CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 8

BLOCK DIAGRAM.................................................................................. 12

EXPLODED VIEW .................................................................................. 13

SVC. SHEET ...............................................................................................

Copyright © 2010 LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
 SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance Leakage Current Hot Check (See below Figure)

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
AC Volt-meter

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical Good Earth Ground
such as WATER PIPE,
shock. CONDUIT etc.
To Instrument's
0.15 uF
exposed
Leakage Current Cold Check(Antenna Cold Check) METALLIC PARTS
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC 1.5 Kohm/10W
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc. When 25A is impressed between Earth and 2nd Ground
If the exposed metallic part has a return path to the chassis, the for 1 second, Resistance must be less than 0.1 Ω
measured resistance should be between 1 MΩ and 5.2 MΩ. *Base on Adjustment standard
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright © 2010 LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
 SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
Copyright © 2010 LG Electronics. Inc. All right reserved. -4-
Only for training and service purposes
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright © 2010 LG Electronics. Inc. All right reserved. -5-
Only for training and service purposes
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
LGE Internal Use Only
 SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range 3. Test method

This spec. sheet is applied to LCD TV used LP92A chassis. 1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
2. Specification - EMC : CE, IEC
Each part is tested as below without special appointment.

1) Temperature
: 25 ºC ± 5 ºC (77 ºF ± 9 ºF), CST : 40 ºC ± 5 ºC
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage
: Standard input voltage(AC 100-240 V~ 50 / 60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.

4. Module specification(General)
No. Item
1 Screen Size
2 Aspect Ratio
3 LCD Module
4 Operating Environment
5 Storage Environment
6 Input Voltage
7 Power Consumption
8 LCD Module
Specification Measurement Remark
80 cm(32 inch) wide Color Display Module Resolution : 1366*768
16:9
80 cm(32 inch) TFT WXGA LCD
Temp. : 0 deg ~ 40 deg
Humidity : 0 % ~ 85 %
Temp. : -20 deg ~ 60 deg
Humidity : 0 % ~ 85 %
AC 100-240 V~ 50 / 60 Hz
≤ 150 W
80 cm 760(H) x 450(V) x 48(D) Outline Dimension, Unit : mm
(32 inch) 510.75 x 170.25 x RGB Pixel Pitch, Unit : mm
12EEFL Backlight Assembly
Coating 3H

Copyright © 2010 LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. Chroma& Brightness (Optical)
(1) LCD Module
The Color Coordinates check condition
- 50 cm from the surface, Full White Pattern
- Picture mode Vivid
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 400 500 cd/m 2

(W/O PC mode)
2. VIew angle (R/L, U/D) 178/178 degree CR > 10
3. Color Coordinates White X Typ 0.279 Typ
Y -0.03 0.292 +0.03
RED X 0.636
Y 0.335
Green X 0.291
Y 0.603
Blue X 0.146
Y 0.061
4. Contrast ratio 900:1 1200:1
5. Luminance Variation 1.3

6. Component Video Input (Y, PB, PR)

Specification
No. Proposed
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50 Hz
4 720*480 31.47 59.94 27.000 SDTV 480P
5 720*480 31.50 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27.000 SDTV 576P 50 Hz
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45.00 60.00 74.250 HDTV 720P
9 1280*720 37.50 50.00 74.25 HDTV 720P 50 Hz

7. HDMI Input(DTV)
Specification
No. Proposed Remarks
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50 Hz
4 720*480 31.47 59.94 27 SDTV 480P
5 720*480 31.5 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27 SDTV 576P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1280*720 37.5 50.00 74.25 HDTV 720P

Copyright © 2010 LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
 ADJUSTMENT INSTRUCTION
1. Application Range (2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
This specification sheet is applied to all of the LCD TV, LP92A utility Vx.x.x) will be opened
chassis. 2) Click the “Connect” button and confirm “Dialog Box”

2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep AC 100-220 V~
50 / 60 Hz.
(5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.

3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC604, Mstar ISP Utility)
- Using D/L Jig
(2) Input Tool-Option
(3) ADC Calibration - Component
(4) Check SW Version.
3) Click the “Config” button and Change speed
3.2. SET assembly adjustment items I2C Speed setting : 350Khz~400Khz
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Preset CH information
(5) Factoring Option Data input

4. PCB assembly adjustment method

4.1. Mstar Main S/W program download
- Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
4) Read and write bin file.
Click “(1)Read” tab, and then load download file
(XXXX.bin) by clicking “Read”.

1
1
Filexxx.bin

Filexxx.

Copyright © 2010 LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
 1

Filexxx.bin

5) Click “(2)Auto” tab and set as below (1) EDID D/L method
6) Click “(3)Run”. 1) Press the In-start key
7) After downloading, you can see the “(4)Pass” message. 2) Move to the System Control2 and Press the OK( )
3) Move to the EDID D/L and press the right direction
key(G)
4) After about a few seconds, appear “OK’, then complete.
5) Press the OK key( ).
6) Press the EXIT key.

* If TV is Turn On, Check the updated SW Version and

Tool Option.
4.4. ADC Calibration-Component
4.2. Input tool option. - Using External pattern
Adjust tool option refer to the BOM. (1) Required Equipments
- Tool Option Input : PCBA Check Process - Remote control for adjustment
- Area Option Input : Set Assembly Process - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

After Input Tool Option and AC off (2) Process

Before PCBA check, you have to change the Tool option and 1) Change the Input to Component mode.
have to AC off/on (Plug out and in) 2) Input the Component 720P@60 Hz 100 % Color Bar
(If missing this process, set can operate abnormally) YPbPr signal into Component
(MSPG-925F Model: 217 / Pattern: 65)
(1) Profile : Must be changed the option value because being
different with some setting value depend on
module maker, inch and market
(2) Equipment : adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remote control.)
(If not changed the option, the input menu can differ the
model spec.)

Refer to Job Expression of each main chassis ass’y 3) Press ADJ key on R/C for adjustment.
(EBTxxxxxxxx) for Option value 4) Enter Password number. Password is “0 0 0 0”.
[Caution] 5) Select “Auto-RGB” and press OK( ) key.
- Don’t Press “IN-STOP” key after completing the function 6) ADC adjustment is executed automatically .
inspection. 7) When ADC adjustment is finished, this OSD appear
- Don’t connect HDMI cable when downloading the EDID. “COMPONENT-OK”
If the cables are connected, Downloading of EDID could
be failed. (3) Confirmation
1) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)
4.3. EDID Data 0x00 0x02 instruction.
* 32LD310 <HDMI : 256 Byte> 2) We confirm whether “0xF3 (offset), 0xF4 (gain)” address
of EEPROM “0xBC” is “0xAA” or not.
3) If “0xF3”, “0xF4” address of EEPROM “0xBC” isn’t
“0xAA”, we adjust once more.
4) We can confirm the ADC values from “0x06~0x0B”
addresses in a page “0xBC”.

