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BST1 P9025AC
VOUT=5.3V
CBST1 OUT
CLAMP1
CCLAMP1 SNS
COUT
CS ACM1 Rlim
CMOD1
AC1 ILIM
LRX
CD
AC2 R1
CMOD2
ACM2 STAT
CCLAMP2 RFOD1
FOD1
CLAMP2 FOD2
CBST2 RFOD2
BST2 TEOP Temperature
VDD Sense
Interupt INT C1
VRECT
CRECT EN
Enable SCL SCL
CHG_END/CS100 SDA SDA
Charge AGND PGND
Complete
NOTES:
1. The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / JA where TJ(MAX) is 125C. Exceeding the maximum allowable power dissipation will result in excessive die
temperature, and the device will enter thermal shutdown.
2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3" x 4.5" in still air conditions.
3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.
4. For the NBG32 package, connecting the 5 mm X 5 mm EP to internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH) vias, from top to bottom sides of
the PCB, is recommended for improving the overall thermal performance.
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P9025AC DATASHEET
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NOTES:
1. Guaranteed by design and not subject to 100% production testing.
2. Guaranteed by design and simulation.
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Pin Configuration
PGND
AGND
FOD1
STAT
VDD
SDA
SCL
AC2
32
31
26
25
30
29
27
28
INT 1 24 NC4
DNC1 2 23 ACM2
DNC2 3 22 PGND1
BST2 4 EP 21 ACM1
BST1 5 20 FOD2
AC1 6 19 CLAMP1
VRECT 7 18 PGND2
RLIM 8 17 CLAMP2
11
13
14
12
15
10
16
9
NC2
NC3
OUT
EN
TEOP
CHG_END / CS100
NC1
SNS
Pin Descriptions
Pin # Name Type Function
1 INT O Interrupt output. Open drain output pin. A low state indicates that an over-current, over-voltage, or
over-temperature condition has occurred. If used, connect a 100K pullup resistor to the OUT pin
or compatible system I/O voltage rail.
2 DNC1 DNC DO NOT connect. It is internally connected. This pin must be left floating.
3 DNC2 DNC DO NOT connect. It is internally connected. This pin must be left floating.
4 BST2 O Bootstrap output for high-side rectifier FET 2. Connect a 0.01F capacitor from AC2 pin to BST2.
5 BST1 O Bootstrap output for high-side rectifier FET 1. Connect a 0.01F capacitor from AC1 pin to BST1.
6 AC1 I AC1 input to the Internal full-wave rectifier.
7 VRECT O Output of the full-wave rectifier. Bypass this pin with ceramic capacitors to power ground.
8 RLIM I Current-limit resistor. A resistor connected between this pin and ground sets the current limit of the
5V LDO output.
9 SNS I LDO output sense pin. Connect to the OUT pin.
10 CHG_END / I Active-high input pin. Default setting is a Charge-End active-high input from an external battery
CS100 charger to terminate power transfer. Alternatively, a Charge-Status active high input which will
send a WPC Charge Status packet with value 100 (100% charge). This pin has an internal pull
down resistor.
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Block Diagram
AC1
AC2
ACM1
AC Current
Modulation limit RLIM
and control
ACM2 Overvoltage
protection
CLAMP1
VRECT
VIN-UVLO
CLAMP2 LDO5V
Control
GND
BST1
BST2
Driver
& OUT
Control
4.5V
Internal
LDO
SNS
(QFN Only)
GND
PGND
VDD
2
SCL IC
SDA
FOD1
FOD2
NTC
TS
reading
STAT
Peripherals
GND
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For more information about how to determine and program the The recommended value of RLIM for a 1A output is 30 k.
FOD settings, refer to application note AN-886 P9025AC FOD
Tuning Guide.
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Bit Encoding Scheme The P9025AC goes through four phases: Start/Selection,
As required by the WPC, the P9025AC uses a differential Ping, Identification & Configuration, and Power Transfer.
bi-phase encoding scheme to modulate data bits onto the
Power Signal. A clock frequency of 2kHz is used for this Start/Selection
purpose. A logic ONE bit is encoded by generating two In this phase, the P9025AC senses the incoming power from
transitions per clock period, whereas a logic ZERO bit is the base station transmitter and proceeds to the PING state. It
encoded using only one transition per clock period as shown monitors the rectified voltage, and when the voltage is above
below: the VRECT, UVLO threshold, the P9025AC wakes up its digital
electronics and prepares to communicate with the base
Figure 4. Bit Encoding Scheme station. If the P9025AC does not proceed to PING, then it does
not transmit any communication packets.
