are
equal but in anti-phase.

A
When the top of T1's secondary winding is positive, TR1 will be switched ON

M
(circuit via base-emitter - Cl) and TR2 will be switched OFF. As the collector
current of TR1 increases, that of TR2 decreases. More current will flow from the
+ve rail through the top half of T2's primary winding, collector - emitter TR1 and R3
Figure 99: CROSSOVER DISTORTION
to the -ve rail.

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

When the bottom of T1's secondary is positive, TR2 will be switched ON (circuit via
base-emitter C1) and TR1 will be switched OFF. As the collector current of TR2
increases, that of TR1 decreases.

Current will flow from the +ve rail through the bottom half of T2's primary winding,

g
collector - emitter of TR2 and R3 to the -ve rail.

i n
The changing currents in the primary of T2 results in an output which is an

n
amplification of each half of the input signal.

a i
This is then operating in Class AB conditions, being a compromise between the

r
low distortion, low efficiency Class A amplifier and the higher efficiency, higher Figure 101: BISTABLE MULTIVIBRATOR

f T
distortion Class B amplifier.

o
Operation

g
MULTIVIBRATORS

y n
When the DC supply is switched on then, because of the slight differences in

r r i
These are transistor switching circuits of two stages with the output of one stage manufacture, one transistor will conduct more than the other. This causes say, TR1

a
to switch fully on while TR2 switches off.

t
being fed back to the input of the other by coupling resistors or capacitors. The

e
output of one is 'high' the other is low' and this occurs alternatively producing a

i e e
square wave output. There are three basic types: At this point TR1 collector voltage is low (high voltage drop across R3), there is

r n
therefore "insufficient voltage to drive current through R1 to the base of TR2. TR2

p i
1. Astable or free running multivibrator remains off and its collector voltage being high there is current flow through R2 to

o g
2. Bistable or flip-flop maintain TR1 switched on. The output at Q is high (logic state 1) and the output at

r n
3. Monostable or 'one shot' Q is low (logic state 0).

P S E
Figure 102 shows the basic circuit of a Bistable Multivibrator. By applying a positive signal to the base of TR2 via R6 (shown on the diagram as a
switch but in a practical circuit would be a temporary input signal) TR2 would

A
conduct, causing its collector voltage to fall to a low value (lower than 0.6v). TR1
base current ceases and TR1 switches off, its collector voltage rises to a high value

M
and this is fed through R1 to the base of TR2 keeping it switched on. Q is therefore
low (logic 0) and Q is high and therefore at logic state 1.

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Each transistor can be made to flip to a high collector voltage or 'flop' to a low
collector voltage changing the outputs on Q and Q . The switching can also be When TR1 conducts, its collector voltage falls to a low value and since capacitor C1
cannot change its charge instantaneously there is no change of capacitor voltage
achieved by applying a negative voltage to the base of the transistor that is during the rise of conduction of TR1.
conducting.

g
Therefore the fall of collector voltage at TR1 causes TR2 base to fall by the same
The inputs R & S would be supplied by a trigger pulse and this circuit is the basis

n
amount causing TR2 to cut off, causing TR2 collector voltage to rise.

i
of the SR flip-flop Q = 0, Q = 1 = reset condition; Q = 1 Q = 0 set condition.

n
This multivibrator produces a continuous stream of almost square wave pulses, i.e.

i
These are used in memory circuits and binary counters in digital computers.
it is a square wave oscillator. It requires no input trigger and is sometimes called a

a
relaxation oscillator.

r
ASTABLE MULTIVIBRATOR

f T
When the supply is connected as before one transistor conducts faster than the It is extensively used for producing timing (clock) pulses for digital systems.

o
Remember, everything in computing works in synchronisation with a (very fast)

g
other (due to slight manufacturing differences) and cuts the other one off. In this
electronic clock.

y
multivibrator each transistor then switches automatically to its other state and then

r i n
back to its first state, producing an output of square wave pulses.

t a e r
Action

i e e
With reference to figure 102. Assume that TR2 ON and TR1 OFF. The base of TR1

r i n
is negative at the moment, but is approaching cut on (base voltage going positive)

p g
on a time constant determined by C2R2.

r
P So E n
M A
Figure 102: ASTABLE MULTIVIBRATOR
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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

MONOSTABLE VIBRATOR
The JK Flip-Flop
Figure 103 refers. Again, when the supply is switched on the circuit settles into the
state TR1 OFF and TR2 ON, therefore Q = 0. Figure 104 shows the JK flip-flop. Study it for a few minutes and note the layout of
the system including the inputs at J and K.

g
A positive trigger pulse, represented by the switch in the diagram will switch TR1

n
ON, C1 right hand plate falls rapidly switching off TR2 making the output Q go high.

i
Now the capacitor charges up through R1 making the right hand plate go low TR2

n
is switched on again and the Q output goes low.

ra i
o f g T
a r y r i n
i e t e e
n
Figure 104: JK FLIP-FLOP

r i
Figure 103: MONOSTABLE MULTIVIBRATOR

p g
Operation

o
This multivibrator has one stable state and one unstable state. It can be switched

r n
into its unstable state for a certain time (determined by the values of C and R) and Suppose that TR4 is conducting and that TR3 is cut off. Q is at logic 0. If logic 1 is

P S E
then returns to its stable state. It can be used to create a pulse of known timing to applied to J and logic 0 to K, there would be no effect because there would be no
act as a delay circuit in digital systems. change to the diodes D1 and D2. A falling (1-0) signal at T will cause the
transistors to change over in the usual way, so Q now goes to logic 1. However, a

A
The Multivibrators we have seen are using junction transistors, however, they can further falling pulse at T will have no effect on the circuit if J is still at logic 1. It
be constructed using Field Effect Transistors (FET's) logic gates and operational follows, therefore, that a trigger pulse at T will only change the state if the logic

M
amplifiers (to be discussed later). levels at J and K are reversed. From this it can be seen that A TRIGGER PULSE
AT T' WILL ONLY CHANGE THE STATE IF THE LOGIC LEVELS AT 'J' AND 'Q'
ARE DIFFERENT. It also follows that a Logic 0 or a Logic 1 can be stored at J
until a trigger pulse arrives at T, when it will be released at Q.

FLIP-FLOPS
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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

R S FLIP FLOP Operation Q zero volts (Logic 0) and Q six volts (Logic 1).
With reference to figure 105 (circuit and symbol). When power is applied, current-
biasing will be applied to each transistor base-emitter by way of R2-R4 to T1 and A positive pulse at R (RESET) will send the outputs back again to the original
R1-R3 to T2. Although the two 'sides' are identical, mis-matching will mean that condition. So, a pulse at S sets Q at Logic 1 and a pulse at R sets Q at Logic Q.

g
one transistor will start to conduct before the other. If silicon transistors are being
These devices are widely used in storage and timing device circuits.

n
used, 0.6 volts is needed across the base-emitter for switching ON.

i
FIELD EFFECT TRANSISTORS

a i n
There are two basic types of Field Effect Transistors (FET's). A Junction Gate FET

r
(JUGFET) and a Metal Oxide Semiconductor FET (MOSFET)

o f T
JUGFET

y n g
With reference to figure 106. The bar of N-type material provides the medium

r i
through which the majority carriers (electrons) pass. In doing so, they have to pass

a r
between the two sections of P-type material, known as the Gate. The two P-type

t e
sections are usually connected together electrically (so are at the same potential)

e e
and are used as the Control electrode. Current enters at the SOURCE electrode

i n
Figure 105: RS FLIP-FLOP CIRCUIT & SYMBOL

r
and leaves at the DRAIN electrode.

p g i
Suppose that T2 reaches the point of switch-on before T1. When T2 conducts, the

o n
volts drop across R2 becomes almost 6 volts and the T2 collector voltage now

r
applied via R4 to the base of T1 becomes almost zero, forcing T1 into a 'cut-off

P S E
non-conducting condition.

The volts drop across R1 is almost zero and so 6 volts is applied via R3 to the

A
base of T2, keeping it switched hard-on. Under these conditions, the two outputs
are:

M
Q six volts (Logic 1) and Q zero volts (Logic 0).

A positive pulse at S (SET) will cause T1 to conduct and the ensuing volts drop
across R1 will switch T2 off. The two outputs will now be:
Figure 106: JUGFET

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

As in any semiconductor device containing P-N junctions, depletion zones exist at


these junctions. In this device, the P-type gate sections are more heavily doped
than the N-type channel. This results in the depletion zone extending further into -
the channel than it does into the gate.

i ng
a i n
f T r
o g
Figure 107: JUGFET SYMBOLS

r y i n
Note: The opposite arrangement of a P-type channel and N-type gate is also

a r
available. Figure 108: JUGFET SCHEMATIC

e t e e
Operation Since no majority carriers exist in the depletion zones, the width of the channel

i n
through which they can flow is dependent on the size of these zones and hence on

r i
With reference to figure 108. The Drain-Source voltage VDS sets up a current flow the value of VGS. It is in this way that VGS controls the current flow. Under normal

p g
of majority carriers through the channel. The Gate-Source voltage VGS reverse- operating conditions, the gate-channel junction is reverse-biased so that only a

o
biases the gate-channel junction, thus increasing the width of the depletion zones.

n
very small leakage current flows in the gate-source circuit. It has, therefore, got

r
As can be seen in the diagram, these zones are not uniform in shape. This is very high input impedance.

P S E
because the potential gradient between drain and source produces a greater
potential difference between the gate and the channel towards the drain than it
does towards the source. Thus we have characteristic wedge' shaped depletion

A
zones.

M
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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Uses The main difference between this device and the JUGFET is that there is no direct
electrical connection between the gate terminal and the semiconductor material.
The JUGFET can be used as an amplifier or a switch and the next diagram shows Instead they are insulated from one another by a very thin layer of highly insulative
it connected as an amplifier. Its input resistance is very high compared with that of silicon oxide.
a transistor (1 x 1010 compared to 1 to 5k for a transistor). Its output impedance

g
is 50k to 1M compared to a transistors output impedance of 10 50k.

ni n
ra i
o f T
Figure 111: OUTPUT CURVE - MOSFET (N CHANNEL DEPLETION)

r y i n g
The voltage between the gate and the source (VGS) controls the electron

r
concentration in the channel. If the drain (D) is made positive to the Source (S) and

t a e
VGS is zero a current will flow. If VGS is made negative, positive holes are attracted
into the channel so reducing the number of free electrons in the channel and

i e e
therefore channel current decreases. This is known as the DEPLETION MODE. If

r n
Figure 109: JUGFET AMPLIFIER

i
VGS is positive, electrons are attracted into the channel from the P substrate

p
increasing current flow - this is known as the ENHANCEMENT MODE. If a P-

o g
MOSFET channel FET (figure 112) was used in the enhancement mode, the conduction is

r n
by holes.

P S E
Also called an Insulated Gate Field Effect Transistor IGFET. The basic
construction of an n-channel MOSFET and symbol is shown in figure 110.

M A Figure 112: MOSFET & SYMBOL (N CHANNEL ENHANCEMENT)

Figure 110: MOSFET & SYMBOL (N CHANNEL DEPLETION)

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SEMICONDUCTORS (DCAM 4.1 L2)

The MOSFET has a higher input impedance than the JUGFET > 1X1012,
however its output impedance is similar to that of a bi-polar transistor 10 to 50k.
When used as a switch its switching time is very fast.

i ng
a i n
f T r
y o n g
Figure 113: OUTPUT CURVE - MOSFET (N CHANNEL ENHANCEMENT)

a r r i
MOSFET structure is very compact and is widely used in integrated circuits. Great

t e
care has to be taken to protect MOSFETS from electrostatic charges, which could

i e e
break down the insulated oxide layer. They are supplied with a metal clip short

r n
circuiting the leads, which should be left in place until connected in the circuit.

i
Figure 114: CMOS INVERTOR GATE

p g
CMOS (Complementary Metal Oxide Semiconductor)

o
FEEDBACK IN AMPLIFIERS

r n
Feedback is the return of a portion of the output signal of an amplifier back into the

E
This is one of the most important families of logic gates which uses a P-channel

P S
input signal of the same system. There are many variations on this but the
and an N-channel MOSFET to create all the relevant logic gates. An example of an following deals with the broader principles.
invertor gate is shown in figure 114. The great advantage of CMOS is that in both
-9
the HIGH and LOW states the current consumption is very small (1 x 10 A).

