LTC3108-1

Ultralow Voltage Step-Up

Converter and Power Manager

Features Description
n Operates from Inputs of 20mV The LTC®3108-1 is a highly integrated DC/DC converter ideal
n Complete Energy Harvesting Power for harvesting and managing surplus energy from extremely
Management System low input voltage sources such as TEGs (thermoelectric
- Selectable VOUT of 2.5V, 3V, 3.7V or 4.5V generators), thermopiles and small solar cells. The step-up
- LDO: 2.2V at 3mA topology operates from input voltages as low as 20mV.
- Logic Controlled Output
Using a small step-up transformer, the LTC3108-1 provides
- Reserve Energy Output
n Power Good Indicator
a complete power management solution for wireless sens-
n Uses Compact Step-Up Transformers
ing and data acquisition. The 2.2V LDO powers an external
n Small 12-Lead (3mm × 4mm) DFN or 16-Lead
microprocessor, while the main output is programmed to
one of four fixed voltages to power a wireless transmitter
SSOP Packages
or sensors. The power good indicator signals that the main
Applications output voltage is within regulation. A second output can be
enabled by the host. A storage capacitor provides power
n Remote Sensors and Radio Power when the input voltage source is unavailable. Extremely
n Surplus Heat Energy Harvesting low quiescent current and high efficiency design ensure
n HVAC Systems the fastest possible charge times of the output reservoir
n Industrial Wireless Sensing capacitor. The LTC3108-1 is functionally equivalent to the
n Automatic Metering LTC3108 except for its unique fixed VOUT options.
n Building Automation
n Predictive Maintenance The LTC3108-1 is available in a small, thermally enhanced
12-lead (3mm × 4mm) DFN package and a 16-lead SSOP
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners. package.

Typical Application
Wireless Remote Sensor Application
Powered From a Peltier Cell VOUT Charge Time
1nF
1:100 5.25V 1000
C1 VSTORE VOUT = 3V
+
+ + 0.1F COUT = 470µF
THERMOELECTRIC LTC3108-1 6.3V
220µF 330pF
GENERATOR
VOUT2 100
C2
PGOOD
PGD µP
20mV TO 500mV 2.2V
TIME (sec)

SW VLDO
10
2.2µF SENSORS
3V
VS2 VOUT
+ RF LINK
470µF 1
1:100 Ratio
VS1 VOUT2_EN 1:50 Ratio
VAUX GND 31081 TA01a 1:20 Ratio
0
0 50 100 150 200 250 300 350 400
1µF VIN (mV)
31081 TA01b

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LTC3108-1
Absolute Maximum Ratings (Note 1)

SW Voltage...................................................–0.3V to 2V VS1, VS2, VAUX, VOUT, PGD.........................–0.3V to 6V

C1 Voltage.....................................................–0.3V to 6V VLDO, VSTORE.............................................–0.3V to 6V
C2 Voltage (Note 5)..........................................–8V to 8V Operating Junction Temperature Range
VOUT2, VOUT2_EN............................................–0.3V to 6V (Note 2).................................................. –40°C to 125°C
VAUX.....................................................15mA into VAUX Storage Temperature Range................... –65°C to 125°C

Pin Configuration
TOP VIEW
TOP VIEW
GND 1 16 GND
VAUX 1 12 SW
VAUX 2 15 SW
VSTORE 2 11 C2
VSTORE 3 14 C2
VOUT 3 13 10 C1
VOUT 4 13 C1
GND
VOUT2 4 9 VOUT2_EN
VOUT2 5 12 VOUT2_EN
VLDO 5 8 VS1 VLDO 6 11 VS1
PGD 6 7 VS2 PGD 7 10 VS2
GND 8 9 GND
DE PACKAGE
12-LEAD (4mm × 3mm) PLASTIC DFN
GN PACKAGE
TJMAX = 125°C, θJA = 43°C/W 16-LEAD PLASTIC SSOP NARROW
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB (NOTE 4)
TJMAX = 125°C, θJA = 110°C/W

order information
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC3108EDE-1#PBF LTC3108EDE-1#TRPBF 31081 12-Lead (4mm × 3mm) Plastic DFN –40°C to 125°C
LTC3108IDE-1#PBF LTC3108IDE-1#TRPBF 31081 12-Lead (4mm × 3mm) Plastic DFN –40°C to 125°C
LTC3108EGN-1#PBF LTC3108EGN-1#TRPBF 31081 16-Lead Plastic SSOP –40°C to 125°C
LTC3108IGN-1#PBF LTC3108IGN-1#TRPBF 31081 16-Lead Plastic SSOP –40°C to 125°C
Consult LTC Marketing for parts specified for other fixed output voltages or wider operating temperature ranges.
*The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/

Electrical
The Characteristics l denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are for TA = 25°C (Note 2). VAUX = 5V, unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum Start-Up Voltage Using 1:100 Transformer Turns Ratio, VAUX = 0V 20 50 mV
No-Load Input Current Using 1:100 Transformer Turns Ratio; VIN = 20mV, 3 mA
VOUT2_EN = 0V; All Outputs Charged and in Regulation
Input Voltage Range Using 1:100 Transformer Turns Ratio l VSTARTUP 500 mV
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 LTC3108-1
Electrical
The Characteristics l denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are for TA = 25°C (Note 2). VAUX = 5V, unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Voltage VS1 = VS2 = GND l 2.45 2.50 2.55 V
VS1 = VAUX, VS2 = GND l 2.94 3.00 3.06 V
VS1 = GND, VS2 = VAUX l 3.626 3.70 3.774 V
VS1 = VS2 = VAUX l 4.41 4.50 4.59 V
VOUT Quiescent Current VOUT = 3.7V, VOUT2_EN = 0V 0.2 µA
VAUX Quiescent Current No Load, All Outputs Charged 6 9 µA
LDO Output Voltage 0.5mA Load l 2.134 2.2 2.266 V
LDO Load Regulation For 0mA to 2mA Load 0.5 1 %
LDO Line Regulation For VAUX from 2.5V to 5V 0.05 0.2 %
LDO Dropout Voltage IVLDO = 2mA l 100 200 mV
LDO Current Limit VLDO = 0V l 4 11 mA
VOUT Current Limit VOUT = 0V l 2.8 4.5 7 mA
VSTORE Current Limit VSTORE = 0V l 2.8 4.5 7 mA
VAUX Clamp Voltage Current into VAUX = 5mA l 5 5.25 5.55 V
VSTORE Leakage Current VSTORE = 5V 0.1 0.3 µA
VOUT2 Leakage Current VOUT2 = 0V, VOUT2_EN = 0V 0.1 µA
VS1, VS2 Threshold Voltage l 0.4 0.85 1.2 V
VS1, VS2 Input Current VS1 = VS2 = 5V 0.01 0.1 µA
PGD Threshold (Rising) Measured Relative to the VOUT Voltage –7.5 %
PGD Threshold (Falling) Measured Relative to the VOUT Voltage –9 %
PGD VOL Sink Current = 100µA 0.15 0.3 V
PGD VOH Source Current = 0 2.1 2.2 2.3 V
PGD Pull-Up Resistance 1 MΩ
VOUT2_EN Threshold Voltage VOUT2_EN Rising l 0.4 1 1.3 V
VOUT2_EN Pull-Down Resistance 5 MΩ
VOUT2 Turn-On Time 5 µs
VOUT2 Turn-Off Time (Note 3) 0.15 µs
VOUT2 Current Limit VOUT = 3.7V l 0.15 0.3 0.45 A
VOUT2 Current Limit Response Time (Note 3) 350 ns
VOUT2 P-Channel MOSFET On-Resistance VOUT = 3.7V (Note 3) 1.3 Ω
N-Channel MOSFET On-Resistance C2 = 5V (Note 3) 0.5 Ω
Note 1: Stresses beyond those listed under Absolute Maximum Ratings environmental factors. The junction temperature (TJ) is calculated from
may cause permanent damage to the device. Exposure to any Absolute the ambient temperature (TA) and power dissipation (PD) according to
Maximum Rating condition for extended periods may affect device the formula: TJ = TA + (PD • θJA°C/W), where θJA is the package thermal
reliability and lifetime. impedance.
Note 2: The LTC3108-1 is tested under pulsed load conditions such that Note 3: Specification is guaranteed by design and not 100% tested in
TJ ≈ TA. The LTC3108-1E is guaranteed to meet specifications from production.
0°C to 85°C junction temperature. Specifications over the –40°C to Note 4: Failure to solder the exposed backside of the package to the PC
125°C operating junction temperature range are assured by design, board ground plane will result in a thermal resistance much higher than
characterization and correlation with statistical process controls. The 43°C/W.
LTC3108-1I is guaranteed over the full –40°C to 125°C operating junction Note 5: The absolute maximum rating is a DC rating. Under certain
temperature range. Note that the maximum ambient temperature conditions in the applications shown, the peak AC voltage on the C2 pin
is determined by specific operating conditions in conjunction with may exceed ±8V. This behavior is normal and acceptable because the
board layout, the rated thermal package thermal resistance and other current into the pin is limited by the impedance of the coupling capacitor.
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LTC3108-1
Typical Performance Characteristics TA = 25°C, unless otherwise noted.

