TABLE OF CONTENTS

S No. TOPIC PAGE No.

1. Acknowledgement I
2. Table of Content Ii
3. List of Figures Iii
4. List of Tables Iv
5. Organization Profile 1
6. 1. Printed Circuit Board (PCB) 2
1.1 Introduction to Printed Circuit Board 2
1.2 History of Printed Circuit Board 3
7. 2. PCB Manufacturing 6
2.1 Materials 8
2.2 Laminates 8
2.3 Panelization 9
2.4 Etching 11
2.5 Chemical Etching 12
2.6 Lamination 13
2.8 Drilling 13
8. 3. Exposed Conductor Plating & Coating 14
3.1 Solder Resist 14
3.2 Silk Screen 15
15
3.3 Printed circuit Assembly
17
3.4 Protection &Packaging
9. 4. Design 18
4.1 Copper Thickness 19
4.2 Cordwood Construction 20
4.3 Multi wire Boards 21
10. 5. Component Mounting Technology 22
5.1 Through Hole Technology 22
5.1.1 History 22
5.1.2 Characteristics 23
5.2 Surface Mounting Technology 23
5.2.1 Introduction 23
5.2.2 History 24
5.2.3 Terms 25
5.2.4 Assembly Techniques 25
5.2.5 Advantages 27
5.2.6 Disadvantages 27
5.2.7 Rework 28
11. 6. Soldering 29
6.1 History 29
6.2 Applications 29
6.3 Soldering Iron 30
6.4 Types of Iron 30
 6.4.1 Simple Iron 30
6.4.2 Cordless Iron 30
6.4.3 Temperature Controlled Soldering Iron 6.5 31
Cleaning 31

12. 7. Solder 33
7.1 Flux 34
7.2 Processes 35
7.3 Soldering & Brazing 36
7.4 Silver Soldering 37
7.5 Induction Soldering 37
7.6 De-soldering 38
7.7 Soldering defects 39
13. 8. References 40
 LIST OF FIGURES

S No. NAME OF FIGURE PAGE No.

1. Fig 1.1 Printed Circuit Board 3
Fig 1.2 The component side of a PCB in a 5
computer mouse; Some examples for
common components and their reference
designation in the legend.
2. Fig 2.1 Panelization of PCBs 10
Fig 2.2 The two processing methods used to produce a 11
double-sided PWB with plated through holes.
Fig 2.3 PCBs in process of having copper
12
pattern plated, notice the blue dry film resist.

3. Fig 3.1 PCB with test connection pads 16

Fig 3.2 Antistatic bags for PCB 17
4. Fig 4.1 A board designed in 1967; the sweeping curves 18
in the traces are evidence of freehand design using self-
adhesive tape
Fig 4.2 A cordwood module 20
5. Fig 5.1 Through-hole devices mounted on circuit board. 23
Fig 5.2 Surface mount components including resistors, 24
transistors and an integrated circuits
Fig 5.3 Assembly line with SMT placement machines 28
Fig 5.4 Removal of surface mount device using soldering 28
tweezers
6. Fig 6.1 Soldering 29

7. Fig 7.1 An Improperly soldered joint 35

Fig 7.2 Solder 36

LIST OF TABLE

S No. NAME OF TABLE PAGE No.

1. Tab. 2.1.1 PCB Manufacturing Process Steps 6
Tab. 2.1.2 Process Sequences for Single, Double and 7
Multi-layer PCB 8
Tab .2.1.3 Standard laminate thickness per
ANSI/IPC-D- 275