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Welding and soldering processes
Introduction
Soldering processes
Joining Technologies
Welding and soldering processes
Practical examples
Joining Technologies
Welding and soldering processes
Practical examples 2
Reflowelding of smd
4
Quelle: Lugscheider, Fügen von Hochleistungswerkstoffen SMD-Technik Buch
Joining Technologies
Welding and soldering processes
Practical example 3
Quelle: Audi
Joining Technologies
Welding and soldering processes
Definition of soldering
soldering: soldering:
Joining Technologies
Welding and soldering processes
Definition of soldering
Joint formation by
● Wetting of the solid surfaces of the
joint
● With liquid solder
Joining Technologies
Welding and soldering processes
Physical principal and influencing factors
Soldering
process
wetting flux
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Joining Technologies
Welding and soldering processes
Wetting
q = 180° q = 30° q = 0°
No wetting Sound wetting Ideal wetting
EO >> E A EO < E A E O << E A
EA : adhesion energy E O : surface energy q : wetting angle
Quelle: iwb
Wetting means a specific reaction of the liquid solder with the solid surface
The droplet is affected by cohesive force and adhesive force
Wetting is measured by the surface tension
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Joining Technologies
Welding and soldering processes
Wetting process
gl
q
gs
g ls
Youngs equitation: gs =g l cosq +gLS
Mit gs : surface energy of the solid phase [N/m]
gl : surface energy of the liquid phase [N/m]
g ls : surface energy of the boundary layer solid-liquid [N/m]
q : contact angle
10
Quelle: iwb
Joining Technologies
Welding and soldering processes
Tasks and effects of the flux
Quelle: iwb
11
Joining Technologies
Welding and soldering processes
flux
solvent solid
Additives:
basis: Activator foam regulation
Colophony thickener (solder paste)
Synthetic resin anti setting agent
diluent
Quelle: iwb 12
Joining Technologies
Welding and soldering processes
Capillary effect
Differentiation by solder joint fusion brazing
● fusion brazing depending on depending on capillary action of the
capillary action (gap soldering) solder
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Joining Technologies
Welding and soldering processes
Brazing fit and capillary action
right wrong
0,05...0,2
>0,5
Melting solder Melting solder
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Quelle: iwb
Joining Technologies
Welding and soldering processes
Brazing fit and capillary action,
rules for gap soldering
Rules fusion brazing depending on capillary
Solder penetrates both gaps
action:
Inlay solder Applied solder
Inlay solder:
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Joining Technologies
Welding and soldering processes
20
mm For gap soldering
16
● Choose a small gap size
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Capillary head
Joining Technologies
Welding and soldering processes
Tin lead phase diagram
Joining Technologies
Welding and soldering processes
Temperature curve for soldering
Soldering temperature
Working temperature
temperature
Soak temperature
● Lowest surface temperature of the
specimen at which
– wetting takes place
– Solder flows
Soldering time
Total time Zeit
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Joining Technologies
Welding and soldering processes
Classification of soldering processes
soldering
brazing
(high temperature brazing)
Working
temperatur
Applied solder
Soldering Insert solder
Solder
and brazing
feeding Dip soldering
processes and brazing
Joining Technologies
Welding and soldering processes
Classification by working temperature
Soldering brazing High temperature brazing
Working temperature <450°C >450°C >900°C
flux + + -
vacuum - + +
Quelle: iwb Shielding gas - + +
soldering:
● Low tensile strength, leakproof, electric conductable
● Solder is based on tin and lead
● Low heat input for heat-sensitive parts, e.g. elektronics
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Joining Technologies
Welding and soldering processes
Classification by working temperature
Soldering brazing High temperature brazing
Working temperature <450°C >450°C >900°C
flux + + -
vacuum - + +
Quelle: iwb Shielding gas - + +
brazing:
● Tensile strength as high as base material
● Solder is based on cupper alloys with silver
● Furnace brazing without flux, especially for light weight metals
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Joining Technologies
Welding and soldering processes
Examples, metallographic examination
Cupper solder
Diffusion layer
Electro galvanised sheet
(400:1,
etching Nitral 2%)
22
Quelle: ESAB GmbH
Joining Technologies
Welding and soldering processes