A
Power consumption is therefore low and the fan out is high (typically 50). The

M
speed of operation is poorer than TTL.

Figure 115: FEEDBACK AMPLIFIER

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SEMICONDUCTORS (DCAM 4.1 L2)

There are generally two types of feedback - which, incidentally, occurs in all forms
of control systems whether mechanical, electrical, electronic etc., these are a) Improve the stability of the gain. It is less affected by changes in transistor
Positive Feedback and Negative feedback. parameters and temperature changes.
b) Effectively change the input and output impedances.
Positive Feedback c) Reduce 'noise' and distortion.

g
d) Increase bandwidth (see below)

n
When the returned portion of the output signal assists the input signal, it is called

i
Positive Feedback. This causes an increase in the overall gain. It can be many

n
times larger than the gain without feedback, but can also lead to instability and

i
oscillation.

ra
The Gain of an amplifier with Positive feedback is given by:

f T
A
Af

o g
Where,
1 A

r y i n
Af = Gain with feedback

a r
A = Gain without feedback

t e
Feedback

e e
= Feedback fraction =

i
Output

p r i n
It can be seen that, if A equals unity, the gain is infinite and oscillation occurs.

g
r o n
Negative Feedback

P S E
When the returned portion of the output signal opposes or tries to cancel the input
signal, it is called Negative Feedback. This is the most common form of feedback Figure 116: FREQUENCY RESPONSE CURVE

A
(in all control systems), having several advantages and uses.

M
The Gain of an amplifier with Negative feedback is given by:

A
Af
1 A which gives a reduction in overall gain.
Negative Feedback is used to:
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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Frequency Response and Bandwidth electrical energy have been transferred to the coil. At this time the magnetic field
begins to collapse, current now flows to charge up the capacitor, lower plate +ve.
The GAIN of an electronic amplifier is determined by such things as the type of
amplifying device being used and by its associated circuit components. Any Once charged the capacitor discharges in the opposite sense creating a magnetic
particular circuit arrangement will provide maximum gain at a single frequency (or field of opposite polarity.

g
over a narrow band of frequencies) and less gain at all other frequencies. Since

n
many amplifiers are required to provide amplification over a wide range of

i
frequencies it is common practice to provide each amplifier with a graph showing

n
how its gain varies with frequency. This is known as the amplifier's Frequency

i
Response Curve. Figure 116 shows an example.

ra
The Effects of Negative Feedback on Bandwidth

o f T
An amplifier's Gain is generally considered to be adequate as long as it is equal to,

g
or greater than, half the Maximum Power Gain.

y n
(OR)

r i
Figure 117: SIMPLE OSCILLATOR CIRCUIT

r
An amplifier's Gain is generally considered to be adequate as long as it is equal to,

t a
or greater than, 0.707 of the Maximum Voltage Gain

e
This oscillation would continue indefinitely if the circuit had no resistance, but the
coil has resistance, so the oscillations gradually decrease. To maintain the

i e e
The range of frequencies over which this requirement is satisfied is known as the oscillation some energy must be continuously fed into the LC circuit. Most

r i n
amplifier's BANDWIDTH. oscillators are amplifiers with positive feedback which means the feedback is in

p
phase with the input and makes good the energy losses in the oscillatory circuit.

o g
As stated above, negative feedback has the effect of reducing the gain of an

r n
amplifier but it also has the very valuable effect of increasing its bandwidth. Figure

P S E
116 shows graphs of an amplifier's gain and associated bandwidth, both with and
without negative feedback.

A
OSCILLATORS

M
With reference to figure 117 assume the capacitor is charged from an external
supply.

When the switch is closed the capacitor will discharge, thus changing magnetic
field causes an induced voltage into the coil, the back emf opposes this discharge
and this therefore takes some time. Eventually the capacitor discharges and its

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Radio Frequency Oscillators


The transistor has no moving parts and can switch at very high speeds.
With reference to figure 118, the basic operation of this circuit is as follows.
In switching applications the transistor is treated as a two state device, ie the
Switching on the power supply charges up the capacitor and starts the oscillations. transistor is either fully conducting or cut-off.

g
Feedback is obtained by the changing magnetic field in L1 inducing an emf into L2.

n
Thus emf is applied between the base and emitter, which causes more collector In figure 119, when the input voltage reverse biases the base-emitter junction and

i
current and therefore more current in L1, this continues until oscillation is the transistor is cut-off and acts as an open switch. If the input voltage switches to

n
maintained. a large forward bias the transistor will conduct and act as a closed switch.

ra i
o f g T
a r y r i n
i e t e e
n
Figure 118: OSCILLATOR CIRCUIT

p r g i
The feedback from L2 being enough to draw DC from the supply to make good the

o n
energy losses and keep the oscillation going. So the oscillator converts DC to AC.

r
P S E
For very high frequency stability crystal oscillators are used in the range 1 to 10
MHz.
Figure 119: THE TRANSISTOR AS A SWITCH

A
Audio frequency oscillators using resistors and capacitors are used up to 50 MHz.
Fast switching is desirable and NPN types are preferred because their majority

M
carriers, which are electrons, travel faster than the majority carriers (holes) in PNP
You have already seen the commonest square wave type oscillator, that is the
types.
Astable Multivibrator.
MOSFETS can be used as switches, their switching speed being about ten times
faster than a transistor.
THE TRANSISTOR AS A SWITCH

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

4.1.3(a) Integrated Circuits Silicon is the base material used, as it has a high degree of purity and a
continuous regular monocrystalline structure. A silicon wafer (about 10cm in
INTEGRATED CIRCUITS diameter) is produced onto which hundreds of IC's can be formed.

An integrated circuit (IC) is a complete electronic circuit on a chip of silicon about Figure 122 shows how areas of silicon oxide deposited on the silicon are

g
5mm square and 0.5mm thick. selectively removed. It is basically a photographic process where areas of the chip

n
are masked and then the surface is subject to UV light. The unmasked areas are

i
Figure 120 shows a typical IC cutaway so you can see the silicon chip and the 'eaten' away using a solvent leaving those areas that are required. Finally the

n
leads radiating from it to the pins. The diagram shows a dual in-line package, but unmasked silicon oxide area is removed by etching.

i
circular packages are available.

ra
ICs are assembled this way to allow their fitment to PCBs (Printed Circuit Boards)

f T
etc. Otherwise they would be too small for handling and connection purposes.

y o n g
t a r e r i
r i e i n e
r op n g
Figure 120: IC PACKAGE

P S E
M A Figure 122: IC PRODUCTION 1
Figure 121: SILICON WAFER

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Figure 123 shows how a transistor is made using the diffusion process, i.e. Linear Circuits
exposing the wafer at high temperature to the vapour of boron or phosphorus so
their atoms diffuse through the window producing a 'P' or 'N' type area. Most linear IC's are based on bi-polar transistors but in some cases FET's are
used exclusively or in addition to bi-polar types. The majority of today's linear
integrated circuits use operational amplifiers (op-amps).

ng
OPERATIONAL AMPLIFIERS

ni
A typical op-amp contains twenty transistors as well as resistors and small

i
capacitors.

ra
The chief properties of op-amps are:

o f T
1. Very high open loop gain

g
6 12
2. High input impedance (1 x 10 to 1 x 10 )

y n
3. Low output impedance (typically 1000)

t a r e r i
i e e
Figure 123: IC PRODUCTION - 2

p r i n
Monolithic integrated circuits are manufactured by an extension of the planar

o g
diffusion process. The active elements (transistors), and the passive elements

r n
(diodes, resistors and capacitors) are all created by modifying the conductive

P S E
properties of the silicon.

Integrated diodes are made by forming a P-N junction similar to that previously

A
described. Integrated resistors are thin layers, the resistance being defined by the
length and width of the layer. Integrated capacitors are made by using the

M
capacitance of reverse biased P-N junctions.

There are two broad types of IC

1. Linear (analogue)
2. Digital (logic) Figure 124: CIRCUIT - OPERATIONAL AMPLIFIER

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SEMICONDUCTORS (DCAM 4.1 L2)

i ng
i n
Figure 127: SYMBOL

ra
Figure 125: SYMBOL With the I input grounded and an input at N1, causes a voltage of the same polarity

f T
to appear at the output.

o g
With reference to figure 126, the basic op-amp has one output and two inputs. The
When signals are applied to both input terminals the output is the difference

y
NON-INVERTING (NI) input is marked + and the INVERTING (I) input is marked -.

r i n
In the diagram point E is the common reference for the input and output volts. The between to the two inputs, i.e. two identical signals will produce zero output. The

r
op-amp is basically a differential amplifier.

a
DC power supply is typically 5V to 15V with 0V being the reference level.

e t e e
With the Nl input grounded (chassis potential), an input at I, causes a voltage of

i
opposite polarity to appear at the output.

p r g i n
r
P So E n
A
Figure 128: OP-AMP SYMBOL

M Figure 126: BASIC OP-AMP CIRCUIT


Although the power supplies positive and negative are shown in the basic op-amp
symbol they are usually omitted on wiring diagrams.

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Most op-amps use negative feedback, i.e. feeding some of the output back to the The circuit shown produces an output which is proportional to the difference
inverting input. The coupling between the stages is direct coupling. In practice between the two inputs. If RS = RF then Vout is equal to the difference in input
even when dc bias conditions are met and no input signal is applied, there may be voltages. If RF and RS have different values then the circuit gain (A0) = RF/RS
a small voltage at the input, called the differential input offset voltage. It may be In general the output is
caused by different manufacturing tolerances of the components of the op-amp.

g
This offset voltage produces a voltage at the output (with no input signal V0 = A0(V2 V1)

n
remember) and in certain applications is undesirable. For the 741 op-amp this is

i
achieved by placing a variable resistor across the offset null pins (1 and 5) and

n
adjusting it until the output is zero when the input is zero.

a i
In AC operation a coupling capacitor at the output removes any DC component

r
caused by the offset voltage. Slew rate is the maximum rate of change of large

f T
amplitude output voltages that an op-amp can allow before it behaves non-linearly,

o
it is measured in volts per micro-second (V/s).

y n g
As previously stated the op-amp is basically a differential amplifier so it is useful to

r r i
look at its operation.

e t a e e
p r i i n
r o n g
P S E
A
Figure 129: DIFFERENTIAL AMPLIFIER

M
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

4.1.3(b) Integrated Circuits

LOGIC CIRCUITS

There are two main types of logic circuit:

ng
a) TTL (Transistor Transistor Logic)

i
b) CMOS (Complimentary Metal Oxide Semiconductor)

i n
The following shows the scales of integration which refer to the number of gates

a
contained in a single package:

f T r
Small scale integration (SSI) containing not more than 11 gates Figure 131: TTL 'NAND' GATE

o
Medium scale integration (MSI) -containing up to 100 gates

g
Large scale integration (LSI) -containing between 100 - 1000 gates Figure 131 shows a two input NAND gate which uses a multiple emitter NPN

y n
Very large scale integration (VLSI) containing over 1000 gates transistor. If both inputs to T1 are high, then no current flows from the base to the

r i
emitter. Current does flow through the base collector circuit to switch on T2. The

a r
output F is near zero volts. If either input A or B go low then T1 conducts, this

t
The following diagrams show some TTL and CMOS gates.

e
causes current flow from collector of T2 (positive charges) through T1 to ground

e e
which switches T2 off and the output goes high.

p r i i n
r o n g
P S E
M A Figure 132: CMOS 'NOR' GATE
Figure 130: TTL 'AND' GATE

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Speed of operation - the time that elapses between the application of a signal to an
input terminal and the resulting change in the logical state at the output terminals.