Copyright © 2010 LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
4.5. Check SW Version
(1) Method
1) Push In-star key on Adjust remote control.
2) SW Version check
Check “Main : Vx.xx” - LD310
5. SET assembly adjustment method
5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Country’s Language and
signal Condition.
(2) Equipment : adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remote control.)
Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value.
5.2. Adjustment of White Balance
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm
(Medium data is automatically calibrated by the Cool data)
- Required Equipment
1) Remote control for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV(ch : 9)
(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for auto adjustment)
5.2.1. Connecting diagram of equipment for measuring
(For Automatic Adjustment)
* LP92A Support I2C Interface For ADC/DDC Adjustment.
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
(1) Enter the adjustment mode of DDC
- 22Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-
run pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance
- Enter the white balance adjustment mode with aging
command (F3, 00, 00)
(4) Release the adjust mode of white balance
- Release the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5.3. Adjustment of White Balance
(for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit” key.
3) Change to the AV mode by remote control.
4) Input external pattern (85 % white pattern)
5) Push the ADJ key -> Enter “0000” (Password)
6) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on R/C..
7) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.
8) Adjust three modes all (Cool/ Medium/ Warm) : Fix the
one of R/G/B gain and change the others
9) When adjustment is completed, Enter “COPY ALL”.
10) Exit adjustment mode using EXIT key on R/C.
- 10 - LGE Internal Use Only
 * CASE
First adjust the coordinate far away from the target value(x, y).
1) x, y > target
i) Decrease the R, G.
2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3) x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4) x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G

(4) Standard color coordinate and temperature when using the

CA100+ or CA210 equipment
Coordinate
Mode Temp uv∆
x y
Cool 0.276±0.002 0.283±0.002 11,000 K 0.000
Medium 0.285±0.002 0.293±0.002 9,300 K 0.000
Warm 0.313±0.002 0.329±0.002 6,500 K 0.003

To check the Coordinates of White Balance, you have to

measure at the below conditions.
Picture Mode : User 1
Dynamic Contrast : Off
Dynamic Colour : Off
(If you miss the upper condition, the coordinates of W/B
can be lower than the spec.)

Copyright © 2010 LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
 TX IC603
IR & LED (P201)
IC301 Serial Flash
(16MByte)
EEPROM
HDMI_SCL/SDA
24C02
TMDS
HDMI (JK301) HDMI_DATA
IC602

Only for training and service purposes

MAIN_SCL/SDA EEPROM
for HDCP
(8K)
DSUB_SCL/SD A
RGB_PC (JK102) IC601
SCL/SDA
(SVC Only )
MAIN_SCL/SDA
MAIN SCLAER EEPROM

Copyright © 2010 LG Electronics. Inc. All right reserved.

(64K)
8 LG7871
Miaria8-
(IC604)

COMPONENT_Y/Pb/Pr : 1/0.7Vpp
COMP_Y/Pb/Pr
COMPONENT E-DIM
MNT_OUT TXCE0±
±
(JK100) TXCE1±
±
COMPONENT_L/R : 500mVr ms

- 12 -
COMP_LIN/RIN TXCE2±
±
TXCE3±
±
TXCLKE ± P202
TXCLKO ± P203
TXCO0±
± P204
TXCO1±
±
AV(JK101) TXCO2±
±
HD LVDS connect or

TXCO3±
±
AV_VIN : 1Vpp
AV_VIN
BLOCK DIAGRAM

AV_LIN/RIN : 500mVrms
AV_LIN/RIN

IC501
IC502 AUAMP_SCL/SDA PWM
AUDIO_LOUT/ROUT : 500mVr ms
m AUDIO R_SPK _OUT
AUDIO_L/R OUT NTP3100L
AUDIO_OUT(JK 103) AMP IIS_OUT R_CH
TU401 L_CH
IF VIF SAW
TV TU_MAIN
TUNER Filter L_SPK_O UT
(RF)
SIF SAW SIF PANEL_STATUS
Filter
LIPS
CONTROL (P200) OPC_OUT
TUNER_SCL/SDA RL_ON/I-DIMMING/DISP_EN

LGE Internal Use Only

 EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

400

520
805

540
530

806
801

803
804

550

900
LV1

802

A10
200T

200

A2
200N

120
500
300

510

Copyright LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
 INPUT
JK101
Component/AV In PPJ228-01

9A [GN]E-LUG

4A [GN]O-SPRING-S
COMP_Y
ZD103
SD05 R116
ZD104 75

3A [GN]CONTACT-S SD05

9B [BL]E-LUG

8B [BL]C-LUG-S
COMP_PB
D103
SD05 R117
75

9C [RD]E-LUG_1

CVBS_VIN
[YL]O-SPRING-L 5F
ZD101
R110 SD05
75 ZD102
SD05
[YL]CONTACT-L 6F 8C [RD]C-LUG-S
COMP_PR
D104
SD05 R118
75

9D [WH]E-LUG

CVBS_LIN R103
[WH]C-LUG-L 7G 8D [WH]C-LUG-S R121
COMP_L
10K 10K
D105 READY
READY R101 R108 D101 30V R119 R123 C108
C106 12K 220K 30V 220K 12K 560pF
560pF
50V
9E [RD]E-LUG_2 50V

CVBS_RIN
R104
[RD]O-SPRING-L 5H 4E [RD]O-SPRING-S R122
COMP_R
10K 10K
D106 READY
READY R102 R109 D102 30V R120 R124 C109
C107 12K 220K 30V 220K 12K 560pF
560pF
50V
[RD]CONTACT-L 6H 3E [RD]CONTACT-S 50V

AV Audio Out HOTEL_OPT

R129
0 HOTEL_OPT
SPK_R+_HOTEL AV Video Out
R130
0 HOTEL_OPT
SPK_R-_HOTEL R105 JP101
R131
0 AUDIO_R 75

1 [RD]1P-CAN
NON_HOTEL_OPT
R128
2 1K MNT_ROUT 12V_AUDIO
NON_HOTEL_OPT

[RD]O-SPRING C104
C102 RT1C3904-T112 10uF
D107
30V 5.6nF
50V
R125
0
C
E
B
Q105 16V
MUTE_LINE GAIN X 4
3 [RD]CONTACT ISA1530AC1 R111
POP NOISE Q101 470
C B E B
E C RT1C3904-T112
Q102
Q103 C R114
4 [WH]1P-CAN RT1C3904-T112
E
B
47