tCLK
Ping
In this phase, the P9025AC transmits a Signal Strength
Packet as the first communication packet to instruct the base
to keep the power signal ON. After sending the Signal
ONE ZERO ONE ZERO ONE ONE ZERO ZERO Strength Packet, the P9025AC proceeds to the Identification
and Configuration phase. If, instead, the P9025AC sends End
Each byte in the communication packet comprises 11bits in an of Power Packets, then it remains in the PING phase.
asynchronous serial format, as shown below:
In this phase, the P9025AC sends the following packets:
Figure 5. Byte Encoding Scheme
Signal Strength Packet
End of Power Packet
Start b0 b1 b2 b3 b4 b5 b6 b7 Parity Stop
Identification and Configuration (ID & Config)
Each byte has a start bit, 8 data bits, a parity bit, and a single In this phase, the P9025AC may send the following packets:
stop bit.
Identification Packet
System Feedback Control Configuration Packet
The P9025AC is fully compatible with WPC specification Rev. After sending the Configuration Packet, the P9025AC
1.1.2 and has all necessary circuitry to communicate with the proceeds to the power transfer phase.
base station via WPC-compliant communication packets.
Power Transfer
The overall WPC-compliant system behavior between the
transmitter and receiver follows the state machine below: In this phase, the P9025AC controls the power transfer from
the Power Transmitter by means of the following Control Data
Figure 6. WPC System Feedback Control Packets:
Modulation
The P9025AC is compatible with WPC V1.1.2 transmitter
coils. Each receiver coil type has a unique inductance value
and various physical properties as are best for a given
application. As such, the resonant capacitor (CS) that is used
with a given receiver coil should be optimized for the overall
application. The WPC guidance for Cs is that the resonant
frequency of the receiver coil and Cs capacitor should be
100kHz while placed on the surface of a transmitter with the
normal spacing.
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P9025AC DATASHEET
Application Information
External Components Power Dissipation and Thermal Requirements
The P9025AC requires a minimum number of external The P9025AC is offered in a VFQFPN-32 package which has
components for proper operation, as indicated in the a maximum power dissipation capability of about 1.9W. The
Reference schematic. maximum power dissipation is determined by the number of
thermal vias between the package and the printed circuit
LDO board, combined with the ability of the board to ultimately
transfer the thermal energy into the ambient environment. The
Input Capacitor (VRECT Capacitors) maximum power dissipation is defined by the dies specified
The LDO input capacitors (VRECT capacitors) should be maximum operating junction temperature, TJ, of 125C. The
located as close as possible to the VRECT pins, and ground junction temperature rises when the heat generated by the
(PGND). Ceramic capacitors are recommended for their lower device's power dissipation goes through the package thermal
ESR and small profile. resistance. The VFQFPN package offers a typical thermal
resistance, junction to ambient (JA), of 35C/W when the
VDD Capacitor PCB layout and surrounding devices are optimized as
The P9025AC has an internal LDO regulator that must be described in application note AN-889 P9025AC Layout
bypassed with a 1F capacitor connected from the VDD pin to Guidelines.
GND. This capacitor should be as close as possible to the VDD
pin with a close GND connection. Thermal Overload Protection
The P9025AC integrates thermal overload shutdown circuitry
Output Capacitor to prevent damage resulting from excessive thermal stress
A 0.1F and a 4.7F capacitors in parallel must be connected that may be encountered under fault conditions. This circuitry
from this pin to ground (PGND). The trace should be made as will shut down and reset the device if the die temperature
short as practical for maximum device performance. Since the exceeds 150C. To allow the maximum load current on each
LDO has been designed to function with very low ESR regulator and the synchronous rectifier, and to prevent thermal
capacitors, a ceramic capacitor is recommended for best overload, it is important to ensure that the heat generated by
performance. For better transient response increase the total the P9025AC is dissipated efficiently into the PCB and
amount of output capacitance. For 1-Amp load steps, an environment
output capacitance of at least 10F is recommended.
End of Charge (EOC)
NC and DNC Pins In the event of thermal shutdown (150C), EN, CHG_END or
TEOP pins assertion the device turns off the LDO and
NC pins that are indicated as Not Internally Connected continually sends End Of Power (EOP) packets until the
should be soldered to the PCB ground plane to improve transmitter removes the power and the rectifier voltage on the
thermal performance with multiple vias exiting the bottom side receiver side drops below the UVLO threshold.
of the PCB. This improves heat flow away from the package
and minimizes package thermal gradients.
Special Notes
DNC pins that are indicated as Internally connected must be 32-VFQFPN Package Assembly
left floating. Note 1: Unopened Dry Packaged Parts have a one year shelf
life.