Fan in - number of inputs coming from similar circuits that can be connected to the
gate without adversely affecting its performance.

ng
Fan out - the maximum number of similar circuits that can be connected to it's

i
output terminals without the output falling outside the limits at which logic levels 1

n
and 0 are specified.

a i
Noise margin - this is maximum noise voltage (unwanted voltage) that can appear

r
Figure 133: CMOS 'NAND' GATE at it's input terminals without producing a change in output state.

o f T
Properties of TTL and CMOS Power dissipation - as in any circuit, supply voltage multiplied by the current

g
(Power = V x I) gives the power in the circuit and this heat must be dissipated.

r y i n
TTL uses bi-polar transistors along with diodes and transistors formed to

r
Typical figures for TTL and CMOS are shown below.

a
microscopic dimensions on a slice of silicon (chip). TTL must have a steady 5V DC

t e
supply, while CMOS will work on DC voltages between 3 and 15V and usually
Speed of Fan Fan Noise Power

e e
requires much less power. CMOS uses uni-polar Field Effect Transistors (FET)

i
with metal-oxide-silicon technology; this lends itself to VLSI as they take up less Operation in out margin dissipation

r i n
room on a chip, compared to the TTL. CMOS has much higher input impedance. Standard
9nS 8 10 0.4V 40mW

p
TTL

o g
One important point with CMOS is that if static electric charges are allowed to build CMOS 30nS 8 50 1.5V 0.001mW

r n
up on it's input pins, these voltages can break down the thin layer of silicon oxide

P S E
insulation between the gate and the other electrodes of MOSFET's and this will If you look back at the diagrams for the TTL AND gate and the TTL NAND gate
destroy the 1C. So antistatic protection is important. you will see that the NAND gate uses fewer components and is therefore cheaper
to produce.

A
Gate operating parameters include:
This also applies to the NOR gate, i.e. it is cheaper to produce than the OR gate.

M
a) Speed of operation
b) Fan in
c) Fan out
d) Noise margin
e) Power dissipation

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

NAND gates can be connected together to form any of the other basic gates - thus
reducing production costs by manufacturing one gate only. The following drawings Figure 135 shows the pin connections of IC's for different gate configurations.
show how these gates can be formed. There is no need to remember them but it does give a good idea of how the chip
(with the gates in) is connected - although the chip itself is so small that it looks like
a piece of silver metal 4 or 5mm square.

i ng
a i n
f T r
y o n g
t a r e r i
r i e i n e
r op n g
P S E
M A
Figure 134: USE OF NAND GATES
Figure 135: IC PIN CONNECTIONS
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

IC's are made which also perform the function of encoding, decoding, performing S R Q Q
binary addition (adders) and multiplexers.
1 0 1 0
In sequential logic circuits flip-flops are extensively used all of which are 0 1 0 1
manufactured on IC's. 0 0 Depends on state before inputs applied
1 1 Indeterminate

ng
The SR Flip-Flop

i
So basically the flip-flop can exist in two stable states:

n
The SR flip-flop has two output terminals Q and Q. Figure 136 shows the SR flip- Q = 1 ( Q = 0) or Q = 0 ( Q = 1)

i
flop using NAND gates. Clocks

ra
In sequential logic circuits where there may be a large number of flip-flops, it is
important they all act at the same time, so no circuit operates out of sequence.

o f g T
This is achieved by a CLOCK pulse from a high frequency pulse generator. The

y
circuits may be triggered when the clock pulse changes from 1 to 0 or when it

r i n
changes from 0 to 1 (edge triggered) or when the level is 1 or 0. Figures 137 and

a r
138 shows a clocked SR flip-flop and its truth table.

e t e e
Figure 136 THE SR FLIP-FLOP

r i i n
With reference to figure 136:

p g
When S =1 R=0 Q=1 Q = 0 the flip-flop is SET

r o n
When S = 0 R=1 Q=0 Q = 1 the flip-flop is RESET

P S E
When S = 0 R=0 then no change occurs Q and Q will be what they were
before. Figure 137: CLOCKED SR FLIP-FLOP

M A
When S = 1 and R = 1 then Q = 1 and Q equals 1. The circuit is stable while S =
R = 1, but if they are changed simultaneously from 1 to 0 then due to different
switching times of the gates we cannot predict whether Q or Q will be 1.
The output state is said to be indeterminate so S = R = 1 should not be allowed to
occur. The truth table is shown.

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SEMICONDUCTORS (DCAM 4.1 L2)

OUTPUTS OUTPUTS
DURING
BEFORE AFTER
INPUTS CLOCK
CLOCK CLOCK COMMENTS
PULSE
PULSE PULSE

ng
S R A B Q Q Q Q

i
0 0 1 1 1 0 1 0

n
NO CHANGE IN OUTPUTS

i
0 0 1 1 0 1 0 1
1 0 0 1 1 0 1 0 FLIP-FLOP SETS WITH Q = 1

ra
1 0 0 1 0 1 1 0 &Q=0
Figure 139: CLOCKED D TYPE FLIP-FLOP

f T
0 1 1 0 1 0 0 1 FLIP-FLOP RESETS WITH Q

o
=1&Q=0 OUTPUTS BEFORE OUTPUTS AFTER

g
0 1 1 0 0 1 0 1 INPUT
CLOCK PULSE CLOCK PULSE

y
1 1 0 0 1 0 1 1 THIS INPUT IS NOT

r i n
1 1 0 0 0 1 1 1 ALLOWED D S R Q Q Q Q

a r
0 0 1 1 0 0 1

t e
Figure 138: TRUTH TABLE - CLOCKED SR FLIP-FLOP 0 0 1 0 1 0 1

i e e
1 1 0 1 0 1 0

n
D Type SR Flip-flop

r
1 1 0 0 1 1 0

p g i
This is a modified SR flip-flop. The D stands for Delay. If you look at the truth table, Figure 140: TRUTH TABLE CLOCKED D TYPE FLIP-FLOP

o n
when the clock pulse changes (rises), whatever is at D is transferred to Q, when

r
clock pulse falls Q stays at that level. NO MATTER WHAT IS APPLIED TO D, Q

P S E
will only change state at the next clock pulse. The truth table shows that the output
equals the input one clock pulse earlier, i.e. the data is held back until the clock
pulse = 1.

M A
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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

JK Flip-flop The two inputs are called J and K and the operation is described in the truth table.
J = K = 1 is allowed (unlike S = R = 1 in a SR flip-flop) and toggles (changes state)
Figures 141 and 142 show the layout and truth table of the JK flip-flop using NAND when this input is applied.
gates.

i ng
a i n
f T r
y o g
Figure 141: JK FLIP-FLOP

n
OUTPUTS

t a r e
OUTPUTS

r i
e e
DURING
BEFORE AFTER

i
INPUTS CLOCK

r n
CLOCK CLOCK

i
PULSE COMMENTS

p
PULSE PULSE

o n g
J K Q Q A B Q Q

r E
0 0 1 0 1 1 1 0

P S
NO CHANGE IN OUTPUTS
0 0 0 1 1 1 0 1
1 0 1 0 1 1 1 0 STAYS AT OR SET TO Q = 1

A
1 0 0 1 0 1 1 0 &Q=0
0 1 1 0 1 0 0 1 STAYS AT OR SET TO Q = 1

M
0 1 0 1 1 1 0 1 &Q=0
1 1 1 0 1 0 0 1
TOGGLES
1 1 0 1 0 1 1 0

Figure 142: TRUTH TABLE JK FLIP-FLOP

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Shift Registers, which store a binary number and shifts it out when required usually
consist of a number of flip-flops and manufactured in IC's as are counters and
memories.

The Astable, Monostable and Bistable multivibrators are also manufactured on IC's

g
using op-amps as the diagrams below.

ni n
ra i
o f g
Figure 143: ASTABLE MULTIVIBRATOR

T
a r y r i n
i e t e e
p r g i n
o n
Figure 144: MONOSTABLE MULTIVIBRATOR

r
P S E
M A
Figure 145: BISTABLE MULTIVIBRATOR

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

OPERATIONAL AMPLIFIERS
With reference to figure 148 the op-amp compares V1 to Vref. When V1 is slightly
Op-amp as an Inverting Amplifier greater than Vref the op-amp saturates in one direction and when Vref is greater
than V1 it saturates in the other direction. It is therefore behaving as a two-state
With reference to figure 146, the input voltage V1 is applied to the inverting digital device with V0 switching from high to low, i.e. comparing voltages. When fed

g
terminal via resistor R1. The non-inverting input is grounded. Feedback is applied with an ac input the op-amp in its saturated condition is converting a continuously

n
from the inverting input via R2 which because of the inversion of the amplifier acts varying analogue signal into a two-state digital one, i.e. converting a sine wave into

i
as negative feedback. Output is of opposite polarity to input. a square wave.

a i n
f T r
y o n g
a r r i
Figure 146: OP-AMP INVERTING AMPLIFIER

e t e e
Figure 148: SIMPLE COMPARATOR

p r i i n
r o n g
P S E
Figure 147: OP-AMP NON INVERTING AMPLIFIER

A
Figure 149: OP-AMP INTEGRATOR

M
Op-amp as a Non-inverting Amplifier

Figure 147 shows a non-inverting op-amp. The input voltage is applied to the non-
inverting input (+) with the inverting input grounded. The feedback resistor is still
connected to the inverting input to obtain negative feedback. Output is the same
polarity as the input.
Op-amp as a Simple Voltage Comparator

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MODULE 4 ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS (DCAM 4.1 L2)

Op-amp as an Integrator Op-amp as a Summing Amplifier (Figure 152). The output voltage V0 is equal to
the inverted sum of the inputs V0 = (V1 + V2 + V3)
The circuit shown (figure 149) is similar to an inverting amplifier but feedback is via
a capacitor. It therefore inverts, amplifies the input signal over a period of time
determined by the values of R1 and C1.

ng
Op-amp as a Differentiator (Figure 150)

ni
This circuit responds only to changes of input Vi. It is only during these input

i
changes that current flows through C1 and Rf. The output is the inversion of the

a
input rate of change.

f T r
y o n g
a r r i
Figure 152: SUMMING OP-AMP

e t e e
Other uses of Op-amps

i n
Figure 150: DIFFERENTIATING OP-AMP

r i
Linear IC's are used in audio amplifiers, radio frequency amplifiers and video

p g
Op-amp as a Voltage Follower (Figure 151) amplifiers, but are of specialised types and require a small number of external

o n
components. Figure 153 shows a radio frequency amplifier.

r
This is a special case of the non-inverting amplifier in which 100% negative

P S E
feedback is applied by connecting the output directly back to the inverting terminal.
This effectively gives a situation where the output voltage follows the input and
almost exactly equals it. It has extremely high input impedance and low output

A
impedance and its main application is for impedance matching, i.e. to act as a
buffer amplifier.

M Figure 153: RADIO FREQUENCY AMPLIFIER


Figure 151: VOLTAGE FOLLOWING OP-AMP
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Page 67
DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
PRINTED CIRCUIT BOARD (DCAM 4.2 L1)

4.2 Printed Circuit Boards (DCAM Ref. 4.2) Level 1


In this technique metallic foil is bonded onto a base board made from insulating
material, and a pattern is printed onto the foil and chemical etching on to the foil
forms a series of current conducting paths. The components are then mounted to

g
the board and soldered to the appropriate points to make-up the circuit required.

n
The boards are usually made-up of layers of phenolic resin impregnated paper, or

i
epoxy resin impregnated glass-fibre cloth.

i n
The thickness of the boards depends in the strength and stiffness required. The

a
boards are manufactured in three basic configurations:

f T r
These boards contain all printed conducting

o
1. Single layer - paths on one side with the components mounted

g
Figure 154: MAKE UP OF PCBs
on the opposite side

y n
These have printed conducting paths on both

r i
The layered sheets are bonded in a hot press. The heat during the pressing

r
2. Multilayer - sides and the components may also be mounted

a
operation melts the resin in the base material so that it flows and fully wets the

t
on both sides

e
material and the copper foil. As polymerisation of the resin mix proceeds, each
These boards are many thin boardslaminated

e e
layer of base material reaches the fully cured state with the copper foil is bonded to

i
3. Multilayer sandwich - together with the components mounted on one

n
it. When cooled each board is trimmed to the required size, inspected and packed

r i
or both external sides in polythene bags.

op g
The most commonly used conducting material is copper foil. To bond the copper to

n
Next a master diagram must be produced to show clearly the conductor pattern (a

r
the board, copper foil sheets are cut to the size of the board and steel separate sort of wiring pattern) required and where the components are to be located. This

P S E
plates are interposed between the layers as shown in figure 154. is usually done by computer aided design techniques.