NON_HOTEL_OPT
JP102 R106 MNT_VOUT_T
R127 220
5 1K MNT_LOUT READY
NON_HOTEL_OPT

[WH]C-LUG-L RT1C3904-T112 C105

C103 10uF R107 R112
D108 Q106
30V 5.6nF R126 C 16V 402 68

PPJ200-01
50V 0
E
B MUTE_LINE
JK102 C
POP NOISE

E B
Q104
RT1C3904-T112

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX61462901 2009/08/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. INPUT 1 7

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 LVDS/IR

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKE-

5V_12V_LCD P204
P203 5V_12V_LCD SMAW200-28C2

HD(26/32") FF10001-30
26_32inch
19_22inch
HD(19/22")
1
NON_LGDV5
1 2
R210 0
NON_LGDV5
2 3
R211 0 External VBR
OPC_ENABLE
3 E_DIM 4
R224 0
OPC_ENABLE
4 OPC_OUT 5
R222 0 OPC_OUTPUT
5 6
TXCE3+
6 7
TXCE3-
7 8

8 9
TXCLKE+
9 10
TXCLKE- TXCE3+
11
10
TXCE3-
12
11
TXCE2+
13
12
TXCE2- TXCLKE+
14
13
TXCLKE-
15
14
TXCE1+
16
15
TXCE1- TXCE2+
17
16
TXCE2-
18
17
TXCE0+
19
18
TXCE0- TXCE1+
20
19
TXCE1-
21
20
22
21
TXCE0+
23
22
TXCE0-
24
23
25
24
26
25
27
26
28
27
3.3V_M
28

29 JEIDA
R221
30 4.7K

31

VESA
R220
0
3.3V_M

OPC_ENABLE
R201 3.3V_M
470
OPC_ENABLE OPC_ENABLE
RT1C3904-T112
Q201 R213
READY OPC_ENABLE 4.7K
R202 C R205
0 B OPC_EN
E 1K

CONTROL
SMAW200-03
P200
KEY1
L206
C209
IR & LED 12507WS-08L
P201
8OHM
100pF
L207 50V
L204 KEY2
KEY1 1 8OHM
C212 KEY1
8OHM 100pF
L205 50V 1
KEY2 2 READY
ZD204
8OHM 5.6B
C210 C211 3
KEY2
100pF 100pF 2
50V 50V MBW3216-501TF
READY
L203
ST_5V ZD205
500-ohm C207 C208 5.6B
0.1uF 100pF GND
50V 50V 3
BG2012B080TF
L202
IR READY ST_5V
8OHM C205
C202 47pF 4
0.1uF
50V 50V READY
ZD203
5.6B
GASKET for ESD Improvement
GND
5

3.3V_M IR
6 32inch_GASKET 32inch_GASKET 32inch_GASKET 32inch_GASKET
R206 GAS1 GAS2 GAS3 GAS4
ZD201
4.7K 5.6B MDS61887706 MDS61887706 MDS61887706 MDS61887706
E KST3906-MTF
R208 Q202 LED_B
LED_B 7
4.7K B READY
BG2012B080TF ZD202
READY C 5.6B
R209 L200
0 READY C206
LED_R
8OHM 8
C203 100pF 26inch_GASKET 26inch_GASKET 26inch_GASKET 26inch_GASKET
ST_3.3V 0.1uF 50V READY GAS1-*1 GAS2-*1 GAS3-*1 GAS4-*1
50V ZD200
5.6B MDS61887701 MDS61887701 MDS61887701 MDS61887701
R204 9
4.7K
R203 BG2012B080TF
10K L201
GND
C READY 8OHM C204
C201 100pF
R212 0.1uF 50V
LED_R 50V
10K B
Q204 E
RT1C3904-T112

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX61462901 2009/08/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. LVDS/IR 2 7

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 HDMI

HDMI ฀
2SC3052
C Q301
READY B R313
R302 R301 HPDCTL
1K 10K 10K
E
HD_5V

R320
4.7K
R323
HDMI_5V_DET
22 10K
R321
10K
19

18

17
R303 10 HDMI_SDA
16
R304 10 HDMI_SCL
15

14

13
R305 5.6 TXCLK-
12

11
R306 5.6 TXCLK+
10
R307 5.6 B_TX0-
9

8
R308 5.6 B_TX0+
7
R309 5.6 G_TX1-
6

5
R310 5.6 G_TX1+
4
R311 5.6 R_TX2-
3

2
R312 5.6 R_TX2+
1

20

21

JK301
QJ41193-CFEE1-7F

P301 PC(Control)
KCN-DS-1-0089
6630TGA004K

ENKMC2838-T112
D302 A1
MMBD301LT1G
D301 C
5V_M 6 RED_GND

30V A2
IC301 HD_5V GND_2
AT24C02BN-10SU-1.8
C302
0.1uF 1 11
50V
R327 R329 R331 RED
10K 4.7K 4.7K
A0 VCC
1 8 GREEN_GND
7
DDC_DATA
A1
2 7
WP R322
DDC_CTL 2 12 DSUB_SDA
100
GREEN D303
A2 SCL R324
3 6 HDMI_SCL 30V
100 8 BLUE_GND
GND SDA R325
4 5 HDMI_SDA H_SYNC
100 3 13
READY BLUE
R328
0
9 NC

V_SYNC
4 14
GND_1

10 SYNC_GND

DDC_CLOCK
5 15 DSUB_SCL
DDC_GND D304
30V

16 SHILED

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX61462901 2009/08/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. HDMI/RGB 3 7

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 TUNER

ONLY_TA
TU401
TDTC-G427D

5V_TUNER D401 30V

R418 R423 12K

1 NC C413
100
C417
TU_AGC
0.1uF 0.1uF
16V 16V

2 B1_5V R409
0
C403 C406
0.01uF 10uF
50V 10V 5V_M 5V_M

3 NC
R432 R433
4.7K 4.7K

4 SCL R415
TUNER_SCL
C411 47
47pF
50V

5 SDA R414
TUNER_SDA
C412 47
47pF
5V_TUNER 50V

6 B2_5V Near the pin R408

0
C404 C407
0.01uF 10uF
50V 10V

7 NC
VIF_12V

R435 R405

8 AS 330
R402
0

READY 330
R401 C405 C402
0

9 NC
0.01uF 47uF
L401 R411 50V 25V
820nH 680

Layout placement
10 NC READY
C755
22pF
50V
Close to Mstar IC
5V_M

ONLY_TA

11 AIF C409 R410 R413 C414

TU_SW_VIF
R419
6.8K
INPUT 1
L403
K7257M
4 OUTPUT1
READY
R426 0.01uF 1.2K 0 0.01uF
VIF1
50V 50V TU_SW_VIF TU_SW_VIF
R406 R420 D403 READY

