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INTRODUCTION

Electronics without silicon is unbelievable, but it will come true with the evol
ution of Diamond or Carbon chip. Now a day we are using silicon for the manufact
uring of Electronic Chip's. It has many disadvantages when it is used in power e
lectronic applications, such as bulk in size, slow operating speed etc. Carbon,
Silicon and Germanium are belonging to the same group in the periodic table. The
y have four valance electrons in their outer shell. Pure Silicon and Germanium a
re semiconductors in normal temperature. So in the earlier days they are used wi
dely for the manufacturing of electronic components. But later it is found that
Germanium has many disadvantages compared to silicon, such as large reverse curr
ent, less stability towards temperature etc so in the industry focused in develo
ping electronic components using silicon wafers
Now research people found that Carbon is more advantages than Silicon. By using
carbon as the manufacturing material, we can achieve smaller, faster and stronge
r chips. They are succeeded in making smaller prototypes of Carbon chip. They in
vented a major component using carbon that is "CARBON NANOTUBE", which is widely
used in most modern microprocessors and it will be a major component in the Dia
mond chip
WHAT IS IT?
In single definition, Diamond Chip or carbon Chip is an electronic chip manufact
ured on a Diamond structural Carbon wafer. OR it can be also defined as the elec
tronic component manufactured using carbon as the wafer. The major component usi
ng carbon is (cnt) Carbon Nanotube. Carbon Nanotube is a nano dimensional made b
y using carbon. It has many unique properties.
HOW IS IT POSSIBLE?
Pure Diamond structural carbon is non-conducting in nature. In order to make it
conducting we have to perform doping process. We are using Boron as the p-type d
oping Agent and the Nitrogen as the n-type doping agent. The doping process is s
imilar to that in the case of Silicon chip manufacturing. But this process will
take more time compared with that of silicon because it is very difficult to dif
fuse through strongly bonded diamond structure. CNT (Carbon Nanotube) is already
a semi conductor.
ADVANTAGES OF DIAMOND CHIP
1 SMALLER COMPONENTS ARE POSSIBLE
As the size of the carbon atom is small compared with that of silicon atom, it i
s possible to etch very smaller lines through diamond structural carbon. We can
realize a transistor whose size is one in hundredth of silicon transistor.
2 IT WORKS AT HIGHER TEMPERATURE
Diamond is very strongly bonded material. It can withstand higher temperatures c
ompared with that of silicon. At very high temperature, crystal structure of the
silicon will collapse. But diamond chip can function well in these elevated tem
peratures. Diamond is very good conductor of heat. So if there is any heat dissi
pation inside the chip, heat will very quickly transferred to the heat sink or o
ther cooling mechanics.
3 FASTER THAN SILICON CHIP
Carbon chip works faster than silicon chip. Mobility of the electrons inside the
doped diamond structural carbon is higher than that of in he silicon structure.
As the size of the silicon is higher than that of carbon, the chance of collisi
on of electrons with larger silicon atoms increases. But the carbon atom size is
small, so the chance of collision decreases. So the mobility of the charge carr
iers is higher in doped diamond structural carbon compared with that of silicon.
4 LARGER POWER HANDLING CAPACITY
For power electronics application silicon is used, but it has many disadvantages
such as bulk in size, slow operating speed, less efficiency, lower band gap etc
at very high voltages silicon structure will collapse. Diamond has a strongly b
onded crystal structure. So carbon chip can work under high power environment. I
t is assumed that a carbon transistor will deliver one watt of power at rate of
100 GHZ. Now days in all power electronic circuits, we are using certain circuit
s like relays, or MOSFET inter connection circuits (inverter circuits) for the p
urpose of interconnecting a low power control circuit with a high power circuit
.If we are using carbon chip this inter phase is not needed. We can connect high
power circuit direct to the diamond chip

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