Escolar Documentos
Profissional Documentos
Cultura Documentos
Ultrafast Rectifier,
2 x 35 A FRED PtTM
FEATURES
• Two common-cathode diodes
Base
common • Ultrafast reverse recovery Available
DESCRIPTION
The 70CRU04 integrates two state of the art Vishay HPP
ultrafast recovery rectifiers in the common-cathode
configuration. The planar structure of the diodes, and the
PRODUCT SUMMARY platinum doping life-time control, provide a ultrasoft recovery
current shape, together with the best overall performance,
trr 38 ns
ruggedness and reliability characteristics. These devices are
IF(AV) at TC = 116 °C 2 x 35 A thus intended for high frequency applications in which the
VR 400 V switching energy is designed not to be predominant portion
of the total energy, such as in the output rectification stage of
welding machines, SMPS, dc-to-dc converters. Their
extremely optimized stored charge and low recovery current
reduce both over-dissipation in the switching elements (and
snubbers) and EMI/RFI.
1000
1000 Tj = 175˚C
100
(μA)
150˚C
R
10
Reverse Current - I
125˚C
1
0.1 25˚C
(A)
0.01
100
F
Instantaneous Forward Current - I
0.001
50 100 150 200 250 300 350 400
Reverse Voltage - V (V)
Fig. 2 - Typical Values of Reverse Current vs.
Tj = 175˚C
Reverse Voltage
Tj = 125˚C
1000
Tj = 25˚C
Tj = 25˚C
100
1 10
0 0.5 1 1.5 2 2.5 3 1 10 100 1000
Forward Voltage Drop - VFM (V) Reverse Voltage - VR (V)
Fig. 1 - Maximum Forward Voltage Drop Characteristics Fig. 3 - Typical Junction Capacitance vs.
(Per Diode) Reverse Voltage
10
(°C/W) thJC
1
Thermal Impedance Z
PDM
t1
t2
0.1 Single Pulse
(Thermal Resistance) Notes:
1. Duty factor D = t1/ t2
2. Peak Tj = Pdm x ZthJC + Tc
0.01
0.0001 0.001 0.01 0.1 1 10
t , Rectangular Pulse Duration (Seconds)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics (Per Diode)
150
If = 35A
180 140 Vrr = 200V
Allowable Case Temperature (°C)
170 130
150 110
trr ( ns )
DC
140 100
130 90
Square wave (D = 0.50)
120 Rated Vr applied 80 Tj = 25˚C
110 see note (1)
70
100
0 5 10 15 20 25 30 35 40 60
Average Forward Current - I F(AV) (A)
50
100 1000
di F /dt (A/μs )
Fig. 5 - Maximum Allowable Case Temperature vs. Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Average Forward Current
2500
If = 35A
40 Vrr = 200V
35 RMS Limit 2000
Average Power Loss ( Watts )
30
25 1500 Tj = 125˚C
Qrr ( nC )
20 D = 0.01
D = 0.02
15 D = 0.05 1000
D = 0.10
10 D = 0.20
Tj = 25˚C
D = 0.50
5 500
DC
0
0 5 10 15 20 25 30 35
Average Forward Current - I F(AV) (A)
0
100 1000
di F /dt (A/μs )
Fig. 6 - Forward Power Loss Characteristics Fig. 8 - Typical Stored Charge vs. dIF/dt
Note
(1)
Formula used: TC = TJ - (Pd + PdREV) x RthJC;
Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated VR
1 2 3 4 5 6
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.