12 AIF 0
C401 R404
6.8K
B
C
BFS17W
Q401
6.8K KDS114E(KEC)
35V TU_SW_VIF
SWITCHING_INPUT 2 L404
2.2uH

0.01uF 0 R429 5 OUTPUT2

50V R407
1K E
5V_M 0 VIF2
READY READY 3 CHIP_CARRIER
C410 NON_TU_SW
13 0.1uF
16V
R412 R427
22 22
5V_M TU_SW_VIF
R425
3.3K
R430
0

R424 C TU_SW_VIF
10K TU_SW_VIF 2SC3875S(ALY)
R417
Layout placement TU_CTL_VIF 10K
B Q403

GND Close to Tuner E

5V_M

ONLY_TA
TU_SW_SIF L402
R421 K9653D
6.8K
ONLY_MA C415 INPUT 1 4 OUTPUT_1
TU401-*1
TDVH-H426F 0.01uF
SIF1
50V TU_SW_SIF TU_SW_SIF
R422 D402 SWITCHING_INPUT 2
6.8K KDS114E(KEC)
35V
ANT_PWR 5V_M TU_SW_SIF
1 R428 5 OUTPUT_2

2
B1[+5V]
0 SIF2
5V_M TU_SW_SIF 3
NC[RF_AGC] R416
INPUT-GND/CHIP_CARRIER_GND
3 NON_TU_SW
3.3K
SCL R431
4 R436 0
SDA 10K C TU_SW_SIF
5 TU_SW_SIF 2SC3875S(ALY)
R403 B Q402
6
B2[+5V] TU_CTL_SIF 10K
NC[VTU] E
7
AS
8
NC_1
9
NC_2
10
NC_3
11
AIF
12
ONLY_MA ONLY_MA
L403-*1 L402-*1
13 M9370M
M3953M
INPUT 1 4 OUTPUT_1 INPUT 1 4 OUTPUT_1
SHIELD

PAL-BG,DK,I NTSC-M
INPUT-GND 2 5 OUTPUT_2 INPUT-GND 2 5 OUTPUT_2
TU_CTL_VIF High Low CHIP_CARRIER-GND
3 3 CHIP_CARRIER-GND
TU_CTL_SIF High Low

R428 R429 R430 R431 L403 L402

NTSC X X O O M3953 M9370

PAL/MULTI O O X X K7257 K9653
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX61462901 2009/08/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. TUNER 4 7

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 AUDIO R550 R516 R518 C534
MLB-201209-0120P-N2
L505
120-ohm
SPK_L+
24V_15V_NTP 18 C529 0.01uF
READY 18 18 0.1uF R520 50V
D501 L503 50V 4.7K
100V C521 DA-8580
1000pF 2S 2F
R522
50V 3.3
C527
C516 C517 0.47uF
0.1uF 10uF C522 1S 1F 50V
50V 35V 1000pF R523
READY 50V 3.3
D502 EAP38319001 C530
100V 0.1uF R521 C535
R551 R517 R519 50V 4.7K 0.01uF MLB-201209-0120P-N2
18 18 18 50V L506
120-ohm
SPK_L-
C520
22000pF
50V
C552 C515
0.1uF 0.1uF C523
C512 50V 50V P501
1uF
25V SMAW250-04
22000pF
50V

PGND1A_2

PGND1A_1

PVDD1A_2

PVDD1A_1
R-SOUND-N

PVDD1B_2
PVDD1B_1

PGND1B_2

PGND1B_1
OUT1A_2

OUT1A_1
1

OUT1B_2

OUT1B_1
SPK_R-

BST1B

VDR1B
ST_3.3V R-SOUND-P
2
SPK_R+
L-SOUND-N

56

55

54

53

52

51

50

49
48

47

46

45

44

43
R505 3
10K SPK_L-
C RT1C3904-T112 L-SOUND-P
4
3.3V_M R504 B Q501
BST1A 1 NC SPK_L+
10K HIGH : ACTIVE 42
LOW : RESET
READY E VDR1A 2 VDR2A
R502 41
4.7K READY
R503 R506 RESET 3 BST2A
SW_RESET 0 100
C507 C509
40
READY AD 4 PGND2A_2 C526 C525
R501 1000pF 1uF 22000pF 1uF
22K 50V 25V 39 50V 25V
DVSS_1 5 PGND2A_1
VSS_IO 6
Main AMP 38
OUT2A_2
MLB-201209-0120P-N2
L507
37
120-ohm
SPK_R+
R508 CLK_I 7 IC501 OUT2A_1 R534 R524
18 18
R526
18
C542
0.01uF
I2S_MCLK 100
36 READY
D503
C540
0.1uF R530
50V
VDD_IO 8 NTP-3100L PVDD2A_2 C531
0.1uF
100V L504
DA-8580
50V 4.7K R532
3.3V_M 35 50V
C536 2S 2F 3.3
1000pF
C508 DGND_PLL 9 50V C539
C504 0.1uF PVDD2A_1
1000pF 50V 34 0.47uF
C501 C537 1S 1F 50V
50V
100pF AGND_PLL 10 PVDD2B_2 1000pF
R533
50V R507 33 50V EAP38319001
C541 3.3
3.3K READY 0.1uF R531
LFM 11 32 PVDD2B_1 C528 D504 50V 4.7K C543
0.1uF 100V R535 R525 R527 0.01uF
50V 18 18 18 50V
MLB-201209-0120P-N2
L502 AVDD_PLL 12 L508
31 OUT2B_2 SPK_R-
120-ohm 120-ohm
C503 C505
10uF 0.1uF DVDD_PLL 13 30 OUT2B_1
16V 50V
1.8V_M
TEST0 14 29 PGND2B_2
L501

120-ohm
C502 C506
10uF

15

16

17

18

19

20

21

22

23

24

25

26

27

28
0.1uF
16V 50V
24V_15V_NTP

DVSS_2

DVDD

SDATA

WCK

BCK

SDA

SCL

MONITOR_0

MONITOR_1

MONITOR_2

FAULT

VDR2B

BST2B

PGND2B_1
READY C533 C538
C532 0.1uF 10uF
0.1uF 50V 35V
C519 C524 50V
1uF
C510 C511 25V
22000pF
1uF 0.1uF 50V
10V 50V

R509 100
I2S_SDO R510 100
R515
MULTI_PW_SW
0
I2S_WS R511 100
C518
1000pF
HIGH : ACTIVE
LOW : MUTE
50V
I2S_SCK R512 100
AUAMP_SDA R513 100
HOTEL_OPT
R514
AUAMP_SCL READY READY 0 AMP_MUTE_HOTEL
R528 R529 C514
4.7K 4.7K C513
33pF 33pF
3.3V_M 50V 50V