Classification by working temperature
Soldering brazing High temperature brazing
Working temperature <450°C >450°C >900°C
flux + + -
vacuum - + +
Quelle: iwb Shielding gas - + +
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Joining Technologies
Welding and soldering processes
Classification by solder application
flame
seam
Brazing fit
specimen
flame
Application by dipping
Passage angle card
=7°
Drying way
Joining Technologies
Welding and soldering processes
Energy carrier for heating: solid (soldering gun)
wire
wire
Soldering gun
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Quelle: iwb
Joining Technologies
Welding and soldering processes
Energy carrier for heating: solid (rolling)
counterroller
Application in
electronic workshops
Flat part
(e.g. electronics))
Solder roller
Cover salt
Solder bath
26
Quelle: iwb
Joining Technologies
Welding and soldering processes
Energy carrier for heating: gas (inserted solder)
flame
Application:
Bicycle frame
27
Quelle: iwb
Joining Technologies
Welding and soldering processes
Energy carrier for heating: gas (applied solder)
Gas mixture
solder burner
Lötnaht
Brazing fit
specimen
e.g.:
Wide flame
Quelle: iwb
installation function 28
Joining Technologies
Welding and soldering processes
Energy carrier for heating: gas (braze welding)
burner
seam
hardFlame
Joint fitting
Application example:
Cooling fins for heat
specimen exchanger 29
Quelle: iwb
Joining Technologies
Welding and soldering processes
Energy carrier for heating: gas (mechanized gap soldering)
Application example:
tube bundle heat exchanger solder
Burning gas
mixture
Field burner 30
Quelle: iwb specimen
Joining Technologies
Welding and soldering processes
Energy carrier for heating: liquid – drag soldering
Solder bath
Flux bath
Application example:
electronic workshops
31
Quelle: Peter Jordan GmbH
Joining Technologies
Welding and soldering processes
Energy carrier for heating: liquid – wave soldering
Drying line
32
Quelle: Peter Jordan GmbH
Joining Technologies
Welding and soldering processes
Energy carrier for heating: liquid – ultrasonic soldering
US-oscillator specimen
Sonotrode
Platform with
Cooler blower
Solder bath
socket
Application example:
special process (oxid layer remove by ultrasonic)
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Quelle: Peter Jordan GmbH
Joining Technologies
Welding and soldering processes
Energy carrier for heating: radiation – laser beam brazing
Current source
Eliptic mirror
gas laser
Quelle: mta automation ag Quelle: Siemens
Light radiation
Laser beam
lense
application:
Turning table electronic industries
34
Quelle: iwb car industries
Joining Technologies
Welding and soldering processes
Energy carrier for heating: radiation – electron beam
brazing
Vaccum chamber
cathode
Current source
anode
Deflection system
Electron beam
Working chamber
Brazing seam
Application:
Special application
specimen 35
Quelle: iwb Turning unit
Joining Technologies
Welding and soldering processes
Energy carrier for heating: current – induction brazing
specimen
generator
Solder seam
Induction
coil
36
Quelle: iwb
Joining Technologies
Welding and soldering processes
Energy carrier for heating: electric current – resistance
soldering
indirect direct
electrode
(carrier)
specimen specimen
(e.g. Hard metal) Solder, fluxl Formed
Current source
electrode tip
(coal)
Solder, flux
Electrode
Current source tip
specimen (coal, thungsten)
Copper electrode
(e.g. steel)
Second
electrode
(carrier) 37
Quelle: iwb
Joining Technologies
Welding and soldering processes
Energy carrier for heating: electric current – arc soldering
Electrode holder
Coal electrode
Hard solder
(e.g.: phosphoric)
Current source
Lötnaht arc
Brazing fit
specimen 38
Joining Technologies
Welding and soldering processes
Energy carrier for heating: electric current – MSG
soldering
Solder is applied by filler wire which melt temperature is below of the base
material melt temperature
Electric arc is for heating electrode and base material to working temperature
High solder speed, no flux is deeded
Use in body in white production: for zink coated steel
● Less zink burn out than for welding, corrosion resistance remains, porefree
● Solder material bronze
MIG-Hard brazing of steel with impulse arc, filler material penetration< 0,5xsheet thickness 39
Joining Technologies
Welding and soldering processes
Energy carrier for heating: electric current – MSG
soldering
Advantages for MSG-soldering: Disadvantages
● Low heat input ● Expensive filler wire
● Good gap bridgeability ● Flat seam only with impulse arc
● Good suitability for Zn- and Al-
coated sheets
● Remain of corrosion resistance
● High brazing speed compared to
other brazing processes
● No flux needed
● Not weld penetration at seam
edges