M A
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Page 68
DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
PRINTED CIRCUIT BOARD (DCAM 4.2 L1)

The printing process may be by the etching or additive process. In the etching
process the copper foil is cleaned and coated with a photo-sensitive solution In mass soldering all joints are soldered simultaneously by bringing the board into
known as a 'resist', this solution has the property of becoming soluble when contact with an oxide free surface of molten solder, which is contained in a special
exposed to strong light. The master diagram is then placed over the board and bath. The solder specification for mass soldering is 60/40 tin/lead. To prevent
exposed for a time in a printing machine. The resist is washed away to leave the oxidation a flux is used and in the automated mass soldering system a fluxer unit is

g
resist etched away around the circuit pattern. The board is then placed in a bath of incorporated, removal of any flux residue is by solvents.
ferric chloride to etch away all the unprotected copper.

ni n
ra i
o f g
Figure 155 ETCHING PROCESS
T
r y r i n
An alternative process is the additive method. In this process the copper is

a
t e
deposited only in the areas where conductors are required. Again the board is

e
coated with a photo resist solution. A negative of the master diagram is then

i e
screen printed onto the board, exposing the areas for the conductor layout. These

r i n
exposed areas are chemically activated and the whole board is immersed in a

p g
copper plating solution, when the required thickness is obtained the board is

o
withdrawn from the solution. Figure 157: TYPICAL DOUBLE SIDED PCS

r
P S E n
M A Figure 156: ADDITIVE PROCESS
Figure 158: BOARD COMPONENTS
The components are soldered to the board by two main methods (a) by hand, (b)
mass soldering.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
PRINTED CIRCUIT BOARD (DCAM 4.2 L1)

Flexible printed wiring circuits are available and usually serve as a means of
interconnecting units and are basically copper foil conductors bonded to a base of RANGE WHERE DAMAGE CAN
TYPE OF DEVICE
thin flexible insulator (polyester, epoxy glass cloth and polyimide) and covered with OCCUR (V)
the same material. MOSFET 150 TO 1,000
CMOS 250 TO 1,000

g
Printed circuit boards are widely used in components on a modern large transport BIPOLAR TRANSISTOR 4,000 TO 15,000
aircraft. When removing or replacing these boards strict precautions must be

n
SILICON CONTROLLED RECTIFIER

i
observed. 4,000 TO 15,000
(SCR)

n
THIN FILM RESISTORS 150 TO 1,000

i
The reason for this is that the static electricity or charge that we have in our body

a
can cause serious damage to the software of the components on the boards. The

r
Figure 160: TABLE OF VOLTAGE SENSITIVITY
table shows typical electrostatic voltages that may be developed.

f T
To identify components fitted with ESD's a symbol is used on the line replacement

o
ELECTROSTATIC VOLTAGES

g
unit (LRU) and associated documentation, transport bags etc.
MEANS OF STATIC GENERATION RELATIVE HUMIDITY (%)

r y i n
10 TO 20 65 TO 90 To overcome the static discharge problem the person removing the PCB must use

a r
WALKING ON CARPET 35,000 1,500 a conducting wrist strap which is connected to a convenient grounding point on the

t e
WALKING ON VYNIL FLOOR 12,000 250 aircraft and the person, to initially discharge any energy within the body.

e e
WORKING AT BENCH 6,000 100

r i n
VINYL (PLASTIC) DOCUMENT

i
7,000 600
ENVELOPES

p g
POLY BAG PICKED FROM BENCH 20,000 1,200

r o n
CHAIR PADDED WITH
18,000 1,500

E
POLYURETHANE FOAM

P S
Figure 159: TABLE OF TYPICAL ELECTROSTATIC CHARGES

A
If we were to touch the edge connectors or some other exposed metal part then a

M
surge of current due to the difference in potential between our body and the PCB
would cause damage to the components. The following table lists static sensitive
devices and voltages that can cause damage. These devices are often referred to
as ESD's (electrostatic sensitive devices).

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Page 70
DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
PRINTED CIRCUIT BOARD (DCAM 4.2 L1)

If you are removing the complete LRU then it is important you do not touch the
connector pins and place dust caps on all connectors.

REMEMBER STATIC DISCHARGE CAN CAUSE DAMAGE!

i ng
a i n
f T r
y o n g
t a r e r i
r i e i n e
r op n g
Figure 161: BSD DECALS AND WARNINGS

P S E
When removing an BSD PCB (or any PCB for that matter) electrical power is
removed, the wrist strap is connected to the ground (there is usually a convenient
point nearby on the aircraft), attach strap to your wrist and remove the PCB using

A
the extractors provided. Place the PCB immediately into a special conductive bag

M
(designed for ESD components) and identify with a label, do NOT use staples or
adhesive tape. Remove wrist strap if not immediately refitting a new PCB. Do not
forget any documentation such as JAA form 1 etc.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

4.3 Servomechanism (DCAM Ref. 4.3) Level 1 Closed Loop Control System

4.3(a) Servomechanism If we observe what the load is doing and make appropriate corrections at the input,
the system is no longer open loop; it is now, in effect, a closed loop system, the
Open Loop Control System human operator completing the loop between output and input. He/she compares

g
the desired effect with the actual effect and adjusts the system so as to reduce the
error between them. He/she is thus, in this connection, an 'error detector, and the

n
Suppose that we wish to control the position of a radar scanner. Suppose also that

i
we have a motor capable of driving the scanner and some means of controlling the amount of error which the person observes determines how adjustments are made

n
motor. Such an arrangement is illustrated in figure 164. to the input to produce the desired results.

a i
However, to measure the error and take the necessary correcting action, we have

r
'built in' the human operator as an essential element. A more effective and efficient

f T
control can be obtained by replacing the human operator with an automatic control

o
system. The response of the automatic system is generally quicker and more

g
accurate than that of a human operator, and the automatic arrangement is not

y n
subject to fatigue. In addition, of course, the automatic system gives a saving in

r i
Figure 162: OPEN LOOP CONTROL SYSTEM
manpower.

t a e r
The control element controls the magnitude and direction of the input to a power
amplifier, whose output drives the motor at the desired speed in the required The essential features of the closed loop system are as follows:

i e e
direction. The motor, in turn, moves the load in accordance with the input demand.

r n
The feedback of information concerning the behaviour of the load.

i
The comparison of this information with the behaviour demanded by the input.

p
The control element could be calibrated with a scale indicating the required

g
The production of an error signal proportional to the difference between the

o
position of the load. Then when we set the control dial for the required position, we

r n
hope that the load (possibly unseen) is doing what we are telling it to do. desired behaviour and the actual behaviour.

E
The amplification of the error signal to control the power into a servomotor.

P S
In practice, however, the accuracy of control is limited because there are several The movement of the load by the servomotor in such a direction as to reduce
factors, other than the input, that affect the output (e.g. variations in the output the error signal to zero, at which point the output is the same as that

A
load, in the amplifier characteristics or in the motor circuit). We have no means of demanded by the input.
controlling these variations in the open loop system and, because of the resulting

M
inaccuracy; open loop systems are hardly ever used.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

The block schematic diagram of a basic closed loop control system is illustrated 4.3(b) Servomechanism
below. In this arrangement:
Practical Closed Loop Control System
I is the input demand, which in this case is in the form of a shaft angle.
0 is the output shaft angle of the load. The input demand I sets the angle of the transmitter (CX) rotor. The resulting
The control element converts the demand I into some form suitable for

g
alternating field in the control transformer stator induces a voltage in the
operation of the error detector, e.g. produces a voltage proportional to i. transformer rotor and this voltage is fed as an error or misalignment signal to the

i n
The feedback element does the same for the output angle 0, e.g. produces a amplifier. The amplifier output is used to drive an ac servomotor that turns the
voltage proportional to 0. output shaft and also the rotor of the control transformer through output angle 0.

a i n
f T r
y o n g
t a r e r i
r i e i n e
Figure 163: CLOSED LOOP CONTROL SYSTEM

p g
Figure 164: PRACTICAL CLOSED LOOP SYSTEM

o n
The error detector has two inputs applied to it, one due to I and the other due

r
to 0; it produces an error signal e proportional to the difference between the

E
When the output shaft is turned into alignment with the setting of the input shaft (0

P S
two inputs, i.e. (I - 0). = I) the transformer rotor is at right angles to the transmitter rotor and its own
The error signal operates the amplifier which, in turn, causes the motor to stator field. In this position there is no error signal induced in the transformer rotor,
rotate until 0 equals I (output equals demand); at this point the error signal is

A
there is no input to the amplifier or servomotor, and the motor stops. The output
zero and the drive from the motor ceases, the output load having taken up the has now taken up the position demanded by the input.

M
position demanded by the input.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

Servomechanisms Types of Servo


There are two main classes of servomechanism - remote position control (rpc)
To be classed as a servomechanism, an automatic control system must have: servos and speed control servos.

a) Error actuation. a) RPC servos These are used to control the angular or linear position of a

g
b) Power amplification. load.
c) Closed loop control. b) Speed Control Servos These are used to control the speed of a load. In this

i n
d) Continuous operation, or 'follow-up' properties, i.e. if the load is disturbed from case, the speed of the driving motor is made proportional to the input demand

n
the demanded position, it always tends to return usually a voltage).

i
to it.

a
Two types of input to a servo are:

r
The system is said to be error-actuated because it is the error between the output

f T
demanded by the input and the actual output which starts the action. The final net 1. STEP INPUT - created when the input shaft is suddenly

o
input to the amplifier is the error signal and not the input demand. rotated from one angular position to another.

g
2. RAMP INPUT - created when the input shaft is rotated at a

y n
We must have torque amplification to be able to drive heavy loads. The servo constant angular velocity.

r i
therefore contains an amplifier that supplies the necessary driving power to the

a r
servomotor; the motor provides the required torque.

i e t e
The servo also has a closed loop system;

e
p r i n
Error detector - amplifier - motor and load - error detector...

r o n g
Finally, continuous operation is assured in a servomechanism because any

E
variation in the output from that demanded by the input automatically produces a

P S
difference between output and input, and hence an error signal. The error signal Figure 165: STEP INPUT
again starts the correcting action.

A
A servomechanism has many applications, covering a wide range of power

M
requirements.

Figure 166: RAMP INPUT


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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

PERFORMANCE OF SERVOMECHANISMS require it to be stationary. Further, since there is nothing to stop it, it keeps moving
past the required position.
Response
The error signal produced, and, therefore, the torque applied to the load, now
The response of a servo is the pattern of behaviour of the load when a change is reverses in sense to slow down the load. Since, however, the components operate

g
made to the input condition. It has so far been assumed that if the input moves to symmetrically about the null, the pattern of deceleration is a mirror image of the
i the load will simply follow, its response being a reproduction of the input original acceleration.

i n
movement.

n
The load stops when it has overshot by the initial error, and from there the

i
The paragraphs that follow will show that matters are not as simple as this. performance is repeated. The resulting load oscillation about the demanded

a
position is illustrated graphically in figure 168.

f T r
y o n g
t a r e r i
i e e
Figure 167: SIMPLE SERVOMECHANISM

r n
Figure 168: RESPONSE TO A STEP INPUT - NO FRICTION

p g i
Step Input - No Friction
Ramp Input - No Friction

r o n
For this discussion we will assume that the input and output were aligned at 0,

E
The description of the response can be followed in the diagram. In the early states

P S
until the input suddenly changes to i. An error signal proportional to 0 - i
of the ramp, while the error signal is small, the load accelerates slowly and lags
appears at the amplifier input and the motor is energised to null the error.
behind the input.