12V_AUDIO
AMP:GAIN X 4 IC502
HOTEL_OPT
C544 RT1C3904-T112 R541-*1 15K
0.1uF C Q502
50V B R538
1 OUT1 LM324D OUT4 14
C546
1K
C548 NON_HOTEL_OPT
Chinese Hotel Option
MNT_LOUT E 6800pF
50V
33pF
50V
R541
12K
R536 24V_15V_NTP
4.7K
2 INPUT1- INPUT4- 13 HOTEL_OPT
HOTEL_OPT
P502
R549 12505WS-09A00
R546
6.8K HOTEL_OPT 0
C551
0.1uF
50V 1

MNT_L_AMP
R542
3 INPUT1+ INPUT4+ 12
5.6K
2
AUDIO_R
12V_AUDIO HOTEL_OPT
R548
3
SW_RESET
4 VCC GND 11 0

C550 4
0.01uF 3.3V_M
50V
HOTEL_OPT 5

MNT_R_AMP
R543
5 INPUT2+ INPUT3+ 10 R545
10K
5.6K
6
C HOTEL_OPT

HOTEL_OPT HOTEL_OPT RT1C3904-T112

R540 B Q504
12V_AUDIO
R544-*1 15K AMP_MUTE_HOTEL 200
7
6 INPUT2- INPUT3- 9 E
C549 NON_HOTEL_OPT
R544 R547 8
33pF 6.8K
50V 12K
C545 RT1C3904-T112
0.1uF C Q503 9
50V SPK_R+_HOTEL
B R539
7 OUT2 OUT3 8 10
1K
E C547 SPK_R-_HOTEL
MNT_ROUT 6800pF
50V
R537
4.7K

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX61462901 2009/08/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. AUDIO 5 7

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 ST_3.3V ST_3.3V ST_3.3V

MAIN(MARIA8)

MUTE_LINE
TXCLK-

SW_RESET

HDMI_SDA
B_TX0+

B_TX0-

TXCLK+

I2S_MCLK

POWER_SW

HDMI_SCL
HPDCTL

G_TX1+

G_TX1-
R_TX2-

DSUB_SDA

DSUB_SCL
HWRESET
I2S_SDO
I2S_SCK
I2S_WS
E_DIM

I_DIM

LED_R
KEY1
KEY2

4.7K
4.7K

4.7K

4.7K

4.7K
IR
R663
4.7K
VDDC

AVDDP1

AVDDP2

READY R648

R674
R666

R672
R668
AVDD_ADC

100

100
100

100
C656 0.1uF
C667 0.1uF

22
100

100

22
100
0
SERIAL FLASH 2M 3.3V_M

READY
0.1uF
0.1uF

READY
R657
R670

R647
R671

R675
R669

R673
R665

R667
R684
C659
C665
IC603
MX25L1605AM2C-15G

AVDD_ADC_3

AVDDP_1_7

DDCD_SDA
DDCD_SCL

DDCA_DAT
DDCA_CLK
CS# VCC

HOTPLUG

AVDDP_2
R608 R610 1 8

VDDC_4

GPIOM1
AUMCKO

WAKEUP
10K SPI_CZ

RXA2N

RXA1P
RXA1N

RXA0P
RXA0N

RXACP
RXACN

GND_7

AUSCK
AUSD0

RESET
100

PWM3
PWM2

AUWS

SAR0
SAR1
SAR2
IRIN
CEC

INT
C606
R611 SO HOLD# 0.1uF
SPI_DO 2 7 16V
100

156

155
154
153
152

151
150

149
148
147
146
145
144

143
142

141
140
139
138
137
136
135
134
133
132

131
130
129
128
127
126
125
R607 WP# SCLK R620
3 6 SPI_CLK
FLASH_WP
RXA2P AVDDP_1_6 100 100
R_TX2+ 1 124 AVDDP1
C644 GND SI R622
AVSS_ADC_1 GND_6 0.1uF 4 5 SPI_DI
2 123 100
BIN1 122 LVA0P
3
SOGIN1 121 LVA0N
4
GIN1 120 LVA1P
5
R640 68 C629 0.047uF GIN1M LVA1N
RIN1
6 119
EEPROM(A0)
LVA2P

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKE-
7 118
VSYNC1 LVA2N IC601
8 117 AT24C64AN-10SU-2.7 3.3V_M
AVDD_ADC_1 LVACLKP
AVDD_ADC C641 0.1uF
9 116
A0 VCC
HSYNC0 LVACLKN 1 8 3.3V_M
10 115 C602
BIN0 LVA3P 0.01uF
R636 33 C621 0.047uF 114 A1 WP 50V
COMP_PB 11 2 7
GIN0M R697 R696
R641 68 C630 0.047uF 113 LVA3N 4.7K 4.7K
12 A2 SCL R615
COMP_Y R637 33 C622 0.047uF GIN0
13 112 GND_5
C662
3 6
22 MAIN_SCL
0.1uF
SOGIN0 AVDDP_1_5 16V GND SDA R616
R638 0 C623 1000pF 14 111 AVDDP1
TXCE0-
4 5
22 MAIN_SDA
R639 33 C624 0.047uF RIN0 110 LVB0P
COMP_PR 15
VSYNC0 TXCE0+
109 LVB0N
16
C651 0.1uF
AVDD_ADC_2 TXCE1-
AVDD_ADC 108 LVB1P
17
CVBS3/C1 TXCE1+
R629 33 C616 0.047uF 107 LVB1N
READY 18
READY
CVBS2/Y1 TXCE2-
R630 33 C617 0.047uF 106 LVB2P
READY 19
READY
R631 47 C618 0.047uF
READY
CVBS1/C0
20 IC604 105 LVB2N TXCE2+
HDCP EEPROM(A8) 3.3V_M
READY
CVBS0/Y0 TXCLKE-
LVBCLKP
CVBS_VIN R632 33 C619 0.047uF
21 MARIA8(LGE7871) 104
VCOM0 TXCLKE+
R633 68 C620 0.047uF 103 LVBCLKN
22 C603
TXCE3-
IC602 0.1uF
CVBSOUT2 102 LVB3P CAT24WC08W-T 16V
23 R602
CVBSOUT LVB3N TXCE3+ 4.7K
MNT_VOUT_T 24 101 A0 VCC
1 8
AVSS_ADC_2 100 AVDDP_1_4 AVDDP1
25 R614
C648 0.1uF C657 A1 WP R655 4.7K READY
R653
AVDD_MPLL GND_4 0.1uF
AVDD_MPLL 26 99
C666
2 7
100 0 DDC_CTL
C612 27pF R642 200 XTAL_OUT VDDC_3 0.1uF
27 98 VDDC A2 SCL R617
14.31818MHz R628 XTAL_IN TXD0/GPIOD0
3 6
22 MAIN_SCL
X601 1M 28 97 MAIN_SCL
VSS SDA R618
C613 27pF AVSS_MPLL
29 96 RXD0/GPIOD1 MAIN_SDA
4 5
22 MAIN_SDA
READY
AVDD_VIF_1 95 RXD1/GPIOD2 AUAMP_SDA
R658
Seperate with IC ground AVDD_VIF C646 0.1uF
30 0