IVOUT and Efficiency vs VIN,

IIN vs VIN, (VOUT = 0V) 1:20 Ratio Transformer
1000 4000 80
1:50 RATIO, C1 = 4.7n C1 = 10nF
1:100 RATIO, C1 = 1n 3500 70
1:20 RATIO, C1 = 10n IVOUT
3000 (VOUT = 0V) 60
100

EFFICIENCY (%)
2500 50

IVOUT (µA)
IIN (mA)

2000 EFFICIENCY IVOUT 40

(VOUT = 4V) (VOUT = 4V)
1500 30
10
1000 20

500 10

1 0 0
10 100 1000 0 100 200 300 400 500
VIN (mV) VIN (mV)
31081 G00
31081 G01

IVOUT and Efficiency vs VIN, IVOUT and Efficiency vs VIN,

1:50 Ratio Transformer 1:100 Ratio Transformer
3200 80 1400 70
C1 = 4.7nF IVOUT C1 = 1nF
2800 (VOUT = 0V) 70 1200 IVOUT 60
(VOUT = 0V)
2400 EFFICIENCY 60
1000 50
(VOUT = 4V) EFFICIENCY
EFFICIENCY (%)

EFFICIENCY (%)
2000 50 (VOUT = 4V)
IVOUT (µA)

IVOUT (µA)

800 40
1600 IVOUT 40
(VOUT = 4V)
600 30
1200 30 IVOUT
(VOUT = 4V)
400 20
800 20

400 10 200 10

0 0 0 0
0 100 200 300 400 500 0 100 200 300 400 500
VIN (mV) VIN (mV)
31081 G02 31081 G03

Input Resistance vs VIN IVOUT vs VIN and Source Resistance,

(VOUT Charging) 1:20 Ratio
10 10000
C1 = 10nF
9
8 1:20 RATIO
1000
INPUT RESISTANCE (Ω)

7
6
IVOUT (µA)

5 100
1:50 RATIO
4
3
10 1Ω
2 1:100 RATIO
2Ω
1 5Ω
10Ω
0 0
0 100 200 300 400 500 0 100 200 300 400 500 600 700 800
VIN (mV) VIN OPEN-CIRCUIT (mV)
31081 G05
31081 G04

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 LTC3108-1
Typical Performance Characteristics TA = 25°C, unless otherwise noted.

IVOUT vs VIN and Source Resistance, IVOUT vs VIN and Source Resistance,
1:50 Ratio 1:100 Ratio
10000 1000
C1 = 4.7nF C1 = 1nF

1000

IVOUT (µA)
IVOUT (µA)

100 100

10 1Ω 1Ω
2Ω 2Ω
5Ω 5Ω
10Ω 10Ω
0 10
0 100 200 300 400 500 600 700 800 0 100 200 300 400 500
VIN OPEN-CIRCUIT (mV) VIN OPEN-CIRCUIT (mV)
31081 G06 31081 G07

IVOUT vs dT and TEG Size,

1:100 Ratio Resonant Switching Waveforms
10000
VOUT = 0V VIN = 20mV
1:100 RATIO TRANSFORMER
40mm
TEG
1000
C1 PIN
15mm 2V/DIV
TEG
IVOUT (µA)

C2 PIN
100 2V/DIV

SW PIN
50mV/
10 DIV
1:50 RATIO
1:100 RATIO 31081 G09

1:50 RATIO 10µs/DIV

1:100 RATIO
0
0.1 1 10 100
dT ACROSS TEG (°C)
31081 G08

LDO Load Regulation LDO Dropout Voltage

0.00 0.20
0.18
0.16
–0.25
DROPOUT VOLTAGE (V)

0.14
DROP IN VLDO (%)

0.12
–0.50 0.10
0.08
0.06
–0.75
0.04
0.02
–1.00 0.00
0 0.5 1 1.5 2 2.5 3 3.5 4 0 0.5 1 1.5 2 2.5 3 3.5 4
LDO LOAD (mA) LDO LOAD (mA)
31081 G10 31081 G11

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LTC3108-1
Typical Performance Characteristics TA = 25°C, unless otherwise noted.

VOUT and PGD Response

Start-Up Voltage Sequencing During a Step Load
VIN = 50mV 50mA LOAD STEP
1:100 RATIO TRANSFORMER COUT = 220µF
COUT = 220µF
CSTORE = 470µF CH1
CLDO = 2.2µF VSTORE
1V/DIV CH2
VOUT, 1V/DIV
CH2, VOUT
1V/DIV CH1
CH3, VLDO PGD, 1V/DIV
1V/DIV

31081 G12 31081 G13

10sec/DIV 5ms/DIV

VOUT Ripple LDO Step Load Response

30µA LOAD
COUT = 220µF

VLDO
20mV/
20mV/DIV
DIV

ILDO
5mA/DIV

31081 G14
100ms/DIV 200µs/DIV
31081 G15

0mA TO 3mA LOAD STEP

CLDO = 2.2µF

Enable Input and VOUT2 Running on Storage Capacitor

CSTORE = 470µF
VOUT LOAD = 100µA
CH3
VSTORE
CH2 1V/DIV
VOUT2
1V/DIV CH2, VOUT
1V/DIV
CH4, VLDO
CH1 1V/DIV
VOUT2_EN CH1, VIN
1V/DIV 50mV/DIV
31081 G16 31081 G17
1ms/DIV 5sec/DIV
10mA LOAD ON VOUT2
COUT = 220µF