A
One important point must now be emphasised. The torque delivered by the motor
The error signal grows as the lag increases, building up the acceleration.
to the load is directly proportional to the error; it acts only on the inertia of the load,

M
Eventually the load speed equals the input speed but since a substantial position
which therefore accelerates at a rate proportional to the error. As the error
error exists it continues to accelerate.
reduces so the acceleration reduces, until it reaches zero with zero error.
When its speed exceeds that of the input the position error starts to decrease; the
But this is not a satisfactory state of affairs, for the load acceleration is in one
acceleration reduces and the load reaches a constant speed at zero position error
sense only and that to increase its velocity. Saying that the acceleration is zero at
with no error signal.
zero error simply means that the load has reached a steady speed when we

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

The load speed, however, exceeds the input speed and an overshoot results. That Steady State Errors
the outcome is a continuous oscillation can be easily imagined from this point.
Examination of the various restraints present would show that their effect is in part
due to a small constant magnitude force known as coulomb friction and in part to
viscous friction that increases with speed.

g
Coulomb friction is that part of the frictional force that is independent of speed, e.g.

i n
a shoe on a brake drum.

i n
The resistance due to coulomb friction tends to degrade the sensitivity of a servo,

a
for a torque that overcomes it must: be generated before any movement of the

r
Figure 169: RESPONSE TO A RAMP INPUT - NO FRICTION load takes place. To provide this torque the load error must reach some finite size,

f T
and any errors less than this will not be corrected. Figure 170 shows the effect of

o
Effect of Restraints coulomb friction on the response to a step input.

y n g
The oscillatory responses are obviously not desirable, and luckily, restraints on the The load comes to rest somewhere within a band of error, known as the dead

r i
space, the width of which depends on the amount of coulomb friction. For most

r
load have a stabilising effect. Various inherent factors are to oppose the load

a
movement; they include static friction, kinetic friction, eddy currents, air resistance, modern servos the coulomb friction is very small, and its effect is often neglected.

t e
viscous lubricants and many others.

r i e n e
Lumping them all together for the moment the general effect is to reduce the

p i
amplitude of each successive swing until gradually the output becomes steady.

g
The oscillations are known as transients and they are effective during the transient

r o n
response period, or settling time. Once the .output has settled it has reached the

E
steady state.

P S
While restraints are beneficial in stabilising, or damping, the response, they do

A
have certain detrimental effects. One of these is that power is wasted; another is
the introduction of error in the steady state.

M
Figure 170: RESPONSE WITH COULOMB FRICTION TO A STEP INPUT

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

Viscous friction does not produce a dead space in the step input case since it has
no value when the speed is zero. It does however produce a similar effect when Let us assume that the output shaft is driving a load, and that it has taken up a
the ramp input is considered. position which agrees with that demanded by the input shaft (0 = i).

In the steady state the load is moving with constant speed; it is therefore being The error signal is therefore zero, and the servo is stationary in a steady state

g
resisted by viscous friction. An error signal must be produced to overcome this condition.
therefore an error must exist.

The response is illustrated in figure 171 and the error necessary to overcome the

ni n
i
friction is known as velocity lag.

ra
The output shaft rotates at the same speed as the input shaft but lags behind it by

f T
some constant angle. This positional error is velocity lag.

o g
Coulomb friction may be considered small compared with viscous friction during a

y n
ramp input, but, of course, it also contributes to this error. However, the greater

r i
part is due to viscous friction, and since this increases with speed the error is

a r
generally reckoned to vary directly with speed. Figure 172: BASIC RPC SERVO

i e t e e
p r g i n
r
P So E n
M A
Figure 171: RESPONSE WITH VISCOUS FRICTION TO A RAMP INPUT

Response of a RFC Servo to a Step Input (Negligible Coulomb Friction)

Figure 172 shows a basic rpc servo system.


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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

(e) The error signal now increases in the opposite direction ((0 greater than i)
and the motor applies a reverse torque which eventually stops the load and
brings it back to the required position at point e.
(f) Once again, however, the momentum of the load carries it past the required
position and another overshoot occurs at f.

g
The load may thus oscillate about its final required position many times before it

i n
comes to rest; a servomechanism that does this is said to be 'hunting'.

i n
IMPROVEMENT OF TRANSIENT RESPONSE

ra
For many applications the simple servo using its inherent friction for damping is

f T
perfectly adequate. This is usually the case for small position servos, but when

o
large loads are involved the transient response is unsatisfactory.

y n g
Figure 173: RESPONSE CURVE Time and energy is wasted during this period, and bearing wear is increased. It is

r i
evidently desirable to reduce the number of oscillations, and also the response

a r
Now suppose that the input shaft is suddenly turned through a certain angle in time. Two methods commonly employed are described.

t e
order to bring the load into a new position, i.e. an input known as a 'step input' is

e e
applied. The sequence of events is illustrated in figure 173.

(a)

p r i i n
The input demand i is suddenly change to a new value at point a. The

g
output shaft cannot immediately follow this change in demand because of

o n
the inertia of the load. Therefore there is now a difference between 0 and

r
i and an error signal is produced.

P S E
(b) The error signal, after amplification, causes the motor to accelerate in an
attempt to bring the output shaft to the new demanded position. Because of
the inertia of the load this takes time; there is therefore a time lag during

A
which the output angle 0 is changing in response to the change in demand

M
(b in figure (b) above).
(c) As the motor turns the load, the output angle 0 approaches the demand i.
The error signal, which is proportional to (i - 0) therefore decreases but the
driving force remains until 0 equals i at point c; this is the required load
position.
(d) By the time 0 has reached the demanded position, the load has acquired
considerable momentum and consequently overshoots (point d).
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

Viscous Damping Too much extra viscous friction will produce a very sluggish response and the
system is over damped. The degree of damping which just prevents any overshoot
This method is simply a controlled increase of the inherent viscous damping to is known as critical damping.
achieve the required response. One device in use is the eddy current damper as
shown in figure 174. Slightly less damping than this, to allow one small overshoot, is optimum damping

g
which gives the smallest settling time.

i n
Most designs are aimed at this condition.

a i n
f T r
y o n g
t a r e r i
Figure 174: EDDY CURRENT DAMPER

i e e
This simple device consists of a thin disc of metal with high electrical conductivity

r i n
(usually aluminium), which is attached to the output shaft. It spins between the

p g
poles of electromagnets mounted round its periphery. Figure 175: DEGREES OF DAMPING - STEP INPUT

r o n
Eddy currents are induced of magnitude proportional to the field strength and to

E
The effect on the transients for a ramp input can be similarly adjusted to reduce

P S
the disc velocity. These eddy currents set up magnetic fields that act against the optimum damping. A snag arises, however, for any increase in viscous friction also
inducing fields and forces opposing the disc rotation are created. increases the velocity lag.

A
These forces are closely proportional to the disc velocity, and therefore provide Thus to remove the transient oscillations completely a considerable velocity lag
parallels to the inherent viscous forces. Adjusting the current flow to the

M
must be expected. Figure 178 illustrates the response for two degrees of damping
electromagnets can control them. for a ramp input.
Varying degrees of damping can be applied. The next diagram shows some of the
stages, coulomb friction being ignored for simplicity. Using only inherent friction
under damping is achieved.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

Velocity Feedback Damping For a servomechanism, this arrangement is achieved by attaching a tacho-
generator to the output shaft. A tacho-generator is a small ac or dc generator that
This form of damping is similar to viscous friction damping in one respect; the produces a voltage proportional to the angular velocity of the output shaft.
compensation produced is proportional to the velocity, or rate of movement, of the
output shaft. Velocity feedback damping has the advantage, however, that it A suitable fraction of this voltage is fed back to the input of the amplifier in

g
consumes very little power. opposition to the error signal (negative feedback) to provide the necessary
compensation; this is known as velocity feedback damping, because the voltage

i n
fed back is proportional to the velocity of the output shaft.

i n
The aim with velocity feedback is to reduce the net input to the amplifier to zero

a
and then to reverse it before the output shaft reaches its required position.

f T r
If the amount of feedback is correctly adjusted - and this can be done fairly easily

o
by means of a potentiometer - the forward momentum of the load, acting against

g
the reversed torque, causes the load to come to rest just as it reaches the required

y n
position.

t a r e r i
r i e i n e
p
Figure 176: DEGREES OF DAMPING - RAMP INPUT

r o n g
In an rpc servo we are required to move the load from one position to another as

E
quickly as possible without causing instability (i.e. hunting) or wasting power.

P S
We have already seen that a step input applied to a servo causes the servomotor
to apply a torque, which accelerates the load. As the load gathers speed and

A
approaches the desired position we require some arrangement that will 'anticipate'

M
that the load is going to overshoot and so reverse the motor torque before the
desired position is reached.

If the arrangement is adjusted correctly the result is that the load comes to rest just
as it reaches the required position; overshooting and hunting are therefore
prevented.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

The motor accelerates the load and as the input and output shafts come into
alignment, the error falls; at the same time, because the load is now moving
rapidly, a large velocity feedback voltage is applied in opposition to the error
voltage.

g
The net input to the amplifier therefore drops rapidly and then increases in the

i n
opposite direction as the velocity feedback voltage becomes larger than the error

n
signal. A decelerating torque is thus applied to the load before it reaches the

i
demanded position. As the motor slows down, the velocity feedback voltage falls;

a
so also does the error signal because the output and input shafts are coming more

r
into alignment.

o f T
When the required position is reached, the motor stops; velocity feedback is then

g
zero and so also is the error signal, the input and output shafts being aligned.

r y i n
So transient response can be improved in two ways, by applying extra viscous

a r
friction or by velocity feedback. Both increase velocity lag in response to ramp

t e
inputs, but of the two, velocity feedback is preferred since power is not wasted.

r i e n e
Just a re-cap on velocity lag on a servomechanism with a ramp input and velocity

p i
feedback damping.

r o n g
The feedback voltage from the tacho-generator to the amplifier is in opposition to

E
the error signal.

P S In a servo that is being driven at a constant speed there must always be an error
signal to keep the load moving, however this error signal will have to be larger than

A
required as it has to be greater than the velocity feedback voltage. Therefore,

M
velocity lag is greater than required, i.e. greater positional error between input and
output shafts.
Figure 177: VELOCITY FEEDBACK DAMPING
We shall now look at common methods to reduce velocity lag in step input and
The action is illustrated by the graph (figure 177). Initially, when the step input is
ramp input systems.
applied, the output shaft does not move and the full amplified error is applied to the
motor (no velocity feedback since the load is at rest).

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

Transient Velocity Feedback When the speed changes, i.e. damping required, the capacitor charges or
discharges through R to give an output to the amplifier to provide the necessary
This type of damping is often referred to as 'acceleration feedback damping' and is damping.
used in an angular velocity system to reduce velocity lag.
The tacho-generator output is therefore differentiated by CR giving damping only

g
As you can see inserted between the tacho-generator and the amplifier is a when the load speed is changing.
differentiating network.

i n
Phase Advance Damping

i n
Stabilisation of a servomechanism to obtain a good transient response in rpc

a
system and a good steady state response in a velocity system, reducing velocity

r
lag can also be achieved by inserting a suitable network in the input to the

f T
amplifier.

o g
A typical arrangement using a correction network, known as a phase-advance

y n
network is shown in figure 179.

t a r e r i
r i e i n e
p g
Figure 178 TRANSIENT VELOCITY FEEDBACK

r o n
In a speed control servo, the velocity feedback provides damping when transient

P S E
speed changes occur, however when the speed is constant no damping is
required, however the signal is still being fed to the amplifier and causing
excessive velocity lag.

A
The transient velocity feedback system is designed therefore to provide damping

M
during changes in speed, but when the speed is constant, provide no damping and
therefore reduce velocity lag to a minimum.

When the speed of the output shaft is constant, the tacho-generator voltage is Figure 179: PHASE ADVANCE CORRECTION NETWORK
constant, after the initial charging current the voltage across R falls to zero, no
output from the network, no damping to the system, velocity lag reduced.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

In an rpc system when a step input is applied, there is a large error signal, the the error plus a voltage proportional to the input speed minus a voltage
current through R and the charging current through C are in the same direction. proportional to the output speed.
The input to the amplifier is therefore IR + IC (modified error signal), this causes the
servomotor to accelerate rapidly. As the error signal decreases, C commences to If you remember in a velocity feedback system in the steady state i.e. input and
discharge through R, the total current therefore into the servo amplifier is then IR - output shafts rotating at the same speed, the velocity lag was mainly caused by

g
IC. the signal from the output tacho-generator.

i n
By suitable choices of C and R, ie controlling the time constant of the network, it

n
can be arranged that the signal itself becomes zero, before the error signal is zero,

i
providing a retarding torque before the load reaches the required position,

a
overshooting is prevented and stability during the transient period improved.

r
Velocity feedback damping is omitted, the network is doing the same job but is not

f T
introducing velocity lag.

o g
For a velocity control system (ramp input), the network provides damping on the

y n
initial switch 'on' and for any speed change as described for the step input system.

r i
However, at steady state the error is very small indeed and velocity lag is greatly

a r
reduced. So this system by removing velocity feedback damping has reduced

t e
velocity lag, the correction network providing the necessary damping.

r i e n e
Other types of correct network are used, depending upon the response required.

p i
Some rpc servos require only a rapid response velocity lag being unimportant; in

g
other rpc servos, velocity lag must be taken into consideration. In systems

r o n
required to rotate at a constant angular velocity, velocity lag must be reduced to a
Figure 180: ERROR RATE DAMPING

E
minimum. Different combinations of C and R in the network may be used to

P S
produce the desired response.

