001 B Operator Training

J-STD-001B Operator/Inspector
Skills Training Plan

April, 1998
IPC-TNG-001B “J-STD-001B Generic Training Plan”
Copyright released by IPC, April, 1998. This publication was developed by the IPC J-STD-001 Training Task Group (5-22b). This
publication may be reprinted for internal company-specific training purposes. Material is included for an Operator/Inspector course that
will provide an understanding of the requirements of ANSI/J-STD-001B “Requirements for Soldered Electrical and Electronic
Assemblies.” This material does not constitute an IPC-sanctioned program or an IPC certification to J-STD-001B.
IPC-TNG-001B April 1998
Acknowledgment
Any Document involving a complex technology draws material from a vast number of sources. While the principal members of the IPC J-STD-001 Certification Task Group (5-22b) of the
Assembly & Joining Processes are shown below, it is not possible to include all of those who assisted in the evolution of this document. To each of them, the members of the IPC extend
their gratitude.
Assembly & Joining Processes J-STD-001 Certification Task Group Technical Liaison of the IPC Board of
Directors
Chairman Co Chairmen
Jim Reed, Raytheon TI Systems Fred Lee, Northrop Grumman Stan Plzak, Pensar Corp.
Theresa Rowe, AAI
A Special Note of Appreciation
The following core group has volunteered much of their time and have made significant contributions to this document.
Gerald Leslie Bogert, Westinghouse Electric Corp. James Moffitt, Moffitt Consulting Services Teresa Rowe, AAI Corporation
Leo Lambert, EPTAC Corporation Gregg Owens, Omni Training Corp. Sharon Ventress, U.S. Aviation & Missile Command
Frederic Lee, Northrop Grumman Norden Systems Melvin Parrish, EMPF/ACI James Walter Woodford, Department of Defense
Garry McGuire, Hernandez Engineering Inc. Michael Ressel, Raytheon Missile Systems Co. Don Youngblood, Honeywell Inc.
J-STD-001 Certification Task Group
Kari Anderson, Raytheon Technical Services Co. Kathie Drake-Willcox, Jet Propulsion Laboratory Robert Paukst, Inservco Inc.
Sherman Banks, Trimble Navigation Manon Dutil, C-MAC Electronic Systems Inc. Jim Reed, Raytheon TI Systems, Inc.
Allen Bennink, IEC Electronics Corp. Keith Foreman, Raytheon TI Systems Kenneth Reid, IUPUI-Indiana/Purdue University
Peter Biocca, Multicore Solders John German, Orbital Sciences Corporation Sarah Rogers, Hughes Missile Systems
P.C. Boh-Tea, Standard Technologies Pte Ltd Gary Gorsche, Litton Amecom Jerald Rosser, Raytheon Missile Systems Company
Diana Bradford, Soldering Technology International Richard Heck, Omni Training Corp. Joseph Salvin, Smiths Industries
Gloria Brown, Best Power Inc. James Herard, IBM Corp./Endicott Electronic Pat Scott, IUPUI-Indiana/Purdue University
John Burke, Electronic Controls Design Inc. Packaging George Shannon, Quatro Corporation
Robert Burress, SEHO USA Inc. Mario J.J. Hermans, PIEK Training & Support Sidney Alan Smith, MTTC (Manufacturing Technology
Ivan Clark, Projects Unlimited Inc. David Hillman, Rockwell International Training Center)
Bill Coleman, Photo Stencil Inc. Peter Hosp, DSC Communications Corporation Jorgen Svensson, Ericsson Telecom AB
Frank Croce, AlliedSignal Aerospace Jennie Hwang, H-Technologies Group Inc. Myron Szot, Raytheon E-Systems
Robert Cummings, Swales & Associates Les Hymes, Les Hymes Associates Douglas Whitnell, MTTC (Manufacturing Technology
Derek D'Andrade, The Surface Mount Technology Martin Lau, Quebish Limited Training Center)
Centre David LeMay, Cray Research Inc. Edward Zamborsky, OK International Inc.
Lyn Dayman, Australian Technology Training James Maguire, Boeing Defense & Space Group Kathy Zirpel, Raven Industries
Education Centre Peter Maher, Kimball Electronics Group
John De Gruyter, Quality Products International John Mastorides, Group Technologies Corp.
Alan DeSantis, Libra Industries Inc. Lester Moreland, Ciba Speciality Chemicals Corp.
Michele DiFranza, The Mitre Corp. Graham Kirk Naisbitt, Concoat Limited
Al Dill, BlackFox Training Institute Edward O'Donnell, Imperial Electronic Assembly
Scope: Electrical and electronic solder assembly skills training for production workers employed by manufacturers who use ANSI/J-STD-001B in
product quality control.
Application: Formal workplace training for employers to develop workers’ knowledge and skill in hand solder assembly and quality control processes.
Organization: Modular arrangement for flexible implementation in various manufacturing environments.
Requirements:
Prerequisites Module SA and SB must precede training in Modules SC, SD or SE.
Local training in safety, ESD prevention, material handling, tool and equipment handling and other necessary subjects
should precede or be integrated into this training plan.
Tailoring This training plan may be modified to meet the needs of the users. For this purpose, Module SA can be combined with any
other modules or partial modules to fulfill user training requirements.
Testing Tests should be written, recall-type examinations; multiple choice and matching types of test questions are best for module
SA. Other modules should be tested with practical, competency-based examinations.
Scoring Since each student’s knowledge and ability is being assessed, it is best to convert raw scores to percentages. Generally,
minimum passing scores of 80% have been historically used by the industry.
Records Documents attesting to student attendance, written and practical test records should be filed. Additionally, material
(hardware) test samples may be retained as part of the training records.
Vision Tests Vision testing in accordance with IPC-OI-645 may be performed prior to the start of training.
Instructional Aids and Training Materials: Ideally, instructional aids and materials should be developed around local products, however, when it is not
convenient to do this, there are several commercial sources of instructional aids and practical work materials.
Instructor Qualification: Instructors for this Training plan should be highly skilled in assembly, soldering and inspection processes at their facility, trained
on ANSI/J-STD-001 requirements, able to communicate information in oral and written form and able to interact with students and others within their
organizations.
Table of Contents
Section Topic Lesson Time

SA Introduction and General Requirements 10 hrs
SB Practical Lab Instruction – General Information Section 2 hrs
SC Soldering to Terminals 4 hrs
SD Soldering Surface Mount Devices 4 hrs
SE Soldering Through-Hole Devices 4 hrs

Section SA - Introduction and General Requirements
Lesson Time: 10.0 hours
Instructional Materials:
J-STD-001B
J-STD-001B Handbook
IPC-TM-650
Instructional Aids:
1. Projector
2. Slides
3. Screen
4. Flip Chart
Topic Objectives: At the end of the instruction, the student will be able to:
a. Understand the intent of J-STD-001.
b. Know the differences between the classes of product.
c. Distinguish between requirements that are mandatory and recommended practices.
d. Define the use of process control.
e. Understand proficiency of personnel.
f. Explain the definition of ESD and understand how to handle ESD sensitive parts.
g. Identify the design and fabrication specifications, which form the basis for the soldering operations, equipment and conditions given in J-
STD-001.
h. Define the order of precedence for documents, which may be required for completion of soldered connections.
i. Explain the required action in the event of a conflict between documents in use.
j. Find definitions of terms in IPC-T-50 and provide definitions for some basic J-STD-001 terminology.
k. Discuss material and process compatibility.
l. Explain the J-STD-001 requirements for personnel proficiency.
m. Identify the requirement for an electrostatic discharge program.
n. Define facilities requirements.
o. Discuss the requirements for selection of soldering tools and equipment.
p. List the materials and give the requirements for making soldered electrical and electronic assemblies.
q. Explain solderability and the requirements for compliance.
r. Understand solder purity and the requirements for maintenance.
s. Explain gold contamination and the requirements for removal prior to soldering.
t. Explain the pre-soldering and post-soldering cleanliness requirements.
u. Read, understand and apply cleanliness designators.
SA-1
v. Discuss the various types of tests for cleanliness.
w. Define the types of contaminants, which could be present on soldered assemblies.
x. Give the visual inspection criteria for cleanliness.
y. Define rework and repair.
z. Define the hardware defects that require disposition per J-STD-001.
aa. Use Table 11-1.
bb. Explain the health and safety requirements of J-STD-001.
cc. Discuss the special requirements for devices incorporating magnetic windings.
dd. Discuss the requirements for high frequency, voltage and power applications.
ee. Explain requirements flowdown for J-STD-001.
SA-2
Instructor Reference Instructor Activity
J-STD-001 Skills Training SHOW AND DISCUSS SLIDE SA-1

J-STD-001
Welcome students to the J-STD-001 Skills Training class. Introduce yourself

and ask the participants to introduce themselves by giving their name,
company and job function, where applicable.
Discuss the titles of the documents the students have in front of them and the
role they will play in the class.
Have chalkboard/dry erase board prepared in advance with your name and
emergency telephone numbers, where appropriate.
Prerequisites SHOW AND DISCUSS SLIDE SA-2

Prerequisites
- Modules SA and SB must precede any other training in this
course
- Safety, ESD prevention, material handling, and tool and
equipment handling, where applicable
Discuss the prerequisites. If students are new to this training, explain that
the topics covered in this slide will be incorporated into this program for
their benefit and training.
Course Mission
SHOW AND DISCUSS SLIDE SA-3
Course Mission
- To help electronics manufacturers produce high quality
products at the lowest possible cost by promoting a greater
understanding of the soldering and assembly processes
through standardized training.
SA-3
Discuss this with the students. Explain that this will establish requirements
for soldered connections as well as prepare them for soldering and assembly
operations at their facility. The ultimate goal is to increase the quality,
productivity and competitiveness of electronics manufacturers.
Ask the students if they have any experience with J-STD-001. Ask those
who have to briefly describe their level of experience.
General Information SHOW AND DISCUSS SLIDE SA-4

General Information
- Class hours
- Eating/drinking restrictions
- Smoking policy
- Location of break rooms
Discuss with the students.
General Information (continued) SHOW AND DISCUSS SLIDE SA-5

General Information (continued)
- Location of rest rooms
- Notify if unable to attend class
- Emergency exits and instructions
Discuss.
Agenda SHOW AND DISCUSS SLIDE SA-6

Agenda
(To be determined)
Explain the agenda.
SA-4
Course Requirements SHOW AND DISCUSS SLIDE SA-7

Course Requirements
- Written test with a minimum score of 80%
- Skills assessment grade of passing
Explain the course requirements for successful completion.
History of J-STD-001 SHOW AND DISCUSS SLIDE SA-8

History
- Single industry standard
Explain the background of J-STD-001. It was developed as a single industry

standard. It includes all type of electronic products from low consumer
electronics to high cost critical application electronics.
Explain that many documents preceded this one, and indicate those which
are applicable to the class of students that are present.
If applicable, explain to the students what types of product will be addressed
in this class.
1.0 Scope
This standard prescribes practices and requirements...
Scope SHOW AND DISCUSS SLIDE SA-9

SCOPE
- Includes all types of electrical soldered connections
- Includes information and requirements for assembly and
conformal coating
- Does not include non-electrical soldering
Explain this includes all types of soldered connections used for electrical
interconnections. Also includes information and requirements for assembly
and conformal coating. Non-electrical soldering is excluded.
SA-5
1.1 Purpose
This standard describes materials....
Purpose SHOW AND DISCUSS SLIDE SA-10

Purpose of J-STD-001
- Established practices and requirements for making
acceptable solder connections
Explain that this document covers practices and requirements. The class will
examine each “piece” of this to better understand it.
Practices SHOW AND DISCUSS SLIDE SA-11

Practices
- Provided for guidance
- Are not requirements
Explain that practices are not mandatory. Alternative practices may be used.
Discuss different practices, which would yield the same product. Assure that
students are comfortable with the idea.
Begin a short dialogue with the students. Ask them to identify a task, which
is common to all of them. Have them identify the practice. Even though it is
not required, most people do it (Suggestion: Holding the door open for
someone).
Conclude discussion
SA-6
Requirements SHOW AND DISCUSS SLIDE SA-12

Requirements
- Mandatory conditions
- Essential for producing acceptable product
Explain that requirements are mandatory. A manufacturer must comply with

these.
Begin a short dialogue with the students. Ask them to identify a task, which
is common to all of them, that is requirements. (Suggestion: eating)
Conclude discussion.
Requirements for Making a Soldered Connection SHOW AND DISCUSS SLIDE SA-13
Requirements for Making a Soldering Connection
- Materials
- Methods
- Verification Criteria
Explain the difference between materials, methods and verification criteria.

This can be done by defining each of them and giving an example.
SA-7
Process Control Methodology SHOW AND DISCUSS SLIDE SA-14

Process Control Methodology
- Is a logical approach to performing a task
- Must be used in the planning, implementation and evaluation
of the manufacturing process.
Begin a discussion about a simple task such as tying shoelaces.
Explain that in doing this task, each person may do this slightly differently,
this making the practice different, but the requirement is to finish with tied
shoes.
“Build” a flowchart of the steps required to perform this task using class
inputs.
Be sure to include in the flowchart:
- Pull the laces tight

- Make a loop
- Pull tight
- Form another loop with one shoe lace
- Put other lace over the loop
- Pull second lace through, forming a bow.
Conclude by discussing that each company may have different requirements.

The important thing is an understanding of J-STD-001 and how to make it
work for your company.
SA-8
1.2 Classification
This standard recognizes that electrical and electronic....
Classification of Product SHOW AND DISCUSS SLIDE SA-15

Classification
CLASS 1 General Electronic Products
CLASS 2 Dedicated Service Electronic Products
CLASS 3 High Performance Electronic Products
State the three general end product classes and relate them to different
product. If applicable, relate them to specific products in the student’s
facility. For example, if the facility produces only Class 3 products, briefly
mention Class 1 and 2, them concentrate on Class 3; or if only Class 1 or 2
products is manufactured, don’t spend a lot of time explaining Class 3.
Determining Product Class SHOW AND DISCUSS SLIDE SA-16

Determining Product Class
- Based on reliability, environment and cost
- Is a decision made by the customer and the manufacturer
- Is not a decision made by the operator and /or the inspector
Discuss the decisions that must be made between the customer and the
manufacturer. Emphasize that the operators and inspectors do not make this
decision.
Explain that a company’s processes should be set up to notify the operators

and inspectors of the proper class of product for any given item.
SA-9
1.4 Definition of Requirements

When the word must....
Definition of Requirements SHOW AND DISCUSS SLIDE SA-17

Definition of Requirements
(Table* showing mandatory requirements by class)
* Appears as an attachment to this document)
Explain that mandatory requirements are described using the word “must” as
well as the use of “shall” and “should.” Explain the use of the table. Cite an
example such as J-STD-001, para 1.1 “...the methods must produce
completed solder joints...” (Have students look at this paragraph as you read
it to them.) Cite examples where shall and should are used, having the
students look at these paragraphs as they are read.
1.4.1 Hardware Defects and Process Indicators

Defects listed in Table 11.1...
Definition of Defect SHOW AND DISCUSS SLIDE SA-18

Defects
- Conditions listed in Table 11-1
- Other conditions identified by the manufacturer
Give the definition of a defect.
Explain that if a condition is classified as a defect, it must be dispositioned:

e.g., rework, repair or scrap or use as is. If there are other defects that make
product unfit for use, the manufacturer must identify those conditions and
treat them the same as defects.
SA-10
Definition of Process Indicator SHOW AND DISCUSS SLIDE SA-19

Process Indicators
- Conditions that are outside the normal, expected output of the
process, but are not sufficient to be classified as defects.
Give the definition of process indicator.
Discuss how process indicators should be monitored and corrective action

may be required. If corrective action is initiated, it should be used to
improve the process, to reduce the condition or eliminate it.
Explain the difference between a defect and a process indicator.
Table 11-1 SHOW AND DISCUSS SLIDE SA-20

TABLE 11-1
Have students locate J-STD-001, Table 11-1 (p 28).
Discuss the table.
1.5 Process Control Requirements

Process control methodologies must be used...
Process Control Requirements SHOW AND DISCUSS SLIDE SA-21

Process Control Requirements
- Will differ from facility to facility
- Have objective evidence of a plan available for review
Discuss the requirements.
Emphasize the mandates associated with the words must and shall as they
relate to process control requirements.
SA-11
Review SHOW AND DISCUSS SLIDE SA-22

Review
- Classes of product
- Requirements
- Process control
Review the topics discussed and ask the class some of the following
questions: What is a Class 1 (2 or 3) product? What is the requirement when
the standard states something shall be done? What is a process indicator?
Are all process control requirements the same from facility to facility?
Applicable Documents SHOW AND DISCUSS SLIDE SA-23

Applicable Documents
- Extent of applicability
Have students locate paragraph 2.0 in J-STD-001.
Have student take note that this section is a list of documents with numbers
and titles. Indicate that there is very little text in J-STD-001 that covers this
section.
Explain that the documents listed in this section are referenced in J-STD-
001. This does not mean that the entire document applies. The extent that it
applies is a result of the manner in which it is used in J-STD-001.
Indicate that there are several types of industry documents listed, and have
the students locate the different listings.
SA-12
3.1 Order of Precedence

The contract always takes precedence over this....
Order of Precedence SHOW AND DISCUSS SLIDE SA-24