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 LTC3108-1
Pin Functions (DFN/SSOP)

VAUX (Pin 1/Pin 2): Output of the Internal Rectifier Cir-
cuit and VCC for the IC. Bypass VAUX with at least 1µF of
capacitance. An active shunt regulator clamps VAUX to
5.25V (typical).
VSTORE (Pin 2/Pin 3): Output for the Storage Capacitor
or Battery. A large capacitor may be connected from this
pin to GND for powering the system in the event the input
voltage is lost. It will be charged up to the maximum VAUX
clamp voltage. If not used, this pin should be left open
or tied to VAUX.
VOUT (Pin 3/Pin 4): Main Output of the Converter. The
voltage at this pin is regulated to the voltage selected by
VS1 and VS2 (see Table 1). Connect this pin to an energy
storage capacitor or to a rechargeable battery.
VOUT2 (Pin 4/Pin 5): Switched Output of the Converter.
Connect this pin to a switched load. This output is open
until VOUT2_EN is driven high, then it is connected to
VOUT through a 1.3Ω P-channel switch. If not used, this
pin should be left open or tied to VOUT. The peak current
in this output is limited to 0.3A typical.
VLDO (Pin 5/Pin 6): Output of the 2.2V LDO. Connect a
2.2µF or larger ceramic capacitor from this pin to GND.
If not used, this pin should be tied to VAUX.
PGD (Pin 6/Pin 7): Power Good Output. When VOUT is
VS1 (Pin 8/Pin 11): VOUT Select Pin 1. Connect this pin
to ground or VAUX to program the output voltage (see
Table 1).
VOUT2_EN (Pin 9/Pin 12): Enable Input for VOUT2. VOUT2
will be enabled when this pin is driven high. There is an
internal 5M pull-down resistor on this pin. If not used,
this pin can be left open or grounded.
C1 (Pin 10/Pin 13): Input to the Charge Pump and Rectifier
Circuit. Connect a capacitor from this pin to the secondary
winding of the step-up transformer.
C2 (Pin 11/Pin 14): Input to the N-Channel Gate Drive
Circuit. Connect a capacitor from this pin to the secondary
winding of the step-up transformer.
SW (Pin 12/Pin 15): Drain of the Internal N-Channel
Switch. Connect this pin to the primary winding of the
transformer.
GND (Pins 1, 8, 9, 16) SSOP Only: Ground
GND (Exposed Pad Pin 13) DFN Only: Ground. The DFN
exposed pad must be soldered to the PCB ground plane.
It serves as the ground connection, and as a means of
conducting heat away from the die.
Table 1. Regulated Voltage Using Pins VS1 and VS2
VS2 VS1 VOUT

within 7.5% of its programmed value, PGD will be pulled GND GND 2.5V
up to VLDO through a 1MΩ resistor. If VOUT drops 9% GND VAUX 3V
below its programmed value PGD will go low. This pin VAUX GND 3.7V
can sink up to 100µA. VAUX VAUX 4.5V

VS2 (Pin 7/Pin 10): VOUT Select Pin 2. Connect this pin
to ground or VAUX to program the output voltage (see
Table 1).

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LTC3108-1
Block Diagram

LTC3108-1
VOUT2
1.3Ω
ILIM VOUT2

VOUT2_EN
OFF ON
1.2V
SYNC RECTIFY REFERENCE VREF 5M
C1 VOUT
VIN 1:100 C1 VOUT

CIN 5.25V COUT

C2 +
C2 VS1
–
SW SW VOUT CHARGE
VOUT
CONTROL VS2
VSTORE PROGRAM

0.5Ω VREF

VLDO

1M
PGD
–
PGOOD
+
VAUX VSTORE
VBEST LDO
VOUT VREF
1µF CSTORE
GND (SSOP) EXPOSED PAD (DFN) VLDO

31081 BD

2.2V
2.2µF

operation (Refer to the Block Diagram)

The LTC3108-1 is designed to use a small external step-up
transformer to create an ultralow input voltage step-up
DC/DC converter and power manager. It is ideally suited
for low power wireless sensors and other applications in
which surplus energy harvesting is used to generate system
power because traditional battery power is inconvenient
or impractical.
The LTC3108-1 is designed to manage the charging and
regulation of multiple outputs in a system in which the
average power draw is very low, but there may be periodic
pulses of higher load current required. This is typical of
wireless sensor applications, where the quiescent power
draw is extremely low most of the time, except for transmit
bursts when circuitry is powered up to make measure-
ments and transmit data.
The LTC3108-1 can also be used to trickle charge a standard
capacitor, supercapacitor or rechargeable battery, using
energy harvested from a Peltier or photovoltaic cell.

