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Product Brief

Transcede*
T3K Concurrent Dual-Mode SoC Family
Communications Infrastructure

LTE / Dual-Mode Small Cell SoC


Intel’s T3K family addresses the needs of the highest-
performance small cell designs for single-mode (LTE)
and dual-mode (3G and LTE) solutions for picocell,
enterprise, and rural applications.

Transcede* solutions from Intel deliver set of Intel’s industry-leading PHY


a complete small cell base station on capability with support for Release 9 At a Glance
a chip, supporting concurrent multi- HSPA+, including MIMO, dual carrier,
standard operation with carrier-grade and soft handover, while meeting
software performance (HSPA and 3GPP LABS (Local Area Base Station)
LTE). Simplifying the migration from performance levels. Optimized SoC solution for enterprise,
3G to LTE networks, Transcede T3K rural, and picocell applications
(T2xxx) devices handle the complete All four T3K devices are intended for
signal flow from the radio interface to carrier-grade, public access picocells Single mode (LTE) and concurrent
IP packets for network connectivity. and small cells. Each can support up
dual mode (3G and LTE)
The product suite builds upon the to 32-128 simultaneous users as a
Transcede family of award-winning1 complete solution, from RF interface 3GPP Local Area Base Station
small cell system-on-chip to L1 and L2/L3 on a single device. All specification
(SoC) solutions. devices include carrier-grade, pre-
integrated and pre-verified code for 3GPP Release 8/9/10 (LTE-A)
The T3K family with 20 MHz channels PHY and stacks.
and MIMO (2x2) supports either TD- MIMO 2x2
LTE or LTE FDD. Pre-integrated and The T3100 is ideal for in-building
LTE-only solutions, while the T3130 Channel bandwidths up to 20 MHz
pre-verified software that supports
3GPP Release 8/9 and a roadmap to and T3150 have longer range, support
high mobility, and are optimized for HSPA+ support for MIMO, dual carrier,
Release 10 (LTE-A) is included.
metro cell or rural small cell use. and soft handover
The T3120 and T3150 have the They can also be used to upgrade a
L1 and L2/L3 on a single device
identical LTE capability as the T3100 distributed antenna system (DAS)
and T3130, but also add simultaneous installation by adding local capacity Carrier-class integrated software
3G operation to enable a single-chip, and improving network efficiency
dual-mode solution. This is a super- and performance.
The Transcede T3K family from Intel enables the highest-performing picocell, enterprise, and
rural small cell products.

Functional Description verified software solutions. They are


available with a reference design kit, Product Features
The Transcede T3K family was which provides optimized LTE and 3G
specifically designed for the next software, and an extensible verification
generation of high-performance small environment and board support package
cell base stations. This is achieved (BSP) using Linux*. Single SoC design for complete
through the use of ARM* Cortex* A9 L1, L2, and L3 solutions
technology for control and protocol The high-performance processing and
processing, CEVA* DSP cores for I/O of the T3K family is well-suited to Intel carrier-class L1 LTE and 3G
baseband processing, and specialized “smart” small cells with integrated cache software support
MAP2 DSP blocks for advanced signal servers or multi-mode capabilities. USB
and PCI Express* interfaces simplify the Quad ARM* Cortex* A9 Processor
processing and encryption functions.
The single SoC design delivers a integration of additional features, such
Quad CEVA* XC DSP
complete L1, L2, and L3 solution, as Wi-Fi, and a CPRI interface is available
which can dramatically reduce overall to communicate with remote radio Eight MAP DSP accelerator blocks
system cost. heads or distributed nodes.
Hardware accelerators (FEC,
The T3K family with integrated network The T3K family integrates industry- PRACH, PSC, and COR)
processor capabilities supports Layer 2 leading security, meeting or exceeding
processing requirements for the next the requirements of 3GPP and Small Cell Backhaul IPsec engine (AES, DES,
wave of small cell designs. Network Forum. Backhaul security is provided by and hashing)
processing is performed by a high- an integrated IPsec engine (AES, DES,
performance ARM Cortex RISC processor and hashing), and air-interface security RAN security engine (AES,
with fast IP/Ethernet interfaces coupled is provided by a RAN security engine Kasumi, SNOW-3G, and ZUC)
with Metro Ethernet Forum (MEF) class that supports AES, Kasumi, SNOW-3G,
and ZUC, along with the new modes Integrated support for USB, PCI
of service hardware acceleration.
in 3GPP releases. In addition, the T3K Express*, and CPRI
The devices are supplied with family implements secure boot and
complete, pre-integrated, and pre- key management. Glueless connectivity to leading
RF transceivers

Secure boot and key


For more information about Intel solutions for communications infrastructure, visit management support
www.intel.com/communications
1
Mindspeed Technologies, Inc., SK Telecom, and Contela won the Small Cell Industry Award Product T3K Market Segment
for Commercial Deployment (Innovation in Commercial Deployment) at the 2012 Small Cell
World Summit in London. The award is for the deployment of the world’s first data-only T3100 LTE Enterprise
femtocell service designed to offload increasing mobile data traffic caused by the rapid
growth of smartphones and tablets. T3130 LTE Pico

2
MAP is an abbreviation for multifunction application processor. T3120 Dual-Mode Enterprise

Copyright © 2014 Intel Corporation. All rights reserved. Intel and the Intel logo are T3150 Dual-Mode Pico
trademarks of Intel Corporation in the United States and/or other countries.

*Other names and brands may be claimed as the propertyof others.

Printed in USA MS/VC/0114 Order No. 330134-001 US

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