AVDD_VIF AVDD_VIF_2 94 TXD1/GPIOD3 ST_3.3V

31 AUAMP_SCL
C652 0.1uF
L606 600 AVSS_VIF_1 GPIOD4
32 93 OPC_EN 3.3V_M
READY
VIFIP 92 GPIOD5 R677 100 R692 4.7K
VIF2 33
R693 4.7K L602 R676 L604
VIFIM 91 AUMUTE/GPIOD6 R685 100 3.3V_M AVDDP1 ST_3.3V AVDDP2
VIF1 34 MUTE_LINE
120-ohm 0
C638 120-ohm C650 C664
SIFIM GPIOD7 10uF 10uF 0.01uF
5V_M SIF1 35 90 FLASH_WP 10V R683 10V 50V
AVDD_ADC
SIFIP 89 SPI_CK 0
SIF2 36 SPI_CLK
L605
L601 AVSS_VIF_2 R686 ST_3.3V AVDD_MPLL
120-ohm 88 SPI_CZ AVDD_VIF
R625 C615 37 SPI_CZ
0 120-ohm C649 C663
C614 10uF 0.01uF
10uF 0.1uF VR27
R639 C607 5.6K C608 C610 16V 87 SPI_DI READY 10V 50V
1uF 0.1uF 0.1uF 100pF
10V 38 SPI_DI R691
10V 16V 16V 50V AVDD_VIF_3
AVDD_AUSDM
AVDD_VIF 86 SPI_DO 0
C645 0.1uF 39 SPI_DO L603
R662 1.2V_VDDC_M8 VDDC
TAGC 85 GPIO/SPI_SIO2 R678 100 120-ohm
TU_AGC 40 ST_3.3V C640
4.7uF
C643
10uF
C654
C642 0.1uF 0 0.01uF
AVDD_AUSDM GPIO/SPI_SIO3 R681 100 6.3V 10V 50V
AVDD_AUSDM 41 84 DISP_EN

C625 2.2uF LINE_IN_0L 83 GPIO_5 R682 100 PANEL_ON

COMP_L 42
C626 2.2uF LINE_IN_0R 82 GPIO_4 R661 100
COMP_R 43 RL_ON
C627 2.2uF LINE_IN_1L 81 GPIO_3 R664 100
CVBS_LIN 44 JTP-1127WEM
CVBS_RIN C628 2.2uF LINE_IN_1R
45 80 GPIO_2 R649 100 HDMI_5V_DET
ST_5V
1
SW601
3
RESET
LINE_IN_2L 79 GPIO_1 R651 100 C611
46 DDC_CTL 4.7uF
10V 2 4
R621
HWRESET
47

48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78

100
R624 C604
D603
LINE_IN_2R
AUCOM
AUVRM
AUVRP
AUVAG
AVSS
DAC_OUT_L
DAC_OUT_R
LINE_OUT_L
LINE_OUT_R
VDDC_1
GND_1
AVDDP_1_1
GPIOD10
GPIOD11
GPIOB13
GPIOB12
GPIOB11
GPIOB10
GPIOB9
GPIOB8
GPIOB3
GPIOB2
GPIOB1
GPIOB0
AVDDP_1_2
GND_2
VDDC_2
PWM1
PWM0
GND_3
AVDDP_1_3

33K 0.1uF
KDS181 16V

3.3V_M
100

100
0.1uF C631

100

100

ST_5V
READY
P_24V_SMALL_15V
R660

0.01uF

R601
R659

0.1uF

0.1uF
R634

R635
0.01uF

KDS181 R623
0.1uF

0 D602
ISA1530AC1 10K
KDS181 Q601
MULTI_PW_SW
0

0
0

D601
C660

C647

R609 R612 C
1K

1K

C658

RT1C3904-T112
C661
C653

READY READY P_12V_SMALL_15V R605 R603 150 2K R619 B Q602

R654
R652

R689
R650

R698
R656

1K R679 R687 R613

1K 0
R644

1K
R645

4.7K 4.7K 1K
10K
VDDC

19_22inch READY E
R604 R606 C601 C605
AVDDP1

AVDDP1

VDDC

AVDDP1

READY 1K 10K 47uF 2.2uF

READY 25V 16V
0.1uF

4.7uF

R690 R699 R680 R688

C633 10uF

C636 0.01uF

C637 0.01uF
1uF

1K 1K 4.7K 4.7K
22K
22K
C635
C632

C634

26_32inch
R606-*1
R643

R646

TUNER_SCL

TUNER_SDA

PANEL_STATUS

LED_B
TU_CTL_VIF

TU_CTL_SIF

20K
MNT_L_AMP

MNT_R_AMP

26_32inch
Q603
C RT1C3904-T112
26_32inch 26_32inch
R627 R626
Close to IC as close as possible
RL_ON 0 33K
B
READY
C609 E
4.7uF
10V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX61462901 2009/08/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MARIA8 6 7

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 Power STAND_BY VOLTAGE
5V_M -> 1.2V_VDDC_M8, 3.3V_M, 1.8V_M