PCB Layout Considerations
For optimum device performance and lowest output phase Note 2: The HIC indicator card for newly-opened Dry
noise, IDT recommends that customers copy the reference Packaged Parts should be checked. If there is any moisture
layout used in the P9025AC-R-EVK reference kit. More content, the parts must be baked for a minimum of 8 hours at
information and layout files can be found at 125C within 24 hours of the assembly reflow process.
http://www.idt.com/P9025AC-R-EVK.
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P9025AC-R-EVK V1.0
The reference schematic bill-of-materials can be found in the P9025AC-R-EVK reference board manual.
C4 47nF VRECT
50V 28AWG
C5 0.1uF
D D
50V AC1
14
C1 I2CRAIL VRECT
C6 C10 VRECT
LC_NODE 0.1uF 0.47uF 10nF 28AWG
50V 50V 50V
C11 C16 C15 C14 C13
BST1 0.1uF 4.7uF 4.7uF 4.7uF 4.7uF
BST1 R3
C7
Rx COIL CONNECTIONS
CLAMP1 1uF
CLAMP1 0
0
R2 R1 /EN
4.7K 4.7K 28AWG
29
0 0
7
L1
VRECT
VDD
INDUCTOR
/EN 14 12 OUT OUT
C2 AC1 6 /EN OUT 9 28AWG
C3 ACM1 AC1 SNS
22nF 50V
AC2 30 R7 C17 C18
1.8nF C9 AC2 U1 21 ACM1 4.7K 1uF 4.7uF
ACM2 ACM1 ACM1
50V 22nF 50V BST1 BST1 5 23 ACM2 ACM2
C
BST2 4 BST1 P9025AC QFN ACM2 19 CLAMP1 C
BST2 BST2 CLAMP1 CLAMP1
D3 GND
SCL SCL 27 17 CLAMP2 CLAMP2 GREEN 28AWG
SDA SDA 26 SCL CLAMP2
SDA 32 STAT
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AC2 25 /STAT 1 0
RLIM 8 FOD1 /INT 11
20 RLIM NC1 13 STAT OPTIONAL
FOD2 NC2
Reference Schematic (P9025AC-R-EVK V1.0)
10 16 28AWG
C12 CHG_END/CS100 NC3 24 INT
C8 15 NC4 2 28AWG
0.47uF
PGND1
PGND2
10nF TEOP DNC1
AGND
PGND
EPAD
50V 50V R4 R6 R5 3
47k DNC2
NP 30K
BST2 BST2
28
31
22
18
33
CLAMP2 CLAMP2
0 0
0
0
CHG_END
B B
28AWG
GND1
TEOP 28AWG
28AWG
0
NOTES:
1.FOD1 (R4) is for selecting internal OTP settings and FOD2 (R5) is
for adding offset to the FOD1 setting. Values will be THIS DOCUMENT CONTAINS INFORMATION PROPRIETARY
TO Integrated Device Technology, Inc. (IDT).
determined during pre-production. USE OR DISCLOSURE WITHOUT THE
A
WRITTEN PERMISSION OF AN OFFICER OF A
2. I2C pins must not float (Pull-up or Pull-down). IDT IS EXPRESSLY FORBIDDEN
3. Connections for programming FOD settings and reading I2C: Vrect, /EN, SDA, SCL, GND. Title
P9025AC-R-EVK V1.0
4. TEOP and CHG_END/CS100 inputs may be directly Size Document Number Rev
Custom305-PD-15-0285 1
connected to GND if these functions are not required.
Date: Tuesday, August 04, 2015 Sheet 2 of 2
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Package Outline and Package Dimensions (NBG32), cont. Use Epad 3.1mm Sq.
09/01/15 19 5W, QI WIRELESS POWER RECEIVER WITH INTEGRATED RECTIFIER AND LDO OUTPUT
Ordering Information
Part/Order Number Marking Package Shipping Packaging Ambient Temperature
P9025AC-RNBGI P9025AC-RNBGI 5 x 5 x 0.75 mm 32-VFQFPN Tray 0 to +85C
P9025AC-RNBGI8 P9025AC-RNBGI 5 x 5 x 0.75 mm 32-VFQFPN Tape and Reel 0 to +85C
Note 1: Custom configurations and a compact CSP package is available for qualified customers. Contact your IDT Sales Representative for more information
Note 2: Factory-customized versions are available for qualified customers. Contact your IDT Sales Representative for more information.
Revision History
Date Originator Description of Change
08/19/15 A.L. Initial release.
09/01/15 A.L. 1. Updated Block Diagram.
2. Updated TJ from 0 to 150C to 0 to 125C.
3. Corrected minor textual typos.
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDTs sole discretion. All information in
this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined
in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether
express or implied, including, but not limited to, the suitability of IDTs products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This
document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.
IDTs products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Product specification subject to change without notice. Other trademarks and service marks used herein, including protected
names, logos and designs, are the property of IDT or their respective third party owners.