Error Rate Damping

M A
Another method used to reduce velocity lag in am angular velocity control system
is error rate damping. One possible arrangement is shown in figure 180.

One tacho-generator is mounted on the output shaft and produces a voltage


proportional to the speed of the shaft. A second tacho-generator is mounted on the
input shaft produces a voltage proportional to the input speed. There are therefore
three input signals to the amplifier. The combined input is a voltage proportional to
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

In this system the input tacho-generator is cancelling this signal in the steady state, state the system has very low velocity lag. In the transient state the differentiator
so velocity lag is reduced to a minimum. The position error reducing any velocity will provide the necessary damping signals.
lag that does exist.
At start up rate of change of error signal is high and the input to the amplifier will
In principle, this arrangement seems fine but it is very difficult to get two tacho- be high to accelerate the load. As the input and output shaft speeds come into line

g
generators to give exactly the same output, especially with time. the output of the differentiator opposes the position error signal to provide a
retarding torque before the load reaches the required speed. At steady state the

i n
However a simplification of this arrangement is possible. The two tacho- differentiator output is zero, position error signal reduces velocity lag.

n
generators are producing voltage outputs proportional to input minus output speed,

i
or proportional to the speed of the error signal. The velocity of this error is equal to Integral Control

a
rate of change of error with respect to time. This can be achieved by using a

r
differentiator, i.e. differentiating the error with respect to time. The methods so far described reduce velocity lag, but have no effect on lag and

f T
dead space caused by inherent friction. A common method of dealing with these

o
residual steady state errors is known as Integral Control.

r y i n g
t a e r
r i e i n e
r op n g
P S E Figure 182: INTEGRAL CONTROL

A
The differentiator D (figure 182) acts as previously described for error are

M
damping. The integrator is connected as shown, ie integrating the error signal and
Figure 181 ERROR RATE DAMPING WITH DIFFERENTIATOR feeding into the amplifier. An integrator is a device that takes on input signal and
slowly builds up that input signal on its output.
Therefore by combining the derivative of the error signal and combining it with the
actual error, the net input to the amplifier is a voltage proportional to the error plus
a voltage proportional to speed (input minus output). So therefore in the steady

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

When the servo system reaches its steady state with a small residual error, the
integrator output will have built up to provide an additional signal to drive the load
to the alignment position.

Adjustment of the integrator output can be made to ensure that when the error

g
signal is zero its output is just sufficient to counter inherent friction.

i n
Summary

i n
Most servos in aircraft systems are damped by inherent friction, extra viscous

a
friction or velocity feedback. However in some application, improved sensitivity

r
and reduction of velocity lag are required. The diagram below shows a comparison

f T
of damping methods.

y o n g
t a r e r i
r i e i n e
r op n g
P S E
M A Figure 183: COMPARISON OF DAMPING METHODS

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

SERVOMECHANISM COMPONENTS directly proportional to the speed at which it is driven and whose polarity depends
upon the direction of rotation.
Servomechanisms may be ac or dc operated.
AC Servo Components
DC Servo Components

g
The positional feedback signal may be from potentiometers, synchros, LVDT's,
The positional feedback signal would be from a potentiometer in most cases. The RVDT's. The servo amplifier is a conventional transistorised amplifier with voltage

i n
error detector would be potentiometer circuits or electronic circuits producing an and power amplifiers.

n
error signal proportional to the difference between input and output shaft rotations.

i
The servo amplifiers must produce sufficient power to drive the servomotor; this AC servomotors capable of producing moderately high torque are usually induction

a
power requirement will depend on the system. The power amplifiers used in motors. Induction motors run at a constant speed (related to the frequency of the

r
conjunction with voltage amplifiers (to provide gain) will thus vary in power output. ac supply), but their torque and their direction of rotation can be controlled fairly

f T
easily by the amplified error signal, without the use of complex circuitry.

o
DC servomotors must be capable of being reversed and the torque developed

g
must be proportional to the error signal input. As torque is proportional to the Two-phase and three-phase induction motors are in common use in ac servo

y n
product of the armature current and the field current, the armature current is kept systems; the two-phase type is more usual.

r i
constant, and the torque can be controlled by varying the field current (error

a r
signal).

i e t e e
So separate supplies are used, the armature current being fed from a constant

r n
current source and the field being fed from the servo amplifier. The diagram shows

p i
a de-operated servomotor. Attached to the motor is a servo amplifier, feedback is

g
provided by a potentiometer, the wiper of which is driven by the motor.

r
P So E n
M A Figure 185: TWO-PHASE INDUCTION MOTOR
Figure 184: DC OPERATED SERVOMOTOR
The dc tacho-generator mounted on the output shaft of the servomechanism. It is
small, separately excited dc generator. It will therefore produce a dc voltage that is
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

The two-phase induction motor (figure 185) requires two ac supply voltages 90 Since a torque is being exerted on the rotor it will turn to follow the rotating
out of phase with each other. One phase is fed to the control system and then magnetic field and will continue to do so until the error signal falls to zero. The
through the servo amplifier to one stator winding of the motor; this supply is direction of rotation depends upon the phase of the error-controlled voltage relative
controlled by the error signal. The other phase, known as the 'reference phase', is to the reference voltage and this, in turn, depends upon the sense of the error. The
fed directly to the other phase winding of the motor. torque developed depends upon the magnitude of the error.

g
When the reference phase to one stator winding and the error-controlled phase to

i n
the other winding are both present, a rotating magnetic field is produced; the

n
squirrel-cage rotor follows this field and so rotates.

a i
The direction of rotation depends upon the sense of the error signal, i.e. on the

r
direction of misalignment between input and output shafts of the servo.

o f T
As the misalignment signal passes through the zero error signal position, the

g
phase of the error-controlled voltage reverses and this reverses the direction of

y n
rotation of the motor. When the error is zero, the error-controlled phase voltage is

r i
zero also and no rotating magnetic field is produced; the motor thus stops.

t a e r
The torque developed by the motor depends upon the magnitude of the error

i e e
signal; the greater the error, the larger is the torque.

r i n
FIGURE 186: HYSTERESIS SERVOMOTOR

p
Hysteresis motors may also be used as ac servomotors. A typical arrangement is

g
shown in figure 186. A two-phase supply is required, the reference phase voltage

r o n
being applied to phase windings AA1, and the error-controlled voltage to BB1. At

E
one instant, A will act as a N-pole and A1 as a S-pole; B and B1 will be neutral.

P S
The rotor - a cobalt steel ring - will therefore have a S-pole induced at X and a N-
pole at Y. A quarter of a cycle later, B will act as a N-pole and B1 as a S-pole, A

A
and A1 will be neutral. However, the rotor, which is made of a large hysteresis loop

M
material, will have retained its S-pole at X and its N-pole at Y. So point X on the
rotor is attracted to the B stator winding and Y is attracted to B1.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

Servomotor Construction

The diagram shows a two-phase induction motor, the two phase winding
accommodated in slots in the stator. The rotor is of the squirrel cage construction
generally with aluminium conductors.

g
The stator and rotor slots are skewed, this prevents the reluctance of the rotor to

i n
move away from one of a number of positions where the slots in the rotor and

n
stator are aligned and so ensures smooth torque output.

a i
The ac tacho-generator is used to provide velocity feedback damping in ac servo

r
systems, is mounted on the output shaft so that it rotates at the same speed as the

f T
load.

o g
The ac tacho-generator is usually a drag-cup generator that produces an

y n
alternating voltage of the same frequency as the ac supply. However, the FIGURE 187: SERVOMOTOR CONSTRUCTION

r i
amplitude of the voltage depends upon the speed of rotation; and the phase of the

a r
voltage leads or lags the ac supply depending upon the direction of rotation.

i e t e e
The drag-cup generator has a two-coil stator whose axes are at right angles, as in

r n
a two-phase induction motor. The rotor, however, is a copper or brass cup with a

p i
stationary iron cylinder fitted inside it to complete the magnetic path for the stator.

r o n g
AC is applied to only one stator coil - the primary coil. As the output shaft drives

E
the rotor, voltages are induced in it by interaction with the field produced by the

P S
current in the primary stator. At any instant, maximum voltage is induced in that Figure 188: AC TACHOGENERATOR DETAILS
part of the cup passing through the primary axis.
Maximum circulating (eddy) currents are therefore in this axis, and these currents

A
produce a secondary magnetic field that is at right angles to the axis of the primary

M
field.

This secondary field alternates at the frequency of the supply current but its
magnitude depends upon the amplitude of the circulating eddy currents induced in
the rotor by the primary field; this, in turn, depends upon the speed or rotation.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

The secondary stator winding of the tacho-generator is at right angles to the SYNCHROS
primary axis and so has a voltage induced in it by the secondary field only.
In many cases on modern aircraft it is necessary to transmit information from a
This is the output voltage whose amplitude is proportional to the speed of rotation remote point and transfer this data to control box or instrument. A typical data
and whose phase relative to the reference ac supply depends upon the direction of transmission system used to do this uses 'synchros'.

g
rotation. A typical ac tacho-generator provides a velocity feedback voltage of 0.5V
per 1,000 rpm of the rotor. There are four basic types are:

a) Resolver synchros

ni n
i
b) Differential synchros

a
c) Control synchros

r
d) Torque synchros

o f T
RESOLVER SYNCHROS

y n g
An alternating voltage can be represented by a phasor length r and the angle it

r i
makes with the x-axis.

t a e r
r i e i n e
op g
Figure 190: PHASOR

r
P S E n This is called the POLAR co-ordinates
r

A
We can split this phasor into its two component parts as shown in figure 191.

M Figure 189: DRAG CUP ROTATION

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

i ng
i n
Figure 191 COMPONENTS OF PHASOR

ra
Where x = r cos and y = r sin

f T
These are called the CARTESIAN co-ordinates of the phasor.

y o g
A resolver synchro can convert from polar to Cartesian i.e. feed in an AC voltage

n
Figure 192: RESOLVER SYNCHRO - TWO STATOR & TWO ROTOR

r i
WINDINGS

t a e
and rotate the shaft and it will give two outputs r sin and r cos . It can
Polar to Cartesian

e e
also convert Cartesian to polar i.e. feed in a sine and cosine voltage and it

i
resolves them into a voltage and shaft rotation.

r n
In this mode the rotor winding R3R4 is shorted and we feed our alternating voltage r

p i
onto R1R2. With the system stationary, S1S2 winding is directly opposite so

g
The resolver synchro as shown in next diagram has two windings on the stator at
maximum voltage is induced into it, while stator winding S3S4 is at right angles to

o
90 to one another and two windings on the rotor at 90 to one another.

r n
this supply and no voltage is induced.

P S E
We shall now look at the resolver synchro operation in both modes.
If the rotor is now moved angle then the voltage in S1S2 will fall and that in S3S4
will begin to rise and at 90 rotation the emf induced into S1S2 will be zero and that
induced into S3S4 will be maximum. If this rotation continued than a S1S2 = r cos

A
(cosine waveform) and S3S4 = r sin (sine waveform) will be formed.

M
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Page 90
DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

The amplifier output is fed to a servomotor that is mechanically coupled to a load


and the rotor of the synchro. So the rotor and load are turned, when the rotor
winding R1R2 is at 90 to the stator field there is no emf induced into R1R2 and the
servomotor stops.

i ng
a i n
f
Figure 193: INPUT SIGNAL

T r
y o n g
a r r i
Figure 195: CARTESIAN TO POLAR SYSTEM

e t e e
The rotor winding R3R4 at this time is aligned with the stator field and the voltage

i n
induced will be the resultant of the input voltages Vx and Vy

p r g i
o n
Figure 194: COS & SIN OUTPUT SIGNALS

r
P S E
So by rotating the rotor an angle we have split the input voltage into its two
Cartesian components.