Order of Precedence
- Contract
- J-STD-001
- Documents cited in J-STD-001
Explain to the students that this is the order of precedence. Emphasize that
the contract always takes precedence over all other documents because this is
what the customer wants.
3.1.1 Conflict
In the event of conflict between the requirements....
Conflict SHOW AND DISCUSS SLIDE SA-25

Conflict
- Approved assembly drawing(s) / documentation
- J-STD-001
- Assembly drawing(s) / documentation not approved
Explain this hierarchy to the students.
Direct the students to the paragraph in J-STD-001 and the fact that this is a
“must” requirement. Remind the students that this is mandatory for all three
classes of product.
SA-13
3.2 Terms and Definitions

Other than those terms listed....
Terms and Definitions SHOW AND DISCUSS SLIDE SA-26

Terms and Definitions
- IPC-T-50
- J-STD-001
Show the students a copy of IPC-T-50 and explain that it is a dictionary for
the terms used in J-STD-001.
Explain that some terms are defined in J-STD-001, and the class will cover
these in more detail in the upcoming class discussion. These are definitions,
which cannot be found in IPC-T-50. All others can be found in IPC-T-50.
3.2.1 Manufacturer (Assembler)

The individual, organization, or company responsible....
3.2.4 Supplier
The individual, organization or company...
3.2.5 User
The individual, organization or company....
Definitions of Supplier, Manufacturer (Assembler) and User Terms and Definitions (continued)
1. Supplier
2. Manufacturer (Assembler)
3. User
On a flip chart, begin to draw a chart showing the hierarchy, using the
students’ company, if possible. Show the user. Explain that the user is the
“customer” in that this is who is purchasing the product produced by the
manufacturer. Add the manufacturer to the chart.
Ask the students if the company fits into more than one category? Initiate a
short discussion.
SA-14
Describe the user’s authority to define the class of equipment and any
variation or restrictions to the requirements of J-STD-001. Show that the
manufacturer purchases materials and components from the supplier by
adding the supplier to the chart.
Terms and Definitions (continued) SHOW AND DISCUSS SLIDE SA-28

Terms and Definitions (continued)
- Objective Evidence
- Process Indicator
- Disposition
Define “ objective evidence” for the students.
Ask the students to verbally list a few types of “hard copy.” Make notes of
this for the class to see. These should include, but not be limited to purchase
orders, work instructions and company documents, as applicable.
Define “process indicator” for the students, making it clear that this is not a
defect.
Define “disposition” for the students. Explain that this may not be
something that an operator or an inspector can do independently but often
requires input from other sources.
3.5 Personnel Proficiency

All instructors, operators, and inspection personnel must....
SA-15
Personnel Proficiency SHOW AND DISCUSS SLIDE SA-29

Personnel Proficiency
- Records of Training
- Work Experience
- Testing to the Requirements
- Periodic Reviews
- On the Job Training
Explain the requirements for proficiency as given on the slide. Stress the
need for all participants to be proficient in the task, which needs to be
performed to pass the course. State the various methods, which are utilized
to show proficiency.
3.6 Electrostatic Discharge (ESD)

The ESD control program must be in accordance....
Electrostatic Discharge (ESD) SHOW AND DISCUSS SLIDE SA-30

Electrostatic Discharge (ESD) Control Program
- Compliance with EIA-625 or other documented program
available for review.
Define ESD.
Begin presentation of this section by asking if anyone knows about the ESD
program at his or her facility. Have them briefly discuss it. Emphasize to
the students that electrostatic charges can potentially damage components
and product, and an ESD control program will allow for the safe handling of
these components and product.
SA-16
3.7 Facilities
Cleanliness and ambient temperatures....
Facilities SHOW AND DISCUSS SLIDE SA-31

Facilities
- Cleanliness and ambient environments must prevent
contamination or deterioration of soldering tools, material
and surfaces to be soldered.
Discuss the need for cleanliness and an ambient environment when work is
to be conducted. Ask the students if they have any thoughts on why this is a
requirement. Make a list.
Temperature and Humidity Control SHOW AND DISCUSS SLIDE SA-32

Recommended Temperature and Humidity Controls
- Temperature between 180C and 30 0C
- Relative humidity not to exceed 70%
- More restrictions may be necessary for process control
Inform the students that these recommendations are for operator comfort and
solderability maintenance. These are not requirements. Explain that
humidity 30% or less may require enhanced ESD control procedures,
depending on the class of product.
Lighting SHOW AND DISCUSS SLIDE SA-33

Lighting
- Minimum of 1000 lm/m2 at the work surface is recommended
Inform the students that this is a recommendation. Be brief, but mention the
need for good lighting to prevent shadowing and glare.
3.8 Soldering Tools and Equipment

Tools and equipment used must be selected and maintained....
SA-17
Soldering Tools and Equipment SHOW AND DISCUSS SLIDE SA-34

Selection of Soldering Tools and Equipment
- No detrimental damage or degradation to parts or assemblies
- Provide temperature control and isolation from EOS or ESD
Explain these requirements.
Define EOS (electrostatic overstress) for the students and briefly explain the
difference between EOS and ESD.
Note that more guidance will be given on tool selection and maintenance in
the practical portion of the class.

Review of General Requirements
Ask the students questions on this section. Examples: What is the definition
of a process indicator? What is the requirement for personnel proficiency for
Class 3 product? When is eating prohibited during the production of Class 2
product?
Introduce this section by asking the students if they can name the materials
used in making soldered electrical and electronic assemblies. Make a list of
these. Once everyone has had a chance to respond, show Slide SA-36.
SA-18
4.0 Materials
Materials SHOW AND DISCUSS SLIDE SA-36

Materials
- Solder, Solder Paste, or Solder Preforms
- Flux
- Cleaning Agents
- Polymeric Coatings
- Adhesives
- Strippers
- Heat Shrinkable Soldering Devices
Show the students that during this section, the items listed above will be
covered in greater detail. Compare this with the list made during the
discussion.
4.1 Solder
Solder alloys must be in accordance with...
Solder SHOW AND DISCUSS SLIDE SA-37

Solder
- Must be in accordance with J-STD-006 or equivalent
- Sn60A, Pb36B and Sn63A
- Other alloys may be used if specific conditions are met.
Explain the requirement for solder to meet J-STD-006 or an equivalent.
Explain that typically the solder alloys are Sn60A, Pb36B and Sn63A. Other
types may be used, if all other conditions of J-STD-001 are met.
Explain the term eutectic and its melting temperatures.
SA-19
4.2 Flux
Flux must be in accordance with...
Flux SHOW AND DISCUSS SLIDE SA-38

Flux
- Must be in accordance with J-STD-004
- May be required to use flux with a specific activity level
- May be required to use Appendix D
- Previously tested or qualified fluxes or solder paste soldering
process combinations do not require further additional testing.
Explain that compliance to J-STD-004 is a requirement for all classes of

product. Note that the second and third items may be requirements,
depending on the class of product
SA-20
Flux Activity Levels SHOW AND DISCUSS SLIDE SA-39

Use table 4-13 from the Handbook.
Briefly explain that table, the flux types and designators.
If applicable, discuss Type H flux and its use.
4.3 Solder Paste

Solder paste must be in accordance with...
4.3 Solder Preforms

Solder preforms must meet the requirements...
Solder Paste and Solder Preforms SHOW AND DISCUSS SLIDE SA-40
Solder Paste and Solder Preforms
- Must be in accordance with J-STD-005 or equivalent
- May be required to meet the solder and flux requirements of
J-STD-001
- Solder preforms must meet the solder and flux requirements
of J-STD-001
Explain how solder paste and preforms are used.

Review
- Solder
- Flux
- Solder Paste
- Solder Preforms
Ask the students questions concerning these topics, such as: What is the
requirement for solder alloys? What requirements exist for solder preforms?
What is the purpose of flux?
SA-21
Components (e.g., electronic devices,
Introduction to Components SHOW AND DISCUSS SLIDE SA-42

Components
Ask the class to define components. What are they? Construct a short list as
the discussion is occurring. Assure that electrical and mechanical devices as
well as printed boards are included in the list.
Explain in this section, components and component preparation will be

discussed. Emphasize that materials and process compatibility is a
requirement.
Keep the discussion brief, focusing on the components to be used during the
hands-on segments of the course.
5.2 Solderability
Electronic/mechanical components...
Wetting, Solder (from IPC-T-50F) is the formation of a relatively

uniform, smooth, unbroken and adherent film of solder to a basis metal.
5.4 Solderability Maintenance

The manufacturer must ensure that all components....
5.4.2 Rework of Nonsolderable Parts

Component leads, terminations, and printed...
SA-22
Solderability SHOW AND DISCUSS SLIDE SA-43

Solderability
- The ability of a metal to be wetted by molten solder.
- Components must meet J-STD-002 or equivalent
- Boards must meet J-STD-003 or equivalent
Ask the class to help define “wetting” in order to better understand the
definition given above. Provide pictures of good solder wetting for the class
to pass around and view. As this is occurring, continue with the discussion.
Explain that solderability is the ability of a metal to be wetted by molten

solder.
Give the students the requirements for J-STD-002 and J-STD-003. Explain
the test include a steam aging. Briefly discuss the purpose of this process.
Emphasize that solderability is of utmost importance in the outcome of the
soldering operation and the problems associated with a lack of or poor
solderability.
Provide pictures of conditions resulting from a lack of or poor solderability.

Pass these around for the class to view.
Solderability (continued) SHOW AND DISCUSS SLIDE SA-44

Solderability (continued)
- Should ensure conformance prior to storage or use
- May use pre-tinning and inspection instead
Explain that solderability testing is recommended prior to storage or use.
Discuss the requirements the students may have in their facility. Explain
that the system used must be part of a documented assembly process.
SA-23
Solderability Maintenance SHOW AND DISCUSS SLIDE SA-45

Solderability Maintenance
- Must ensure solderability at the start of soldering process
- Should have procedures to minimize degradation
Explain that solderability deteriorates over time. Begin a short discussion on

what could affect the solderability of a part. Make sure that time,
temperature and humidity are mentioned.
Discuss the need to ensure solderability prior to starting the soldering

process. Explain that because of the things that affect solderability, storage
or environment where the parts are kept is very important.
Rework (per IPC-T-50) is the act of reprocessing noncomplying articles,

through the use of original or alternate equivalent processing, in a
manner that assures compliance of the article with the applicable
drawings or specifications.
Rework of Nonsolderable Parts SHOW AND DISCUSS SLIDE SA-46

Rework of Nonsolderable Parts
- Rework is allowed using hot solder dip tinning
- Must conform to solderability requirements
- Steam aging is not required
Define rework per IPC-T-50.
Explain that rework is allowed.

Have class recall how to hot solder dip tin parts.
Explain that solderability is to J-STD-002 or J-STD-003 as applicable
(note steam aging is not required).
Remind students to take safety precautions including using heat sinks.
SA-24
Gold Contamination SHOW AND DISCUSS SLIDE SA-50

Gold Contamination
-Reliability of solder joint could be degraded
-Gold embrittlement could occur
Explain gold embrittlement.
Ask class for ideas on what effects gold embrittlement could have on an
assembly, and discuss possible ways to avoid it
5.4.1 Gold Removal

Gold shall be removed....
Gold Removal Gold Removal
-May be required to remove gold from solderable surfaces
-Can use a double tinning process or dynamic solder wave
-Evidence can be used to eliminate requirement
Explain removal process and that it is a “shall” requirement.
Discuss percentage necessary - 95% of the surface to be soldered with 2.5

micro- meters or more of gold plating and from 95% of all surface mount
surfaces to be soldered, regardless of gold plating thickness.
Describe double tinning and its purpose.
Explain that these requirements may be eliminated if objective evidence

exists showing no embrittlement problems, objective evidence is documented
and records are available for review.
SA-25

Review
- Solderability
- Solderability Purity Maintenance
- Rework of Nonsolderable Parts
- Gold Removal
Review this section by asking questions concerning the material covered.

Examples of questions: What is the requirement for solderability? Is gold a
solder contaminant? What happens to a solder connection that has gold in
it? What is rework and is it allowed on nonsolderable parts?
8.0 CLEANLINESS REQUIREMENTS

If cleaning is required (per 8.3) during and after....
8.1 Cleaning Process Requirements

The cleaning media and equipment shall be....
Cleaning
Cleanliness
- Pre-soldering
- Post-soldering
Discuss the need for pre-solder and post-solder cleanliness. Explain that
poor cleanliness is a common cause of solderability problems, and may be
required for good adhesion of conformal coating, to prevent leakage paths
and avoid corrosion.
SA-26
Manner of Cleaning SHOW AND DISCUSS SLIDE SA-54

Manner of Cleaning
- Must prevent detrimental thermal shock and/or intrusion of
cleaning media into components that are not totally sealed.
Discuss what would happen if a very hot assembly was placed directly into a
cold cleaning solvent without a cooldown period. Explain this is what is
meant by “detrimental thermal shock”.
Explain the remainder of the requirement and discuss what would happen if
a cleaning solvent got into an unsealed component. Ask the class what could
happen to a part over a long period of time.
Cleanliness Requirements SHOW AND DISCUSS SLIDE SA-55

Cleanliness Requirements
- Limit time before cleaning
- Remove both ionic and nonionic contamination
- Do not degrade material or parts being cleaned
- Should not damage markings
Explain that there are “shall” requirements.
Explain the need to limit the time before cleaning due to the nature of some
fluxes. The longer the time is before cleaning, the more difficult removal
becomes.
Define ionic and nonionic contamination and discuss the removal of both.
Discuss the process of cleaning. Ask the class for inputs on what might
cause damage or degradation to parts or materials and how these can be
eliminated.
SA-27
8.1.2 Pre-Soldering cleanliness Requirements

The cleanliness of terminals, component leads....
Pre-Soldering Cleanliness SHOW AND DISCUSS SLIDE SA-56

Pre-Soldering Cleanliness
- Must be sufficient to ensure final assembly cleanliness
- Ensure solderability
Discuss the requirement to ensure final assembly cleanliness. Explain that if

the assembly has a high level of contamination prior to soldering, it will be
more difficult for the assembly to pass the final cleanliness requirements.
Discuss the requirement that cleaniness to ensure solderability is a “shall”
requirement.
Remind the students that part solderability is an issue prior to soldering, and
contamination impedes the formation of good solder joints.
8.1.3 Post-Soldering Cleaning

When cleaning is required, flux residue shall be removed....
8.1.3.1 Ultrasonic Cleaning

Ultrasonic cleaning is permissible....
Post-Soldering Cleaning Post-Soldering Cleaning
- Machine soldering
- Hand soldering
- Exemptions exist
Discuss the time allowed before cleaning is required. When cleaning is

required, flux residue “shall” be removed as soon as possible, preferably
within one hour after soldering. Some fluxes or processes may require more
immediate action to facilitate adequate removal. For hand soldering, discuss
the use of interim cleaning to reduce the number of times that complete
cleaning is required. Complete cleaning, if required, is to be completed prior
to the end of the shift.
Discuss the exemption of terminations internal to self-sealing devices.
SA-28
Cleaning Equipment SHOW AND DISCUSS SLIDE SA-58

Cleaning Equipment
- Hand tools
- Machines
- Ultrasonics
Discuss the wide variety of solvents and cleaning agents available.