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Operation
Oscillator
The LTC3108-1 utilizes a MOSFET switch to form a resonant
step-up oscillator using an external step-up transformer
and a small coupling capacitor. This allows it to boost input
voltages as low as 20mV high enough to provide multiple
regulated output voltages for powering other circuits. The
frequency of oscillation is determined by the inductance of
the transformer secondary winding and is typically in the
range of 10kHz to 100kHz. For input voltages as low as
20mV, a primary-secondary turns ratio of about 1:100 is
recommended. For higher input voltages, this ratio can be
lower. See the Applications Information section for more
information on selecting the transformer.
Charge Pump and Rectifier
The AC voltage produced on the secondary winding of
the transformer is boosted and rectified using an external
charge pump capacitor (from the secondary winding to
pin C1) and the rectifiers internal to the LTC3108-1. The
rectifier circuit feeds current into the VAUX pin, provid-
ing charge to the external VAUX capacitor and the other
outputs.
VAUX
The active circuits within the LTC3108-1 are powered from
VAUX, which should be bypassed with a 1µF capacitor.
Larger capacitor values are recommended when using
turns ratios of 1:50 or 1:20 (refer to the Typical Applica-
tion examples). Once VAUX exceeds 2.5V, the main VOUT
is allowed to start charging.
An internal shunt regulator limits the maximum voltage
on VAUX to 5.25V typical. It shunts to GND any excess
current into VAUX when there is no load on the converter
or the input source is generating more power than is
required by the load.
Voltage Reference
The LTC3108-1 includes a precision, micropower refer-
ence, for accurate regulated output voltages. This reference
becomes active as soon as VAUX exceeds 2V.
For more information www.linear.com/LTC3108-1
LTC3108-1
Synchronous Rectifiers
Once VAUX exceeds 2V, synchronous rectifiers in parallel
with each of the internal diodes take over the job of rectify-
ing the input voltage, improving efficiency.
Low Dropout Linear Regulator (LDO)
The LTC3108-1 includes a low current LDO to provide a
regulated 2.2V output for powering low power processors
or other low power ICs. The LDO is powered by the higher
of VAUX or VOUT. This enables it to become active as soon
as VAUX has charged to 2.3V, while the VOUT storage
capacitor is still charging. In the event of a step load on
the LDO output, current can come from the main VOUT
capacitor if VAUX drops below VOUT. The LDO requires
a 2.2µF ceramic capacitor for stability. Larger capacitor
values can be used without limitation, but will increase
the time it takes for all the outputs to charge up. The LDO
output is current limited to 4mA minimum.
VOUT
The main output voltage on VOUT is charged from the VAUX
supply, and is user programmed to one of four regulated
voltages using the voltage select pins VS1 and VS2, ac-
cording to Table 2. Although the logic threshold voltage
for VS1 and VS2 is 0.85V typical, it is recommended that
they be tied to ground or VAUX.
Table 2. Regulated Voltage Using Pins VS1 and VS2
VS2 VS1 VOUT
GND GND 2.5V
GND VAUX 3V
VAUX GND 3.7V
VAUX VAUX 4.5V
When the output voltage drops slightly below the regulated
value, the charging current will be enabled as long as VAUX
is greater than 2.5V. Once VOUT has reached the proper
value, the charging current is turned off.
The internal programmable resistor divider sets VOUT,
eliminating the need for very high value external resistors
that are susceptible to board leakage.
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LTC3108-1
Operation
In a typical application, a storage capacitor (typically a few
hundred microfarads) is connected to VOUT. As soon as
VAUX exceeds 2.5V, the VOUT capacitor will be allowed to
charge up to its regulated voltage. The current available
to charge the capacitor will depend on the input voltage
and transformer turns ratio, but is limited to about 4.5mA
typical.
PGOOD
A power good comparator monitors the VOUT voltage.
The PGD pin is an open-drain output with a weak pull-up
(1MΩ) to the LDO voltage. Once VOUT has charged to within
7.5% of its regulated voltage, the PGD output will go high.
If VOUT drops more than 9% from its regulated voltage,
PGD will go low. The PGD output is designed to drive a
microprocessor or other chip I/O and is not intended to
drive a higher current load such as an LED. Pulling PGD
up externally to a voltage greater than VLDO will cause a
small current to be sourced into VLDO. PGD can be pulled
low in a wire-OR configuration with other circuitry.
VOUT2
VOUT2 is an output that can be turned on and off by the
host, using the VOUT2_EN pin. When enabled, VOUT2 is
connected to VOUT through a 1.3Ω P-channel MOSFET
switch. This output, controlled by a host processor, can
be used to power external circuits such as sensors and
amplifiers, that do not have a low power sleep or shutdown
capability. VOUT2 can be used to power these circuits only
when they are needed.
Minimizing the amount of decoupling capacitance on
VOUT2 will allow it to be switched on and off faster, allowing
shorter burst times and, therefore, smaller duty cycles in
pulsed applications such as a wireless sensor/transmit-
ter. A small VOUT2 capacitor will also minimize the energy
that will be wasted in charging the capacitor every time
VOUT2 is enabled.
VOUT2 has a soft-start time of about 5µs to limit capacitor
charging current and minimize glitching of the main output
when VOUT2 is enabled. It also has a current limiting circuit
that limits the peak current to 0.3A typical.
10 For more information www.linear.com/LTC3108-1
The VOUT2 enable input has a typical threshold of 1V
with 100mV of hysteresis, making it logic-compatible. If
VOUT2_EN (which has an internal pull-down resistor) is
low, VOUT2 will be off. Driving VOUT2_EN high will turn on
the VOUT2 output.
Note that while VOUT2_EN is high, the current limiting cir-
cuitry for VOUT2 draws an extra 8µA of quiescent current
from VOUT. This added current draw has a negligible effect
on the application and capacitor sizing, since the load on
the VOUT2 output, when enabled, is likely to be orders of
magnitude higher than 8µA.
VSTORE
The VSTORE output can be used to charge a large storage
capacitor or rechargeable battery after VOUT has reached
regulation. Once VOUT has reached regulation, the VSTORE
output will be allowed to charge up to the VAUX voltage.
The storage element on VSTORE can be used to power
the system in the event that the input source is lost, or
is unable to provide the current demanded by the VOUT,
VOUT2 and LDO outputs. If VAUX drops below VSTORE,
the LTC3108-1 will automatically draw current from the
storage element. Note that it may take a long time to charge
a large capacitor, depending on the input energy available
and the loading on VOUT and VLDO.
Since the maximum current from VSTORE is limited to a
few milliamps, it can safely be used to trickle-charge NiCd
or NiMH rechargeable batteries for energy storage when
the input voltage is lost. Note that the VSTORE capacitor
cannot supply large pulse currents to VOUT . Any pulse load
on VOUT must be handled by the VOUT capacitor.
Short-Circuit Protection
All outputs of the LTC3108-1 are current limited to protect
against short-circuits to ground.
Output Voltage Sequencing
A timing diagram showing the typical charging and
voltage sequencing of the outputs is shown in Figure 1.
Note: time not to scale.
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 LTC3108-1
Operation

5.0
VSTORE (V)
2.5
0
3.0
2.0
PGD (V)
1.0
0
5.0
VOLTAGE (V)

2.5 VOUT (V)

0
3.0
2.0
VLDO (V)
1.0
0

5.0 VAUX (V)

2.5

0
0 10 20 30 40 50 60 70 80

TIME (ms)
31081 F01a

Figure 1. Output Voltage Sequencing with VOUT Programmed for 3V (Time Not to Scale)

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LTC3108-1
Applications Information
Introduction
The LTC3108-1 is designed to gather energy from very
low input voltage sources and convert it to usable output
voltages to power microprocessors, wireless transmitters
and analog sensors. Such applications typically require
much more peak power, and at higher voltages, than
the input voltage source can produce. The LTC3108-1 is
designed to accumulate and manage energy over a long
period of time to enable short power bursts for acquiring
and transmitting data. The bursts must occur at a low
enough duty cycle such that the total output energy dur-
ing the burst does not exceed the average source power
integrated over the accumulation time between bursts.
For many applications, this time between bursts could
be seconds, minutes or hours.
The PGD signal can be used to enable a sleeping micro-
processor or other circuitry when VOUT reaches regulation,
indicating that enough energy is available for a burst.
Input Voltage Sources
The LTC3108-1 can operate from a number of low input
voltage sources, such as Peltier cells, photovoltaic cells or
thermopile generators. The minimum input voltage required
for a given application will depend on the transformer
turns ratio, the load power required, and the internal DC
resistance (ESR) of the voltage source. Lower ESR will
allow the use of lower input voltages, and provide higher
output power capability.
1000
TEG VOPEN_CIRCUIT (mV)
100
10
Figure 2. Typical Performance of a Peltier Cell Acting as a Thermoelectric Generator
12
Refer to the IIN vs VIN curves in the Typical Performance
Characteristics section to see what input current is required
for the source for a given input voltage.
For a given transformer turns ratio, there is a maximum
recommended input voltage to avoid excessively high
secondary voltages and power dissipation in the shunt
regulator. It is recommended that the maximum input
voltage times the turns ratio be less than 50.
Note that a low ESR bulk decoupling capacitor will usually
be required across the input source to prevent large voltage
droop and ripple caused by the source’s ESR and the peak
primary switching current (which can reach hundreds of
milliamps). The time constant of the filter capacitor and
the ESR of the voltage source should be much longer than
the period of the resonant switching frequency.
Peltier Cell (Thermoelectric Generator)
A Peltier cell (also known as a thermoelectric cooler) is
made up of a large number of series-connected P-N junc-
tions, sandwiched between two parallel ceramic plates.
Although Peltier cells are often used as coolers by apply-
ing a DC voltage to their inputs, they will also generate
a DC output voltage, using the Seebeck effect, when the
two plates are at different temperatures. The polarity of
the output voltage will depend on the polarity of the tem-
perature differential between the plates. The magnitude of
the output voltage is proportional to the magnitude of the
temperature differential between the plates. When used in
100
TEG: 30mm
127 COUPLES VOC
TEG MAXIMUM POUT —IDEAL (mW)
R = 2Ω
10
MAX POUT
(IDEAL)
1
1 0.1
1 10 100
dT (°C) 31081 F02
31081fb
For more information www.linear.com/LTC3108-1
 LTC3108-1
Applications Information
this manner, a Peltier cell is referred to as a thermoelectric current capability by providing a higher input voltage
generator (TEG). under load.
The low voltage capability of the LTC3108-1 design allows
Peltier Cell (TEG) Suppliers
it to operate from a TEG with temperature differentials
as low as 1°C, making it ideal for harvesting energy in Peltier cells are available in a wide range of sizes and
applications in which a temperature difference exists power capabilities, from less than 10mm square to over
between two surfaces or between a surface and the am- 50mm square. They are typically 2mm to 5mm in height.
bient temperature. The internal resistance (ESR) of most A list of Peltier cell manufacturers is given in Table 3.
cells is in the range of 1Ω to 5Ω, allowing for reasonable
power transfer. The curves in Figure 2 show the open- Table 3. Peltier Cell Manufacturers
Fujitaka
circuit output voltage and maximum power transfer for a www.fujitaka.com/pub/peltier/english/thermoelectric_power.html
typical Peltier cell (with an ESR of 2Ω) over a 20°C range FerroTec
of temperature differential. www.ferrotec.com/products/thermal/modules
Laird Technologies
www.lairdtech.com
TEG Load Matching
Marlow Industries
The LTC3108-1 was designed to present a minimum input www.marlow.com
resistance (load) in the range of 2Ω to 10Ω, depending Micropelt
www.micropelt.com
on input voltage and transformer turns ratio (as shown Nextreme
in the Typical Performance Characteristics curves). For www.nextreme.com
a given turns ratio, as the input voltage drops, the input TE Technology
www.tetech.com/Peltier-Thermoelectric-Cooler-Modules.html
resistance increases. This feature allows the LTC3108-1
Tellurex
to optimize power transfer from sources with a few ohms www.tellurex.com
of source resistance, such as a typical TEG. Note that a Kryotherm
lower source resistance will always provide more output www.kryothermusa.com