A
Cartesian to Polar

M
Figure 196: PHASOR DIAGRAM
Note here the cosine voltage (r cos ) is applied to the stator winding S1S2 while
the sine voltage (r sin ) is applied to the stator winding S3S4. These two voltages
The voltage output and the angle the rotor has turned through represent the polar
produce fields in the stator that combine to form one field that cuts the rotor
co-ordinates.
windings R1R2 and R3R4. The emf induced into R1R2 is fed to an amplifier.
The resolver synchros are used in aircraft instruments and navigation systems.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

DIFFERENTIAL SYNCHROS

These are used as an additional synchro (TDX or CDX) inserted between a TX


and TR in a torque differential system and between a CX and CT in a control
differential system. They give an output proportional to the sum or difference of two

g
inputs.

i n
The torque differential transmitter (TDX) is similar in construction to the control

n
differential transmitter (CDX).

a i
The rotors have three windings instead of the usual single winding, spaced 120

r
wound on a slotted core connected in the star configuration. One end of each

f
Figure 198: STATOR/ROTOR COILS & SYMBOL

T
winding is connected to a slip ring on the rotor shaft.

o g
The stator windings are the normal star connected windings at 120 to one

y n
another. The next diagrams show the basic construction with electrical and

r i
schematic diagrams. The CDX has higher impedance windings than the TDX.

t a e r
r i e i n e
r op n g
P S E
Figure 197: ROTOR DETAILS

M A
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

TORQUE DIFFERENTAIL SYNCHO SYSTEM the TR stator that causes the field produced to rotate 15 anti-clockwise and the
TR rotor will line up with this, indicating the movement of input shaft 2.
With reference to figure 199 note the input shaft 1 is attached to the TX rotor and
input shaft 2 is connected to the rotor of the TDX. The TR rotor is connected to a If now input shaft 1 in rotated 45 clockwise and input shaft 2 is rotated 15
pointer, giving the sum of difference between the input shaft angles 1 and 2. clockwise then the output will be the difference between the two inputs i.e. 30

g
Power supply is connected to the TX and TR rotor. clockwise output of TR.

i n
If input shaft 1 is rotated, say 15 clockwise and input shaft 2 is kept still, the

n
voltage changes in TX stator windings to cause current to flow in the TDX stator.

ra i
o f g T
a r y r i n
t e
Figure 200: SYMMETRICAL CONNECTION

r i e n e
If the stator windings between TX and TDX are crossed (S1-S3, S3-S1) and TDX to

i
TR (R1-S3, R3-S1) are crossed then 45 clockwise rotation of the TX rotor and 15

p g
clockwise rotation of the TDX rotor will give the sum of the two inputs.

r
P So E n
Figure 199: TORQUE DIFFERENTIAL SYNCHRO SYSTEM

A
This produces a field which cuts the TDX rotor and this induced emf drives
currents through the TR stator windings, producing a field which has moved 15

M
clockwise and the rotor, free to move, will line up with this field, indicating the
movement of input shaft 1. So in this condition the TDX is acting as a transformer.

Assume input shaft 1 is kept still and input shaft 2 is rotated 15 clockwise. Figure 201: TWO INPUT & OUTPUT LEADS INTERCHANGED
Moving the TDC rotor clockwise is equivalent to moving the field 15 anti-
clockwise. The induced emf in rotor produces voltages that drive currents through

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

Crossing over (S1-S3, S3-S1) between TX and TDX produces an output that is the CONTROL DIFFERENTIAL SYNCHRO SYSTEM
reverse of the sum of the two inputs, see next diagram.
As can be seen this is very similar to the torque differential system with the CDX
between the CX and CT. AC supply being fed to the CX only, the output being an
error signal proportional to the sum or difference of the two shaft rotations.

g
The operation is similar to that of the torque synchro system.

ni n
Figure 202: TWO INPUT LEADS INTERCHANGED

ra i
o f T
Just crossing over (R1-S3, R3-S1) between TDX and TR produces the reverse

g
difference between the two inputs.

a r y r i n
i e t e e
p r g i n
r o n
Figure 203: TWO OUTPUT LEADS INTERCHANGED

P S E
Figure 204: CONTROL DIFFERENTIAL SYNCHRO SYSTEM

M A
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

Frequency and Supply Voltages Torque Synchros

The supply frequency will be 400Hz and input voltages are 115 volts or 26 volts The basic construction of this type of synchro is shown in figure 205.
giving induced line voltages of 90 volts and 11.8v respectively and control
transformer maximum outputs of 57.3v and 22.5v respectively. The stator is star connected with the windings 120 apart, the rotor has a single

g
winding which is fed with single-phase ac via slip rings.
The following table gives a list of the possible faults and subsequent actions.

SYMPTOM CAUSE REMEDY

ni n
i
Power
Check appropriate fuse.

a
No Movement of receiver Failure /

r
Switch ON
OFF

f T
One pair of

o
Receiver displaced 180 from Rotor Check rotors for correct

g
transmitter. Rotation correct. Connections wiring

y n
reversed

r r i
2

a
connections

t e
Check stators for correct
Reverse rotation of receiver between

e e
wiring

i
stators

r i n
reversed

p
3

o g
Receiver displaced 120 or 240 connections

n
Check stators for correct

r
clockwise from transmitter. Rotation between
wiring

E
Figure 205: TYPICAL SYNCHRO DETAILS

P S
correct stators
crossed
Receiver displaced 0, 60, 120, Short circuit Carry out insulation

A
180, 240, 300 and moves in 180 between 2 resistance check between
steps stator lines stator lines

M
Open circuit
Receiver oscillates between 2 Carry out continuity check
on one
points approximately 75 apart on stator lines
stator line

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

The torque synchro circuit is shown in figure 206. It consists of a torque (T) Operation of Torque Synchro System
transmitter (X) and a torque (T) receiver (R).
In this system AC is fed to both synchro rotors, assuming the rotors are in identical
The TX and TR are similar but the TR has some form of damper mechanism to position then the ac applied to the rotor is acting like the primary of a transformer
prevent oscillation. The TR can be used as a TX but the TX cannot be used as a and emfs will be induced into the stator windings.

g
TR as it has no damping. Note the circuit symbol in figure 207.
These emfs will depend on rotor position.

ni n
If the rotors are in identical position then the emfs in the TX and TR stator

i
windings are identical and no current flows between the two-synchro stators. This

a
is known as the 'NULL' position.

f T r
y o n g
t a r e r i
r i e i n e
p
Figure 206: SYNCHRO CIRCUIT

r o n g
P S E
M A Figure 207: CIRCUIT SYMBOL

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

i ng
a i n
f T r
y o n g
t a r e r i
r i e i n e
r op n g
P S E
M A Figure 208: EFFECT OF VARIOUS INTERCONNECTIONS IN THE TORQUE SYNCHRO SYSTEM

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

The TX is usually mechanically coupled to an input shaft and the rotor of the TR is
coupled to a pointer of an instrument. A typical application on older aircraft would
be flap position indication. The TX being in the flap transmitter near the flap and
the TR being in the flap indicator on the flight deck.

g
If the flap is now moved (TX input shaft moves, say 20) then the emfs in the TX

i n
stator will change due to change of rotor position. These emfs are no longer equal

n
to the TR stator voltages, therefore current must flow between the two stators. This

i
causes a resultant magnetic field in the TX and TR stator's.

ra
The TX rotor cannot move as it is mechanically coupled to the flap. The TR rotor is

f T
free to move and lines up with this resultant field (which is 20 from the NULL

o
position). As the rotor lines up with this field, the two rotors are again in the same

g
position, the emfs induced in the stators are the same, no current flows and the

y n
flap position indicator now shows the new flap position.

a r r i
The effect of interchanging the rotor and stator connections are shown in Figure

t e
208, particularly notice that reversal of rotor connections (b) produces an output

i e e
that is 180 out from the input rotation and changing over any two stator

r n
connections gives reversed direction of rotation of TR.

p g i
It should be noted that the output of the TR produces a very low torque, enough

o
r n
only to drive a light pointer mechanism.

P S E
M A
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

CONTROL SYNCHROS One of the two important things to note is that the AC supply is fed only to the CX
rotor and the discriminator amplifier, and the other is that in the NULL (no error
The control synchro system provides an error voltage signal in the receiving signal) position the rotors are at 90 to one another.
element. This error signal is an indication of the displacement of the two rotor
windings relative to each other. The control synchro system comprises two In the null position the AC voltage applied to the CX rotor acts like the primary of a

g
synchros the control (C) transmitter (X) and the control (C) transformer (T). transformer and voltages are induced in the CX stator windings. These voltages
will be different, and this difference in potential will drive a current through the CT

i n
The control transmitter (CX) is similar in construction to the TX except the windings stator windings.

n
are of high impedance.

a i
The control transformer (CT) also has windings of high impedance; the rotor

r
winding is wound on a laminated cylindrical former and distributed in slots that are

f T
skewed to prevent lock-on effect.

o g
The control synchro can be used to indicate control surface position with the CT in

y n
the indicator, or used in a servo system to provide a signal to a control surface

r i
servomotor.

t a e r
r i e i n e
p g
Figure 210: CONTROL SYNCHRO - APPLIED & OUTPUT VOLTAGE

r o E n
These currents produce magnetic fields around each coil; the fields combine to

P S
form one resultant field. In this null position this resultant field cuts the CT rotor at
90 so no emf is induced into the CT rotor winding.

A
If the CX rotor input shaft is moved the voltages in the CT rotor will change, due to

M
change of rotor position. These new voltages will change the currents flowing
through the CT stator windings and therefore the position of the resultant magnetic
field.

Figure 209: CONTROL SYNCHRO

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

Whatever angle the CX rotor had been turned, the resultant magnetic field across SLAB SYNCHROS
the CT will also have moved that amount. As this resultant field is no longer at 90
in the rotor but at an angle to it, then an emfis induced in the rotor winding. These are synchros consisting of wound stators and rotors; typical uses are in
gyroscopic instruments where the rotor is connected to one component and the
This induced emf is fed to the discriminator amplifier where its phase relationship stator on another. For example to measure roll movement in a vertical gyroscope,

g
is compared with that of the supply to provide the correct error voltage and phase where the stator is mounted on the case and the rotor on the outer gimbal, so any
relationship to the two phase induction control phase and drive the motor in the roll movement moves case relative to outer gimbal.

i n
correct sense.

i n
The motor drives through a gearbox to the indicator (in this example) and also to

a
the rotor of the CT. When the motor has driven the CT rotor until it is 90 to the

r
new field, no voltage will be induced, motor stops, and indicator shows the

f T
movement of the CX input shaft. The two-synchro rotors are once again in the

o
NULL position i.e. 90 to one another.

y n g
Again in this system if two of the stator windings between the CX and CT are

r i
swapped then for a clockwise input to the CX rotor the output signal to indicator

a r
will be anti-clockwise, i.e. the indicator will show reverse indication.

e t e e
Figure 211: TYPICAL SLAB SYNCHRO

i
What would be the effect of swapping the rotor leads R1 and R2 on the

p r i n
a) CX rotor?

g
b) CT rotor?

r
P So E n
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

THE SYNCHROTEL

This can be used as a low torque control transformer or transmitter. The next
diagram shows the quite unusual construction.

g
The stationary rotor coil fits into the highly permeable case over the central core.
The conventional three-phase stator also fits over the core. The rotor is an

i n
aluminium hollow cylinder with an oblique section that rotates in the air gap

n
between the stator and the coil. The rotor shaft is supported in jewelled bearings.

ra i
o f g T
a r y r i n
t e
Figure 213: SYNCHROTEL CUT-AWAY

r i e i n e
op n g
Figure 212: SYNCHROTEL - EXPLODED VIEW

r
P S E
Because of the low torque required to operate the synchrotel they are ideal for
connection to capsule operated devices e.g. Pitot-static capsules. When used as a
control transformer it will be connected to a control transmitter as shown in figure

A
214.