Discuss the different methods of cleaning, including ultrasonics.
Discuss the use of ultrasonic cleaning equipment. Explain that its use is only
Permissible on (a) bare boards or assemblies, provided only terminals or
connectors without internal electronics are present, or (b) electronic
assemblies when mechanical and electrical performance of the assemblies are
not affected by the cleaning, and documentation is available as proof.
8.2 Cleanliness Verification
Assemblies shall meet the requirements....
8.3 Post-solder Cleanliness
8.3.1 Particulate Matter

Assemblies shall be free of dirt....
8.3.2 Flux Residues and Other Ionic or Organic Contaminants
Unless specified by the user, the manufacturer....
Post-Solder Cleanliness SHOW AND DISCUSS SLIDE SA-59

Post-Solder Cleanliness
- Particulate Matter
- Flux Residues and Other Ionic or Organic Contaminants
Explain that post solder cleanliness is addressed by two separate topics as

shown. Discuss the difference between the two categories.
SA-29
Particulate Matter SHOW AND DISCUSS SLIDE SA-60

Particulate Matter
- Dirt, lint, solder splash, dross, wire clippings, etc.
- Solder balls must not be loose or violate minimum electrical
spacing
Explain that particulate matter is dirt, solder dross or splash, wire clippings
etc. Discuss the shall requirement that these “shall” not be present.
Discuss the presence of solder balls on a finished product and the effects they
may have on the product. Discuss when solder balls are most likely to occur
and why. Explain that when solder balls are imbedded in solder mask or
laminate, they cannot move around, but they can violate spacing
requirements and thus violate this requirement.
Flux Residues and Other Ionic or Organic Contaminants SHOW AND DISCUSS SLIDE SA-61
Flux Residues and Other Contaminants
- Cleanliness designators must be established
- Default shall be C-22
Define a cleanliness designator as a number that establishes the cleaning

option and test for cleanliness per J-STD-001.
Define the default if no designator is given. Visual requirements for

cleanliness “shall” apply.
SA-30
8.3.2.1 Post -soldering Cleanliness Designator

The cleanliness designator shall be....
Cleanliness Designator SHOW AND DISCUSS SLIDE SA-62

Cleanliness Designator
- Establishes the cleanliness requirements for assemblies
- C-XY
where X is the cleaning option
Y is the requirements for cleanliness testing
Give the definition of a cleanliness designator. Explain the numbering

system. Using the blackboard or dry-erase board, write the cleanliness
designator “C-_ _” on it.
8.3.3 Cleaning Option

The first digit of the cleanliness designator defines.....
Cleaning Option SHOW AND DISCUSS SLIDE SA-63

Cleaning Option
0 = No surfaces to be cleaned
1 = One side (wave solder source side) of assembly to be
cleaned
2 = Both sides of assembly to be cleaned
Give the class the information on the digits to be used for the cleaning
option.
Establish a scenario for the class. Sample situations are as follows:
A. No surfaces must be cleaned; tested for ionic residues

B. One side of a board must be cleaned; tested for surface insulation
resistance
C. Both sides of a board must be cleaned; tested for residual rosin,
ROSE, SIR, FTIR and a test to be named
SA-31
Using the “C-_ _”, present a scenario for the class and have them identify the
cleaning option. Enter it accordingly.
8.3.4 Test for Cleanliness
The second and following digits of the .....
Test for Cleanliness SHOW AND DISCUSS SLIDE SA-64

Test for Cleanliness
0 = No test for cleanliness required
1 = Test for rosin residues required
2 = Test for ionic residues required
3 = Test for surface insulation resistance
4 = Test for surface organic contaminants
5 = Other tests as defined by user/manufacturer agreement
Give the class the information on the digits to be used for cleanliness test.
Using the prior scenario, have the class identify the remainder of the
cleanliness designator. Enter it accordingly.
Explain what each test type is using the following slides. Tell the class that
all requirements for these tests are “shall” requirements.
8.3.5 Flux Residues
Assemblies shall be tested in accordance....
Flux Residues SHOW AND DISCUSS SLIDE SA-65

Flux Residues (per IPC-TM-650)
Class 1: < 200 micrograms per sq cm
Explain testing is to be per IPC-TM-650 and the maximum allowable levels

of flux residues are listed.
Explain that the test method is an extraction-based test where the solution
used for extraction is often isopropanol.
SA-32
8.3.6 Ionic Residues (Instrument Method)

Assemblies shall be tested....
8.3.7 Ionic Residues (Manual Method)

Assemblies shall be tested....
Ionic Residues Ionic Residues (per IPC-TM-650)
- ROSE test
- 1.56 microgram/sq cm sodium chloride equivalent ionic or
ionizable flux residue
Define the ROSE test and the required end results.
Explain that the ionic residues test can be conducted either manually or by
machine, depending on the test method used.
Explain that there are drawbacks to this test method, and J-STD-001 allows
for the use of other methods when the sensitivity of the alternate method is
equal to or better in detecting the residue.
8.3.8 Surface Insulation Resistance (SIR)

When required, SIR testing.....
Surface Insulation Resistance (SIR) Surface Insulation Resistance (SIR)
- Method and pass/fail criteria documented and available
for review
Explain the SIR test.
Discuss the requirements for use of this test.
SA-33
8.3.9 Other Contamination

Assemblies tested in accordance.....
Other Contamination Other Contamination (per IPC-TM-650)
- Maximum level to be established between the manufacturer
and the user
Explain that other contamination could exist. This contamination “shall”

not exceed the maximum contamination level, as established between the
manufacturer and the user.
8.2.2 Testing
If required in 8.3.4, periodic testing of cleanliness....
Testing SHOW AND DISCUSS SLIDE SA-69

Testing
- Periodic testing on a random sample after final cleaning
- Minimum of one test per 8 hour shift unless process
control system allows reduction in testing frequency
- When failures occur:
- Re-clean the entire lot
- Test all lots following the last acceptable test
Discuss the requirements and explain that they are “shall” requirements.
Ask the class to give reasons why the board may have failed during testing.
Explain the need to identify when the failure occurred and determine the
corrective action to be taken.
SA-34
8.2.1 Visual Inspection

Visual inspection shall be used....
8.3.2.2 Visual Requirements

Surface cleaned should be inspected....
Inspection Inspection
- Cleaned surfaces should be inspected using no magnification
- Assess the presence of contaminants
- A sample may be used if a process control system is in place
- Surfaces not cleaned may have flux residues
Explain the inspection criteria for cleanliness.
Explain that a sample may be used if a process control system exists, but
otherwise, the “shall” requirement is for 100% inspection.

Review Review
- Cleanliness requirements
- Cleanliness designators
- Types of tests
Review the material as discussed.
Ask the class some of the following questions: What does C-2345 mean?
What is the magnification necessary for inspecting cleanliness? What is
particulate matter?
SA-35
11.0 REWORK AND REPAIR SHOW AND DISCUSS SLIDE SA-72

Rework and Repair
Introduction
Introduce this section by explaining that this section covers the requirements
for hardware that doesn’t meet the requirements of J-STD-001.
11.1 Rework of Unsatisfactory Solder Connections

Rework of unsatisfactory solder connections shall not be....
Rework Rework
- The process that returns a product to compliance with
applicable drawings or specifications.
Define rework. Explain that documentation of discrepancies before rework

is mandatory for Class 3. This is a “shall” requirement.
Inspection after Rework SHOW AND DISCUSS SLIDE SA-74

Inspection after Rework
- Each connection shall be inspected.
Explain that after rework, inspection shall be done on each

reworked/reflowed connection.
11.2 Repair
Repairs are changes to an unacceptable...
Repair SHOW AND DISCUSS SLIDE SA-75

Repair
- The process which returns product to a functional condition.
Explain repair. The user and the manufacturer should decide the repair
method.
SA-36
11.3 Post Rework/Repair Cleaning

After rework or repair, assemblies...
Post Rework/Repair Cleaning SHOW AND DISCUSS SLIDE SA-76

Post Rework/Repair Cleaning
- Shall be cleaned to meet cleanliness requirements of
J-STD-001.
Explain that if product is reworked or repaired, it shall meet the cleanliness

requirements as discussed earlier.
Hardware Defects SHOW AND DISCUSS SLIDE SA-77

Hardware Defects
- Defects that required disposition per J-STD-001 are found in
Table 11-1.
Explain “disposition.
Direct the students to J-STD-001, Table 11-1.
Explain that there are only twenty defects listed, and the class will review
each one of them in detail.
Defects SHOW AND DISCUSS SLIDE SA-78

Hardware Defects
Discuss each criterion in Table 11-1 and what would constitute a reject
requiring disposition. Ask the students for inputs.
SA-37
13.1 Health and Safety

The use of some materials referenced in this standard....
Health and Safety Health and Safety
- Compliance to material data is a requirement
- Adequate ventilation must be provided
- Compliance to local and OSHA requirements
Discuss these requirements. Explain that manufacturers provide information

on material concerning safety issues, and compliance to these must be met.
Explain that solder and associated chemicals give off fumes. Ventilation
must be provided for those working around these fumes.
Explain that each area may have local as well as OSHA requirements.
Compliance must be made to these.
13.2 Special Manufacturing Requirements
13.2.1 Manufacture of Devices Incorporating Magnetic Windings

This standard is very limited in its applicability....
Manufacture of Devices Incorporating Magnetic Windings SHOW AND DISCUSS SLIDE SA-80
Devices Incorporating Magnetic Windings
- No requirement for internal interconnections
- External interconnect points must meet solderability
requirements without steam aging
Explain that magnetic wire may not have the strength and stability to be used
as connection wires. For this reason, J-STD-001 requirements do not apply
to internal elements unless the user has a specific requirement.
Explain that external connections must meet solderability testing without any
steam aging.
SA-38
13.2.2 High Frequency Applications

High frequency applications (i.e. radio waves...
High Frequency Applications High Frequency Applications
- May require alternate designs to meet performance
requirements
Explain that because of the application, IPC-D-275 may not be, and other
design specifications can be used. Explain processes “shall” be documented.
13.2.3 High Voltage or High Power Applications

High power applications such as...
High Voltage or High Power Application High Voltage or High Power Applications
- May require alternate designs to meet performance
requirements
Explain that because of the application, IPC-D-275 may not be, and other
design specifications can be used. Explain processes “shall” be documented.
13.3 Guidance on Requirement Flowdown

Manufacturers are responsible for delivering...
Guidance on Requirement Flowdown Requirement Flowdown
- Manufacturers are responsible for delivering fully compliant
hardware
- Manufacturer and user should agree on limits of flowdown
Explain that manufacturers are ultimately responsible for delivering

hardware that is fully compliant.
Briefly discuss where those limits are. Suggested scenario: An assembly
containing three boards is to be manufactured and delivered. All parts and
board assemblies are to be purchased from suppliers. Where does flowdown
of J-STD-001 stop?
SA-39
Review DISCUSS
Ask the students some of the following questions: What is the requirement
for high power applications? What is the requirement for ventilation over a
solder pot? When do requirements for J-STD-001 no longer get flowed down
to a supplier?
SA-40
Section SB - Practical Lab Instruction - General Information
Lesson Time: 2.0 hrs
J-STD-001B
J-STD-001B Handbook
J-STD-005
J-STD-006
Instructional Aids:
1. Samples of the different forms of solder
2. Flux
3. Cleaning Agent
4. Wire (previously stripped) and Components (to be soldered during a later lesson)
Note: Lesson on wire preparation will be given in a later section and practical experience will be obtained.
5. Tools and safety equipment
6. Handout
a. Discuss the forms and function of solder.
b. Discuss the types and functions of flux.
c. Discuss the types and functions of cleaning agents.
d. Explain the purpose of a heat sink.
e. Describe wicking.
f. Tin wires and components.
g. Understand Appendix A.
SB-1
Introduction Distribute handout giving a synopsis of this section. Example:

I. Solder: A metal alloy with a melting temperature that is below
427 0C.
A. Function: to join metals and make an electrical connection.

1. Eutectic: Melts and solidifies at the same temperature.
Use of a eutectic solder, such as Sn63, limits
disturbed connections.
2. Non-eutectic: Passes through a plastic stage between the
solid and liquid states. Any movement during
this plastic stage causes disturbed connections.
The most commonly used non-eutectic solder

is Sn60.
B. Forms: Wire, paste, preforms, bar, ingot, powder, ribbon,

special
II. Flux
A. Function: remove oxides and penetrate films, prevent
oxidation during heating and lower interfacial surface
tensions.
B. Forms: Liquid, Solid or Paste
C. Types: Inorganic, Organic, Resin and Rosin
III. Cleaning Agents

A. Function: Remove residues
B. Types: Solvent, Semi-aqueous and Aqueous
Explain that during this section, solder, flux and cleaning agents will be
discussed. The students will also get the opportunity to use these three items
in a practical exercise.
SB-2
Solder SHOW SAMPLES, REFER TO HANDOUT AND DISCUSS
Discuss eutectic and noneutectic solder. The most common alloy is tin lead.
Other alloys used in soldering include tin-antimony, tin-silver, tin-zinc, and
indium based solders. The melting point of the solder depend on the metals
in the alloy and the percentage of each. Give the different forms and show
samples of the various forms.
Flux REFER TO HANDOUT AND DISCUSS
Discuss flux. Flux is a chemically and physically active compound that,

when heated, promotes the wetting of a base metal surface with molten
solder. Flux removes minor surface oxidation and other surface films, and
protects the surfaces from reoxidation during a soldering operation.
Explain the purpose of flux:

A. Chemical: Reduces the oxides from the surface to be soldered and
protects the surface from re-oxidation.
B. Thermal: Assists in the transfer of heat from the heat source to the
item being soldered.
C. Physical: Allows for transport of the oxides and other reaction
products away from the area being soldered.
Explain the forms of flux: Liquid, solid or paste
Explain the types of flux: Inorganic, organic, resin and rosin
Discuss: When you use an external liquid flux in conjunction with flux cored
solders, the fluxes must be compatible.
SB-3
Abrasives DISCUSS
Explain that abrasives such as knives, sandpaper, and emery cloth are not to
be used. These may leave residues behind resulting in solderability problems
or cause damage to the surfaces of the printed wiring boards. When used,
abrasives can expose the copper under the thin solder film on the boards and
cause solderability problems. Abrasives can also expose printed wiring
board fibers, damage the solder mask and damage the traces on the boards.
Cleaning Agents REFER TO HANDOUT AND DISCUSS
Ask the students for some ideas on where contamination is generated.
Explain the function of a cleaning agent and the types of cleaning agents
available. Explain that more will follow later.
Solder Pot DISCUSS
Show students the solder pot, and review safety precautions for the lab
environment.
Heat Sinks DISCUSS
Explain that heat sinks are used in some circumstances, and for this exercise,
students are to use them when tinning components. The use of heat sinks is
a “shall” requirement.
Explain that a heat sink is a tool that is temporarily attached to a heat-

sensitive component in order to minimize the transfer of heat from the
component lead to the component body during a soldering operation.
Explain that heat sinks are used to absorb heat from part leads, to protect
sensitive parts, insulation materials, and/or previously completed
connections, from damage during soldering operations.
SB-4
Wicking DISCUSS
Define wicking as the capillary movement of solder between metal surfaces,
such as strands of wire.
Explain solder wicking can be caused by the capillary movement of solder

between metal surfaces, such as strands of wire.
Explain solder wicking underneath a wire’s insulation material has to be

kept to a minimum to allow the wire to maintain its flexibility. Usually
design specification have dimensional requirements when required. This is a
“shall” requirement.
Review Ask the students some question pertaining to the topics discussed.
Examples: What are heat sinks used for? What is a heat sink? What is
solder wicking? What are some of the causes of wicking? What is flux?
Why is flux used?
Hand Soldering Systems DISCUSS
Discuss the types of hand soldering systems available to the operator.
Explain that when using a soldering iron, take the following things into
consideration:
The number of interconnects to a plated-through hole will affect the amount

of heat drawn from the iron by the board. As the number of interconnects
increases, it will greatly increase the heat transfer from the tip. Some
specific board design concerns are:
(1) Pad size and hole diameter. This is a copper quantity issue. A
small pad and a narrow barrel, plated with a thick layer of copper,
may draw more heat than is expected.
SB-5
(2) Boards with internal heat sinks. Heavy internal heat sinks with
plated-through hole feed through will draw large quantities of heat
from the solder area.
Tip sizes affect what type of connections can be made. Generally, soldering
iron tips are made of a copper, tellurium copper or lead copper because
copper is economical and a good material for heat transfer. This base
material is coated or plated to reduce oxidation and tip reactivity. The
material composition and shape of the tip should be considered when
selecting soldering iron tips. Tips that are readily changeable limit the need
for multiple irons at a workstation .
Tools and equipment should be clean prior to use and should be kept clean
and free of dirt, grease, flux, oil and other foreign matter during use. The
heat source must not cause damage to the printed board or components.
Tools must be maintained such that they do not cause any detrimental
damage resulting from their use.
Discuss the parameters for operation of the hand soldering system.
SB-6
Wiping Pads DISCUSS
Explain that wiping pads are not to be detrimental to solderability or to

contaminate soldering tool surfaces. These need to be kept free of
contamination, which could affect the solderability of the components or
contaminate the tools.
Sponges collect contaminants, which can be introduced into the solder

connection or may form corrosive byproducts. Corrosion related failures can
be reduced by keeping wiping pads used to clean tips free of sulfur. Wiping
pads should be kept clean and damp.
Soldering Guns DISCUSS
Explain that the transformer in a soldering gun creates a magnetic field

which can damage static sensitive components (integrated circuits,
processors, hybrids, etc.). For this reason, soldering guns with the
transformer incorporated into the handpiece are not used.
Heated Soldering Tool Holders DISCUSS
Explain that soldering iron holders hold the iron leaving the element and the
tip unsupported while protecting the operator from burns.
Explain that the soldering iron tip and heater should not come in contact
with the tool holder. When a tool holder comes in contact with a tip or
heating element it will act as a heat sink.
SB-7
Use and Control DISCUSS
Explain that manufacturers’ recommendations are to be followed in order to

ensure proper function of the equipment. Calibration may be required to
maintain specifications or to satisfy internal operating procedures.
Explain that when qualifying equipment or inspecting new or repaired

equipment, equipment grounding, protection and temperature control testing
should be performed.
Show the students how to flux, tin and clean wires and components. When
Practical Exercise demonstrating the components, identify each type. Make at least two
demonstrations of tinning the wire and each type of component.
Upon completion of the tinning, “inspect” the work and explain the possible
defects as a result of this operation.
Have the students tin wires and components as provided to them. All work
should be retained. Students must present tinned wires and components for
evaluation. If defects are noted by the students prior to submission, they
should be documented prior to instructor evaluation of the work.
SB-8
Section SC- Soldering to Terminals
Lesson Time: 4.0 hours
J-STD-001B
J-STD-001B Handbook
IPC-A-610
Requirements Handout Sheet
Equipment List (as seen on page 2 of this section)
IPC Video on Hand Soldering, Part 1 (optional)
Instructional Aids:
1. Projector
2. Slides
3. Screen
4. Flip Chart
5. Posters of completed solder terminals per IPC-A-610B
6. Soldering equipment
7. Materials
a. A terminal board with turret terminals and bifurcated terminals previously installed
b. A connector
c. Labels or tape
d. Wire
e. Gold terminals
8. Buddy microscope
9. Instructor records
a. Understand the general part mounting requirements.
b. Be aware of the recommendations and requirements for lead cutting and forming.
c. Understand the wire and cable preparation requirements.
d. Discern the requirements for bifurcated and turret terminal installation.
e. Comprehend the requirements for mounting to terminals.
f. Strip wires using mechanical, thermal and chemical strippers, as required.
g. Hand solder wires to turret and bifurcated terminals using Class 3 requirements.
h. Hand solder wires to gold terminals using Class 3 requirements.
SC-1
NOTE: During the practical soldering portion of this section, any terminals not listed can be added or substituted into the training. Any terminals
not used in a facility can be eliminated from soldering portion of this section.
Equipment List
Soldering iron
Solder
Flux
Mechanical, thermal and chemical strippers, as required. (Sharing among students is permitted.)
Cleaning solvent
Tweezers
Orange sticks
Needle-nosed pliers
Brush (for cleaning purposes)
Wire cutters
SC-2
6.0 ASSEMBLY PROCESSES SHOW SLIDE SC-1

ASSEMBLY PROCESSES
SHOW AND DISCUSS SLIDE SC-2

Introduction Objectives
- At the completion of this section, the student will understand
requirements for:
A. General part mounting
B. Lead cutting and forming
C. Wire and cable preparation
D. Bifurcated and turret terminal installation
E. Mounting to terminals
Review the objectives of this section. Tell the students that this is the
information they will also be applying during their practical lab section to be
conducted at a later time.