P701 BD9130EFJ-E2
FM20020-24 IC702
P_5V
ADJ EN R740
1 8
ST_3.3V 19_22inch 10K
26_32inch
READY R719 P703 R726 VCC PVCC
R702 NC Power ON 2.2K 5V_M 2 7
1 2 26_32inch
26_32inch
R758 SMAW200-11 0 C716
0 2SC3875S
26_32inch
10K
ITH SW
10uF L707
GND 3 GND 3 Q702 R763 10V
4 1
2 RL_ON C715
10uF
3 6
2.2uH READY R2
1.2V_VDDC_M8
47K READY READY C726 C727 C728 R744
GND GND R762 10V R730 R739 C747 2K OUT:1.27V
5 6 10K 15V 12K GND
4 5
PGND
3.3
0.1uF
16V 1uF
25V
10uF
10V
10uF
10V
1
5.2V 5.2V READY
P_5V 7 8 C717 MAX 2A C725 R745
P_5V 560pF 2200pF 3.3K
5.2V 5.2V 50V 50V R1
9 10 15V
2
GND
11 12 GND V0 = 0.8*(1+(R2/R1))
12V 13 12V GND
P_12V_SMALL_15V 14 P_12V_SMALL_15V
3 R753
3.3V_M
GND GND 19_22inch 0
15 16 R723
0
24V 24V GND IC704 AP1117EG-13
P_24V_SMALL_15V 17 18 P_24V_SMALL_15V 4 AZ1085S-3.3TR/E1 IC705
NTP,AUDIO DSP
NC Inverter ON R738 INPUT 3 MAX 3A 2 OUTPUT OUT:3.3V IN OUT OUT:1.85V
19 20 0
3
MAX 1A
2 1.8V_M
1 1 READY
A.Dim Error Out 5V C723 C729 C733 C735 C742 C744 C746
21 22 5 0.1uF
50V
ADJ/GND 100uF
16V
10uF
10V
0.1uF
50V ADJ/GND R1 R750
120
10uF
10V
0.1uF
50V
1uF
25V
NC 23 PWM Dim
24 5V_M
5V
6 R2 R751
56
3.3V_M
R712
25 3K
NC
V0 = 1.25*(1+(R2/R1))
R755 R707 7
26_32inch 10K 2SC3875S
Q701 0
R713 3
DISP_EN 2 NC
10K 1 8
MULTI VOLTAGE
Inverter_ON
9 **Switch 12V:P12V, P5V -> 5V_12V_LCD **Switch 5V:P5V -> 5V_M
PWM_Dim
10 26_32inch
L706
P_12V_SMALL_15V Q705
120-ohm SI4925BDY
A.Dim 19_22inch EBK32753101
11 R733-*1
19_22inch/Sharp32 MLB-201209-0120P-N2
10K
L705 S1 1 8 D1_2 L708
Non Sharp32 P_5V 5V_12V_LCD
R722 R704 Sharp32 120-ohm C721 120-ohm
R721 READY R732 1uF C731 C745 C748
0 0
0 C718 33K 25V G1 2 7 D1_1 0.1uF R747
4.7K
R749
4.7K
R752
4.7K 100uF 0.01uF PANEL
68uF 50V 16V 50V
35V
READY ST_3.3V 26_32inch
R725 R706 R733 S2 D2_2
I_DIM 10K 0 R756 R765
33K
C719
3 6
C RT1C3904-T112
C706 10K 10K Q703 1uF
2.2uF R764 B 25V G2 D2_1
16V 4 5
C 10K
R729 B E
PANEL_ON 10K Q706
DC_DIM READY
R727 E RT1C3904-T112
R709-*1
NON_CMO32
10K
1K R705
0
OPC_DISABLE PWM_DIM CMO32 Non Sharp32
R715 R709 R708 R711 R724 P_5V 5V_M
E_DIM 1K 100 0 4.7K 0 PANEL_STATUS R734
OPC_DISABLE
19_22inch/Sharp32 Non Sharp32
22K C734 C737
READY R710 C702 10uF 0.01uF
R716 C701 0 0.47uF 10V 50V
6.2K 2.2uF 25V
16V R735
1.6K
C
RT1C3904-T112
OPC_ENABLE R728 B Q704
R714 POWER_SW
OPC_OUT 1K
10K
E
OPC_ENABLE
R717
6.2K

TUNER VOLTAGE
**DC-DC CONVERTER IC706
AP1117EG-13

P_5V
L703
ST_5V P_24V_SMALL_15V
L702
24V_15V_NTP
12V->5V_TUNER C740 C741 C743
IN 3
1
2 OUT
READY
5V_TUNER

120-ohm 500 10uF 10uF 0.1uF R759 C749

C705 C709 C711 C703 C707 C712 16V 16V 16V ADJ/GND 110 0.1uF
10uF 0.01uF 0.01uF 68uF 0.01uF 0.1uF 16V
16V 50V 50V 35V 50V 50V
V0 = 0.8*(1+(R1/R2)) OUT:6.8V R757
330
C732
AP2121N-3.3TRE1 100uF
26_32inch 16V
IC701 R741 5V_M
R718 L701
VIN 3 2 VOUT 10K
ST_5V MAX 300mA
ST_3.3V P_12V_SMALL_15V 12V_AUDIO
0 READY 120-ohm
1 C710 C713 C704 C708 READY 19_22inch
GND 10uF 0.01uF C714 47uF 0.01uF C753 MP2212DN R748
10V 25V 1uF 25V 50V 100pF R1 R736 IC703
25V 43K 10
50V
26_32inch 19_22inch
L710 26_32inch READY FB 1 8 EN/SYNC R743 C738
VIF_12V C724 R737 MAX 3A 2K 0.1uF
560pF R2 5.6K 50V
120-ohm 19_22inch 50V
READY D701 50V GND 2 7 SW_2
C754
5V_M
Power indicator
ST_5V
10uF
16V 19_22inch
R761
0 P_12V_SMALL_15V
CIC21J501NE
L704 26_32inch
R731 IN 3 6 SW_1
L709
5V_M 19_22inch 500 0 3.6uH R746
AS7812ADTR-E1 C720 C722 10
IC707 10uF 10uF BS 4 5 VCC
19_22inch 25V 25V
R760 INPUT 1 3 OUTPUT C730 C736
R701 R703 1uF 0.1uF
10K 1.2K 0 2 19_22inch 19_22inch C739 25V 50V
C752 C751 0.47uF
GND 1uF 0.1uF 50V
25V 50V
R742
SAM2333
LD701 0

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX61462901 2009/08/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. POWER 7 7

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 DESIGN CONCEPT

H5 (MSTAR) BIG BANG (MSTAR)

BIG-BANG

Module(HD/FHD) Speaker Module(HD) Speaker

Decoder for PIP

Audio Amplifier Audio Amplifier
(Digital) (Digital)
MSTAR NPT3000A MSTAR NPT3100L
(Romeo2) Hotel speaker out (MARIA8) Hotel speaker out

USB/MPEG
Audio S/W

USB
HDMI SW

Digital Inputs RS232C Analog Inputs Digital Inputs Analog Inputs

HDMI 1,2&3* RF/AV/COMPONENT HDMI RF/AV/COMPONENT

/RGB/S-Video
/RGB/S Video
Option

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 DESIGN CONCEPT

TV Minimalist & Value Maximizers

Spec
H5_Entry (HD) Maria8 (HD)