M Figure 214 SYNCHROTEL PRINCIPLE

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

The transmitter (CX) is typically fed with a 26v 400Hz supply, the induced voltages In the following diagram the I bar is parallel to the E bar and the AC fed to the
in its stator are connected to the synchrotel stator and the current flow through the central limb creates a magnetic flux which will flow as shown. The flux in the top
windings produces a magnetic field that cuts the rotor. The rotor position has been and bottom limbs will be the same as the air gaps between the I bar and E core
determined by the capsule movement. are equal. The emf induced into the two coils B and C will be the same but of
opposite phase, so the output will be zero.

g
As the rotor is around the core then a component of the flux cutting the rotor will
flow along the core and cut the rotor winding. The output from this winding is fed to

i n
the servo-amplifier where it feeds the control winding of a 2-phase servomotor that

n
drives the indicator and also the CX rotor.

a i
This changes the CX stator voltages and therefore synchrotel stator current and

r
flux. This will continue until the synchrotel stator flux is no longer producing an

f T
output from the rotor winding ie NULL position. The indicator now shows a position

o
of the pressure applied at that instant.

y n g
When used as a transmitter the rotor winding is energised producing an axial flux

r i
Figure 215: I BAR NEUTRAL
along the core, this causes a current flow in the rotor. This rotor current produces a

a r
radial flux that cuts the stator coils and induces an emf into them. The emf

t e
induced is a function of rotor position determined by input pressure measurement.

r i e n e
INDUCTANCE TRANSMITTERS

The 'E' and I Bar

op g i
r E n
This type of sensor is used in older servo instruments acceleration sensors, air

P S
data computers.

The fixed laminated E shaped core has an alternating supply connected to its

A
central limb; the outer two limbs are wound with coils connected in series Figure 216: I BAR - POSITION 1

M
opposition. The laminated I shaped core sits parallel to the E core and is attached
to whatever we are trying to measure the movement of, e.g. in a servo altimeter
the I bar is connected to the capsules.

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

When the I bar is moved by the sensing element, the air gaps are now unequal, THE LINEAR VARIABLE DIFFERENTIAL TRANSFORMER (LVDT)
there is now more flux cutting coil B (less air gap) and less flux cutting coil C
(larger air gap). The emf induced in coil B is greater than that in coil C, the output The LVDT consists of a primary coil of a transformer; the secondary has two coils
is therefore the difference between these two giving an output that is 'in phase' connected in series opposition. In between the two coils is an iron core that can
with the input. The amplitude of the output will depend on the amount of be moved in a linear manner by the system whose displacement is to be

g
movement of the I bar. measured.

i n
The next diagram shows the I bar moved in the opposite direction, in this case the

n
emf induced coil C is greater than coil B and the output will be 'anti-phase' to the

i
input, again the amplitude will depend on the amount of movement of the I bar.

f T ra
o g
Figure 218: LVDT - CORE CENRAL POSITION

r y i n
Figure 219 shows the LVDT with the core central, the outputs of the two coils A

a r
and B will be equal but of opposite phase, the output of the LVDT is therefore zero.

e t e e
If the core is displaced as shown in the next diagram, the output of coil A increases

r i n
(iron core full in line) and that of coil B decreases (air gap only). The output is

i
therefore the difference and is 'in phase' with the input, the amplitude depends on

p g
the amount of displacement.

r
P So E n
Figure 217: I BAR - POSITION 2

M A Figure 219: LVDT - CORE POSITION 1

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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

If the core is displaced downwards, as shown in the next diagram, then coil B
output increases (iron core fully in line) and that of coil A decreases (air gap only),
once again the output is the difference between the two and is 'anti-phase' to the
input, the amplitude depends on the amount of displacement.

i ng
a i n
r
Figure 220: LVDT - CORE POSITION 2

o f T
The LVDT is used extensively for control surface position indication, being

g
attached to the servo actuator. They are also used in Engine Pressure Ratio

y n
Transmitters, accelerometers and some older fuel flow transmitters.

t a r r i
There is another version of this transformer called the ROTARY VARIABLE

e
DIFFERENTIAL TRANSFORMER (RVDT) that works on the same principle, but as
Figure 221: TYPICAL RVDT FITMENT

i e e
the name implies the central core moves in a circular movement.

p r i n
One of the uses is to measure control column movement. With reference to figure

o g
221, as the control column is moved a cable assembly is attached to the RVDT

r n
input drum and therefore rotates the central core of the RVDT's to give an output

P S E
to, for example, a spoiler control module.

M A
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

CAPACITANCE TRANSMITTERS

The most common use of capacitance transmitters is in fuel quantity indication


systems. The sensor being in principle two concentric tubes with the fuel being the
dielectric. The capacitance of a capacitor depends on, the distance between the

g
plates, the area of the plates and the dielectric constant of the material between
the plates. As the distance between the plates and the area of the plates is set the

i n
only variable is the dielectric constant of the material between the plates.

i n
Air has a dielectric constant of one and aircraft fuel has a dielectric constant of

a
approximately two. This means whatever the capacitance was with air as the

r
dielectric, when fuel replaces the air the capacitance will approximately double e.g.

f T
100pF to 200pF. So this is therefore a good way of measuring fuel quantity as the

o
tank is filled with fuel the dielectric changes gradually from air to fuel increasing the

g
capacitance as fuel level increases.

y n
Figure 222: CAPACITANCE TRANSMITTER

r i
This same principle is used for measurement of hydraulic fluid level in a hydraulic

a r
reservoir. As pressure is applied to the diaphragm the two metallic films come closer

t e
together changing the distance between the 'plates' and changing the capacitance.

i e e
Another type of transmitter used in digital air data systems is the formation of a This forms part of a capacitive bridge network that will change its output depending

r n
capacitor by depositing a metallic film on a small area in the centre of a diaphragm

i
on pressure applied. These are used as pressure transducers in some digital air

p
to form a capacitor (figure 222). data computers.

r o n g
P S E
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

SYNCHRONOUS TRANSMITTERS

The Desynn System

The Desynn is a DC system of transmission that indicates continuous variation of

g
shaft position. It is a relatively simple system, which because it produces a low
torque, is useful only for remote indication of angular position; as such it is ideal

i n
where a simple pointer and scale indicator is adequate.

i n
As in all electrical remote indication systems, the input shaft is connected to a

a
transmitter element that is connected to the receiver unit by wires. The receiver

r
unit drives the output shaft that operates the remote indicator.

o f T
In the Desynn system (figure 223), the transmitter is a circular potentiometer which

g
has three fixed tapings (a, b and c) spaced 120 apart, connected to the receiver

y n
unit. A rotating spring loaded mechanism (to take up backlash/) mounted on the

r i
input shaft carried two sliding contacts or wipers that are arranged exactly opposite

a r
one another. The wipers are fed, via slip rings and brushes, from the positive and

t e
negative terminals of a DC supply.

r i e n e
The receiver has three coils (a, b and c) with axes 120 apart (connected in star).

p i
Within them is a permanent magnet rotor which is capable of rotation through 360

g
and which carries a pointer over a calibrated scale. The three air-cored coils in the

r o n
receiver are connected to the tapping points a, b and c on the transmitter by the

E
three lines shown in figure 223. Figure 223 THE DESYNN SYSTEM

P S
M A
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

A weak circular magnet which plays no part in the normal operation of the indicator
will return the points to an "OFF SCALE" position if the power supply fails or is
switched 'OFF' (See figure 225).

When a DC supply is connected to the transmitter wipers, the voltages at the

g
tapping points a, b and c in the transmitter cause currents to flow through the three
stator coils in the receiver, a resultant magnetic field is produced and the rotor

i n
magnet aligns itself with this field. For example, with the input shaft in the position

n
shown at a in figure 32 point a is at 24V with respect to supply negative, while b

i
and c are both +8V.

ra
With a positive by the same amount to both b and c, current flows from a through

f T
coil a in the receiver; it then divides equally and half the total current goes through

o
coil b and half through coil c back to the transmitter. The magnetic fields fa, fb and

g
fc associated with these currents and also the resultant magnetic field are shown

y n
by vectors and the rotor magnet aligns itself with this field.

a r r i
If the input shaft is rotated 120 clockwise, as at b in figure 226 the voltage

t e
distribution is such that the total current flows through coil b, it then divides equally

i e e
through a and c and flows back to the transmitter. The vectors show that the

r n
resultant magnetic field has also rotated 120 clockwise from its initial position and

p i
the rotor magnet aligns along itself this new axis.

r o n g
The magnitude and polarity of the voltage at each tapping point on the transmitter

E
therefore vary according to the position of the wipers.

P S
Thus, if the input shaft is rotated, the variation of voltage at a, b and c produces
changes in the currents flowing in the stator coils, and a magnetic field rotating in

A
sympathy with the input shaft is produced.

M
The rotor magnet remains aligned with this field at all times and so rotates in
synchronism with the input shaft. A pointer, moving over a calibrated scale, is FIGURE 224: POSITION INDICATOR TRANSMITTER
attached to the rotor so that a remote indication of the position of the input shaft is
immediately available.
A typical example of the use of the Desynn is remote indication of wing flap angle,
the flap shaft acting as the 'input' shaft.
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

i ng
FIGURE 225: INDICATOR - EXPLODED VIEW

a i n
f T r
The Desynn is said to be self-synchronous because the output shaft continuously

o
moves in sympathy, or in synchronism, with the input shaft.

r y n g
Any change in the position of the input shaft results in an immediate and

r i
corresponding change in the position of the output shaft; this synchronous

t a e
movement is inherent in the system, ie it is self-synchronous.

i e e
The Desynn also gives a continuous indication of change of position through 360.

r i n
It is, however, only a low power device, the current being limited by the resistance Figure 226: DESYNN SYSTEM - THEORY

p
of the transmitter potentiometer. The desynn is therefore only suitable for operating

o g
indicating pointers and similar light loads. Figures 225 and 226 show a Desynn system used to indicate flap position on a

r n
small passenger carrying jet aircraft. Note the linkage between the flap and the

P S E
transmitter and the available adjustments.

M A
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

Typical Desynn Faults

The table below shows some of the possible faults and subsequent actions.

SYMPTOM CAUSE REMEDY

g
Power Supply Failure / Check appropriate fuse.
Pointer OFF SCALE
OFF Switch ON

Pointer displaced 180. Check transmitter for correct

ni n
i
Power supply reversed
Rotation correct. wiring

ra
Check wiring connections
Pointer rotation

f T
2 connections crossed between transmitter and
reversed

o
indicator

y n g
Pointer displaced 120 Check wiring connections

r r i
or 240 clockwise. 3 connections crossed between transmitter and

a
Rotation correct. indicator

i e t e e Carry out insulation

n
Pointer displaced and Open circuit or short

r
resistance check and

i
moves in 180 steps circuit

p
continuity checks Figure 227: DESYNN TYPICAL COMPONENT LOCATION

r o n g
P S E
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

i ng
a i n
f T r
y o n g
t a r e r i
r i e i n e
p g
Figure 228: TYPICAL TRANSMITTER SET-UP Figure 229: PRINCIPLE OF LEVER LENGTH ADJUSTMENT

r
P So E n
M A
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DCAM PART 66 CAT B1.1
MODULE 4 ELECTRONIC FUNDAMENTALS
SERVOMECHANISM (DCAM 4.3 L1)

Maintenance Checks on Adjustment of Transmitter

On the desynn system there will usually be two forms of adjustment, one adjusts
lever length and the other lever angle. It may be useful now to discuss these two
adjustments in a bit more detail.

g
Lever length on the transmitter is the distance between the lever pivot point X and

i n
the connection to the link at Y; this arm is adjustable as shown in detail A-A figure

n
230. It should be noted that making the extension arm longer would increase lever

i
length and decrease indicator pointer movement. Making the extension arm

a
smaller will decrease lever length and increase indicator pointer movement.

f T r
The basic adjustment then of this type of system is to set the flap to various

o
positions and checking pointer indication and adjusting the lever length as required

g
ensuring correct pointer indication at all flap positions.

r y i n
It should be noted that adjusting lever length generally only counteracts a regularly

a r
increasing or decreasing error, e.g. for each 1 unit movement it only moves 0.8. In

t e
other systems, adjustment of lever angle may be possible. This is the angle

i e e
between the adjustable link arm and the extension arm. (Note: It cannot be

r n
adjusted on this system).

i
Figure 230: PRINCIPLE OF LEVER ANGLE ADJUSTMENT

op g
Unlike lever length adjustment, lever angle adjustment is not a constant value, i.e.

r n
for each adjustment the pointer deflection becomes progressively greater for each

P S E
indication position.

Therefore on systems with both types of adjustments, it will be necessary to adjust

A
each in turn to obtain the desired pointer indications.

M
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