ASSEMBLY PROCESSES Assembly Processes
General Parts Mounting
Bifurcated and Turret Terminal Installation
Mounting to Terminals
Review the content of the assembly processes section.
6.1 General Part Mounting Requirements

When design restrictions mandate mounting.....
SC-3
General Part Mounting Requirements SHOW AND DISCUSS SLIDE SC-4

General Part Mounting Requirements
- Consider design and component parameters before
performing soldering operations. Make provisions for
separate operations as applicable.
- Clean after each soldering operation.
Explain the requirement for using separate soldering operations as dictated

by design restrictions and component specifications. This is a “must”
requirement.
Explain the “shall” requirement for cleaning after each soldering operation
so that subsequent placement and soldering operations are not impaired by
contamination.
6.1.3 Wire and Cable Preparation

Chemical insulation stripping agents shall be used only.....
Wire and Cable Preparation SHOW AND DISCUSS SLIDE SC-5

Wire and Cable Preparation
- Strip
- Tin
Remind the students of the earlier lab exercise where wires were tinned.
Explain to them that now they will learn the correct methods for stripping
wires and be able to apply that information to subsequent lab exercises.
Wire Stripping SHOW AND DISCUSS SLIDE SC-6

Wire Stripping
- Mechanical Stripping
- Thermal Stripping
- Chemical Stripping
Begin this section by introducing the three types of wire stripping. Continue
with a more detailed description of each type.
SC-4
Mechanical Stripping SHOW AND DISCUSS SLIDE SC-7

Mechanical Strippers
- Hand
- Machine
Discuss the two types of mechanical strippers, hand and machine. Show a
diagram of mechanical strippers (figure 6-3, J-STD-001 Handbook).
Give a brief description and the types available on the market. Emphasize
the importance of the proper selection of the correct notch in the stripper and
or checking for proper alignment of the stripper blades.
Thermal Stripping SHOW AND DISCUSS SLIDE SC-8

Thermal Strippers
- Remove wire by hand to avoid insulation smearing
- Insulation must not be charred
Discuss the use of thermal strippers.

Show a diagram, and using the diagram, explain how they work,
emphasizing that removal of the wire should be done by hand to avoid
smearing insulation.
Explain that J-STD-001 requires that insulation must not be charred when
this type of wire stripper is used, however discoloration is permissible.
Chemical Stripping SHOW AND DISCUSS SLIDE SC-9

Chemical Strippers
- Limited to use on solid wires
- Neutralize or remove residues before soldering
Discuss the use of chemical strippers. There are different types of chemical
strippers, and the manufacturer’s instructions should be followed for storage
and clean-up. J-STD-001 puts requirements on some product, as shown in
the slide. Review these with the class. Explain that without neutralization
or removal of the residues, several things can happen, namely, continued
attack by the residues and/or oxidation that affects solderability. Remind the
students that preserving solderability is key to an acceptable solder joint.
SC-5
Birdcaging (as defined in IPC-T-50)

Damaged Wires Damaged Wires
- Limits are defined in J-STD-001
- Special requirements for wires used at a potential of 6kV or
greater
Define “damage” to the class as “nicked or broken.” To be considered

damage, a nick must be in excess of 10% of the original strand diameter.
Remind the class of the wire damage requirements given earlier.
Direct students to Table 6-1 in J-STD-001. Display a copy as a visual aid.

Show students how to read the table.
Give the students the definition of birdcaging and use diagrams or pictures to
demonstrate the appearance of birdcaging.
Explain the “shall” requirement for wires with a potential of 6kV or greater.
6.1.3.1 Tinning of Stranded Wire

Portions of stranded wire that will be soldered.....
Tinning Tinning
-Occurs after stripping process and prior to soldering
- Bonds the individual wires together
Discuss tinning “shall” be done prior to mounting, wet the tinned portion of
the wire and should penetrate to the inner strands of the wire.
Begin building a flowchart. Keep this flowchart in an area where the class
can see it, and do not erase or remove it until it is completed. The title of the
flowchart will be “The Soldering Process.” Complete the first two blocks as
follows:
Wire Stripping → Wire Tinning →
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Ask the students to recall the lab exercise, and ask if they agree that
successful tinning bonds the individual wires together. If anyone disagrees,
investigate the reason and discuss with the class. Reiterate that successful
tinning will have a smooth finish with the outlines of the wire visible in the
solder.
Review SHOW AND DISCUSS SLIDE SC-12

Review
- Lead Cutting and Forming
- Wire and Cable Preparation
Ask the students some or all of the following questions: What is the
requirement for a nicked wire with 21 strands? What is the reasons cited for
tinning?
6.2 Bifurcated and Turret Terminal Installation
Introduction
Terminals
- Installation
- Mounting
Review the contents of this section. Both installation and mounting of wires
and components to terminals will be discussed.
Using the flow chart on “The Soldering Process,” draw blocks as shown
below:
Terminal Mounting →
→ Mounting
Wire Stripping → Wire Tinning →
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6.2.1 Shank Discontinuities

The shank of the terminal shall be neither....
6.2.2 Flange Discontinuities

The flange shall not be split, cracked or otherwise....
Anatomy of a Terminal (Use pictures terminals)
Explain where the shank and the flange are on a terminal.
Shank and Flange Discontinuities SHOW AND DISCUSS SLIDE SC-15

Shank and Flange Discontinuities
(Show a picture of a terminal with a circumferential crack)
Discuss the circumferential crack, and explain that propagation of these

cracks could result in complete separation. No circumferential cracks or
splits are allowed in the shank
Show the class other types of cracks. Discuss the outcome of entrapped
fluids such as entrapment and blowholes. No perforations, splits, cracks or
other discontinuities that can entrap liquid substances
Rolled Flange Discontinuities SHOW AND DISCUSS SLIDE SC-16

Rolled Flange Discontinuities
(Show J-STD-001, Figure 6-2)
Direct the students to J-STD-001, Figure 6-2, and discuss what makes this a
rolled flange. Briefly describe the process of installing the flange.
Explain that two requirements are given in the form of “shall” statements.
These are: the rolled area is to be free of circumferential splits or cracks and
no more than three radial splits or cracks separated by at least 900 and do not
extend into the barrel of the terminal. Using the figure, explain these
requirements.
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6.2.3 Flared Flange Angles

Flared flanges should be formed.....
Flared Flange Angles SHOW AND DISCUSS SLIDE SC-17

Flared Flange Angles
Using the visual aid, explain the recommendations as follows:

A. Formation of an angle between 350 and 1200 for retention prior
to soldering
B. The flange extend 0.38 - 1.5mm beyond the
surface of the land
C. The flare diameter should not exceed the
diameter of the land
Explain that a requirement in the form of a “shall” statement requires that

minimum electrical spacing is retained.
Explain that the recommendations are based on the fact that that if the flare
is too tightly placed in the hole, solder will not flow during the soldering
process or cause possible laminate damage. If it is too loose, the terminal
could tilt. Show the class where the minimum electrical spacing could be
violated with a flared flange.
6.2.4 Terminal Mounting - Mechanical
Terminals not connected to printed wiring or ground planes.....
Terminal Mounting - Mechanical SHOW AND DISCUSS SLIDE SC-18

Terminal Mounting - Mechanical
(Show J-STD-001 Handbook, Figure 6-7)
Explain that rolled flanges are used when the flange is only providing
mechanical attachment. Using the diagram, explain that rolled flanges shall
be required for terminals not connected to printed wiring or ground planes.
Also show the class on the diagram that printed lands used as seating
surfaces for rolled flanges may be used if the land is isolated.
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Terminal Mounting - Electrical SHOW AND DISCUSS SLIDE SC-19

Terminal Mounting - Electrical
Show the class that non-plated through holes may be used for mounting
terminals when active circuitry is on the top side and a rolled flange is on the
secondary side of the board.
Explain that three additional requirements exist in the form of “shall”

requirements. These are:
A. Use a flared flange in non-interfacial plated through-holes
provided the mounting is in conjunction with a land or
ground plane on the flared side.
B. Do not flare terminals against bare laminate
C. Prohibit the use of funnel-shouldered terminals
Using the diagram, show the students where these violations would occur.
6.3 Mounting to Terminals
6.3.5 General Requirements for Mounting to Terminals
6.3.5.1 Insulation Clearance
The clearance (c) between the end of the wire....
Insulation Clearance SHOW AND DISCUSS SLIDE SC-20

Insulation Clearance
(Show IPC-A-610, Figure 3-67)
Define “wire diameter” for the class, and explain where the “insulation
clearance” is located. Explain to the class that the following requirements
are given in J-STD-001:
A. Minimum: Insulation in contact with the solder joint, but
“shall” not be covered by solder. Wire contour should not
be obscured.
B. Maximum: “Shall” be less than two wire diameters
including insulation or 1.5mm, whichever is larger, but “must”
not permit shorting between adjacent conductors.
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Explain the requirements and the ramifications if the extremes are violated.
Stress that the optimum is to prepare the wire such that the insulation
clearance is at neither extreme. Reintroduce “birdcaging,” and discuss the
use of a properly tinned and mounted wire.
6.3.5.2 Service Loops

Lead wires shall be dressed in the proper..... SHOW AND DISCUSS SLIDE SC-21
Service Loops
Service Loops (Show J-STD-001, Figure 6-13)
Define service loops and field repair. Explain the only requirements given in
J-STD-001 are “shall” requirements. These are to dress wires with a slight
loop or gradual bend and allow for a field repair.
6.3.5.4 Orientation of Wire Wrap SHOW AND DISCUSS SLIDE SC-22

Lead wires may be wrapped clockwise..... Orientation of Wire Wrap
(Show J-STD-001 Handbook, Figures 6-18 - 6-20)
Orientation of Wire Wrap
Explain that the wire may be wrapped clockwise or counter clockwise,
consistent with direction of potential stress application. Discuss a “shall”
requirement to continue the curvature of the dress of the wires and not to
have the wire interfere with wrapping of other wires on the terminal.
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6.3 Mounting to Terminals

6.3.1 Bifurcated (Slotted) and Turret Terminals
6.3.1.1 Wire and Lead Wrap-Around - Turret and Straight Pin
Leads and wires should be mechanically secured to their....
Wire and Lead Wraps - Turret and Straight Pin Terminals SHOW AND DISCUSS SLIDE SC-23
Wraps on Turret and Straight Pin Terminals
Explain that these are straight pin and turret terminals. Recommendations
exist for mechanical securing before soldering and for adequate service loops
be provided for field maintenance. In addition, “shall” requirements are:
A. Wrap of 1800 minimum
B. Should not overlap after wrapping
Define a 1800 wrap on a terminal. Explain that the amount of wrap

determines the strength of the solder joint, and overlapping serves no
purpose.
Discuss the recommendation for mechanical securing by telling the students

that this prevents movement during and immediately after soldering when
such movement could cause fractured and/or disturbed solder joint.
Begin a table for the class to see. Keep this displayed for the duration of this
chapter such that items can be added to it. Begin with:
Wraps on Terminals
Type of terminal Minimum wrap Maximum wrap
Turret 1800 No overlap
Straight Pin 1800 No overlap
Stress Relief SHOW AND DISCUSS SLIDE SC-24

Stress Relief
Define stress relief. Explain that component leads and wires connected to
SC-12
terminals are required to have stress relief, and using the examples, ask the
students what they would think would happen without stress relief. Discuss.
6.3.1.2 Side Route Connection - Bifurcated Terminals

Bifurcated terminals shall have.....
6.3.1.3 Top and Bottom Route Connections

Bottom routed wires shall.....
Bifurcated Terminal Connections Bifurcated Terminal Connections
- Side Route
- Top and Bottom Route
- Continuous Runs
Tell the students that there are several ways to route wires on a bifurcated
terminal. Direct the students to J-STD-001, Figures 6-7A, 6-8 and 6-9 and
explain the difference between side, bottom, top routes and continuous runs.
Bifurcated Terminals - Side Route Connection SHOW AND DISCUSS SLIDE SC-26
Bifurcated Terminals -Side Route Connection
Using the same visual aid (IPC-A-610, Figure 3-52), explain the
requirements for ends which may extend beyond the base of the terminals
provided electrical spacing is maintained and the placement of multiple wire
in ascending order with the largest on the bottom, except for bus wire.
Explain the reason for exclusion of bus wire.
Explain the “shall” requirements for mechanical securing of wire(s) to

bifurcated terminals, side route: (1) 900 minimum wrap, (2) Dressed through
slot and wrapped to either post, (3) One corner in contact with one post, (4)
Contact base or previously installed wire. (Note: If staking/bonding is
incorporated on used approved design, wires may be routed straight through
without wrapping, however, contact to the base or previously installed wire
remains a “shall” requirement.
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Bifurcated Terminals - Side Route Connection (continued) Include a discussion of multiple attachments. Address the recommendation
for no overlapping of wraps and wires and maintaining the spacing between
wires and the wires and terminal boards consistent with the wire insulation
thickness.
6.3.1.3 Top and Bottom Route Connections
Bottom routed wires shall be wrapped.....
Bifurcated Terminals - Top and Bottom Route Connections SHOW AND DISCUSS SLIDE SC-27
Bifurcated Terminals - Top and Bottom Route Connections
Explain the top and bottom route configurations and discuss the need for
doubled or filler wire in the top route connection where space permits (this is
a “shall requirement).
Discuss the process for top route connections by explaining the need to
preform the wire prior to insertion. If two wires are used, both should be
inserted at the same time. Explain that in both cases, the wires should be in
contact with the base of the terminal or the previously installed wire.
Explain that for bottom route connections, the wires should be wrapped on
the terminal base or post with a minimum 90 degree bend.
6.3.1.4 Continuous Runs
A continuous solid bus wire may......
Continuous Runs SHOW AND DISCUSS SLIDE SC-28

Explain that continuous runs are used for solid bus wire connections.
Explain the use of continuous runs when three or more bifurcated or turret
terminals are to be connected and how they are done. Explain that the first
and last terminals must have the wires terminated in the same manner as
turret terminals are terminated.
Discuss the need for a curvature in the wire to provide relief of tensions from
SC-14
environmental loading.
Explain that one “shall” requirement exists, and it is for pierced or

perforated terminals. Show how the wire contacts at least two non-adjacent
contact surfaces of each intermediate terminal.
Suggestion: If the class is having difficulty grasping these ideas,

demonstrate them using class members (volunteers) as “terminals” and a
piece of rope as a “wire.” After establishing the orientation of the
“terminals,” have another student direct the “wire” through the “posts.”
Direct the students’ attention back to the chart started earlier. Ask the
students for input on the requirements for bifurcated terminals, and complete
accordingly.
Bifurcated terminal 900 No overlap
6.3.2 Hook Terminals

The maximum wire wrap shall not exceed.....
Hook Terminal SHOW AND DISCUSS SLIDE SC-29

Hook Terminals
Explain that the wrap requirements for hook terminals are given as “shall”
requirements. Tell the class the number of wires to be placed on the
terminal is limited by how many will fit within the hook. The wire wrap
minimum is 1800 and the wires should not overlap. Add this information to
the chart:
Hook Terminal 1800 No overlap
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6.3.3 Pierced or Perforated Terminals

For wiring to a single terminal, the wire(s) shall pass.....
Pierced or Perforated Terminals SHOW AND DISCUSS SLIDE E-57

Pierced or Perforated Terminals
Explain that in all cases, the lead or wire ends should not extend beyond the
terminal more than one lead diameter. In all cases, the electrical clearance
“must” be maintained. D and E of J-STD-001, Figure 6-11 show this.
Explain that there are several “shall” requirements in this section. These
are:
A. On single terminal wiring, the wire passes through the eye
and is wrapped around the terminal.
B. On continuous run wiring, the wire is attached at each end,
as discussed above, with the wire contacting non-adjacent
contact surfaces of each intermediate terminal.
C. When staking or bonding is used by design, wires attached
to pierced terminals contact at least two (adjacent or non-
adjacent) surfaces of the terminal. They shall be a
minimum of 1/4 to a maximum of 3/4 turn.
Make an entry on the table for pierced or perforated terminals:
Pierced or Perforated wrapped around the terminal

Staked/Bonded
Pierced or Perforated ¼” ¾”
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6.3.4 Cup and Hollow Cylindrical Terminal Soldering