Table 4. Recommended TEG Part Numbers by Size

MANUFACTURER 15mm × 15mm 20mm × 20mm 30mm × 30mm 40mm × 40mm
CUI Inc. (Distributor) CP60133 CP60233 CP60333 CP85438
Ferrotec 9501/031/030 B 9501/071/040 B 9500/097/090 B 9500/127/100 B
Fujitaka FPH13106NC FPH17106NC FPH17108AC FPH112708AC
Kryotherm TGM-127-1.0-0.8 LCB-127-1.4-1.15
Laird Technology PT6.7.F2.3030.W6 PT8.12.F2.4040.TA.W6
Marlow Industries RC3-8-01 RC6-6-01 RC12-8-01LS
Tellurex C2-15-0405 C2-20-0409 C2-30-1505 C2-40-1509
TE Technology TE-31-1.0-1.3 TE-31-1.4-1.15 TE-71-1.4-1.15 TE-127-1.4-1.05

31081fb

For more information www.linear.com/LTC3108-1 13

LTC3108-1
Applications Information
Thermopile Generator these applications the C2 and SW pins are not used and
can be grounded or left open.
Thermopile generators (also called powerpile generators)
are made up of a number of series-connected thermo- Examples of such input sources would be piezoelectric
couples enclosed in a metal tube. They are commonly transducers, vibration energy harvesters, low current
used in gas burner applications to generate a DC output generators, a stack of low current solar cells or a 60Hz
of hundreds of millivolts when exposed to the high tem- AC input.
perature of a flame. Typical examples are the Honeywell A series resistance of at least 100Ω/V should be used
CQ200 and Q313. These devices have an internal series to limit the maximum current into the VAUX shunt
resistance of less than 3Ω, and can generate as much as regulator.
750mV open-circuit at their highest rated temperature. For
applications in which the temperature rise is too high for
a solid-state thermoelectric device, a thermopile can be COMPONENT SELECTION
used as an energy source to power the LTC3108-1. Because
Step-Up Transformer
of the higher output voltages possible with a thermopile
generator, a lower transformer turns ratio can be used The step-up transformer turns ratio will determine how
(typically 1:20, depending on the application). low the input voltage can be for the converter to start.
Using a 1:100 ratio can yield start-up voltages as low as
Photovoltaic Cell 20mV. Other factors that affect performance are the DC
The LTC3108-1 converter can also operate from a single resistance of the transformer windings and the inductance
photovoltaic cell (also known as a PV or solar cell) at light of the windings. Higher DC resistance will result in lower
levels too low for other low input voltage boost convert- efficiency. The secondary winding inductance will deter-
ers to operate. However, many variables will affect the mine the resonant frequency of the oscillator, according
performance in these applications. Light levels can vary to the following formula.
over several orders of magnitude and depend on light- 1
Frequency = Hz
ing conditions (the type of lighting and indoor versus 2 • π • L(sec)• C

outdoor). Different types of light (sunlight, incandescent,
fluorescent) also have different color spectra, and will Where L is the inductance of the transformer secondary
produce different output power levels depending on which winding and C is the load capacitance on the secondary
type of photovoltaic cell is being used (monocrystalline, winding. This is comprised of the input capacitance at pin
polycrystalline or thin-film). Therefore, the photovoltaic C2, typically 30pF, in parallel with the transformer secondary
cell must be chosen for the type and amount of light avail- winding’s shunt capacitance. The recommended resonant
able. Note that the short-circuit output current from the frequency is in the range of 10kHz to 100kHz. See Table 5
cell must be at least a few milliamps in order to power the for some recommended transformers.
LTC3108-1 converter Table 5. Recommended Transformers
VENDOR PART NUMBER
Non-Boost Applications
Coilcraft LPR6235-752SML (1:100 Ratio)
The LTC3108-1 can also be used as an energy harvester www.coilcraft.com LPR6235-253PML (1:20 Ratio)
LPR6235-123QML (1:50 Ratio)
and power manager for input sources that do not require
boosting. In these applications the step-up transformer Würth 74488540070 (1:100 Ratio)
www.we-online 74488540120 (1:50 Ratio)
can be eliminated. 74488540250 (1:20 Ratio)
Any source whose peak voltage exceeds 2.5V AC or 5V
DC can be connected to the C1 input through a current-
limiting resistor where it will be rectified/peak detected. In
31081fb

