Frontmatter

The Electronic Packaging Handbook

Ed. Blackwell, G.R.
Boca Raton: CRC Press LLC, 2000
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Library of Congress Cataloging-in-Publication Data

The electronic packaging handbook / edited by Glenn R. Blackwell.

p. cm. (The electrical engineers handbook series)
Includes bibliographical references.
ISBN 0-8493-8591-1 (alk. paper)
1. Electronic packaging Handbooks, manuals, etc. I. Blackwell,
Glenn R. II. Series.
TK7870.15.E44 1999
621.381046dc21 99-41244
CIP

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2000 by CRC Press LLC

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International Standard Book Number 0-8493-8591-1
Library of Congress Card Number 99-41244
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 Preface

The Electronic Packaging Handbook is intended for engineers and technicians involved in the design,
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manufacturing, and testing of electronic assemblies. The handbook covers a range of applied technologies
and concepts that are necessary to allow the user to follow reasonable steps to reach a defined goal. The
user is encouraged to follow the steps of concurrent engineering, which considers aspects of design,
manufacturing, and testing during the design phase of a project and/or product.
Each chapter begins with an introduction, which includes a Where Else? section. Because the topics
considered in this handbook are interactive, this section guides the reader of a particular chapter to other
sections of the handbook where similar issues are discussed.
The Electronic Packaging Handbook is the latest in a series of major electrical/electronics engineering
handbooks from CRC Press, including several that are published jointly with the IEEE Press:
The Electronics Handbook, Jerry C. Whitaker
The Electrical Engineering Handbook, 2nd ed., Richard C. Dorf
The Circuits and Filters Handbook, Wai-Kai Chen
The Control Handbook, William S. Devine
The Mobile Communications Handbook, Jerry D. Gibson
The Transforms and Applications Handbook, Alexander D. Poularikas
This handbook covers a subset of the topics that exist in Whitakers The Electronics Handbook, and as
such covers the included topics in more detail than that handbook, while restricting coverage to only
topics directly related to electronics packaging. Electronics packaging continues to include expanding
and evolving topics and technologies, as the demands for smaller, faster, and lighter products continue
without signs of abatement. These demands mean that individuals in each of the specialty areas involved
in electronics packaging, such as electronic, mechanical, and thermal designers, and manufacturing and
test engineers, are all interdependent on each others knowledge. This handbook will assist each group
in understanding other areas.

Organization
The two introductory chapters of this handbook are intended to provide an overview to the topics of
project management and quality, and to surface mount technology generally. Following chapters then
present more detailed information about topics needed to successfully design, manufacture, and test the
packaging for an electronic product:
1. Fundamentals of the Design Process
2. Surface Mount Technology
3. Integrated Circuit Packages

2000 by CRC Press LLC

 4. Direct Chip Attach
5. Circuit Boards
6. EMC and Printed Circuit Board Design
7. Hybrid Assemblies
8. Interconnects
9. Design for Test
10. Adhesive and Its Application
11. Thermal Management
12. Testing
13. Inspection
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14. Package/Enclosure
15. Electronics Package Reliability and Failure Analysis
16. Product Safety and Third-Party Certification
The last two chapters cover reliability and failure analysis issues, which are necessary to understand both
failure mechanisms, and also analysis of failed products and the safety issues that must be considered
for any product that is intended to be sold to corporate or public consumers.
The index is complete and was developed by the chapter authors. This index will be of great value to
the reader in identifying areas of the book that cover the topics of interest.
This handbook represents a multi-year effort by the authors. It is hoped that the reader will both
benefit and learn from their work.

Glenn R. Blackwell

2000 by CRC Press LLC

 Contributors

Bruce C. Beihoff Steli Loznen Ray Prasad

Rockwell Automation The Standards Institution of Israel Ray Prasad Consultancy, Inc.
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Allen Bradley Tel Aviv, Israel Portland, OR

Milwaukee, WI
Janet K. Lumpp Michael C. Shaw
Glenn R. Blackwell University of Kentucky
Purdue University Design and Reliability
Lexington, KY Department
W. Lafayette, IN
Rockwell Science Center
Constantin Bolintineanu Victor Meeldijk Thousand Oaks, CA
Digital Security Controls, Ltd. Diagnostic/Retrieval Systems Inc.
Toronto, Ontario, Canada Oakland, NJ
Peter M. Stipan
Garry Grzelak Mark I. Montrose Rockwell Automation
Teradyne Telecommunications Montrose Compliance Services, Inc. Allen-Bradley
Deerfield, IL Santa Clara, CA Milwaukee, WI

2000 by CRC Press LLC

 Contents

1 Fundamentals of the Design Process

Glenn R. Blackwell
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2 Surface Mount Technology

Glenn R. Blackwell

3 Integrated Circuit Packages

Victor Meeldijk

4 Direct Chip Attach

Glenn R. Blackwell

5 Circuit Boards
Glenn R. Blackwell

6 EMC and Printed Circuit Board Design

Mark I. Montrose

7 Hybrid Assemblies
Janet K. Lumpp

8 Interconnects
Glenn R. Blackwell

9 Design for Test

Glenn R. Blackwell

10 Adhesive and Its Application

Ray Prasad

11 Thermal Management
Glenn R. Blackwell

12 Testing
Garry Grzelak and Glenn R. Blackwell

2000 by CRC Press LLC

 13 Inspection
Glenn R. Blackwell

14 Package/Enclosure
Glenn R. Blackwell

15 Electronics Package Reliability and Failure Analysis: A

Micromechanics-Based Approach
Peter M. Stipan, Bruce C. Beihoff, and Michael C. Shaw
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16 Product Safety and Third-Party Certification

Constantin Bolintineanu and Steli Loznen

Appendix A: Definitions

2000 by CRC Press LLC