The lay of the strands of any wire......
Cup and Hollow Cylindrical Terminal Soldering

Cup and Hollow Cylindrical Terminal Soldering
(Show a picture of a gold terminal)
Explain that all requirements in this section are “shall” requirements except
for one allowance for all classes that solder may overfill the cup. The shall
requirements are: the lay of the wire strands not disturbed, no removed
strands, wire inserted the full depth of the cup, a fillet formed along the
surfaces of contact, solder wetting the entire inside of the cup, at least 75% of
the cup filled, solder visible in inspection hole (may rise slightly above it),
and any solder on the outside of the cup in the form of a thin film.
9.2.7 Terminal Soldering

Terminals mounted in accordance with 6.2…
Terminal Solder Connections SHOW AND DISCUSS SLIDE SC-31

Terminal Solder Connections
(Show J-STD-001, Table 9-10)
Explain that solder joints should exhibit good wetting to the land or
conductive plane and the terminal flange/shoulder.
Discuss “shall” requirements for terminal soldering as shown in Table 9-10.
SC-17
Review
Review
Review the table formed during the discussion. Ask the class some of the
following questions: What is the requirement for a continuous run on a
pierced terminal for a Class 1 product? ......a Class 2 product? .......a Class 3
product? What is the importance of stress relief? What are the allowed
routings for a wire on a bifurcated terminal? What is recommended for
wires of different sizes mounted on a turret terminal?
Requirements Handout
DISCUSS REQUIREMENTS HANDOUT
Requirements Handout
1. Using Class 3 requirements and tinned wire stripped using

an acceptable method of stripping, solder one of each of
the following. Note: All extra terminal sites may be used
for practice and do not require instructor critique. Those
for instructor critique should be marked using a label or
piece of tape.
A. Turret terminal with one wire

B. Bifurcated terminal with two wires
C. Gold terminal with one wire
2. Student inspection of the work.
Distribute Requirements Handout to the class. (Note: This can be done prior
to entering the lab work area, if applicable.)
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Soldering Demonstration - Bifurcated Terminal Demonstrate Technique and Discuss
This demonstration should include information on checking the condition

and function of equipment, proper application of flux, proper soldering
technique, including formation of a heat bridge, cooling and cleaning.
Ask the students if there are any questions and answer accordingly.
Explain the requirements as listed. Emphasize to the class that students

should submit work for instructor inspection and critique only after they have
inspected it and found it to be satisfactory.
Explain to the students: For grading purposes, instructors should indicate on

the Requirements Handout when an item has been completed.
Note: Instructors will be required to keep a log of this work if objective
evidence of training is required. Such objective evidence is a “shall”
requirement in J-STD-001.
Soldering Demonstration - Gold Terminals Demonstrate Technique and Discuss
This demonstration should include information on checking the condition

and function of equipment, removal of gold from terminal, proper
application of flux, proper soldering technique, including formation of a heat
bridge, cooling and cleaning.
Explain the requirements as listed. Emphasize to the class that students

should submit work for instructor inspection and critique only after they have
inspected it and found it to be satisfactory.
Explain to the students: For grading purposes, instructors should indicate on

the Requirements Handout when an item has been completed.
Note: Instructors will be required to keep a log of this work if objective
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evidence of training is required. Such objective evidence is a “shall”

requirement in J-STD-001.
Student Soldering
ASSIST AND CRITIQUE STUDENT WORK
Assist students as needed. Be aware of students with difficulties, and give

special attention and instruction where applicable.
Critique student work and record completion on the Requirements Handout

as required.
While reviewing the work, ask students questions concerning the equipment,
the set-up and the requirements of J-STD-001. Examples of these questions
are: What is the suggested solder pot temperature for tinning components?
What is the requirement for soldering a wire to a bifurcated terminal? What
is the requirement for tinning gold terminals?
SC-20
SC-21
Section SD - Soldering Surface Mount Devices
J-STD-001B
J-STD-001B Handbook
IPC-A-610
PCB Assembly Drawing
Instructional Aids:
1. Projector
2. Slides
3. Screen
4. Flip Chart
5. Posters of completed solder joints per IPC-A-610B
6. Materials
a. A printed wiring board with through-hole and surface mount pads
b. Components
Chip capacitor
J-Leaded
Gull wing
7. Buddy microscope
b. Be aware of the recommendations and requirements for lead forming.
c. Describe the types of printed wiring board defects that must be rejected.
d. Understand the requirements for surface mount part mounting.
e. Describe and explain the soldering requirements for surface mount components.
f. Solder surface mount components to a printed wiring board.
g. Define reflow machine soldering and distinguish between it and other types of soldering.
h. Explain the controls necessary for reflow.
i. Describe the flux application for reflow machine soldering.
j. Demonstrate the ability to accurately inspect surface mount solder connections.
k. Distinguish between conformal coating and encapsulants.
l. Explain the requirements for application of conformal coating and encapsulants.
m. Explain where conformal coating and encapsulants should not be placed.
n. Explain the performance requirements for conformal coating and encapsulants.
SD-1
o. Explain the rework requirements for conformal coating and encapsulants.
p. Discuss the inspection requirements for conformal coating and encapsulants.
q. Discuss rework requirements for conformal coating and encapsulants.
r. Inspect conformal coating and encapsulants and determine defects.
Note: During the practical soldering portions of this section, parts used can be tailored to the types of parts used in the students’ facilities.
Any portions of this section that may have been covered during the surface mount section, if taught during the same training session, can be
eliminated.
Equipment List
Soldering iron
Solder
Flux
Cleaning solvent
Tweezers
Orange sticks
Needle-nosed pliers
SD-2
Introduction SHOW SLIDE SD-1

J-STD-001B
JOINT INDUSTRY STANDARD
Requirements for Soldered Electrical and Electronic Assemblies
Operator/Inspector Training Program
Module 2
Surface Mount
SHOW AND DISCUSS SLIDE SD-2

Purpose of Course Purpose of Course
- J-STD-001B Operator/Inspector Training
- Designed the provide Operator/Inspector Personnel with a
structured training program
- Provide Operators/Inspectors with the knowledge and skills
necessary to perform their job
Explain the purpose of the course. The course is designed to provide the
electronic manufacturing industry with a structured training program. The
course will provide the graduating Operator/Inspector with the knowledge and
skills necessary to perform the job.

Module Overview MODULE OVERVIEW
- Knowledge of Requirements
- SMT Soldering Skills
- SMT Inspection Skills
Explain the purpose of the training module. It is designed to help familiarize

the student with the basic assembly requirements for SMT, teach the basic
SMT soldering skills and teach the basic SMT inspection skills.

Module Goal MODULE GOAL
To qualify individuals to perform soldering operations and/or
inspection to the requirements of J-STD-001B for the modules
of instruction completed.
Explain that upon completion of this course, the operator/inspector will be

qualified to perform soldering operations and inspection to the requirements
of J-STD-001B for the modules completed.
SD-3

Course Objectives OBJECTIVES
- Module 2: Surface Mount Assembly and Soldering
- Demonstrate a proficiency level of knowledge to the
requirements of J-STD-001B
Explain the assembly skills goal by discussing how the student will learn to
prepare, install and solder SMT components to a printed wiring board in
accordance with the requirements of J-STD-001B.

When design restrictions mandate mounting..... SHOW AND DISCUSS SLIDE SD-6
General Part Mounting Requirements - Consider design and component parameters before
- Assemblies with mixed technology should have through-hole
components on one side.
Explain the “must” requirement for using separate soldering operations as

dictated by design restrictions and component specifications.
Explain the “shall” requirement for cleaning after each soldering operation so
that subsequent placement and soldering operations are not impaired by
contamination.
Define mixed technology and explain the recommendation for mounting

through-hole components.
6.1.1 Part Markings and Reference Designations

Part markings and reference designations should be....
Part Markings and Reference Designations Part Marking and Reference Designations
(Show photo of legible and illegible marking on an assembly)
Discuss the part marking requirements. Markings should be legible and parts
mounted so that markings are visible.
SD-4
6.1.2 Lead Forming

Part and component leads should be performed to the final..... SHOW AND DISCUSS SLIDE SD-8
Lead Forming Prior to Assembly or Installation
Lead Forming (Show a slide of several different parts with formed leads)
Explain forming may be manual or automated, depending on the availability

of equipment and should be to the final configuration excluding the final
clinch or retention bend. The critical elements of forming are support at the
lead exit from the component body, the lead forming action and the lead end
trimming so that no damage is done to the connections internal to
components. There “must” be no degradation to part bodies, leads and lead
seals below part specifications requirements
Briefly describe the forming action, highlighting the isolation of the lead to
body seal so as to not impart stress.
Describe a part specification and tell the students that these should give
information on acceptable damage limits.
6.1.2.1 Lead Forming Limits

Whether leads are formed manually or by machine or die,...... SHOW AND DISCUSS SLIDE SD-9
(Use IPC-A-610, Figure 3-36)
Lead Forming Limits
Direct the students to IPC-A-610, Figure 3-36. Explain the limit of 10% of
the diameter, width or thickness of the lead for all leads. The flattened areas
of round leads used for surface mount are excluded from the 10% deformation
requirement.
6.1.2.2 Lead Cutting

Tools used to cut leads must.....
Detrimental shock (from J-STD-001 Handbook, para 6.1.2.2)
Any impact force during lead trimming that induces fractures in the seal
of hermetically sealed components that damages internal electrical
connection within components.
SD-5

Lead Cutting Lead Cutting
- Tools must not impart detrimental shock
Define “detrimental shock” per J-STD-001 Handbook for the students.
Explain the consequences of using improper tools such as allowing

contaminants to get inside the component and possible fracture of the internal
solder or weld connection.
6.1.6 Adhesive Coverage Limits

Adhesive materials, when used, shall not flow......
Adhesive Coverage Limits Adhesive Coverage Limits
- May be required to prevent adhesive flow onto areas to be
soldered
Explain that adhesives, such as those used for tacking down wires and
component bodies prior to soldering, may lead to adhesives getting on surface
to be soldered. This may result in a loss of solderability on those surfaces.
Emphasize that proper adhesive disbursement along with an adhesive that
meets the needs and requirements of the job will assist in achieving
acceptable solder joints.

Review Review
- Part mounting requirements
- Hole Obstruction
- Adhesives
Ask the students some or all of the following questions: What happens if a
product has adhesive all over the solder pads prior to soldering? What is the
requirement for mounting over a hole?
9.2 General Assembly Requirements

All products must meet..... SHOW AND DISCUSS SLIDE SD-13
General Assembly Requirements
General Assembly Requirements - Products must meet the requirements of the
SD-6
drawing(s)/documentation
- Electrical and mechanical integrity and reliability of all
components and assemblies must be retained after processing
Discuss the requirements and the need to use processes, processing materials
and assembly methods that are compatible with the hardware being
manufactured.
9.2.1.1 Printed Wiring Board Damage

The following printed wiring board defects must....
Printed Wiring Board Damage SHOW AND DISCUSS SLIDE SD-14

Printed Wiring Board Damage
Defects not allowed in J-STD-001 are indications of fabrication
processing problems which may result in the loss of a completed
assembly if not rejected before beginning assembly.
Discuss the great reduction in costs when defects are noted up front before
time and materials are expended on the assembly. Some defects may
propagate during the assembly and soldering process. These products must be
removed before the assembly process begins.

Printed Wiring Board Damage (continued) Printed Wiring Board Damage
- Blistering
- Delamination
- Charring
- Weave Exposure
- Haloing and Edge Delamination
Explain that if at any time, these defects are noted, assembly operations
should be stopped and noted as applicable.
Blistering (per IPC-T-50): The localized swelling and separation between

any layers of the base material or between the material and the metal
cladding or protective coating.
Blistering Blistering
(Show IPC-A-610, Figure 8-5 or a photo of a blister)
SD-7
Define blistering per IPC-T-50, and discuss the effects of a blister on an

assembly.
Explain that when blisters bridge between plated-through holes or between

subsurface conductors, or extend under surface conductors or over/under
subsurface conductors, the boards must be rejected.
Delamination (per IPC-T-50): A separation between any layers of the

base material or between the base material and the metal cladding. SHOW AND DISCUSS SLIDE SD-17
Delamination
Delamination (Show IPC-A-610, Figure 8-6)
Define delamination per IPC-T-50, and discuss its effects on an assembly.
Explain that the requirements are the same for delamination as they are for
blisters

Charred Printed Wiring Boards
Charred PWB’s (Picture of a charred PWB)
Explain that the requirements are the same for charred printed wiring boards
as they are for blisters and delamination.
Weave Exposure (per IPC-T-50) is a base material surface condition in

which the unbroken fibers of woven glass cloth are not completely
covered by resin. SHOW AND DISCUSS SLIDE SD-19
Weave Exposure
Weave Exposure (Show IPC-A-610, Figure 8-15)
Define weave exposure and discuss the requirements for no weave exposure
that reduces the spacing between adjacent conductors to less than the
minimum electrical spacing. Explain why weave exposure is not acceptable
under these conditions. Note that processing fluids can become trapped in the
laminate and cause subsequent failures.
SD-8

Haloing (per IPC-T-50) is mechanically-induced fracturing or Haloing and Edge Delamination
delamination, on or below he surface of a base material. That is usually (Show IPC-A-610 Figure 8-17, 18, 21 or better)
exhibited by a light area around holes or other machined features.
Define haloing and edge delamination and discuss the requirements.
Haloing and Edge Delamination

A lifted land (per IPC-T-50) is a land that has fully or partially separated Lifted Lands
(lifted) from the base material, whether or not any resin is lifted with the (Show a slide showing this condition)
land.
Define lifted lands and explain the requirement. Explain the reason for this
Lifted Lands being a defect. Note that failures can occur due to the land being lifted.

9.2.1.2 Component Damage Component Damage
No chips shall be allowed on glass bodied components.....
Explain that no chip allowed on glass bodied components in excess of
Component Damage component specification limits is a “shall” requirement. This damage may
lead to performance deterioration when the component substrate or active
element is exposed. Minor surface flaws, discoloration, meniscus cracks,
chips or other damage that does not exceed the component specification limits
are acceptable..

Component Damage
(Show a slide of a charred component)
Explain that charred components are not allowed.

Component Damage (continued)
SD-9
9.2.2 Markings
Markings shall not be deliberately altered, obliterated.....
Markings Markings
- Shall not be deliberately altered, obliterated, or removed by
the manufacturer unless required by the assembly
- Additional markings during the manufacturing process
should not obscure the original supplier’s markings
Explain the requirements and discuss the need for identification. Ask the
class what types of markings could be on a printed wiring board. Make a list
of these (include screening, etching, stamping, laser, and bar code). Explain
to the class that J-STD-001 does not distinguish between the types of
markings. The requirements apply to all types.
Remind the students that part markings are covered by different requirements
(J-STD-001, para 6.1.1).
9.2.3 Bow and Twist

Bow and twist after soldering should not exceed.....
Bow and Twist Bow and Twist
(Show a graphic of the set-up as in IPC-TM-650)
Define bow and twist. Explain the differences, and how the percentages are
calculated. Perform a demonstration for the class, explaining the steps to
arriving at the measurements. Refer the students to IPC-TM-650, 2.4.22 (in
the back of J-STD-001) for the procedure being used.
9.2.4 Solder Connection

The acceptable solder connection must indicate evidence of......
Solder Connection Solder Connection
Explain the slide in terms of the requirements as given. Show the students the
various wetting angles, and tell the students that solder joints should have a
SD-10
smooth or satin luster finish. In certain circumstances, dull, matte, gray or

grainy appearing solder is normal. Explain when they are acceptable.
Explain that marks or scratches “shall” not degrade the integrity of the
connection.
9.2.5.3 Exposed Basis Metal

Incomplete solder wetting at the tip.....
Exposed Basis Metal Exposed Basis Metal
(Show a slide of exposed basis metal)
Explain that exposed basis metal is acceptable at the following locations:

1. The edges and/or periphery of lands and conductors
2. Component lead ends
Explain that depending on how long the basis metal is exposed, oxides will
build up that interfere with the solder wetting. As long as those oxides do not
interfere with the solder connection, they are acceptable.
9.2.5 Interfacial Connections

Unsupported holes with leads or plated through-holes, .....
Interfacial Connections Interfacial Connections
Explain the use of an interfacial connection (via). Tell the class that these do
not need to be filled with solder, and in some cases, due to size, they are
tented by solder mask. Briefly describe tenting.
Explain that when plated through-holes without leads are exposed to reflow,
wave, dip or drag soldering, they “shall” meet the requirements of the figure.
SD-11
9.2.4.1 Solder Connection Defects
The following solder joint conditions.....

Solder Connection Defects - Fractured Solder Connections Fractured Solder Connections
(Picture of a fractured solder joint)
Show the class the fractured solder joint, and explain that this is a defect.
Describe how a solder joint could be fractured. Discuss what would happen
if fractured solder joints were left in assemblies.

Solder Connection Defects - Disturbed Solder Connections Disturbed Solder Connections
(Picture of a disturbed solder connection)
Show the class the disturbed solder joint, and explain that this is a defect.
Describe how a solder connection can be disturbed. Discuss what would
happen if disturbed solder joints were left in assemblies.

Solder Connection Defects - Cold Solder Connections Cold Solder Connections
(Picture of a cold solder connection)
Show the class the cold solder joint, and explain that this is a defect. Describe
how a solder connection can be cold. Discuss what would happen if cold
solder joints were left in assemblies.

Solder Connection Defects - Excess Solder Excess Solder
(Picture of solder contacting the body of a leaded surface mount
component.)
Show the class the excess solder on the body of the component, and explain
that this is a defect. Describe how this defect can occur, and what could
happen if such defects were left in assemblies.
SD-12
6.4 Surface Mounting of Components

Note: See Appendix B for surface mounted device placement guidelines.
Surface Mount Components Surface Mount Components
- Placement Accuracy
- Lead Forming
- Devices with Two Terminations
- Body Positioning
Introduce this section. There will be a practical session for surface mount
components that will follow the classroom instruction.
Discuss the topics, which will be covered in this classroom session.
6.4.1 Placement Accuracy

Placement accuracy for components should be....
Placement Accuracy Placement Accuracy
- Should be sufficient to ensure the component is properly
positioned after soldering
- Appendix B is a guideline for placement
Explain what is meant by placement accuracy.
Direct the students to look at Appendix B. Explain that these are accepted
industry practices and will be used in the practical portion of this class.
Appendix B
Placement Guidelines for Surface Mount Devices
The following placement guidelines.....
B-1 Component Positioning
SD-13

Component Positioning Component Positioning
- Not to reduce spacing below the minimum
electrical spacing
Explain the minimum electrical spacing is not to be violated.
B-5 Surface Mount Device Lead and Land Contact

Minimum contact length should..... SHOW AND DISCUSS SLIDE SD-36
Lead and Land Contact
Lead and Land Contact - Should be equal to the lead width for flat leads and
1.5 times the diameter (1.5D) for round leads.
Explain the lead and land contact suggestions.
B-9 Surface Mount Device Lead Height....

Surface mount device leads should... SHOW AND DISCUSS SLIDE SD-37
Maximum Lead Height Off Land (Prior to Soldering)
Lead Height Off Land (Prior to Soldering) - One-half the original lead diameter for round or
flattened leads
- Two times the lead thickness or 0.5mm,
whichever is less, for flat or ribbon leads
Explain the recommendations for lead height off land prior to soldering.
Explain that toe up or toe down on flat or round leads is permissible provided
that separation between the leads and termination area does not exceed 2T and
0.5D limits, respectively.
B-12 Other Devices

TO-can devices, tall profile....
Other Devices Other Devices
- Includes TO-devices, tall components (over 15 mm),
SD-14
transformers and metal power packages

- Mounting provides for parts to withstand end-item shock,
vibration and environmental stresses
Explain that other devices may be surface mounted, but they must be bonded
or secured to withstand end-item stresses.
6.4.2 Surface Mount Device Lead Forming

The leads of leaded surface mounted components.....

Surface Mount Device Lead Forming Surface Mount Device Lead Forming
(Show a slide of various surface mount components)
Explain the “shall” requirements for lead forming which are:

A. Prior to soldering
B. No damage to the lead-to-body seal with no residual stresses.
Explain that most lead forming on surface mount components is done using
die equipped forming machines that hold the leads firmly before forming and
trimming the ends.
6.4.2.1 Flat Pack Parallelism

Leads on opposite sides of surface mounted flatpacks.....
Flat Pack Parallelism Flat Pack Parallelism
(Show J-STD-001, middle part of Figure 6-15)
Explain parallelism, and discuss the recommendation that the spacing limit of
2.0mm not be violated. Explain the “shall” requirement that nonparallelism
between the base of the component and the surface of the board is minimal.
Ask the class for reasons why cant is undesirable, and explain the need to
limit stress after soldering.
6.4.2.2 Surface Mount Device Lead Bends

Leads shall be supported during forming to protect....
SD-15

Surface Mount Device Lead Bends Surface Mount Device Lead Bends
(Show a formed SMT device with the 1T dimension given)
Discuss the requirement for a lead-bend radius >1T, where T is the nominal
lead thickness/diameter. Explain that any damage can lead to damaging the
internal elements of the component. Explain that this is a requirement for all
classes, but in addition, there are “shall” requirements. These are:
A. Support of the leads during the forming process
B. No bends extending into the seal
6.4.2.3 Surface Mount Device Lead Deformation

Lead deformation (unintentional bending)....
Surface Mount Device Lead Deformation Surface Mount Device Lead Deformation
Explain that unintentional bending is allowed, but there are requirements.

Using the figure, explain these:
A. No evidence of a short or potential short existing
B. No damage to the lead-to-body seal or weld
C. No violation to the minimum electrical spacing
D. Except for preformed stress loops, the top of the lead should
not extend beyond the top of the component body
E. If present on bends, toe curl should not exceed two times the
thickness of the lead
Discuss what would cause failures or latent failures.
6.4.2.4 Flattened Leads

Components with axial leads of round..... SHOW AND DISCUSS SLIDE SD-43
Flattened Leads Flattened Leads
(Show a slide of an axial leaded component with no flattening
beside one that has flattened leads.)
SD-16
Explain how a flattened lead is formed and that they are exempt from the 10%
lead deformation requirement given earlier.
Discuss the reason for flattening, and explain the “shall” requirement that the
thickness shall no less than 40% of the original lead diameter.
6.4.2.6 Parts Not Configured for Surface Mounting

Components of the through-hole configuration....
Parts Not Configured for Surface Mounting Parts Not Configured for Surface Mounting
(Show a slide of non-axial leaded components)
Explain that sometimes these components are formed for surface mounting,
but a “shall” requirement exists that they “shall” not be surface mounted
unless the leads are formed to meet surface mount lead forming requirements.
This is generally accomplished using custom die forming equipment or
tooling.
6.4.2.5 Dual-in-line Packages (DIPs)

Dual-in-line packages may be surface mounted..... SHOW AND DISCUSS SLIDE SD-45
Dual-in-line Packages (DIPs)
Dual-in-line Packages (DIPs) (Show J-STD-001 Handbook, Figure 6-23 ...the left side only)
Explain how DIP leads can be formed for surface mounting with a bend 90
degrees outward to create a flat surface. Discuss the recommendation that
this not be done by hand.
6.4.5 Parts Configured for Butt Lead Mounting

Parts may be configured for surface mounting....
Parts Configured for Butt Lead Mounting Parts Configured for Butt Lead Mounting
(Show J-STD-001 Handbook, Figure 6-23....the right side only)
SD-17
Explain butt mounting, and discuss the small surface-to-surface interface

between the lead and the circuit pad. Explain that it is not allowed for Class 3
products.
6.4.4.1 Axial-Leaded Components

The body of a surface mounted axial-leaded...
Axial-Leaded Components Axial-Leaded Components
(Show an axial-leaded component formed for surface mounting)
Explain the risk of mounting an axial-leaded component too high off of the
board. The recommendation is that it be raised no more than 2.0mm above
the surface without attachment by adhesive or other mechanical means.
6.4.3.1 Mounting of Chips on Parts (Stacking)

When part stacking is permitted by the assembly drawing....
Mounting of Chips on Parts (Stacking) (Show J-STD-001 Handbook, Figure 6-24)
Discuss stacking of components. Although allowed, (only when permitted by

the assembly drawings/documentation), it is not recommended. Explain the
requirement that there “shall” be no violation of minimum electrical spacing.
6.4.3.2 Devices with External Deposited Elements

Components with electrical elements deposited on an....
Devices with External Deposited Elements (Show a slide of a component with an external deposited element)
Discuss the location of the element and what would happen if it was mounted
close to the board. Explain that there is a “shall” requirement for the element
to be away from the board or substrate.
6.4.4 Leaded Component Body Positioning

Non-insulated parts mounted over circuitry shall have....
SD-18
Leaded Component Body Positioning SHOW AND DISCUSS SLIDE SD-50

(Show a slide of the proper positioning requirements)
Explain the spacing requirement of 0.25mm minimum is a “shall”

requirement. The recommended maximum is 2.0mm.
Discuss the potential for shorting over active circuitry, and explain that when
the parts are insulated or are mounted over surface that do not have exposed
circuitry, the parts may be mounted flush.
Review SHOW AND DISCUSS SLIDE SD-51

(Show a slide of a variety of components discussed during this
section)
Ask the students to identify the components as shown and give the
requirements. This can be done as an oral or written exercise.
9.2.6 Surface Soldering of Leads and Terminations

Solder joints or terminations on components designed for surface....
Introduction
Surface Soldering of Leads and Termination
- Flat, Ribbon, “L”, and Gull Wing Leads
- Round or Flattened (Coined) Leads
- “J” Leads
- Rectangular or Square End Components
- Cylindrical End Cap Terminations (e.g., MELF)
- Bottom Only Terminations
- Leadless Chip Carriers with Castellated Terminations
- Butt Joints
Introduce this section by explaining that the types of surface mount

components listed in the slide will be discussed. Describe each type of
component. Criteria for acceptable solder joints will be given, and a practical
exercise will conclude the section.
SD-19
Surface Soldering of Leads and Terminations SHOW AND DISCUSS SLIDE SD-53
Surface Soldering of Leads and Terminations
- Solder joints must meet the criteria of J-STD-001
- Solder joints must not violate minimum electrical spacing
Explain that after soldering surface mount components, the joints must meet
the criteria given for the type of component.
Explain that during soldering, components may self-align, and this is

acceptable as long as they do not violate the minimum electrical spacing.
Surface Soldering of Leads and Terminations (continued) SHOW AND DISCUSS SLIDE SD-54
Surface Soldering of Leads and Terminations (continued)
“Class 1 surface mount joints formed to connector, socket, and
other leads or termination without mechanical support,
subject to stress from insertion and withdrawal of
components or printed boards must meet the requirements of
Class 2 or 3.”
Explain this requirement.
Flat, Ribbon, “L”, and Gull Wing Leads SHOW AND DISCUSS SLIDE SD-55
Explain how some leads are made such that they do not have wettable sides.
Explain that in these cases, side or end fillets are not requirements. Where the
lead length is shorter than the width, the minimum side joint length shall be
0.75L.
Using the table and the slide as shown, explain each of the criteria. Discuss
the notes and special requirements.
Round or Flattened (Coined) Leads

SD-20
“J” Leads SHOW AND DISCUSS SLIDE SD-57

Explain that the leads may be like those for the flat, ribbon, “L” and gull wing
components and need not have side fillets.
Rectangular or Square End Components SHOW AND DISCUSS SLIDE SD-58

Cylindrical End Cap Termination (e.g., MELF) SHOW AND DISCUSS SLIDE SD-59
Bottom Only Terminations SHOW AND DISCUSS SLIDE SD-60


Leadless Chip Carriers with Castellated Terminations (Show J-STD-001, Figure 9-10)
SD-21


Butt Joints
Explain that like the flat, ribbon, “L”, gull wing and “J” leads, the sides of
these leads may not have solder fillets.

Review
Review Ask the students questions concerning this section. Allow them to use their
copies of J-STD-001, and ask questions such as: What is the maximum
allowable end overhang for a bottom termination soldered to Class 1
requirements? What is the minimum acceptable heel fillet height for a gull
wing lead soldered to Class 3 requirements with a toe-down lead
configuration? What class of product does not allow butt joints?
7.4 Reflow Soldering SHOW AND DISCUSS SLIDE SD-64

Reflow Soldering
Introduction
Introduce this section by explaining that this is similar to the hand soldering
requirements in that J-STD-001 does not include specific parameters or “how-
to” requirements for machine soldering. Explain that throughout this section,
there are only recommendations and “shall” requirements.
Begin a short discussion about the reflow soldering process. During this
discussion, draw a flowchart for the class identifying the elements of the
reflow soldering process.
SD-22

7.4.1 Reflow Controls Reflow Controls
The manufacturer shall develop and maintain operating.... - Operating Procedures
- Describe the soldering process
Reflow Controls - Proper operation of the equipment
Discuss the requirement for operating procedures and the elements of those
procedures. Highlight the importance of having control operating procedures,
showing how the reflow controls are set . Experimentation is typically
conducted by process engineering to develop the optimum profile for the
product being processed. The surface mount process needs process controls
to verify all the steps are in place to produce a quality product
Emphasize the need for controls at both the temperature ramp up and thermal
cool down of the product. These controls are necessary to maximize the
performance of the solder paste and to prevent thermal damage to the
components.
Identify the parameters to be defined in the procedures. They are: a

time/temperature envelope including the drying/degassing operation (when
required), preheating operation (when required), controlled atmosphere (if
required), solder reflow operation and a cooling.
Explain, using the process flowchart, that the steps described above may be an
in-line system or may be separate operations.
7.1.1 Handling of Parts

Parts shall be handled in a manner to preclude….
Handling of Parts Handling of Parts
- Handle, transport and process in a manner to preclude
movement that would detrimentally affect formation of
acceptable solder connections.
Explain parts shall be handled to preclude damage to terminations to avoid the

need for straightening the leads later.
Explain that when parts are mounted in solder paste, the parts should be
handled so that the parts do not move in the solder paste prior to reflow and
SD-23
cause misalignment exceeding the requirements already discussed.
Reemphasize the following:

A. Avoid rough handling where parts could fall off the printed
wiring board.
B. Avoid dropping or causing sharp blows to the printed
wiring boards prior to soldering.
C. Handle all the boards by their edges to prevent
contamination and disturbing components mounted in the
solder paste.
D. After SMT reflow, allow sufficient time for boards to cool
to solidify the solder
E. Do not stack the boards one upon the other at any point in
the manufacturing
7.1.2 Preheating
For other than hand soldering…
Preheating Preheating
- Minimize volatiles in the flux
- Prepare the board for soldering
- Improve solder flow
Reemphasize the purpose of preheating and its benefits. Stress the

importance of the preheating again and explain that in all cases it can be
overdone. The preheat temperature exposure must not degrade printed
boards, components or soldering performance.
7.4.2 Flux Application

Flux, when used, shall be applied prior to formation.....

Flux Application (In Reflow Soldering) Flux Application
- Is an integral part of the solder paste
- No damage to the parts
- Can be removed to meet cleanliness requirements
SD-24
Explain that in surface mount, the flux is usually an integral part of the solder
paste. When solder paste is used, the flux in the paste needs to prepare not
only the board surface and the component surface but also the solder spheres
within the paste itself.
Explain that any flux meeting the requirements already discussed (Module
SA, J-STD-001 Section 4.2) can be used as long it causes no damage to the
parts and it can be removed, if required, such that the assemblies meet the
cleanliness requirements and not be detrimental to the product.
Practical Exercise - Surface Mount Components Practical Exercise
Show the students the parts that will be used in this portion of the class.
Identify each part.
Using Appendix B as a guideline for part mounting, demonstrate mounting

and soldering each type of part to a printed wiring board. Show the post
solder cleaning and subsequent inspection. As each step is being conducted,
explain the step in detail. Refer to Appendix B for the class, showing them
where each suggestion is located.
Distribute the Requirements Handout for Surface Mount Soldering. This will
show the practice locations and the “for instructor evaluation” locations on
the boards. All soldering must be conducted, as a minimum, to the highest
applicable class of product being processed at the facility.
Practical Exercise - Reflow Soldering Practical Exercise
Demonstrate the reflow soldering process as a group exercise. Allow several

boards to be processed, discussing the requirements and process parameters as
the exercise is being conducted. (Note: Boards should be preassembled.)
Clean boards and set aside for a later exercise.
SD-25
10.0 COATING AND ENCAPSULATION SHOW AND DISCUSS SLIDE SD-69

Conformal Coating and Encapsulation
Introduction
Define conformal coating and encapsulation, making a clear distinction
between the two.
Explain that during this section, the two will be presented together to show
the similarities and differences between them.
Explain that only one “must” requirement exists in this section. All others are
“shall” requirements.
Shelf life (from IPC-T-50F) is the length of time a material, substrate, or

product can be stored, under specific environmental conditions, while it
meets all applicable specific requirements and remains suitable for its
intended use.
Pot life (from IPC-T-50F) is the length of time a user has to use
conformal coatings after mixing or exposing them to room ambient
conditions in an open container.
Material Preparation Material Preparation
- Use material specifications and supplier’s instructions
- Use within the specified time period
- Document curing conditions when different than supplier
recommendations (conformal coating only)
Explain the requirements for material preparation. Be certain to emphasize

that this is for both conformal coating and encapsulants except where noted.
Discuss the shelf life or pot life of a product. Define the two and discuss the
differences. Explain that in some manufacturers’ facilities, there are
established procedures for the length of time that material can be used that
deviates from material shelf life or pot life. This is acceptable as long as it is
documented.
Explain the requirement for documentation for curing conditions that deviate
from supplier recommendations.
SD-26

Application Application
- Continuous in all areas designated for coverage
- No deleterious effects from masking materials
- Masking materials removable without contaminant residue
- Conformal coating fillets kept to a minimum
- No decrease in masked areas by conformal coating of more
than 0.75mm
Explain the requirement for continuous coverage and discuss the results if
there are pinholes in the materials.
Discuss the use of masking materials and the requirements for removal.
Define “conformal coating filets” (webbing) and the possibility of the

formation of moisture traps or a coating configuration which would place
undue mechanical stress on a component or connection when the assembly is
exposed to thermal extremes during use.
Explain that conformal coating is normally a thin substance, and it can creep
under masking materials. J-STD-001 allows for this by providing a
dimension that this must not exceed.

Conformal Coating on Specific Components Areas Free of Conformal Coating
- Adjustable portion of adjustable components
- Electrical and mechanical mating surfaces
- Mating connector surfaces
- Mating (contact) surface of brackets or other mounting
devices (unless specified by assembly drawing)
Explain these requirements and the obvious reasons for their exclusion from
conformal coating. Discuss the problems that could be incurred if conformal
coating would be placed on these areas. Draw attention to the one “must”
requirement for mating connector surfaces to be free of conformal coating.

Encapsulant Free Surfaces Encapsulant Free Surfaces
- Only areas designated for encapsulant material are to be
encapsulated
SD-27
Explain this requirement and the obvious reason for it. Discuss the problems
that could be incurred if encapsulants would be placed on areas other than
those designated. Draw parallels with the previous requirement for conformal
coating.

Coverage
Coverage - Completely cured and homogenous
- Cover only the areas required by the assembly drawing (s) /
documentation
Explain that both conformal coating and encapsulant require complete cure
and a homogenous mix. Again, only those areas that require the material per
the assembly drawing(s) / documentation are to receive the material.
Mealing (from IPC-T-50F) is a condition in the form of discrete white

spots or patches that reveals a separation at the interface between a
conformal coating and a base material on the surface of a printed board,
surface of attached component, or both.
Conformal Coating Coverage SHOW AND DISCUSS SLIDE SD-75

Conformal Coating Coverage
- Free of blisters or breaks that affect the sealing properties
- Free of voids, bubbles or foreign material which expose
component conductors, printed wiring conductors (including
ground planes) or other conductors, and/or violate design
electrical spacing
- Contain no mealing, peeling or wrinkles (non-adherent
areas)
Explain these requirements for conformal coating. Discuss how blisters,

breaks, voids and bubbles occur. Also discuss mealing, peeling and wrinkles
are all non-adherent areas.
Conformal Coating Coverage (continued) SHOW AND DISCUSS SLIDE SD-76

(Show a picture of an acceptable assembly with conformal coating)
Discuss the acceptability of this assembly.
SD-28

Conformal Coating Coverage (continued) (Show a picture of an unacceptable assembly with conformal coating)
Discuss the defects of this assembly.

Encapsulant Coverage Encapsulant Coverage
- Free of bubbles, blisters or break that affect the printed
wiring assembly operation or sealing properties of the
material
- No visible cracks, crazes, mealing, peeling and/or wrinkles in
the material
Explain the encapsulant requirements. Discuss bubbles, blisters, breaks,

cracks, crazes, mealing, peeling and wrinkles.

Encapsulant Coverage (continued) (Show a picture of an acceptable assembly with encapsulant material)

Encapsulant Coverage (continued) (Show a picture of an unacceptable assembly with encapsulant
material)

Thickness of Conformal Coating Conformal Coating Thickness
(Show the listings in J-STD-001, para 10.1.2.1)
Discuss the different types of conformal coatings and their thicknesses.
Explain how conformal coating is measured. There are two ways:

A. On a flat, unencumbered, cured surface of the assembly or a
coupon processed with the assembly.
B. With a wet film thickness measurement used to establish the
thickness as long as documentation exists to correlate the
wet and dry thicknesses.
SD-29
Explain that the coupon can be a piece of board material, metal or glass.

Rework Rework
- Documented procedures for removal and replacement
- Available for review
Discuss rework of conformal coating and encapsulants. Explain that removal

of conformal coating is not as difficult as removal of encapsulants, but in both
cases, damage could occur due to the procedures required to remove the
materials.

Inspection Inspection
Conformal Coating
May be without magnification
1.75X to 4X may be used for referee purposes
Encapsulants
May be without magnification
Explain the inspection requirements. Discuss the allowance for conformal

coating to be inspected with ultraviolet light when the supplier adds a tracer to
the material.

Review Review
- Application
- Areas to be free of coatings
- Performance
- Rework
- Inspection
Review the items discussed.
Ask the class some of the following questions: What are the coverage
requirements for conformal coating? What is the inspection requirement for
encapsulants? What is the difference between conformal coatings and
encapsulants?
SD-30
Practical Exercise Provide the students with samples of conformally coated and/or encapsulated
assemblies. Ask students to evaluate them for the criteria as discussed. Have
the students document their “findings.” When completed, review individually
with the students.
SD-31
Section SE - Soldering Through-Hole Devices
J-STD-001B
J-STD-001B Handbook
IPC-A-610
PCB Assembly Drawing
Instructional Aids:
1. Projector
2. Slides
3. Screen
4. Flip Chart
5. Posters of completed solder joints per IPC-A-610B
6. Soldering equipment
7. Materials
a. A printed wiring board with through-hole and surface mount pads
b. Components
- Axial-leaded
- Radial-leaded
- Vertical Mounted - Freestanding
- DIP
8. Buddy microscope
b. Be aware of the recommendations and requirements for lead cutting and forming.
c. Understand the requirements for through-hole part mounting.
d. Understand and use Appendix C.
e. Describe and explain the general assembly requirements for through-hole technology.
f. Describe the types of printed wiring board defects that must be rejected.
g. Describe the types of component damage that will result in rejections.
h. Explain the marking requirements of J-STD-001.
i. Measure bow and twist and give the requirements for it.
SE-1
j. Give the solder connection requirements including clinched lead requirements.
k. Solder through-hole components to a printed wiring board.
l. Demonstrate inspection skills applicable to through-hole technology.
m. Distinguish between conformal coating and encapsulants.
n. Explain the requirements for application of conformal coating and encapsulants.
o. Explain where conformal coating and encapsulants should not be placed.
p. Explain the performance requirements for conformal coating and encapsulants.
q. Explain the rework requirements for conformal coating and encapsulants.
r. Discuss the inspection requirements for conformal coating and encapsulants.
s. Discuss rework requirements for conformal coating and encapsulants.
t. Inspect conformal coating and encapsulants and determine defects.
Note: During the practical soldering portions of this section, parts used can be tailored to the types of parts used in the students’ facilities.
Any portions of this section that may have been covered during the through-hole section, if taught during the same training session, can be
eliminated.
SE-2
Equipment List
Soldering iron
Solder
Flux
Cleaning solvent
Tweezers
Orange sticks
Needle-nosed pliers
SE-3
Introduction SHOW SLIDE SE-1

J-STD-001B
Joint Industry Standard
Requirements for Soldered Electrical and Electronic Assemblies
Operator/Inspector Training Program
Through-Hole Mounting of Components
Explain the goal of this section. It is designed to provide the electronic

manufacturing industry with a structured training program. The course will
provide the graduating Operator/Inspector with the knowledge and skills
necessary to perform the job.
Purpose of Module SHOW AND DISCUSS SLIDE SE-2

Module Overview
- J-STD-001 Operator/Inspector Training
- Designed to provide Operator/Inspector personnel with a
structured training program
- Provide Operators/Inspectors with the knowledge and skills
necessary to perform their job
Explain the purpose of this module. Upon successful completion of this

module, the operator/inspector will be qualified to perform soldering
operations and inspection to the requirements of J-STD-001B for plated
through hole technology.

When design restrictions mandate mounting.....
General Part Mounting Requirements SHOW AND DISCUSS SLIDE SE-3

- Consider design and component parameters before
- Assemblies with mixed technology should have through-hole
components on one side.
Explain the requirement for using separate soldering operations as dictated by

design restrictions and component specifications.
SE-4
Explain the requirement for cleaning after each soldering operation so that
subsequent placement and soldering operations are not impaired by
contamination.
Define mixed technology and explain the recommendation for mounting

through-hole components.
6.1.1 Part Markings and Reference Designations

Part markings and reference designations should be...
Part Markings and Reference Designations SHOW AND DISCUSS SLIDE SE-4
Part Marking and Reference Designations
(Show photo of legible and illegible marking on an assembly)
Discuss the part marking requirements. Markings should be legible and parts
mounted so that markings are visible.
Show physical examples of completed assemblies, if available, with

acceptable and nonconforming defect part markings.
6.1.2 Lead Forming

Part and component leads should be preformed to the final.....
Lead Forming SHOW AND DISCUSS SLIDE SE-5

Lead Forming Prior to Assembly or Installation
(Show a slide of several different parts with formed leads)
Explain forming may be manual or automated, depending on the availability

of equipment and should be to the final configuration excluding the final
clinch or retention bend. The critical elements of forming are support at the
lead exit from the component body, the lead forming action and the lead end
trimming so that no damage is done to the connections internal to
components. No degradation to part bodies, leads and lead seals below part
specifications requirements
Briefly describe the forming action, highlighting the isolation of the lead to
body seal so as to not impart stress.
Describe a part specification and tell the students that these should give
information on acceptable damage limits.
SE-5
6.1.2.1 Lead Forming Limits

Whether leads are formed manually or by machine or die,......
Lead Forming Limits SHOW AND DISCUSS SLIDE SE-6

(Use IPC-A-610, Figure 3-36)
Direct the students to IPC-A-610, Figure 3-36. Explain the limit of 10% of
the diameter, width or thickness of the lead for all lead except flattened leads
for nicks and deformation.
6.1.2.2 Lead Cutting
Tools used to cut leads must.....
Detrimental shock (from J-STD-001 Handbook, para 6.1.2.2)
Any impact force during lead trimming that induces fractures in the seal
of hermetically sealed components that damages internal electrical
connection within components.
Lead Cutting SHOW AND DISCUSS SLIDE SE-7

Lead Cutting
- Tools must not impart detrimental shock
Define “detrimental shock” per J-STD-001 Handbook for the students.
Explain the consequences of using improper tools such as allowing

contaminants to get inside the component and possible fracture of the internal
solder or weld connections.
6.1.4 Hole Obstruction

Parts and components shall be mounted.....
Hole Obstruction SHOW AND DISCUSS SLIDE SE-8

Hole Obstruction
(Use J-STD-001, Figure 6-1)
Describe the conditions and consequences of mounting a through-hole

component flush to the surface of a board. Explain that J-STD-001 contains a
shall requirement restricting the mounting of components with no obstruction
of solder flow
SE-6
6.1.5 Metal-Cased Component Installation

Metal-cased components shall be insulated......
SHOW AND DISCUSS SLIDE SE-9
Metal-Cased Components Metal-Cased Component Installation
- May be required to use insulators when installing near
conductive surfaces
Ask the class for input on what they believe may be the result of mounting a
metal-cased component near a conductive surface without the use of
insulation. Discuss the shorting potential with the class, and emphasize that
solder mask is generally not considered acceptable for this application. If it is
used, tell the class that the dielectric properties must be found to be
acceptable for its use as an insulator before it would fulfill any requirements
as stated in J-STD-001.
6.1.6 Adhesive Coverage Limits

Adhesives are frequently used to tack down....
Adhesive Coverage Limits SHOW AND DISCUSS SLIDE SE-10

Adhesive Coverage Limits
- May be required to prevent adhesive flow onto areas to be
soldered
Explain that adhesives, used for tacking down wires and component wires
prior to soldering, may lead to adhesives getting on surface to be soldered.
This may result in a loss of solderability on those surfaces. Emphasize that
proper adhesive disbursement along with an adhesive that meets the needs
and requirements of the job will assist in achieving acceptable solder joints.

Adhesive Coverage (continued) (Show IPC-A-610, Figure 2-29)
Discuss the slide and the conditions for adhesive coverage
SE-7
Review SHOW AND DISCUSS SLIDE SE-12

Review
- Part mounting requirements
- Lead Cutting and Forming
- Hole Obstruction
- Metal-Cased Components
- Adhesives
Ask the students some or all of the following questions: What are the reasons
cited for tinning? What happens if a product has adhesive all over the solder
pads prior to soldering? What is the requirement for lead cutting?.
6.5 Through-hole Mounting

Note: See Appendix C.....
Through-hole Mounting - Introduction SHOW AND DISCUSS SLIDE SE-13

Through-hole Part Mounting
- Placement
- Lead Forming
- Lead Termination
- Meniscus Spacing and Trimming
Introduce this section by discussing the subjects to be covered.
6.5.1 Placement Accuracy

Placement accuracy for components inserted either.....
Placement SHOW AND DISCUSS SLIDE SE-14

Placement Accuracy
- Should be sufficient to ensure the component is properly
positioned after soldering
- Appendix C is a guideline for placement
Explain what is meant by placement accuracy.
Direct the students to look at Appendix C. Explain that these are accepted
industry practices and will be used in the practical portion of this class.
SE-8
Appendix C
Placement Guidelines for Through-Hole Mount Devices
C-1 Horizontal Mounting

C-1.1 Axial Leaded Components
Axial-leaded parts are to be mounted....
Axial Leaded Components SHOW AND DISCUSS SLIDE SE-15

(Show J-STD-001, Figure C-8)
Explain the diagram and the stress relief bends. Be certain to point out the
component body in contact with the board. Explain that the component can
be raised, but that the furthest distance between the component body and the
board should not be >3mm for Class 1&2 or 0.7 mm for Class 3. Show that
the body should be approximately centered.
Explain that for Class 3 products, these parts should not be mounted
perpendicular to the board. They should also have the larger sides
perpendicular to the board surface +/- 15 degrees when they are freestanding.
C-1.2 Radial Leaded Components

Side-mounted radial leaded components..
Radial Leaded Components SHOW AND DISCUSS SLIDE SE-16

Explain that side-mounted radial leaded components should be mounted

parallel to the surface of the board. The side or surface of the body or at least
one point of an irregularly configured component should be in full contact
with the board and the body should be bonded or otherwise retained to
prevent damage when vibrational and shock forces are applied.
C-2 Vertical Mounting - Freestanding

Unless otherwise noted on the assembly drawing....
C-2.2 Radial Leaded Components

Radial leaded components....
Vertical Mounting - Freestanding SHOW AND DISCUSS SLIDE SE-17

SE-9
Explain the requirements for parallelism. Explain the minimum spacing from
the board of 0.25mm and 2.0mm when the part is mounted freestanding.
Show the tilt of +/-15 degrees.

Dual Non-axial leaded components (Show J-STD-001, Figure C-2)
Discuss the different types of dual non-axial leaded components available.

C-3 End Mounting (Show J-STD-001, Figure C-5)
When documented on an approved assembly...
Explain that end mounting is allowed when on the assembly drawing.
End Mounting
Explain that the end surface should be in full contact with the board and the
body should be bonded to prevent damage from vibrational and shock forces
when applied.
C-4 Supported Component Mounting

When components are supported, they should be.....
C-4.1 Standoff Positioning
No standoff is to be inverted.
Supported Component Mounting
Explain the requirements for supporting components. The component should
be seated with each foot in contact with the surface of the board. Show that
the standoffs should have a minimum foot height of 0.25 mm.
Explain that when used, the footed standoff should not be inverted.
C-4.2 Nonresilient Footed Standoffs

When specially configured nonresilient....
Nonresilient Footed Standoffs
SE-10
Explain the figure and the portion of the lead in the lead bend cavity that
should conform with the angular line extending from the lead insertion hole
in the standoff device to the land attachment hole in the board.
C-6 Flat Pack Lead Configuration

Whether of the ribbon, flattened.... SHOW AND DISCUSS SLIDE SE-22
Flat Pack Lead Configuration
Explain that surface mount leads of flatpacks of the normal and butterfly
configuration may be configured as shown in the slide.
6.5.2 Lead Forming Requirements

Leads must extend at least one lead diameter.... SHOW AND DISCUSS SLIDE SE-23
Lead Forming Requirements
Lead Forming Requirements (Show J-STD-001 Figure 6-16)
Explain the difference between a standard bend and a welded bend and the
critical dimension of not less than 0.8mm from the body or weld before the
start of the bend radius to lessen the chance of damage to the lead-to-body
interface.
Discuss the table in the figure, and explain that this is the minimum bend
radius requirement for all classes of product.
6.5.3 Lead Termination Requirements

Component leads in through hole connections may be terminated.... SHOW AND DISCUSS SLIDE SE-24
Lead Termination Requirements - Plated-through Holes
Lead Termination Requirements - Plated-through Holes (Show J-STD-001 Handbook, Figure 6-35)
Define a clinch and its purpose to provide mechanical restraint during the
soldering process. Tell the class that the orientation is optional.
Explain that there are three types of clinches used in through-hole component
SE-11
mounting. Show these to the students using the figure, and explain the
differences.
Explain that the leads should not extend more than 1.5 mm (measured
vertically) from the board surface, and that electrical spacing must not be
violated. Leads “shall” be discernible in the solder.
Draw a small diagram of a DIP, and explain to the class that it has tempered
leads. Define tempered leads, and describe why they must not be bent in a
full cinch. Show the class that the recommended method for restraining a
DIP for soldering is by bending the leads outward from the longitudinal axis.
6.5.3.1 Lead Termination Requirements for Unsupported Holes

As an exception to the requirements of.... SHOW AND DISCUSS SLIDE SE-25
Lead Terminations - Unsupported Holes
Lead Terminations - Unsupported Holes - Must not violate electrical spacing requirements
Explain that the requirements are the same as plated-through holes with a few
exceptions. Remind the students that one of the plated-through hole
requirements was that the solder “shall” be discernible in the solder. Here,
the requirement is that lead protrusions shall be 0.5mm minimum. Also,
terminations shall be clinched a minimum of 45 degrees.
Begin a short discussion with the class by asking the students if they can
think of any reasons for these criteria being different. Lead the discussion
toward the differences between plated-through holes and non-plated through
holes.
6.5.4 Meniscus Spacing & Trimming

Component coating meniscus shall not...... SHOW AND DISCUSS SLIDE SE-26
Meniscus Spacing & Trimming
Meniscus Spacing & Trimming (Show IPC-A-610, Figure 3-19)
Explain what is meant by the meniscus of a part, and ask the class what
would happen if the meniscus is placed in the solder. Discuss the
recommendation that there is a visible clearance between the meniscus and
SE-12
the solder connection. Explain that although this is not a requirement, J-STD-
001 does have a “shall” requirement that the coating meniscus shall not be
trimmed.

Hand Soldering Through-Hole Components
Introduction - Printed Wiring Boards
- Components
- Practical Exercise
Explain the intent of this section. This section includes a practical exercise in
hand soldering.
9.2 General Assembly Requirements

All products must meet..... SHOW AND DISCUSS SLIDE SE-28
General Assembly Requirements
General Assembly Requirements - Products must meet the requirements of the
- Electrical and mechanical integrity and reliability of all
components and assemblies must be retained after processing
Discuss the requirements and the need to use processes, materials as methods
that are compatible with the hardware.
9.2.1.1 Printed Wiring Board Damage

The following printed wiring board defects must.... SHOW AND DISCUSS SLIDE SE-29
Printed Wiring Board Damage
Printed Wiring Board Damage Defects not allowed in J-STD-001 are indications of fabrication
processing problems which may result in the loss of a completed
assembly if not rejected before beginning assembly.
Discuss the great reduction in costs when defects are noted up front before
time and materials are expended on the assembly. Some defects may
propagate during the assembly and soldering process. These products must
be removed before the assembly process begins.
SE-13
Blistering (per IPC-T-50): The localized swelling and separation between

any layers of the base material or between the material and the metal
cladding.
Blistering Blistering
Define blistering per IPC-T-50, and discuss the effects of a blister on an

assembly.
Explain that when blisters bridge between plated-through holes or between

subsurface conductors, or extend under surface conductors or over/under
subsurface conductors, the boards must be rejected.
Delamination (per IPC-T-50): A separation between any layers of the

base material or between the base material and the metal cladding.
Delamination Delamination
Define delamination per IPC-T-50, and discuss its effects on an assembly.
Explain that the requirements are the same for delamination as they are for
blisters.

Charred PWB’s Charred Printed Wiring Boards
(Picture of a charred PWB)
Explain that the requirements are the same for charred printed wiring boards
as they are for blisters and delamination.
Weave Exposure (per IPC-T-50) is a base material surface condition in

which the unbroken fibers of woven glass cloth are not completely
covered by resin.
Weave Exposure Weave Exposure
SE-14
Define weave exposure and discuss the requirements for no weave exposure
that reduces the spacing between adjacent conductors to less than the
minimum electrical spacing. Explain why weave exposure is not acceptable
under these conditions. Note that processing fluids can become trapped in the
laminate and cause subsequent failures.
Haloing (per IPC-T-50) is mechanically-induced fracturing or

delamination, on or below he surface of a base material. That is usually
exhibited by a light area around holes or other machined features.
Haloing and Edge Delamination Haloing and Edge Delamination
(Show IPC-A-610 Figure 8-17, 18, 21 or better)
Define haloing and edge delamination and discuss the requirements.
A lifted land (per IPC-T-50) is a land that has fully or partially separated
(lifted) from the base material, whether or not any resin is lifted with the
land.
Lifted Lands Lifted Lands
(Show a slide showing this condition)
Define lifted lands and explain the requirement. Explain the reason for this
being a defect. Note that failures can occur due to the land being lifted.
9.2.1.2 Component Damage

No chips shall be allowed on glass bodied components.....
Component Damage Component Damage
Explain that no chip allowed on glass bodied components in excess of

component specification limits is a “shall” requirement. This damage may
lead to performance deterioration when the component substrate or active
element is exposed. Damage that does not affect the structural integrity or
active element is acceptable.
SE-15

Component Damage (continued) Component Damage
(Show a slide of a charred component)
Explain that charred components are not allowed.
9.2.2 Markings
Markings shall not be deliberately altered, obliterated.....
Markings Markings
- Shall not be deliberately altered, obliterated, or removed by
the manufacturer unless required by the assembly
- Additional markings during the manufacturing process
should not obscure the original supplier’s markings
Explain the requirements and discuss the need for identification. Ask the
class what types of markings could be on a printed wiring board. Make a list
of these (include screening, etching, stamping, laser, and bar code). Explain
to the class that J-STD-001 does not distinguish between the types of
markings. The requirements apply to all types.
9.2.3 Bow and Twist

Bow and twist after soldering should not exceed.....
Bow and Twist Bow and Twist
(Show and graphic of the set-up)
Define bow and twist. Explain the differences, and how the percentages are
calculated. Perform a demonstration for the class, explaining the steps to
arriving at the measurements. Refer the students to IPC-TM-650, 2.4.22 (in
the back of J-STD-001) for the procedure being used.
9.2.4 Solder Connection

The acceptable solder connection must indicate evidence of......
SE-16

Solder Connection Solder Connection
Explain the slide in terms of the requirements as given. Show the students the
various wetting angles, and tell the students that solder joints should have a
smooth or satin luster finish. In certain circumstances, dull, matte, gray or
grainy appearing solder is normal. Explain when they are acceptable.
Explain that marks or scratches “shall” not degrade the integrity of the
connection.
9.2.5.1 Through-hole Component Lead Soldering

The solder joint must provide evidence.....
Through-hole Soldering Through-hole Soldering
(Show J-STD-001, Table 9-1)
Explain that the solder joint must show good wetting. Explain the
requirements of the table in detail, using diagrams as necessary to assure the
students understand them. Discuss the “shall” requirement for unsupported
holes to meet condition C and E of the table. Ask the class for only these two
requirements for unsupported holes and discuss the reasons.
Direct the students to J-STD-001, Figure 9-3, and using a sketch of the same,
show the minimum acceptable conditions
9.2.5.3 Exposed Basis Metal
Incomplete solder wetting at the tip.....
Exposed Basis Metal Exposed Basis Metal
(Show a slide of exposed basis metal)
Explain that exposed basis metal is acceptable at the following locations:

1. The tip of through-hole component leads
2. The edges and/or periphery of lands and conductors
3. Component lead ends
Explain that depending on how long the basis metal is exposed, oxides will
build up that interfere with the solder wetting. As long as those oxides do not
interfere with the solder connection, they are acceptable.
SE-17
9.2.5 Interfacial Connections

Unsupported holes with leads or plated through-holes, .....
Interfacial Connections Interfacial Connections
Explain the use of an interfacial connection (via). Tell the class that these do
not need to be filled with solder, and in some cases, due to size, they are
tented by solder mask. Briefly describe tenting.
Explain to the class that there is one “shall” requirement. This is when plated
through-holes without leads that are exposed to reflow, wave, dip or drag
soldering shall meet the requirements to the figure.
9.2.4.1 Solder Connection Defects
The following solder joint conditions.....

Solder Connection Defects - Fractured Solder Connections Fractured Solder Connections
(Picture of a fractured solder joint)
Show the class the fractured solder joint, and explain that this is a defect.
Describe how a solder joint could be fractured. Discuss what would happen
if fractured solder joints were found in assemblies.

Solder Connection Defects - Disturbed Solder Connections Disturbed Solder Connections
(Picture of a disturbed solder connection)
Show the class the disturbed solder joint, and explain that this is a defect.
Describe how a solder connection can be disturbed. Discuss what would
happen if disturbed solder joints were found in assemblies.

Solder Connection Defects - Cold Solder Connections Cold Solder Connections
(Picture of a cold solder connection)
Show the class the cold solder joint, and explain that this is a defect.
Describe how a solder connection can be cold. Discuss what would happen if
SE-18
cold solder joints were found in assemblies.
Practical Exercise
Practical Exercise - Soldering
Show the students the parts that will be used in this portion of the class.
Identify each part.
Using Appendix C as a guideline for part mounting, demonstrate mounting

and soldering each type of part to a printed wiring board. Show the post
solder cleaning and subsequent inspection. As each step is being conducted,
explain the step in detail. Refer to Appendix C for the class, showing them
where each suggestion is located.
Distribute the Requirements Handout for Through-Hole Soldering. This will

show the practice locations and the “for instructor evaluation” locations on
the boards. Soldering must be conducted, as a minimum, to the highest
applicablr class (es) of product produced at your facility.
Allow the students to work at their work stations. Encourage them to inspect
their work as they do it, and indicate the defects on the Requirements handout
for each location, if applicable. Offer instruction and guidance as necessary
When students present the “For Instructor Evaluation” solder joints, do the
evaluation, and note deficiencies on the Handout with initials and dates. This
sheet must be collected at the conclusion of this session.
While conducting the evaluation, ask students questions concerning the

soldering process such as: What happens if a solder joint is fractured? What
is the proper method of application of flux? List several conditions on printed
wiring boards which are considered rejections.
10.0 COATING AND ENCAPSULATION

Introduction Conformal Coating and Encapsulation
Define conformal coating and encapsulation, making a clear distinction

between the two.
SE-19
Explain that during this section, the two will be presented together to show
the similarities and differences between them.
Explain that only one “must” requirement exists in this section. All others are
“shall” requirements.
Shelf life (from IPC-T-50F) is the length of time a material, substrate, or

product can be stored, under specific environmental conditions, while it
meets all applicable specific requirements and remains suitable for its
intended use.
Pot life (from IPC-T-50F) is the length of time a user has to use
conformal coatings after mixing or exposing them to room ambient
conditions in an open container.
Material Preparation Material Preparation
- Use material specifications and supplier’s instructions
- Use within the specified time period
- Document curing conditions when different than supplier
recommendations (conformal coating only)
Explain the requirements for material preparation. Be certain to emphasize

that this is for both conformal coating and encapsulants except where noted.
Discuss the shelf life or pot life of a product. Define the two and discuss the
differences. Explain that in some manufacturers’ facilities, there are
established procedures for the length of time that material can be used that
deviates from material shelf life or pot life. This is acceptable as long as it is
documented.
Explain the requirement for documentation for curing conditions that deviate
from supplier recommendations.

Application Application
- Continuous in all areas designated for coverage
- No deleterious effects from masking materials
- Masking materials removable without contaminant residue
- Conformal coating fillets kept to a minimum
SE-20
- No decrease in masked areas by conformal coating of more

than 0.75mm
Explain the requirement for continuous coverage and discuss the results if
there are pinholes in the materials.
Discuss the use of masking materials and the requirements for removal.
Define “conformal coating filets” (webbing) and the possibility of the

formation of moisture traps or a coating configuration which would place
undue mechanical stress on a component or connection when the assembly is
exposed to thermal extremes during use.
Explain that conformal coating is normally a thin substance, and it can creep
under masking materials. J-STD-001 allows for this by providing a
dimension that this must not exceed.

Conformal Coating on Specific Components Areas Free of Conformal Coating
- Adjustable portion of adjustable components
- Electrical and mechanical mating surfaces
- Mating connector surfaces
- Mating (contact) surface of brackets or other mounting
devices (unless specified by assembly drawing)
Explain these requirements and the obvious reasons for their exclusion from
conformal coating. Discuss the problems which could be incurred if
conformal coating would be placed on these areas. Draw attention to the one
“must” requirement for mating connector surfaces to be free of conformal
coating.

Encapsulant Free Surfaces Encapsulant Free Surfaces
- Only areas designated for encapsulant material are to be
encapsulated
Explain this requirement and the obvious reason for it. Discuss the problems
that could be incurred if encapsulants would be placed on areas other than
those designated. Draw parallels with the previous requirement for conformal
coating.
SE-21

Coverage Coverage
- Completely cured and homogenous
- Cover only the areas required by the assembly drawing (s) /
documentation
Explain that both conformal coating and encapsulant require complete cure
and a homogenous mix. Again, only those areas that require the material per
the assembly drawing(s) / documentation is to receive the material.
Mealing (from IPC-T-50F) is a condition in the form of discrete white

spots or patches that reveals a separation at the interface between a
conformal coating and a base material on the surface of a printed board,
surface of attached component, or both.
Conformal Coating Coverage Conformal Coating Coverage
- Free of blisters or breaks that affect the sealing properties
- Free of voids, bubbles or foreign material which expose
component conductors, printed wiring conductors (including
ground planes) or other conductors, and/or violate design
electrical spacing
- Contain no mealing, peeling or wrinkles (non-adherent
areas)
Explain these requirements for conformal coating. Discuss how blisters,

breaks, voids and bubbles occur. Also discuss mealing, peeling and wrinkles
are all non-adherent areas.

Conformal Coating Coverage (continued) (Show a picture of an acceptable assembly with conformal coating)

Conformal Coating Coverage (continued) (Show a picture of an unacceptable assembly with conformal coating)
SE-22

Encapsulant Coverage Encapsulant Coverage
- Free of bubbles, blisters or break that affect the printed
wiring assembly operation or sealing properties of the
material
- No visible cracks, crazes, mealing, peeling and/or wrinkles in
the material
Explain the encapsulant requirements. Discuss bubbles, blisters, breaks,

cracks, crazes, mealing peeling and wrinkles.

Encapsulant Coverage (continued) (Show a picture of an acceptable assembly with encapsulant material)

Encapsulant Coverage (continued) (Show a picture of an unacceptable assembly with encapsulant
material)

Thickness of Conformal Coating Conformal Coating Thickness
(Show the listings in J-STD-001, para 10.1.2.1)
Discuss the different types of conformal coatings and their thicknesses.
Explain how conformal coating is measured. There are two ways:

A. On a flat, unencumbered, cured surface of the assembly or a
coupon processed with the assembly.
B. With a wet film thickness measurement used to establish the
thickness as long as documentation exists to correlate the
wet and dry thicknesses.
Explain that the coupon can be a piece of board material, metal or glass.
SE-23
Rework SHOW AND DISCUSS SLIDE SE-59

Rework
- Documented procedures for removal and replacement
- Available for review
Discuss rework of conformal coating and encapsulants. Explain that removal

of conformal coating is not as difficult as removal of encapsulants, but in both
cases, damage could occur due to the procedures required to remove the
materials.
SE-24

001 B Operator Training

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J-STD-001B Operator/Inspector

Skills Training Plan

J-STD-001 Certification Task Group

Organization: Modular arrangement for flexible implementation in various manufacturing environments.

Section Topic Lesson Time

SB Practical Lab Instruction – General Information Section 2 hrs

SC Soldering to Terminals 4 hrs

SD Soldering Surface Mount Devices 4 hrs

SE Soldering Through-Hole Devices 4 hrs

J-STD-001 Skills Training SHOW AND DISCUSS SLIDE SA-1

Welcome students to the J-STD-001 Skills Training class. Introduce yourself

Prerequisites SHOW AND DISCUSS SLIDE SA-2

General Information SHOW AND DISCUSS SLIDE SA-4

Discuss with the students.

General Information (continued) SHOW AND DISCUSS SLIDE SA-5

Agenda SHOW AND DISCUSS SLIDE SA-6

Explain the agenda.

Course Requirements SHOW AND DISCUSS SLIDE SA-7

Explain the course requirements for successful completion.

History of J-STD-001 SHOW AND DISCUSS SLIDE SA-8

Explain the background of J-STD-001. It was developed as a single industry

Scope SHOW AND DISCUSS SLIDE SA-9

Purpose SHOW AND DISCUSS SLIDE SA-10

Practices SHOW AND DISCUSS SLIDE SA-11

Requirements SHOW AND DISCUSS SLIDE SA-12

Explain that requirements are mandatory. A manufacturer must comply with

Explain the difference between materials, methods and verification criteria.

Process Control Methodology SHOW AND DISCUSS SLIDE SA-14

Begin a discussion about a simple task such as tying shoelaces.

Be sure to include in the flowchart:

- Pull the laces tight

Conclude by discussing that each company may have different requirements.

Classification of Product SHOW AND DISCUSS SLIDE SA-15

Determining Product Class SHOW AND DISCUSS SLIDE SA-16

Explain that a company’s processes should be set up to notify the operators

1.4 Definition of Requirements

Definition of Requirements SHOW AND DISCUSS SLIDE SA-17

* Appears as an attachment to this document)

1.4.1 Hardware Defects and Process Indicators

Definition of Defect SHOW AND DISCUSS SLIDE SA-18

Give the definition of a defect.

Explain that if a condition is classified as a defect, it must be dispositioned:

Definition of Process Indicator SHOW AND DISCUSS SLIDE SA-19

Give the definition of process indicator.

Discuss how process indicators should be monitored and corrective action

Explain the difference between a defect and a process indicator.

Table 11-1 SHOW AND DISCUSS SLIDE SA-20

Have students locate J-STD-001, Table 11-1 (p 28).

Discuss the table.

1.5 Process Control Requirements

Process Control Requirements SHOW AND DISCUSS SLIDE SA-21

Discuss the requirements.

Review SHOW AND DISCUSS SLIDE SA-22

Applicable Documents SHOW AND DISCUSS SLIDE SA-23

Have students locate paragraph 2.0 in J-STD-001.

3.1 Order of Precedence

Order of Precedence SHOW AND DISCUSS SLIDE SA-24

Conflict SHOW AND DISCUSS SLIDE SA-25

Explain this hierarchy to the students.

3.2 Terms and Definitions

Terms and Definitions SHOW AND DISCUSS SLIDE SA-26

3.2.1 Manufacturer (Assembler)

Terms and Definitions (continued) SHOW AND DISCUSS SLIDE SA-28