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Joining Technologies
Welding and soldering processes
Energy carrier for heating: electric current – MSG brazing
Joining Technologies
Welding and soldering processes
Comparison of different brazing processes
Laser oven Gas flame Current
Energy source: induction
(Resistanc)
Machine costs
portability
Energy density
Soldering time
flexibility
Process factors
handling
quality
Joining Technologies
Welding and soldering processes
Design and process steps for brazing and soldering
T-Joint
Scarf joint
Constructive design of the brazing fit
Butt joint
Joint materials
Lap joint
brazeability Solder materials
flux
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Joining Technologies
Welding and soldering processes
Design and process steps for brazing and soldering
Design of the brazing fit Common joint geometries
● Normally parallel for a constant gap ● T-joint
thickness
● Butt-joint
● Keep maximum and minimum
● Lap-joint
width
● Scarf-joint
● Brazing fit shall not grow in solder
flux direction (avoid capillary flow
break)
● Maximum brazing fit length 15 mm
(to have sufficient capillary
pressure)
● Tool marks in solder flow direction
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Joining Technologies
Welding and soldering processes
Design and process steps for brazing and soldering
Scarf joint
T-joint
Lap joint
Butt joint 45
Joining Technologies
Welding and soldering processes
Design and process steps for brazing and soldering
Braze ability is given if: Advantages
● Suitable solder and flux for the ● Due to low heat input braze ability
base material is given is less limited than weldablity
● Base material has no disadvantage ● Not weld able metals are braze
material transformation at brazing able – if the base metals are braze
temperature able with the solder (alloying)
● Melting temperature of solder is
below melting temperature of base
material
● Solder and base material alloy in a
mixed crystal
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Joining Technologies
Welding and soldering processes
Design and process steps for brazing and soldering
Solder brittleness
● Inter crystalline crack initiation
● Liquid solder penetrates along the
grain boundaries into base material
● Crack of grain boundaries
● Steel- and Cu- rich solders have
low solder brittleness
● Hard brazing seldom has solder
brittleness
47
Joining Technologies
Welding and soldering processes
Design and process steps for brazing and soldering
Pre- and post treatment of solder ● Effectively the layer is limited to
joints 0,5mm
Joining Technologies
Welding and soldering processes
Design and process steps for brazing and soldering
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Joining Technologies
Welding and soldering processes
Design and process steps for brazing and soldering
Strength of solder connection Strength of solder connection
Impact factor area Impact factor solder
● Strength decreases with increasing ● Based on strength of the solder
surface area
● Tensile strength of the joint
– Huge soldering areas increases increases with tensile strength of
defects, like pores, gas- and flux the solder
inclusions, and unheated areas
● Strength of joint can be higher than
● Decrease of strength due to bigger the strength of the solder due to
areas mostly is bigger than the
strength increase by bigger areas – Alloying
Joining Technologies
Welding and soldering processes
Design and process steps for brazing and soldering
Strength of brazing joints Strength of brazing joints
Impact factor flux Impact factor temperature and
● Erase existing or forming oxide
filling grad
layers on base material and solder ● Maintain right brazing temperature
● Increase surface tension of joint is important
partners ● To low temperature: no or not
● Sufficient supply of flux needs to be sufficient diffusion and alloying of
secured for solder and base solder and base material
material ● To high temperature: risk of
● Activation temperature of flux evaporation of alloying elements of
needs to be at least 50 – 100 °C the solder (solder over heating)
below working temperature of ● Insufficient filled brazing fits reduce
solder the tensile strength
51
Joining Technologies
Welding and soldering processes
Advantages of soldering and brazing
52
Joining Technologies
Welding and soldering processes
Disadvantages of soldering and brazing
53
Joining Technologies
Welding and soldering processes
What did you learn?
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Joining Technologies
Welding and soldering processes
Vielen Dank für Ihre Aufmerksamkeit!
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Joining Technologies
Welding and soldering processes