14 For more information www.linear.com/LTC3108-1

 LTC3108-1
Applications Information
C1 Capacitor Using External Charge Pump Rectifiers
The charge pump capacitor that is connected from the The synchronous charge pump rectifiers in the LTC3108-1
transformer’s secondary winding to the C1 pin has an ef- (connected to the C1 pin) are optimized for operation from
fect on converter input resistance and maximum output very low input voltage sources, using typical transformer
current capability. Generally, a minimum value of 1nF is step-up ratios between 1:100 and 1:50, and typical C1
recommended when operating from very low input volt- charge pump capacitor values less than 10nF.
ages using a transformer with a ratio of 1:100. Too large
Operation from higher input voltage sources (typically
a capacitor value can compromise performance when
250mV or greater, under load), allows the use of lower
operating at low input voltage or with high resistance
transformer step-up ratios (such as 1:20 and 1:10) and
sources. For higher input voltages and lower turns ratios,
larger C1 capacitor values to provide higher output cur-
the value of the C1 capacitor can be increased for higher
rent capability from the LTC3108. However, due to the
output current capability. Refer to the Typical Applications
resulting increase in rectifier currents and resonant oscil-
schematic examples for the recommended value for a lator frequency in these applications, the use of external
given turns ratio. charge pump rectifiers is recommended for optimal
performance.
Squegging
In applications where the step-up ratio is 1:20 or less, and
Certain types of oscillators, including transformer-coupled
the C1 capacitor is 10nF or greater, the C1 pin should be
oscillators such as the resonant oscillator of the LTC3108-1,
grounded and two external rectifiers (such as 1N4148 or
can exhibit a phenomenon called squegging. This term
1N914 diodes) should be used. These are available as
refers to a condition that can occur which blocks or stops
dual diodes in a single package. Avoid the use of Schottky
the oscillation for a period of time much longer than the
rectifiers, as their lower forward-voltage drop increases
period of oscillation, resulting in bursts of oscillation. An
the minimum startup voltage. See the Typical Applications
example of this is the blocking oscillator, which is designed
schematics for an example.
to squegg to produce bursts of oscillation. Squegging
is also encountered in RF oscillators and regenerative VOUT and VSTORE Capacitor
receivers.
For pulsed load applications, the VOUT capacitor should
In the case of the LTC3108-1, squegging can occur when
be sized to provide the necessary current when the load
a charge builds up on the C2 gate coupling capacitor, such
is pulsed on. The capacitor value required will be dictated
that the DC bias point shifts and oscillation is extinguished
by the load current, the duration of the load pulse, and
for a certain period of time, until the charge on the capacitor
the amount of voltage droop the circuit can tolerate. The
bleeds off, allowing oscillation to resume. It is difficult to
capacitor must be rated for whatever voltage has been
predict when and if squegging will occur in a given ap-
selected for VOUT by VS1 and VS2.
plication. While squegging is not harmful, it reduces the
average output current capability of the LTC3108-1. ILOAD (mA) • tPULSE (ms)
COUT (µF) ≥
Squegging can easily be avoided by the addition of a ∆VOUT (V)
bleeder resistor in parallel with the coupling capacitor on
Note that there must be enough energy available from
the C2 pin. Resistor values in the range of 100k to 1MΩ
the input voltage source for VOUT to recharge the capacitor
are sufficient to eliminate squegging without having any
during the interval between load pulses (to be discussed
negative impact on performance. For the 330pF capacitor
in the next example). Reducing the duty cycle of the load
used for C2 in most applications, a 499k bleeder resistor
pulse will allow operation with less input energy.
is recommended. See the Typical Applications schematics
for an example. The VSTORE capacitor may be of very large value (thou-
sands of microfarads or even Farads), to provide holdup
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For more information www.linear.com/LTC3108-1 15

LTC3108-1
Applications Information
at times when the input power may be lost. Note that this PCB Layout Guidelines
capacitor can charge all the way to 5.25V (regardless of Due to the rather low switching frequency of the resonant
the settings for VOUT), so ensure that the holdup capacitor converter and the low power levels involved, PCB layout
has a working voltage rating of at least 5.5V at the tem- is not as critical as with many other DC/DC converters.
perature for which it will be used. The VSTORE capacitor There are, however, a number of things to consider.
can be sized using the following:
Due to the very low input voltage the circuit may operate
CSTORE ≥
[6µA +IQ +ILDO +(IBURST • t • f)] • TSTORE from, the connections to VIN, the primary of the transformer
5.25 − VOUT and the SW and GND pins of the LTC3108-1 should be
designed to minimize voltage drop from stray resistance
Where 6µA is the quiescent current of the LTC3108-1, IQ and able to carry currents as high as 500mA. Any small
is the load on VOUT in between bursts, ILDO is the load on voltage drop in the primary winding conduction path will
the LDO between bursts, IBURST is the total load during lower efficiency and increase capacitor charge time.
the burst, t is the duration of the burst, f is the frequency
of the bursts, TSTORE is the storage time required and Also, due to the low charge currents available at the outputs
VOUT is the output voltage required. of the LTC3108-1, any sources of leakage current on the
output voltage pins must be minimized. An example board
To minimize losses and capacitor charge time, all capaci-
layout is shown in Figure 3.
tors used for VOUT and VSTORE should be low leakage.
VIN
See Table 6 for recommended storage capacitors.
Table 6. Recommended Storage Capacitors
VENDOR PART NUMBER/SERIES
AVX BestCap Series
www.avx.com TAJ and TPS Series Tantalum
Cap-XX GZ Series
www.cap-xx.com
VAUX SW
Cooper/Bussmann KR Series 1 12
VSTORE C2
www.bussmann.com/3/PowerStor.html P Series 2 11
VOUT VOUT C1
Vishay/Sprague Tantamount 592D 3 10
VOUT2 VOUT2_EN
www.vishay.com/capacitors 595D Tantalum VOUT2 4 9
VLDO VS1
150CRZ/153CRV Aluminum 5 8
VLDO PGD VS2
013 RLC (Low Leakage) PGOOD 6 7

Storage capacitors requiring voltage balancing are not

recommended due to the current draw of the balancing GND
VIAS TO GROUND PLANE
resistors. 31081 FO3

Figure 3. Example Component Placement for

Two-Layer PC Board (DFN Package)

31081fb

16 For more information www.linear.com/LTC3108-1


Applications Information
Design Example 1
This design example will explain how to calculate the
necessary storage capacitor value for VOUT in pulsed
load applications, such as a wireless sensor/transmit-
ter. In these types of applications, the load is very small
for a majority of the time (while the circuitry is in a low
power sleep state), with bursts of load current occur-
ring periodically during a transmit burst. The storage
capacitor on VOUT supports the load during the transmit
burst, and the long sleep time between bursts allows
the LTC3108-1 to recharge the capacitor. A method for
calculating the maximum rate at which the load pulses
can occur for a given output current from the LTC3108-1
will also be shown.
In this example, VOUT is set to 3V, and the maximum al-
lowed voltage droop during a transmit burst is 10%, or
0.3V. The duration of a transmit burst is 1ms, with a total
average current requirement of 40mA during the burst.
Given these factors, the minimum required capacitance
on VOUT is:
40mA • 1ms
COUT (µF) ≥ = 133µF
0.3V
Note that this equation neglects the effect of capacitor
ESR on output voltage droop. For most ceramic or low
ESR tantalum capacitors, the ESR will have a negligible
effect at these load currents.
A standard value of 150µF or larger could be used for COUT
in this case. Note that the load current is the total current
draw on VOUT, VOUT2 and VLDO, since the current for all of
these outputs must come from VOUT during a burst. Current
contribution from the holdup capacitor on VSTORE is not
considered, since it may not be able to recharge between
bursts. Also, it is assumed that the charge current from
the LTC3108-1 is negligible compared to the magnitude
of the load current during the burst.
To calculate the maximum rate at which load bursts can
occur, determine how much charge current is available
from the LTC3108-1 VOUT pin given the input voltage
source being used. This number is best found empirically,
For more information www.linear.com/LTC3108-1
LTC3108-1
since there are many factors affecting the efficiency of
the converter. Also determine what the total load cur-
rent is on VOUT during the sleep state (between bursts).
Note that this must include any losses, such as storage
capacitor leakage.
Assume, for instance, that the charge current from the
LTC3108-1 is 50µA and the total current drawn on VOUT
in the sleep state is 17µA, including capacitor leakage. In
addition, use the value of 150µF for the VOUT capacitor.
The maximum transmit rate (neglecting the duration of
the transmit burst, which is typically very short) is then
given by:
150µF • 0.3V
t= = 1.36sec or fMAX = 0.73Hz
(50µA − 17µA)
Therefore, in this application example, the circuit can sup-
port a 1ms transmit burst every 1.3 seconds.
It can be determined that for systems that only need to
transmit every few seconds (or minutes or hours), the
average charge current required is extremely small, as
long as the sleep current is low. Even if the available
charge current in the example above was only 10µA and
the sleep current was only 5µA, it could still transmit a
burst every 9 seconds.
The following formula enables the user to calculate the
time it will take to charge the LDO output capacitor and
the VOUT capacitor the first time, from 0V. Here again, the
charge current available from the LTC3108-1 must be
known. For this calculation, it is assumed that the LDO
output capacitor is 2.2µF.
2.2V • 2.2µF
tLDO =
ICHG −ILDO
If there were 50µA of charge current available and a 5µA
load on the LDO (when the processor is sleeping), the time
for the LDO to reach regulation would be 107ms.
If VOUT were programmed to 3V and the VOUT capacitor
was 150µF, the time for VOUT to reach regulation would be:
3V • 150µF
t VOUT = + tLDO
ICHG −IVOUT −ILDO
31081fb
17
LTC3108-1
Applications Information
If there were 50µA of charge current available and 5µA of
load on VOUT, the time for VOUT to reach regulation after
the initial application of power would be 11.35 seconds.
In this example, IQ = 5µA, IBURST = 100mA, t = 5ms and
T = one hour. The average charge current required from
the LTC3108-1 would be:

Design Example 2 100mA • 0.005sec

In many pulsed load applications, the duration, magnitude
and frequency of the load current bursts are known and
fixed. In these cases, the average charge current required
from the LTC3108-1 to support the average load must be
calculated, which can be easily done by the following:
IBURST • t
ICHG ≥ IQ +
T power required by this application is only 15.4µW (not
Where IQ is the sleep current on VOUT required by the ex-
ternal circuitry in between bursts (including cap leakage),
IBURST is the total load current during the burst, t is the
duration of the burst and T is the period of the transmit
burst rate (essentially the time between bursts).
ICHG ≥ 5µA + = 5.14µA
3600sec
Therefore, if the LTC3108-1 has an input voltage that al-
lows it to supply a charge current greater than 5.14µA, the
application can support 100mA bursts lasting 5ms every
hour. It can be determined that the sleep current of 5µA is
the dominant factor because the transmit duty cycle is so
small (0.00014%). Note that for a VOUT of 3V, the average
including converter losses).
Note that the charge current available from the LTC3108‑1
has no effect on the sizing of the VOUT capacitor (if it is
assumed that the load current during a burst is much larger
than the charge current), and the VOUT capacitor has no
effect on the maximum allowed burst rate.

Typical Applications
Peltier-Powered Energy Harvester for Remote Sensor Applications

COOPER BUSSMAN PB-5ROH104-R

1:100 1nF 5.25V OR KR-5R5H104-R
VSTORE
T1 + CSTORE
C1 0.1F
+ 3V
THERMOELECTRIC
+ 6.3V VOUT2
CIN 330pF VOUT2
GENERATOR
PGOOD
C2 PGD SENSORS
LTC3108-1 2.2V µP
∆T = 1°C TO 20°C 499k VLDO
2.2µF XMTR
3V
SW VOUT
+
VS2 COUT*

VS1 VOUT2_EN
VAUX GND
OFF ON
T1: COILCRAFT LPR6235-752SML
*COUT VALUE DEPENDENT ON
THE MAGNITUDE AND DURATION 1µF
OF THE LOAD PULSE 31081 TA02

31081fb

18 For more information www.linear.com/LTC3108-1

 LTC3108-1
Typical Applications
Supercapacitor Charger and LDO Powered by a Solar Cell
(Uses External Charge Pump Rectifiers)

0.022µF BAS31 IVOUT vs Illuminance

VAUX (2" Diameter Monocrystalline Cell)
10,000

T1 INCANDESCENT LIGHT
1:20
C1 VSTORE

SOLAR
+ + 1000
220µF VOUT2

IVOUT (µA)
CELL* 330pF OUTDOOR
– LTC3108-1 LIGHT (CLOUDY)
C2 PGD
2.2V
VLDO VLDO
499k 100
3.0V
VOUT VOUT
+
SW 4F* 2.2µF
FLOURESCENT LIGHT
VS2
* 2" DIAMETER MONOCRYSTALLINE CELL
VS1 VOUT2_EN 10
LIGHT LEVEL ≥ 900 LUX
VAUX GND 100 1000 10,000 10,0000
T1: COILCRAFT LPR6235-253PML ILLUMINANCE (LUX)
*TAIYO YUDEN 31081 TA03b
VAUX
PAS1020LA3R0405
4.7µF
31081 TA03

Dual Output Converter and LDO Powered by a Thermopile Generator

HONEYWELL T1 4.7nF
Q313 1:50
THERMOPILE C1 VSTORE
+
220µF VOUT2
330pF
LTC3108-1
C2 PGD PGOOD

499k
2.2V
VLDO VLDO
4.5V
SW VOUT VOUT
VS2
+ 150µF 2.2µF
T1: COILCRAFT LPR6235-123QML VS1 VOUT2_EN 6.3V
VAUX GND

2.2µF

31081 TA04

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LTC3108-1
Typical Applications
DC Input Energy Harvester and Power Manager

RIN
RIN > 100Ω/ V 5.25V
C1 VSTORE
+
+ VIN CSTORE
– VIN > 5V
VOUT2 VOUT2

C2 PGD PGOOD
LTC3108-1 2.2V
SW VLDO VLDO
3V 2.2µF
VS2 VOUT VOUT
+
COUT

VS1 VOUT2_EN VOUT2_ENABLE

VAUX GND

31081 TA05
2.2µF

AC Input Energy Harvester and Power Manager

RIN CIN
RIN > 100Ω/ V 5.25V
C1 VSTORE
+
CSTORE
AC VIN VOUT2 VOUT2
VIN > 5VP-P
- PIEZO PGD PGOOD
- 60Hz LTC3108-1 2.2V
C2 VLDO VLDO
4.5V 2.2µF
SW VOUT VOUT
+
COUT
VS2

VS1 VOUT2_EN VOUT2_ENABLE

VAUX GND

31081 TA06
2.2µF

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20 For more information www.linear.com/LTC3108-1

 LTC3108-1
Typical Applications
Low Profile (1.5mm) Step-Up Converter/Harvester Using 1:10 Transformer

VSTORE 3V AT 20mA
VOUT2 VOUT2
T1 499k
VIN 0.1µF 10ms
1:10
150mV TO 600mV
CIN CRES* C1 PGD PGOOD
330pF LTC3108-1
390pF 2.2V
C2 VLDO VLDO
2.2µF
3V
SW VOUT
+
VS2 330µF
×3
0.068µF
AVX TPSX337M004R0100

VS1 VOUT2_EN 2.2V

ENABLE
T1: COILCRAFT LPR4012-202LML VAUX GND OFF ON
BAS31
*CRES LOWERS START-UP VOLTAGE VAUX 10ms
TO 135mV TYPICAL
10µF
OUTPUT CAN SUPPORT A 20mA,
10ms LOAD PULSE EVERY 0.4s
AT VIN = 150mV 31081 TA07

IVOUT vs VIN (Steady State)

6
VOUT ≤ 3V
TYPICAL
5

4
IVOUT (mA)

3 MINIMUM LIMIT

0
150 200 250 300 350 400 450 500 550 600
VIN (mV)
31081 TA07b

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LTC3108-1
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)

4.00 ±0.10 R = 0.115 0.40 ±0.10

(2 SIDES) TYP
7 12
0.70 ±0.05 R = 0.05
TYP

3.30 ±0.05 3.30 ±0.10

3.60 ±0.05 3.00 ±0.10
2.20 ±0.05 1.70 ±0.05 (2 SIDES) 1.70 ±0.10
PIN 1 PIN 1 NOTCH
TOP MARK R = 0.20 OR
PACKAGE (NOTE 6) 0.35 × 45°
OUTLINE CHAMFER
6 1 (UE12/DE12) DFN 0806 REV D

0.25 ±0.05 0.200 REF 0.75 ±0.05 0.25 ±0.05

0.50 BSC 0.50 BSC
2.50 REF 2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE

GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641 Rev B)

.045 ±.005 .189 – .196*

(4.801 – 4.978)
.009
(0.229)
16 15 14 13 12 11 10 9 REF

.254 MIN .150 – .165

.229 – .244 .150 – .157**

(5.817 – 6.198) (3.810 – 3.988)

.0165 ±.0015 .0250 BSC

RECOMMENDED SOLDER PAD LAYOUT
1 2 3 4 5 6 7 8

.015 ±.004
× 45° .0532 – .0688 .004 – .0098
(0.38 ±0.10)
(1.35 – 1.75) (0.102 – 0.249)
.007 – .0098
0° – 8° TYP
(0.178 – 0.249)

.016 – .050 .008 – .012 .0250

(0.406 – 1.270) (0.203 – 0.305) (0.635) GN16 REV B 0212

NOTE: TYP BSC

1. CONTROLLING DIMENSION: INCHES
INCHES *DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
2. DIMENSIONS ARE IN
(MILLIMETERS) SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
3. DRAWING NOT TO SCALE **DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

31081fb

22 For more information www.linear.com/LTC3108-1

 LTC3108-1
Revision History
REV DATE DESCRIPTION PAGE NUMBER
A 06/12 Added vendor information to Table 5 14
B 08/13 Changed Würth transformer part numbers 14

31081fb

23
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
For more
tion that the interconnection of itsinformation www.linear.com/LTC3108-1
circuits as described herein will not infringe on existing patent rights.
LTC3108-1
Typical Application
Dual TEG Energy Harvester Operates from Temperature Differentials of Either Polarity
1nF
1:100
HOT C1
+ 5.25V
VSTORE
THERMOELECTRIC +
TEC 330pF CSTORE
GENERATOR
VOUT2 VOUT2
COLD C2
LTC3108-1
PGD PGOOD
499k 2.2V
SW VLDO VLDO
3V
VS2 VOUT VOUT
LPR6235-752SML VS1 VOUT2_EN + 2.2µF
COUT
VAUX GND
OFF ON
1µF

VAUX
1nF
1:100
COLD C1 VSTORE
+
THERMOELECTRIC VOUT2
TEC 330pF
GENERATOR
LTC3108-1
HOT C2 PGD
VLDO
499k
SW
VS2 VOUT
LPR6235-752SML VS1 VOUT2_EN
VAUX GND

31081 TA08

THERMOELECTRIC
GENERATOR

Related Parts
PART NUMBER DESCRIPTION COMMENTS
LTC3108 Ultralow Voltage Step-Up Converter and Power Manager VIN: 0.02V to 1V; VOUT = 2.35V, 3.3V, 4.1V, 5V Fixed; IQ = 6µA; ISD <1µA;
3mm × 4mm DFN-12 and SSOP-16 Packages
LTC4070 Li-Ion/Polymer Low Current Shunt Battery VIN: 450nA to 50mA; VOUT(MIN): VFLOAT + 4V, 4.1V, 4.2V; IQ = 300nA;
Charger System 2mm × 3mm DFN-8 and MSOP-8 Packages
LTC1041 Bang-Bang Controller VIN: 2.8V to 16V; VOUT(MIN) = Adj; IQ = 1.2mA; ISD < 1µA; SO-8 Package
LTC1389 Nanopower Precision Shunt Voltage Reference VOUT(MIN) = 1.25V; IQ = 0.8µA; SO-8 Package
LT1672/LT1673/ Single-/Dual-/Quad-Precision 2µA Rail-to-Rail Op Amps SO-8, SO-14 and MSOP-8 Packages
LT1674
LT3009 3µA IQ, 20mA Linear Regulator VIN: 1.6V to 20V; VOUT(MIN): 0.6V to Adj, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V,
5V to Fixed; IQ = 3µA; ISD < 1µA; 2mm × 2mm DFN-8 and SC70 Packages
LTC3525L-3/ 400mA (ISW), Synchronous Step-Up DC/DC Converter VIN: 0.7V to 4V; VOUT(MIN) = 5VMAX; IQ = 7µA; ISD < 1µA; SC70 Package
LTC3525L-3.3/ with Output Disconnect
LTC3525L-5
LTC3588-1 Piezoelectric Energy Generator with Integrated High VIN: 2.7V to 20V; VOUT(MIN): Fixed to 1.8V, 2.5V, 3.3V, 3.6V; IQ = 0.95µA;
Efficiency Buck Converter 3mm × 3mm DFN-10 and MSOP-10E Packages
LTC3632 45V, 20mA Synchronous MicroPower Buck Converter VIN: 4.5V to 45V, 60VMAX; VOUT(MIN): 0.8V to Adj, 3.3V Fixed, 5V Fixed;
IQ = 12µA; ISD < 1µA; 3mm × 3mm DFN-8 and MSOP-8E Packages
LTC3642 45V, 50mA Synchronous MicroPower Buck Converter VIN: 4.5V to 45V, 60VMAX; VOUT(MIN): 0.8V to Adj, 3.3V Fixed, 5V Fixed;
IQ = 12µA; ISD < 1µA; 3mm × 3mm DFN-8 and MSOP-8E Packages
LT8410/ LT8410-1 MicroPower 25mA/8mA Low Noise Boost Converter VIN: 2.6V to 16V; VOUT(MIN) = 40VMAX; IQ = 8.5µA; ISD < 1µA;
with Integrated Schottky Diode and Output Disconnect 2mm × 2mm DFN-8 Package
31081fb

24 Linear Technology Corporation

LT 0813 REV B • PRINTED IN USA

1630 McCarthy Blvd., Milpitas, CA 95035-7417

For more information www.linear.com/LTC3108-1
(408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com/LTC3108-1  LINEAR TECHNOLOGY CORPORATION 2010