Main Chip MSTAR Lomeo2(LG6891DD) MSTAR Maria8(LGE7871)

Module WXGA (VITIAZ 3) WXGA (VITIAZ 4)

PSU PSU PSU(19”/22” Lips)
PCB Size 206 x 121.5 (4 Layer) 206 x 90.5 (2 Layer)
PIP Y N

1080p input support Y(HDMI/Component) N (Support up to 720p for Component/HDMI )

1080p Panel support N N

AV Output Y X (Only Support AV Audio Output)

Hotel Speaker Out Optional Optional
HDMI 2EA 1EA
Component 2EA(22”:1EA) 1EA
AV 2EA 1EA
S-Video 1EA X

RGB_PC 1EA X

Optional
p X
RS 232
RS-232
(26/32/37/42/47LG3R:Must)

USB (Function) N X

USB(D/L SVC) N X
Tuner 1EA 1EA

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 DESIGN CONCEPT

Item Detailed Item H5 BigBang

UI OSD Font Type GUI Font Type GUI

Setup Program Edit Favorite Channel: supports 8 favorite Favorite Channel: supports 8 favorite channel
channel

Picture Picture Mode Vivid/Standard/Cinema/Sport/Game/User1/ Vivid/Standard/Cinema

User2 (In Vi
Vivid/Standard/Cinema,
id/Standard/Cinema Each items support
s pport
User Mode)

Advanced Picture Mode value can’t be changed Picture Mode value can be changed for all mode
Control (except user mode)

Audio Sound Mode SRS TSXT/Clear Voice/Standard/ Standard/Music/Cinema

Music/Cinema/Sport/Game/User (In Standard/Music/Cinema,
Support Treble & Bass setting for all input)

Clear Voice Sound Mode 하위 위치함 Not Support

Input Input List appearance in vertical box Input List appearance in vertical box

PIP Available Not Available

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 ISP METHOD

ISP Program Download Method

1. Unzip H5 Mstar Program.zip file to HDD

H5 Mstar
Program.zip

2 PLUG DownLoad JIG to PC with USB Cable,

2. Cable then JIG RED LED on.
on

USB Cable to PC

Move Switch
tto th
the L
Left-end
ft d
&
Right RED LED On

PLUG USB Cable

RGB(D-Sub) Cable to VSC(H5 TV)

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 ISP METHOD

3. After a few seconds later, new HardWare setup wizard window will pop up. – Ignore this
window (No Need to push anything).
g install DownLoad Program,
You’ll see this window several times until finishing g , but no need
to push anything for this window.
After finishing Installation, this window will be disappeared.

4. Execute Setup.exe in DB07-6 driver directory.(The location of directory can be different.)

D bl Cli
Double Click
k!

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 ISP METHOD

5 P
5. Push
h Next(5-1),
N t(5 1) S Select
l t appropriate
i t Directory
Di t Path
P th and
d Push
P h Next(5-2),
N t(5 2) and
d Push
P h Next(5-3).
N t(5 3)

(5-1) Click ! (5-2) Click ! (5-3) Click !

6. While installation, Warning Windows pop up, then push continue.

(6-2) Click ! (6-3) Click !

(6 4) Cli
(6-4) Click
k! (6 5) Cli
(6-5) Click
k!

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 ISP METHOD

7. After a minute, install will be finished.

(7-1) Click !

(7-2) Click !

8. Make a ISP_tool.exe short cut to desktop.

(8-1) Right Click !

(8-2) Fix the cursor to send(N) !

(8-3) Click “Make a short cut to desktop” !

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 TROUBLE SHOOTING GUIDE

No power
(LED indicator off)
: [A] PROCESS

Fail
Check 24V, 12V, 5,2V Check short of Main B/D
of Power B/D or Change Power B/D

Pass

Check Output of Fail Fail

Check short of IC701, IC702, IC704 Re-soldering or Change defect
IC701, IC702, IC704,Q705 Part
Part.

Pass
Pass
Change IC701, IC702, IC704

Fail
Check LED Assy Change LED Assy

Pass

Check P201 Connector

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 TROUBLE SHOOTING GUIDE

No Raster [B]: Process

Pass

Check LED status

Repeat A PROCESS
On Display Unit Fail

Pass

Check Panel Link Cable Change Panel Link Cable

Or Module Fail Or Module

Pass

Check Inverter Connector Change Inverter Connector

Or Inverter Fail Or Inverter

Pass

Check Output of Q705 Change Q705

Fail

Pass

Ch k LVDS C
Check Cable
bl Ch
Change M
Module
d l
Fail

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 TROUBLE SHOOTING GUIDE

No Raster on HDMI Signal

N Raster on COM
No COMPONENT
ON N Si
Signall

Pass
Pass
Check Input source
C bl A
Cable And
d JJack
k
Check Input source
Cable And Jack
Pass

Pass Check the Input/Output

p p Re-soldering or
Of JK301 Fail Change the defect part
Check The Input/Output Re-soldering or
Of JK101 Change the defect part Pass
Fail

Ch k th
Check the IInput/Output
t/O t t Re-soldering or
Pass Of IC301 Fail Change the defect part

Check the Input/Output Re-soldering or Pass

Of IC604 Fail Change the defect part
Check the Input/Output Re-soldering or
Of 602 Change the defect part
Fail
Check HDMI EDID Data
Re-download HDCP
Pass
Repeat [A], & [B] Process

Check the Input/Output Re-soldering or

Of IC604 Fail Change the defect part

Pass

Repeat [A], & [B] Process

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 TROUBLE SHOOTING GUIDE

No Raster On AV Signal No Signal On TV(RF) Signal

Pass Pass

Check Input source

Check
Ch k IInputt source Cable And Jack
Cable And Jack

Pass
Pass

Check The Input/Output Re-soldering

Re soldering or
Check The Input/Output Re-soldering or Of TU401 Fail Change the defect part
Of JK101 Fail Change the defect part
Pass

Pass
Check the Input/Output Re-soldering or
Of Q401,IC707 Fail Change the defect part
Check the Input/Output Re-soldering or
Of IC604 Fail Change the defect part Pass

Check the Input/Output Re-soldering or

Pass Of IC703,IC706 Change the defect part
Fail

Repeat [A], & [B] Process Pass

Check the Input/Output Re-soldering or

Of L402,L403 Fail Change the defect part

Pass

Repeat [A], & [B] Process

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 TROUBLE SHOOTING GUIDE

No Sound

Check The Input Sourse Change The Source Input

Fail

Pass

Check The Input/Output Re-soldering or

Of IC501 Fail Change the defect part

Pass

Check The Speaker Change Speaker

Fail

Pass

Check The Speaker Wire

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes