Topswitch GX: - Family

®
TOP242-250 ®
TOPSwitch -GX Family
Extended Power, Design Flexible,
®
EcoSmart, Integrated Off-line Switcher
Product Highlights
+
Lower System Cost, High Design Flexibility AC DC
• Extended power range to 290 W IN OUT
-
• Features eliminate or reduce cost of external components
• Fully integrated soft-start for minimum stress/overshoot
• Externally programmable accurate current limit
D L
• Wider duty cycle for more power, smaller input capacitor
CONTROL
• Separate line sense and current limit pins on Y/R/F packages TOPSwitch-GX C
• Line under-voltage (UV) detection: no turn off glitches
• Line overvoltage (OV) shutdown extends line surge limit S X F
• Line feed forward with maximum duty cycle (DCMAX)
reduction rejects line ripple and limits DCMAX at high line PI-2632-060200
• Frequency jittering reduces EMI and EMI filtering costs
• Regulates to zero load without dummy loading Figure 1. Typical Flyback Application.
• 132 kHz frequency reduces transformer/power supply size
• Half frequency option in Y/R/F packages for video applications OUTPUT POWER TABLE
• Hysteretic thermal shutdown for automatic fault recovery
• Large thermal hysteresis prevents PC board overheating 230 VAC ±15%4 85-265 VAC
3
PRODUCT Open Open
Adapter1 Adapter1
Frame2 Frame2
EcoSmart - Energy Efficient
• Extremely low consumption in remote off mode TOP242 P or G 9 W 15 W 6.5 W 10 W
(80 mW @ 110 VAC, 160 mW @ 230 VAC) TOP242 R 21 W 22 W 11 W 14 W
• Frequency lowered with load for high standby efficiency TOP242 Y or F 10 W 22 W 7W 14 W
• Allows shutdown/wake-up via LAN/input port TOP243 P or G 13 W 25 W 9W 15 W
TOP243 R 29 W 45 W 17 W 23 W
Description TOP243 Y or F 20 W 45 W 15 W 30 W
TOPSwitch-GX uses the same proven topology as TOPSwitch, TOP244 P or G 16 W 30 W 11 W 20 W
cost effectively integrating the high voltage power MOSFET, TOP244 R 34 W 50 W 20 W 28 W
PWM control, fault protection and other control circuitry onto a TOP244 Y or F 30 W 65 W 20 W 45 W
single CMOS chip. Many new functions are integrated to re- TOP245 R 37 W 57 W 23 W 33 W
duce system cost and improve design flexibility, performance TOP245 Y or F 40 W 85 W 26 W 60 W
and energy efficiency.
TOP246 R 40 W 64 W 26 W 38 W
Depending on package type, the TOPSwitch-GX family has TOP246 Y or F 60 W 125 W 40 W 90 W
either 1 or 3 additional pins over the standard DRAIN, SOURCE TOP247 R 42 W 70 W 28 W 43 W
and CONTROL terminals allowing the following functions: line TOP247 Y or F 85 W 165 W 55 W 125 W
sensing (OV/UV, line feedforward/DC max reduction), accu- TOP248 R 43 W 75 W 30 W 48 W
rate externally set current limit, remote on/off, and synchroni- TOP248 Y or F 105 W 205 W 70 W 155 W
zation to an external lower frequency and frequency selection
TOP249 R 44 W 79 W 31 W 53 W
(132 kHz/66 kHz).
TOP249 Y or F 120 W 250 W 80 W 180 W
All package types provide the following transparent features: TOP250 R 45 W 82 W 32 W 55 W
Soft-start, 132 kHz switching frequency (automatically reduced TOP250 Y or F 135 W 290 W 90 W 210 W
at light load), frequency jittering for lower EMI, wider DCMAX,
Table 1. Notes: 1. Typical continuous power in a non-ventilated
hysteretic thermal shutdown and larger creepage packages. In enclosed adapter measured at 50 °C ambient. 2. Maximum practical
addition, all critical parameters (i.e. current limit, frequency, continuous power in an open frame design at 50 °C ambient. See
PWM gain) have tighter temperature and absolute tolerance, to Key Applications for detailed conditions. 3. See Part Ordering
simplify design and optimize system cost. Information. 4. 230 VAC or 100/115 VAC with doubler.
April 2003
TOP242-250
Section List
Functional Block Diagram ......................................................................................................................................... 3
Pin Functional Description ........................................................................................................................................ 4
TOPSwitch-GX Family Functional Description ........................................................................................................ 5
CONTROL (C) Pin Operation ................................................................................................................................. 6
Oscillator and Switching Frequency ....................................................................................................................... 6
Pulse Width Modulator and Maximum Duty Cycle ................................................................................................. 7
Light Load Frequency Reduction ............................................................................................................................ 7
Error Amplifier ......................................................................................................................................................... 7
On-chip Current Limit with External Programmability ............................................................................................. 7
Line Under-Voltage Detection (UV) ........................................................................................................................ 8
Line Overvoltage Shutdown (OV) ........................................................................................................................... 8
Line Feed Forward with DCMAX Reduction .............................................................................................................. 8
General Information & Table of Contents
Remote ON/OFF and Synchronization ................................................................................................................... 9
Soft-Start ................................................................................................................................................................ 9
Shutdown/Auto-Restart .......................................................................................................................................... 9
Product Selector Guide
Hysteretic Over-Temperature Protection ................................................................................................................ 9
Bandgap Reference ................................................................................................................................................ 9
1
High-Voltage Bias Current Source ........................................................................................................................ 10
Data Sheets
Using Feature Pins .................................................................................................................................................... 11 2
FREQUENCY (F) Pin Operation ........................................................................................................................... 11
LINE-SENSE (L) Pin Operation ............................................................................................................................ 11
Application Notes
EXTERNAL CURRENT LIMIT (X) Pin Operation ................................................................................................. 11 3
MULTI-FUNCTION (M) Pin Operation .................................................................................................................. 12
Typical Uses of FREQUENCY (F) Pin ...................................................................................................................... 15
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins ....................................................... 16
Design Ideas 4
Typical Uses of MULTI-FUNCTION (M) Pin ............................................................................................................. 19
Design Tools
Application Examples ............................................................................................................................................... 21 5
A High Efficiency, 30 W, Universal Input Power Supply ........................................................................................ 21
A High Efficiency, Enclosed, 70 W, Universal Adapter Supply .............................................................................. 22
Quality and Reliability
A High Efficiency, 250 W, 250 - 380 VDC Input Power Supply ............................................................................. 23 6
Multiple Output, 60 W, 185 - 265 VAC Input Power Supply .................................................................................. 24
Processor Controlled Supply Turn On/Off ............................................................................................................ 25
Package Information
Key Application Considerations .............................................................................................................................. 27
7
TOPSwitch-II vs. TOPSwitch-GX .......................................................................................................................... 27
DPA-Switch DC-DC Seminar
TOPSwitch-FX vs. TOPSwitch-GX ....................................................................................................................... 28
TOPSwitch-GX Design Considerations ................................................................................................................ 29
8
TOPSwitch-GX Layout Considerations ................................................................................................................. 31
LinkSwitch & TinySwitch-II AC-DC Seminar
Quick Design Checklist ......................................................................................................................................... 31
Design Tools ......................................................................................................................................................... 33
9
Product Specifications and Test Conditions .......................................................................................................... 34
TOPSwitch-GX AC-DC Seminar 10
Typical Performance Characteristics ...................................................................................................................... 41
Part Ordering Information ........................................................................................................................................ 45
Sales Representatives and Distributors 11
Package Outlines ...................................................................................................................................................... 45
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2 4/03
TOP242-250
VC
0
CONTROL (C) DRAIN (D)
ZC INTERNAL
1 SUPPLY
SHUNT REGULATOR/
ERROR AMPLIFIER +
SOFT START
- 5.8 V
4.8 V -
+ 5.8 V
INTERNAL UV
IFB COMPARATOR
VI (LIMIT)
CURRENT
LIMIT SOFT
ADJUST START -
ON/OFF ÷8
+
VBG + VT SHUTDOWN/
AUTO-RESTART CURRENT LIMIT
COMPARATOR
EXTERNAL
CURRENT LIMIT (X) HYSTERETIC
STOP LOGIC THERMAL
SHUTDOWN
LINE-SENSE (L) 1V
CONTROLLED
VBG TURN-ON
STOP SOFT- GATE DRIVER
OV/UV START
LINE DMAX
SENSE DCMAX DCMAX
CLOCK
S Q
HALF SAW - LEADING
FREQ. EDGE
R
FREQUENCY (F) + BLANKING
OSCILLATOR WITH JITTER
PWM
COMPARATOR
LIGHT LOAD
FREQUENCY
RE
REDUCTION
SOURCE (S)
PI-2639-060600
PI-2639-060600
Figure 2a. Functional Block Diagram (Y, R or F Package).
VC
0
CONTROL (C) DRAIN (D)
ZC INTERNAL
1 SUPPLY
SHUNT REGULATOR/
ERROR AMPLIFIER +
SOFT START
- 5.8 V
4.8 V -
+ 5.8 V
INTERNAL UV
IFB COMPARATOR
VI (LIMIT)
CURRENT
LIMIT SOFT
START -
ADJUST
ON/OFF ÷8
+
SHUTDOWN/
AUTO-RESTART CURRENT LIMIT
VBG + VT COMPARATOR
STOP LOGIC HYSTERETIC

MULTI-
FUNCTION (M) THERMAL
SHUTDOWN
VBG CONTROLLED
TURN-ON
STOP SOFT- GATE DRIVER
OV/UV START
LINE DMAX
SENSE DCMAX DCMAX
CLOCK
S Q
SAW - LEADING
R EDGE
+ BLANKING
OSCILLATOR WITH JITTER
PWM
COMPARATOR
LIGHT LOAD
FREQUENCY
RE
REDUCTION
SOURCE (S)
PI-2631-061200
PI-2641-061200
Figure 2b. Functional Block Diagram (P or G Package).
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4/03 3
TOP242-250
Pin Functional Description FREQUENCY (F) Pin: (Y, R or F package only)

Input pin for selecting switching frequency: 132 kHz if
connected to SOURCE pin and 66 kHz if connected to
DRAIN (D) Pin:
CONTROL pin. The switching frequency is internally set for
High voltage power MOSFET drain output. The internal
fixed 132 kHz operation in P and G packages.
start-up bias current is drawn from this pin through a switched
high-voltage current source. Internal current limit sense point
SOURCE (S) Pin:
for drain current.
Output MOSFET source connection for high voltage power
return. Primary side control circuit common and reference point.
CONTROL (C) Pin:
Error amplifier and feedback current input pin for duty cycle
VUV = IUV x RLS
control. Internal shunt regulator connection to provide inter- +
VOV = IOV x RLS
nal bias current during normal operation. It is also used as the
For RLS = 2 MΩ
connection point for the supply bypass and auto-restart/ RLS 2 MΩ
VUV = 100 VDC
compensation capacitor. VOV = 450 VDC
DC DCMAX@100 VDC = 78%
D L
LINE-SENSE (L) Pin: (Y, R or F package only) Input
Input pin for OV, UV, line feed forward with DCMAX reduction, Voltage CONTROL
C
DCMAX@375 VDC = 38%
remote ON/OFF and synchronization. A connection to For RIL = 12 kΩ

SOURCE pin disables all functions on this pin. ILIMIT = 69%
Product Selector
S
Guide
X
See fig. 55
RIL
for other 1
EXTERNAL CURRENT LIMIT (X) Pin: (Y, R or F 12 kΩ resistor values (RIL)
- to select different ILIMIT
package only)
Input pin for external current limit adjustment, remote Data Sheets
values PI-2629-040501
2
ON/OFF, and synchronization. A connection to SOURCE pin Figure 4. Y/R/F Package Line Sense and Externally Set Current
disables all functions on this pin. Limit.
Application Notes 3
MULTI-FUNCTION (M) Pin: (P or G package only) +
This pin combines the functions of the LINE-SENSE (L) and V =I xR
EXTERNAL CURRENT LIMIT (X) pins of the Y package Design
V = I xIdeas
UV
R
OV
UV
OV
LS
LS 4
into one pin. Input pin for OV, UV, line feed forward with RLS 2 MΩ For RLS = 2 MΩ
DCMAX reduction, external current limit adjustment, remote VUV = 100 VDC
ON/OFF and synchronization. A connection to SOURCE pin
DC
Input
Design Tools
VOV = 450 VDC 5
disables all functions on this pin and makes TOPSwitch-GX Voltage DCMAX@100 VDC = 78%
operate in simple three terminal mode (like TOPSwitch-II). D M DCMAX@375 VDC = 38%
CONTROL
C
6
Y Package (TO-220-7C) - Package Information

S
7
PI-2509-040501
Tab Internally 7D
Connected to Figure 5. P/G Package Line Sense.
SOURCE Pin
5F
4S DPA-Switch DC-DC Seminar 8
3X
2L
1C +
LinkSwitch & TinySwitch-II AC-DCForSeminar
R Package (TO-263-7C)
R = 12 kΩ
I = 69%
IL
LIMIT
9
F Package (TO-262-7C) For RIL = 25 kΩ
P Package (DIP-8B) ILIMIT = 43%
G Package (SMD-8B) TOPSwitch-GX
DC AC-DCSeeSeminar
fig. 55 for other
10
Input
resistor values (RIL)
M 1 8 S Voltage
to select different
S 2 7 S Sales Representatives and Distributors 11 D M
CONTROL
ILIMIT values
RIL C
S 3
C S
4 5 D -
123 4 5 7
CL X S F D PI-2724-010802 PI-2517-040501
Figure 3. Pin Configuration (top view). Figure 6. P/G Package Externally Set Current Limit.
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4 4/03
TOP242-250
TOPSwitch-GX Family Functional Description

Like TOPSwitch, TOPSwitch-GX is an integrated switched Auto-restart
mode power supply chip that converts a current at the control ICD1 IB
input to a duty cycle at the open drain output of a high voltage
IL = 125 µA
power MOSFET. During normal operation the duty cycle of
132
the power MOSFET decreases linearly with increasing
Frequency (kHz)
CONTROL pin current as shown in Figure 7. IL < IL(DC)
IL = 190 µA
In addition to the three terminal TOPSwitch features, such as

the high voltage start-up, the cycle-by-cycle current limiting,
loop compensation circuitry, auto-restart, thermal shutdown, 30
the TOPSwitch-GX incorporates many additional functions that
reduce system cost, increase power supply performance and
design flexibility. A patented high voltage CMOS technology IC (mA)
allows both the high voltage power MOSFET and all the low
voltage control circuitry to be cost effectively integrated onto
a single monolithic chip. Auto-restart
ICD1 IB
Three terminals, FREQUENCY, LINE-SENSE, and EXTER-
NAL CURRENT LIMIT (available in Y, R or F package) or 78
Slope = PWM Gain
one terminal MULTI-FUNCTION (available in P or G
Duty Cycle (%)
Package) have been added to implement some of the new
functions. These terminals can be connected to the SOURCE IL = 125 µA
pin to operate the TOPSwitch-GX in a TOPSwitch-like three 38
terminal mode. However, even in this three terminal mode, the IL < IL(DC)
TOPSwitch-GX offers many new transparent features that do I = 190 µA

L
not require any external components: 10
TOP242-5 1.6 2.0 5.2 6.0

1. A fully integrated 10 ms soft-start limits peak currents and TOP246-9 2.2 2.6 5.8 6.6
voltages during start-up and dramatically reduces or TOP250 2.4 2.7 IC (mA) 6.5 7.3
eliminates output overshoot in most applications. Note: For P and G packages IL is replaced with IM.
2. DCMAX of 78% allows smaller input storage capacitor, lower PI-2633-011502
input voltage requirement and/or higher power capability.
3. Frequency reduction at light loads lowers the switching Figure 7. Relationship of Duty Cycle and Frequency to CONTROL
Pin Current.
losses and maintains good cross regulation in multiple
output supplies. The pin can also be used as a remote ON/OFF and a
4. Higher switching frequency of 132 kHz reduces the synchronization input.
transformer size with no noticeable impact on EMI.
5. Frequency jittering reduces EMI. The EXTERNAL CURRENT LIMIT (X) pin is usually used to
6. Hysteretic over-temperature shutdown ensures automatic reduce the current limit externally to a value close to the operat-
recovery from thermal fault. Large hysteresis prevents circuit ing peak current, by connecting the pin to SOURCE through a
board overheating. resistor. This pin can also be used as a remote ON/OFF and a
7. Packages with omitted pins and lead forming provide large synchronization input in both modes. See Table 2 and Figure 11.
drain creepage distance.
8. Tighter absolute tolerances and smaller temperature vari- For the P or G packages the LINE-SENSE and EXTERNAL
ations on switching frequency, current limit and PWM gain. CURRENT LIMIT pin functions are combined on one MULTI-
FUNCTION (M) pin. However, some of the functions become
The LINE-SENSE (L) pin is usually used for line sensing by mutually exclusive as shown in Table 3.
connecting a resistor from this pin to the rectified DC high
voltage bus to implement line overvoltage (OV), under-voltage The FREQUENCY (F) pin in the Y, R or F package sets the
(UV) and line feed forward with DCMAX reduction. In this switching frequency to the default value of 132 kHz when
mode, the value of the resistor determines the OV/UV thresholds connected to SOURCE pin. A half frequency option of 66 kHz
and the DCMAX is reduced linearly starting from a line voltage can be chosen by connecting this pin to CONTROL pin
above the under-voltage threshold. See Table 2 and Figure 11. instead. Leaving this pin open is not recommended.
I
4/03 5
TOP242-250
CONTROL (C) Pin Operation SOURCE through resistor RE as shown in Figure 2. This
The CONTROL pin is a low impedance node that is capable of current flowing through RE controls the duty cycle of the power
receiving a combined supply and feedback current. During MOSFET to provide closed loop regulation. The shunt
normal operation, a shunt regulator is used to separate the feed- regulator has a finite low output impedance ZC that sets the
back signal from the supply current. CONTROL pin voltage gain of the error amplifier when used in a primary feedback
VC is the supply voltage for the control circuitry including the configuration. The dynamic impedance ZC of the CONTROL
MOSFET gate driver. An external bypass capacitor closely pin together with the external CONTROL pin capacitance sets
connected between the CONTROL and SOURCE pins is the dominant pole for the control loop.
required to supply the instantaneous gate drive current. The
total amount of capacitance connected to this pin also sets the When a fault condition such as an open loop or shorted output
auto-restart timing as well as control loop compensation. prevents the flow of an external current into the CONTROL
pin, the capacitor on the CONTROL pin discharges towards
When rectified DC high voltage is applied to the DRAIN pin 4.8 V. At 4.8 V, auto-restart is activated which turns the output
during start-up, the MOSFET is initially off, and the MOSFET off and puts the control circuitry in a low current
CONTROL pin capacitor is charged through a switched high standby mode. The high-voltage current source turns on and
voltage current source connected internally between the DRAIN charges the external capacitance again. A hysteretic internal
and CONTROL pins. When the CONTROL pin voltage VC General Information & Table of Contents
supply under-voltage comparator keeps VC within a window
reaches approximately 5.8 V, the control circuitry is activated of typically 4.8 V to 5.8 V by turning the high-voltage current
and the soft-start begins. The soft-start circuit gradually source on and off as shown in Figure 8. The auto-restart
increases the duty cycle of the MOSFET from zero to the maxi- Product Selector Guide
circuit has a divide-by-eight counter which prevents the out- 1
mum value over approximately 10 ms. If no external feedback/ put MOSFET from turning on again until eight discharge/charge
supply current is fed into the CONTROL pin by the end of the cycles have elapsed. This is accomplished by enabling the
soft-start, the high voltage current source is turned off and the Data Sheets
output MOSFET only when the divide-by-eight counter reaches 2
CONTROL pin will start discharging in response to the supply full count (S7). The counter effectively limits TOPSwitch-GX
current drawn by the control circuitry. If the power supply is power dissipation by reducing the auto-restart duty cycle to
designed properly, and no fault condition such as open loop or Application Notes
typically 4%. Auto-restart mode continues until output 3
shorted output exists, the feedback loop will close, providing voltage regulation is again achieved through closure of the
external CONTROL pin current, before the CONTROL pin feedback loop.
voltage has had a chance to discharge to the lower threshold Design Ideas 4
voltage of approximately 4.8 V (internal supply under-voltage Oscillator and Switching Frequency
lockout threshold). When the externally fed current charges The internal oscillator linearly charges and discharges an
the CONTROL pin to the shunt regulator voltage of 5.8 V, cur- Design Tools
internal capacitance between two voltage levels to create a 5
rent in excess of the consumption of the chip is shunted to sawtooth waveform for the pulse width modulator. This
Quality and Reliability 6

~
~
~
~
VUV
Package Information 7
~
~
~
~
~
~
VLINE
0V
S7 S0 S1 S2 S6 S7 S0 S1 S2 DPA-Switch DC-DC Seminar

S6 S7 S0 S1 S2 S6 S7 S7 5.8 V 8
~
~
~
~
~
~
VC 4.8 V
0V
~
~
~
~
VDRAIN
LinkSwitch & TinySwitch-II AC-DC Seminar 9
~
~
0V
VOUT
~
~
~
~
~
~
0V
1 2 3 2 4
Note: S0 through S7 are the output states of the auto-restart counter PI-2545-082299
Figure 8. Typical Waveforms for (1) Power Up (2) Normal Operation (3) Auto-restart (4) Power Down.
I
6 4/03
TOP242-250
oscillator sets the pulse width modulator/current limit latch at
PI-2550-092499
the beginning of each cycle. 136 kHz
Switching
Frequency
The nominal switching frequency of 132 kHz was chosen to
128 kHz
minimize transformer size while keeping the fundamental EMI
frequency below 150 kHz. The FREQUENCY pin (available
4 ms
only in Y, R or F package), when shorted to the CONTROL
pin, lowers the switching frequency to 66 kHz (half frequency)
which may be preferable in some cases such as noise sensitive VDRAIN
video applications or a high efficiency standby mode. Other-
wise, the FREQUENCY pin should be connected to the Time
SOURCE pin for the default 132 kHz.
Figure 9. Switching Frequency Jitter (Idealized VDRAIN waveform).
To further reduce the EMI level, the switching frequency is
jittered (frequency modulated) by approximately ±4 kHz at minimum frequency is typically 30 kHz and 15 kHz for
250 Hz (typical) rate as shown in Figure 9. Figure 46 shows 132 kHz and 66 kHz operation, respectively.
the typical improvement of EMI measurements with frequency
jitter. This feature allows a power supply to operate at lower
frequency at light loads thus lowering the switching losses while
Pulse Width Modulator and Maximum Duty Cycle maintaining good cross regulation performance and low
The pulse width modulator implements voltage mode control output ripple.
by driving the output MOSFET with a duty cycle inversely
proportional to the current into the CONTROL pin that is in Error Amplifier
excess of the internal supply current of the chip (see Figure 7). The shunt regulator can also perform the function of an error
The excess current is the feedback error signal that appears amplifier in primary side feedback applications. The shunt
across RE (see Figure 2). This signal is filtered by an RC regulator voltage is accurately derived from a temperature-
network with a typical corner frequency of 7 kHz to reduce the compensated bandgap reference. The gain of the error ampli-
effect of switching noise in the chip supply current generated fier is set by the CONTROL pin dynamic impedance. The
by the MOSFET gate driver. The filtered error signal is CONTROL pin clamps external circuit signals to the VC
compared with the internal oscillator sawtooth waveform to voltage level. The CONTROL pin current in excess of the
generate the duty cycle waveform. As the control current supply current is separated by the shunt regulator and flows
increases, the duty cycle decreases. A clock signal from the through RE as a voltage error signal.
oscillator sets a latch which turns on the output MOSFET. The
pulse width modulator resets the latch, turning off the output On-chip Current Limit with External Programmability
MOSFET. Note that a minimum current must be driven into The cycle-by-cycle peak drain current limit circuit uses the out-
the CONTROL pin before the duty cycle begins to change. put MOSFET ON-resistance as a sense resistor. A current limit
comparator compares the output MOSFET on-state drain to
The maximum duty cycle, DCMAX, is set at a default maximum source voltage, VDS(ON) with a threshold voltage. High drain
value of 78% (typical). However, by connecting the LINE- current causes VDS(ON) to exceed the threshold voltage and turns
SENSE or MULTI-FUNCTION pin (depending on the the output MOSFET off until the start of the next clock cycle.
package) to the rectified DC high voltage bus through a The current limit comparator threshold voltage is temperature
resistor with appropriate value, the maximum duty cycle can compensated to minimize the variation of the current limit due to
be made to decrease from 78% to 38% (typical) as shown in temperature related changes in RDS(ON) of the output MOSFET.
Figure 11 when input line voltage increases (see line feed The default current limit of TOPSwitch-GX is preset internally.
forward with DCMAX reduction). However, with a resistor connected between EXTERNAL
CURRENT LIMIT (X) pin (Y, R or F package) or MULTI-
Light Load Frequency Reduction FUNCTION (M) pin (P or G package) and SOURCE pin,
The pulse width modulator duty cycle reduces as the load at current limit can be programmed externally to a lower level
the power supply output decreases. This reduction in duty cycle between 30% and 100% of the default current limit. Please refer
is proportional to the current flowing into the CONTROL pin. to the graphs in the typical performance characteristics section
As the CONTROL pin current increases, the duty cycle for the selection of the resistor value. By setting current limit
decreases linearly towards a duty cycle of 10%. Below 10% low, a larger TOPSwitch-GX than necessary for the power
duty cycle, to maintain high efficiency at light loads, the required can be used to take advantage of the lower RDS(ON) for
frequency is also reduced linearly until a minimum frequency higher efficiency/smaller heat sinking requirements. With a
is reached at a duty cycle of 0% (refer to Figure 7). The second resistor connected between the EXTERNAL
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4/03 7
TOP242-250
CURRENT LIMIT (X) pin (Y, R or F package) or MULTI- input voltage operating range (UV low threshold). If the UV
FUNCTION (M) pin (P or G package) and the rectified DC low threshold is reached during operation without the power
high voltage bus, the current limit is reduced with increasing supply losing regulation the device will turn off and stay off
line voltage, allowing a true power limiting operation against until UV (high threshold) has been reached again. If the power
line variation to be implemented. When using an RCD clamp, supply loses regulation before reaching the UV low threshold,
this power limiting technique reduces maximum clamp the device will enter auto-restart. At the end of each auto-
voltage at high line. This allows for higher reflected voltage restart cycle (S7), the UV comparator is enabled. If the UV high
designs as well as reducing clamp dissipation. threshold is not exceeded the MOSFET will be disabled during
the next cycle (see Figure 8). The UV feature can be disabled
The leading edge blanking circuit inhibits the current limit independent of OV feature as shown in Figures 19 and 23.
comparator for a short time after the output MOSFET is turned
on. The leading edge blanking time has been set so that, if a Line Overvoltage Shutdown (OV)
power supply is designed properly, current spikes caused by The same resistor used for UV also sets an overvoltage thresh-
primary-side capacitances and secondary-side rectifier reverse old which, once exceeded, will force TOPSwitch-GX output
recovery time should not cause premature termination of the into off-state. The ratio of OV and UV thresholds is preset at
switching pulse. 4.5 as can be seen in Figure 11. When the MOSFET is off, the
The current limit is lower for a short period after the leading
rectified DC high voltage surge capability is increased to the
voltage rating of the MOSFET (700 V), due to the absence of
edge blanking time as shown in Figure 52. This is due to the reflected voltage and leakage spikes on the drain. A small
dynamic characteristics of the MOSFET. To avoid triggering
the current limit in normal operation, the drain current wave-
amount of hysteresis is provided on the OV threshold to
prevent noise triggering. The OV feature can be disabled
1
form should stay within the envelope shown. independent of the UV feature as shown in Figures 18 and 32.
Line Under-Voltage Detection (UV)

Data Sheets
Line Feed Forward with DCMAX Reduction
2
At power up, UV keeps TOPSwitch-GX off until the input line The same resistor used for UV and OV also implements line
voltage reaches the under voltage threshold. At power down,
UV prevents auto-restart attempts after the output goes out of
Application Notes
voltage feed forward which minimizes output line ripple and
reduces power supply output sensitivity to line transients. This
3
regulation. This eliminates power down glitches caused by feed forward operation is illustrated in Figure 7 by the
the slow discharge of large input storage capacitor present in
applications such as standby supplies. A single resistor
Design Ideas
different values of IL (Y, R or F package) or IM (P or G Pack-
age). Note that for the same CONTROL pin current, higher
4
connected from the LINE-SENSE pin (Y, R or F package) or line voltage results in smaller operating duty cycle. As an added
MULTI-FUNCTION pin (P or G package) to the rectified DC
high voltage bus sets UV threshold during power up. Once the
Design Tools
feature, the maximum duty cycle DCMAX is also reduced from
78% (typical) at a voltage slightly higher than the UV thresh-
5
power supply is successfully turned on, the UV threshold is old to 30% (typical) at the OV threshold (see Figures 7 and
lowered to 40% of the initial UV threshold to allow extended Quality and Reliability
11). Limiting DC MAX at higher line voltages helps 6
Oscillator DPA-Switch DC-DC Seminar 8

(SAW)

DMAX

Enable from
X, L or M Pin (STOP)
Sales Representatives and Distributors
Time 11
PI-2637-060600
Figure 10. Synchronization Timing Diagram.
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8 4/03
TOP242-250
prevent transformer saturation due to large load transients in remotely turned on after entering this mode, it will initiate a
forward converter applications. DCMAX of 38% at the OV thresh- normal start-up sequence with soft-start the next time the
old was chosen to ensure that the power capability of the CONTROL pin reaches 5.8 V. In the worst case, the delay from
TOPSwitch-GX is not restricted by this feature under normal remote on to start-up can be equal to the full discharge/charge
operation. cycle time of the CONTROL pin, which is approximately
125 ms for a 47 µF CONTROL pin capacitor. This
Remote ON/OFF and Synchronization reduced consumption remote off mode can eliminate
TOPSwitch-GX can be turned on or off by controlling the current expensive and unreliable in-line mechanical switches. It also
into the LINE-SENSE pin or out from the EXTERNAL allows for microprocessor controlled turn-on and turn-off
CURRENT LIMIT pin (Y, R or F package) and into or out from sequences that may be required in certain applications such as
the MULTI-FUNCTION pin (P or G package) (see Figure 11). inkjet and laser printers.
In addition, the LINE-SENSE pin has a 1 V threshold compara-
tor connected at its input. This voltage threshold can also be used Soft-Start
to perform remote ON/OFF control. This allows easy implemen- Two on-chip soft-start functions are activated at start-up with
tation of remote ON/OFF control of TOPSwitch-GX in several a duration of 10 ms (typical). Maximum duty cycle starts from
different ways. A transistor or an optocoupler output connected 0% and linearly increases to the default maximum of 78% at
between the EXTERNAL CURRENT LIMIT or LINE-SENSE the end of the 10 ms duration and the current limit starts from
pins (Y, R or F package) or the MULTI-FUNCTION pin (P or G about 85% and linearly increases to 100% at the end of the
package) and the SOURCE pin implements this function with 10ms duration. In addition to start-up, soft-start is also
“active-on” (Figures 22, 29 and 36) while a transistor or an activated at each restart attempt during auto-restart and when
optocoupler output connected between the LINE-SENSE pin restarting after being in hysteretic regulation of CONTROL
(Y, R or F package) or the MULTI-FUNCTION (P or G package) pin voltage (VC), due to remote off or thermal shutdown
pin and the CONTROL pin implements the function with conditions. This effectively minimizes current and voltage
“active-off” (Figures 23 and 37). stresses on the output MOSFET, the clamp circuit and the
output rectifier during start-up. This feature also helps
When a signal is received at the LINE-SENSE pin or the minimize output overshoot and prevents saturation of the
EXTERNAL CURRENT LIMIT pin (Y, R or F package) or transformer during start-up.
the MULTI-FUNCTION pin (P or G package) to disable the
output through any of the pin functions such as OV, UV and Shutdown/Auto-Restart
remote ON/OFF, TOPSwitch-GX always completes its current To minimize TOPSwitch-GX power dissipation under fault
switching cycle, as illustrated in Figure 10, before the output is conditions, the shutdown/auto-restart circuit turns the power
forced off. The internal oscillator is stopped slightly before the supply on and off at an auto-restart duty cycle of typically 4%
end of the current cycle and stays there as long as the disable if an out of regulation condition persists. Loss of regulation
signal exists. When the signal at the above pins changes state interrupts the external current into the CONTROL pin. VC regu-
from disable to enable, the internal oscillator starts the next lation changes from shunt mode to the hysteretic auto-restart
switching cycle. This approach allows the use of these pins to mode as described in CONTROL pin operation section. When
synchronize TOPSwitch-GX to any external signal with a the fault condition is removed, the power supply output
frequency between its internal switching frequency and 20 kHz. becomes regulated, VC regulation returns to shunt mode, and
normal operation of the power supply resumes.
As seen above, the remote ON/OFF feature allows the
TOPSwitch-GX to be turned on and off instantly, on a cycle- Hysteretic Over-Temperature Protection
by-cycle basis, with very little delay. However, remote Temperature protection is provided by a precision analog
ON/OFF can also be used as a standby or power switch to turn circuit that turns the output MOSFET off when the junction
off the TOPSwitch-GX and keep it in a very low power temperature exceeds the thermal shutdown temperature
consumption state for indefinitely long periods. If the (140 °C typical). When the junction temperature cools to
TOPSwitch-GX is held in remote off state for long enough time below the hysteretic temperature, normal operation resumes
to allow the CONTROL pin to dishcharge to the internal providing automatic recovery. A large hysteresis of 70 °C
supply under-voltage threshold of 4.8 V (approximately 32 ms (typical) is provided to prevent overheating of the PC board
for a 47 µF CONTROL pin capacitance), the CONTROL pin due to a continuous fault condition. VC is regulated in hyster-
goes into the hysteretic mode of regulation. In this mode, the etic mode and a 4.8 V to 5.8 V (typical) sawtooth waveform is
CONTROL pin goes through alternate charge and discharge present on the CONTROL pin while in thermal shutdown.
cycles between 4.8 V and 5.8 V (see CONTROL pin operation
section above) and runs entirely off the high voltage DC input, Bandgap Reference
but with very low power consumption (160 mW typical at All critical TOPSwitch-GX internal voltages are derived from
230 VAC with M or X pins open). When the TOPSwitch-GX is a temperature-compensated bandgap reference. This reference
I
4/03 9
TOP242-250
is also used to generate a temperature-compensated current during start-up or hysteretic operation. Hysteretic operation
reference which is trimmed to accurately set the switching occurs during auto-restart, remote off and over-temperature
frequency, MOSFET gate drive current, current limit, and the shutdown. In this mode of operation, the current source is
line OV/UV thresholds. TOPSwitch-GX has improved circuitry switched on and off with an effective duty cycle of approxi-
to maintain all of the above critical parameters within very tight mately 35%. This duty cycle is determined by the ratio of
absolute and temperature tolerances. CONTROL pin charge (IC) and discharge currents (ICD1 and
I CD2). This current source is turned off during normal
High-Voltage Bias Current Source operation when the output MOSFET is switching. The effect
This current source biases TOPSwitch-GX from the DRAIN of the current source switching will be seen on the DRAIN
pin and charges the CONTROL pin external capacitance voltage waveform as small disturbances and is normal.
Product Selector Guide 1
Data Sheets 2
Application Notes 3
Design Ideas 4
Design Tools 5
DPA-Switch DC-DC Seminar 8

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10 4/03
TOP242-250
Using Feature Pins

FREQUENCY (F) Pin Operation example circuits shown in Figure 16 through Figure 40. A
The FREQUENCY pin is a digital input pin available in the description of specific functions in terms of the LINE-SENSE
Y, R or F package only. Shorting the FREQUENCY pin to pin I/V characteristic is shown in Figure 11 (right hand side).
SOURCE pin selects the nominal switching frequency of The horizontal axis represents LINE-SENSE pin current with
132 kHz (Figure 13) which is suited for most applications. For positive polarity indicating currents flowing into the pin. The
other cases that may benefit from lower switching meaning of the vertical axes varies with functions. For those
frequency such as noise sensitive video applications, a 66 kHz that control the on/off states of the output such as UV, OV and
switching frequency (half frequency) can be selected by remote ON/OFF, the vertical axis represents the enable/
shorting the FREQUENCY pin to the CONTROL pin disable states of the output. UV triggers at IUV (+50 µA typical
(Figure 14). In addition, an example circuit shown in Figure 15 with 30 µA hysteresis) and OV triggers at IOV (+225 µA
may be used to lower the switching frequency from 132 kHz in typical with 8 µA hysteresis). Between the UV and OV thresh-
normal operation to 66 kHz in standby mode for very low standby olds, the output is enabled. For line feed forward with DCMAX
power consumption. reduction, the vertical axis represents the magnitude of the
DCMAX. Line feed forward with DCMAX reduction lowers
LINE-SENSE (L) Pin Operation (Y, R and F Packages) maximum duty cycle from 78% at IL(DC) (+60 µA typical) to
When current is fed into the LINE-SENSE pin, it works as a 38% at IOV (+225 µA).
voltage source of approximately 2.6 V up to a maximum
current of +400 µA (typical). At +400 µA, this pin turns into a EXTERNAL CURRENT LIMIT (X) Pin Operation
constant current sink. Refer to Figure 12a. In addition, a (Y, R and F Packages)
comparator with a threshold of 1 V is connected at the pin and is When current is drawn out of the EXTERNAL CURRENT
used to detect when the pin is shorted to the SOURCE pin. LIMIT pin, it works as a voltage source of approximately
1.3 V up to a maximum current of –240 µA (typical). At
There are a total of four functions available through the use of –240 µA, it turns into a constant current source (refer to
the LINE-SENSE pin: OV, UV, line feed forward with DCMAX Figure 12a).
reduction, and remote ON/OFF. Connecting the LINE-SENSE
pin to the SOURCE pin disables all four functions. The LINE- There are two functions available through the use of the
SENSE pin is typically used for line sensing by connecting a EXTERNAL CURRENT LIMIT pin: external current limit
resistor from this pin to the rectified DC high voltage bus to imple- and remote ON/OFF. Connecting the EXTERNAL CURRENT
ment OV, UV and DCMAX reduction with line voltage. In this LIMIT pin and SOURCE pin disables the two functions. In
mode, the value of the resistor determines the line OV/UV thresh- high efficiency applications this pin can be used to reduce the
olds, and the DCMAX is reduced linearly with rectified DC high current limit externally to a value close to the operating peak
voltage starting from just above the UV threshold. The pin can current, by connecting the pin to the SOURCE pin through a
also be used as a remote on/off and a synchronization input. Refer resistor. The pin can also be used for remote on/off. Table 2
to Table 2 for possible combinations of the functions with shows several possible combinations using this pin. See
LINE-SENSE AND EXTERNAL CURRENT LIMIT PIN TABLE*

▲
Figure Number 16 17 18 19 20 21 22 23 24 25 26 27 28 29
Three Terminal Operation ✔
Under-Voltage ✔ ✔ ✔ ✔ ✔
Overvoltage ✔ ✔ ✔ ✔ ✔
Line Feed Forward (DCMAX) ✔ ✔ ✔ ✔
Overload Power Limiting ✔
External Current Limit ✔ ✔ ✔ ✔ ✔ ✔
Remote ON/OFF ✔ ✔ ✔ ✔ ✔ ✔ ✔
*This table is only a partial list of many LINE-SENSE and EXTERNAL CURRENT LIMIT pin configurations that are possible.
Table 2. Typical LINE-SENSE and EXTERNAL CURRENT LIMIT Pin Configurations.
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4/03 11
TOP242-250
MULTI-FUNCTION PIN TABLE*
▲
Figure Number 30 31 32 33 34 35 36 37 38 39 40
Three Terminal Operation ✔
Under-Voltage ✔ ✔ ✔
Overvoltage ✔ ✔ ✔
Line Feed Forward (DCMAX) ✔ ✔
Overload Power Limiting ✔
External Current Limit ✔ ✔ ✔ ✔
Remote ON/OFF ✔ ✔ ✔ ✔ ✔
*This table is only a partial list of many MULTI-FUNCTION pin configurations that are possible.
Table 3. Typical MULTI-FUNCTION Pin Configurations.

Figure 11 for a description of the functions where the horizon- Product Selector Guide
TOPSwitch-GX to operate in a simple three terminal mode like 1
tal axis (left hand side) represents the EXTERNAL CURRENT TOPSwitch-II. The MULTI-FUNCTION pin is typically used
LIMIT pin current. The meaning of the vertical axes varies for line sensing by connecting a resistor from this pin to the
with function. For those that control the on/off states of the Data Sheets
rectified DC high voltage bus to implement OV, UV and DCMAX 2
output such as remote ON/OFF, the vertical axis represents the reduction with line voltage. In this mode, the value of the
enable/disable states of the output. For external current limit, resistor determines the line OV/UV thresholds, and the DCMAX
the vertical axis represents the magnitude of the ILIMIT. Please Application Notes
is reduced linearly with rectified DC high voltage starting from 3
see graphs in the typical performance characteristics section just above the UV threshold. In high efficiency applications
for the current limit programming range and the selection of this pin can be used in the external current limit mode instead,
appropriate resistor value. Design Ideas
to reduce the current limit externally to a value close to the 4
operating peak current, by connecting the pin to the SOURCE
MULTI-FUNCTION (M) Pin Operation (P and G Packages) pin through a resistor. The same pin can also be used as a
The LINE-SENSE and EXTERNAL CURRENT LIMIT pin Design Tools
remote on/off and a synchronization input in both modes. Please 5
functions are combined to a single MULTI-FUNCTION pin refer to Table 3 for possible combinations of the functions with
for P and G packages. The comparator with a 1 V threshold at example circuits shown in Figure 30 through Figure 40. A
the LINE-SENSE pin is removed in this case as shown in Quality and Reliability
description of specific functions in terms of the MULTI- 6
Figure 2b. All of the other functions are kept intact. However, FUNCTION pin I/V characteristic is shown in Figure 11. The
since some of the functions require opposite polarity of input horizontal axis represents MULTI-FUNCTION pin current with
current (MULTI-FUNCTION pin), they are mutually Package Information
positive polarity indicating currents flowing into the pin. The 7
exclusive. For example, line sensing features cannot be used meaning of the vertical axes varies with functions. For those
simultaneously with external current limit setting. When that control the on/off states of the output such as UV, OV and
current is fed into the MULTI-FUNCTION pin, it works as a DPA-Switch DC-DC Seminar
remote ON/OFF, the vertical axis represents the enable/ 8
voltage source of approximately 2.6 V up to a maximum disable states of the output. UV triggers at IUV (+50 µA
current of +400 µA (typical). At +400 µA, this pin turns into a typical) and OV triggers at IOV (+225 µA typical with 30 µA
constant current sink. When current is drawn out of the MULTI- hysteresis). Between the UV and OV thresholds, the output is 9
FUNCTION pin, it works as a voltage source of enabled. For external current limit and line feed forward with
approximately 1.3 V up to a maximum current of –240 µA DCMAX reduction, the vertical axis represents the magnitude of
(typical). At –240 µA, it turns into a constant current source. TOPSwitch-GX AC-DC Seminar 10
the ILIMIT and DCMAX. Line feed forward with DCMAX reduction
Refer to Figure 12b. lowers maximum duty cycle from 78% at IM(DC) (+60 µA
typical) to 38% at IOV (+225 µA). External current limit is
There are a total of five functions available through the use of available only with negative MULTI-FUNCTION pin current.
the MULTI-FUNCTION pin: OV, UV, line feed forward with Please see graphs in the typical performance characteristics
DCMAX reduction, external current limit and remote ON/OFF. section for the current limit programming range and the
A short circuit between the MULTI-FUNCTION pin and selection of appropriate resistor value.
SOURCE pin disables all five functions and forces
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12 4/03
TOP242-250
M Pin
X Pin L Pin
IREM(N) IUV IOV

(Enabled)
Output
MOSFET
Switching
(Disabled)
Disabled when supply I

output goes out of
regulation
ILIMIT (Default)
Current
Limit
DCMAX (78.5%)
Maximum
Duty Cycle
I
-22 µA
-27 µA
VBG + VTP
VBG
Pin Voltage
I
-250 -200 -150 -100 -50 0 50 100 150 200 250 300 350 400
X and L Pins (Y, R or F Package) and M Pin (P or G Package) Current (µA)
Note: This figure provides idealized functional characteristics with typical performance values. Please refer to the parametric
table and typical performance characteristics sections of the data sheet for measured data.
PI-2636-010802
Figure 11. MULTI-FUNCTION (P or G package), LINE-SENSE, and EXTERNAL CURRENT LIMIT (Y, R or F package) Pin Characteristics.
I
4/03 13
TOP242-250
Y, R and F Package
CONTROL Pin
TOPSwitch-GX
240 µA
(Negative Current Sense - ON/OFF,

Current Limit Adjustment)
EXTERNAL CURRENT LIMIT (X) VBG + VT
(Voltage Sense)
LINE-SENSE (L) 1V
VBG
(Positive Current Sense - Under-Voltage,
Overvoltage, ON/OFF Maximum Duty
Cycle Reduction)

400 µA
Product Selector Guide PI-2634-010802

1
Figure 12a. LINE-SENSE (L), and EXTERNAL CURRENT LIMIT (X) Pin Input Simplified Schematic.
Data Sheets 2
P and G Package Application Notes 3

CONTROL Pin
TOPSwitch-GX
240 µA
Design Ideas 4
(Negative Current Sense - ON/OFF,
Current Limit Adjustment)
Design Tools 5
VBG + VT
MULTI-FUNCTION (M)
VBG
(Positive Current Sense - Under-Voltage,
Package Information
Overvoltage, Maximum Duty
Cycle Reduction) 7
400 µA DPA-Switch DC-DC Seminar 8
LinkSwitch & TinySwitch-II AC-DC Seminar PI-2548-092399 9

Figure 12b. MULTI-FUNCTION (M) Pin Input Simplified Schematic.

I
14 4/03
TOP242-250
Typical Uses of FREQUENCY (F) Pin
+ +
DC DC
D D
Input Input
Voltage CONTROL Voltage CONTROL
C C
S F S F
- -
PI-2654-071700 PI-2655-071700
Figure 13. Full Frequency Operation (132 kHz). Figure 14. Half Frequency Operation (66 kHz).
+
QS can be an optocoupler output.
DC
D
Input
Voltage CONTROL
C
STANDBY
S F 47 kΩ
QS
RHF
20 kΩ 1 nF
-
PI-2656-040501
Figure 15. Half Frequency Standby Mode (For High Standby

Efficiency).
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4/03 15
TOP242-250
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins
+ + VUV = IUV x RLS

VOV = IOV x RLS
For RLS = 2 MΩ
CLXS F D RLS 2MΩ VUV = 100 VDC
VOV = 450 VDC
DC DC
Input Input DCMAX@100 VDC = 78%
Voltage Voltage DCMAX@375 VDC = 38%
D L D L
CONTROL C S D CONTROL
C C
S X F S
- -
PI-2617-050100 PI-2618-040501
General Figure
Figure 16. Three Terminal Operation (LINE-SENSE and
Information & Table of Contents
17. Line-Sensing for Under-Voltage, Overvoltage and
EXTERNAL CURRENT LIMIT Features Disabled. Line Feed Forward.
FREQUENCY Pin can be tied to SOURCE or
CONTROL Pin). Product Selector Guide 1
+ + Data Sheets 2
2 MΩ VUV = RLS x IUV 2 MΩ VOV = IOV x RLS
For Value Shown For Values Shown

RLS VUV = 100 VDC Application
RLS V = Notes
450 VDC OV
3
DC DC
Input 22 kΩ Input 30 kΩ
Voltage
D M
Voltage
D L
Design Ideas
1N4148 4
CONTROL CONTROL
C C
6.2 V
Design Tools 5
S
- S -
PI-2510-040501
Quality and Reliability PI-2620-040501
6
Figure 18. Line-Sensing for Under-Voltage Only (Overvoltage Figure 19. Line-Sensing for Overvoltage Only (Under-Voltage
Disabled). Disabled). Maximum Duty Cycle will be reduced at
Low Line.
+ For RIL = 12 kΩ
DPA-Switch
+
DC-DC
I
Seminar
= 100% @ 100 VDC LIMIT
8
ILIMIT = 69% ILIMIT = 63% @ 300 VDC
RLS 2.5 MΩ
LinkSwitch
For R = 25 kΩ
I
IL
= 43%
& TinySwitch-II AC-DC Seminar 9
LIMIT
DC See fig. 55 for other DC

Input
Voltage
D
CONTROL
Input
Voltage
D
CONTROL
C C
S X Sales Representatives and Distributors 11 S X
RIL RIL
6 kΩ
- -
PI-2623-040501 PI-2624-040501
Figure 20. Externally Set Current Limit. Figure 21. Current Limit Reduction with Line Voltage.
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16 4/03
TOP242-250
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins (cont.)
+ + QR can be an
QR can be an optocoupler optocoupler output or
output or can be replaced by can be replaced
a manual switch. QR
by a manual switch.
ON/OFF
47 kΩ RMC
DC DC
D Input
Input 45 kΩ
Voltage CONTROL Voltage
C D L
CONTROL
S X C
QR ON/OFF
47 kΩ S
- -
PI-2625-040501 PI-2621-040501
Figure 22. Active-on (Fail Safe) Remote ON/OFF. Figure 23. Active-off Remote ON/OFF. Maximum Duty Cycle will
be reduced.
+ QR can be an optocoupler
+ QR
QR can be an
optocoupler output
output or can be replaced ON/OFF or can be replaced
by a manual switch. 47 kΩ RMC by a manual switch.
For RIL = 12 kΩ 45 kΩ
ILIMIT = 69% DC
DC
D For RIL = 25 kΩ Input D L
Input
Voltage CONTROL ILIMIT = 43% Voltage CONTROL
C C
S X S X
RIL RIL
QR ON/OFF
- 47 kΩ -
PI-2626-040501 PI-2627-040501
Figure 24. Active-on Remote ON/OFF with Externally Set Current Figure 25. Active-off Remote ON/OFF with Externally Set Current
Limit. Limit.
+ VUV = IUV x RLS

VOV = IOV x RLS
RLS 2 MΩ output or can be replaced
by a manual switch.
DCMAX@100 VDC = 78%
RLS 2 MΩ
QR DCMAX@375 VDC = 38%
For RLS = 2 MΩ
ON/OFF QR can be an optocoupler
47 kΩ VUV = 100 VDC DC output or can be replaced
D L
VOV = 450 VDC Input by a manual switch.
Voltage CONTROL
DC C
Input D L For RIL = 12 kΩ
Voltage CONTROL ILIMIT = 69%
C S X
QR
RIL
ON/OFF
S -
- 47 kΩ
PI-2622-040501 PI-2628-040501
Figure 26. Active-off Remote ON/OFF with LINE-SENSE. Figure 27. Active-on Remote ON/OFF with LINE-SENSE and
EXTERNAL CURRENT LIMIT.
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4/03 17
TOP242-250
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins (cont.)
VUV = IUV x RLS +

VOV = IOV x RLS
output or can be replaced by
For RLS = 2 MΩ a manual switch.
RLS 2 MΩ
VUV = 100 VDC
VOV = 450 VDC
DC DC 300 kΩ
D L DCMAX@100 VDC = 78% D L
Input Input
DCMAX@375 VDC = 38%
Voltage CONTROL Voltage CONTROL
C C
For RIL = 12 kΩ
S X ILIMIT = 69% S
RIL
See fig. 55 for other QR ON/OFF
resistor values (RIL) 47 kΩ
- 12 kΩ
to select different ILIMIT
-
values PI-2629-040501 PI-2640-040501
General Figure
Figure 28. Line-Sensing and Externally Set Current Limit.
29. Active-on Remote ON/OFF.
Data Sheets 2
Application Notes 3
Design Ideas 4
Design Tools 5

I
18 4/03
TOP242-250
Typical Uses of MULTI-FUNCTION (M) Pin
+ +
VUV = IUV x RLS
C S S
VOV = IOV x RLS
M
RLS 2 MΩ For RLS = 2 MΩ
D S S VUV = 100 VDC
DC DC VOV = 450 VDC
Input Input
Voltage Voltage DCMAX@100 VDC = 78%
D M D M DCMAX@375 VDC = 38%
C D S
CONTROL CONTROL
C C
S S
- -
PI-2508-081199 PI-2509-040501
Figure 30. Three Terminal Operation (MULTI-FUNCTION Figure 31. Line Sensing for Undervoltage, Over-Voltage and
Features Disabled). Line Feed Forward.
+ +
2 MΩ VUV = RLS x IUV VOV = IOV x RLS
2 MΩ
For Value Shown For Values Shown

RLS RLS
VUV = 100 VDC VOV = 450 VDC
DC DC
Input 22 kΩ Input 30 kΩ
1N4148
Voltage Voltage
D M D M
CONTROL CONTROL
C C
6.2 V
S S
- -
PI-2510-040501 PI-2516-040501
Figure 32. Line Sensing for Under-Voltage Only (Overvoltage Figure 33. Line Sensing for Overvoltage Only (Under-Voltage
Disabled). Disabled). Maximum Duty Cycle will be reduced at
Low Line.
+ +
For RIL = 12 kΩ
ILIMIT = 69% ILIMIT = 100% @ 100 VDC
RLS 2.5 MΩ ILIMIT = 63% @ 300 VDC
For RIL = 25 kΩ
ILIMIT = 43%
DC DC
See fig. 55 for other
Input Input
Voltage Voltage
to select different D M
D M
ILIMIT values
CONTROL RIL 6 kΩ CONTROL
RIL C C
S S
- -
PI-2517-040501 PI-2518-040501
Figure 34. Externally Set Current Limit. Figure 35. Current Limit Reduction with Line Voltage.
I
4/03 19
TOP242-250
Typical Uses of MULTI-FUNCTION (M) Pin (cont.)
+ + QR can be an optocoupler
QR can be an optocoupler output or can be replaced
output or can be replaced by a manual switch.
by a manual switch.
QR
DC DC ON/OFF
Input Input 47 kΩ RMC
Voltage Voltage
D M 45 kΩ
D M
CONTROL CONTROL
QR C C
ON/OFF
47 kΩ S
- S
-
PI-2519-040501 PI-2522-040501
Figure 36. Active-on (Fail Safe) Remote ON/OFF.

General Figure
37. Active-off Remote ON/OFF. Maximum Duty Cycle will
be Reduced.

+
QR can be an optocoupler
+ Data Sheets
Q can be an
R optocoupler 2
output or can be replaced
by a manual switch.
by a manual switch.
For RIL = 12 kΩ Application Notes
QR 3
ILIMIT = 69% ON/OFF
DC DC 47 kΩ
Input Input
Voltage
RIL D M
For RIL = 25 kΩ
ILIMIT = 43%
Voltage Design
RMC R =Ideas
2R
24 kΩ MC IL
4
D M
CONTROL CONTROL
QR C RIL C
ON/OFF
12 kΩ
Design Tools 5
47 kΩ S
- S
-
PI-2520-040501
Quality and Reliability PI-2521-040501
6
Figure 38. Active-on Remote ON/OFF with Externally Set Figure 39. Active-off Remote ON/OFF with Externally Set
Current Limit. Current Limit.
DPA-Switch
Q can be an optocoupler
DC-DC Seminar 8
+ R
by a manual switch.
RLS 2 MΩ
9
QR
DC
Input
ON/OFF
47 kΩ TOPSwitch-GX AC-DC Seminar 10
Voltage For RLS = 2 MΩ
D M
V = 100 VDC
Sales Representatives
V = 450 VDC and Distributors 11
CONTROL
C
UV
OV
S
-
PI-2523-040501
Figure 40. Active-off Remote ON/OFF with LINE-SENSE.
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20 4/03
TOP242-250
Application Examples provides line sensing, setting UV at 100 VDC and OV at

450 VDC. The extended maximum duty cycle feature of
A High Efficiency, 30 W, Universal Input Power Supply TOPSwitch-GX (guaranteed minimum value of 75% vs. 64%
The circuit shown in Figure 41 takes advantage of several of for TOPSwitch-II) allows the use of a smaller input capacitor
the TOPSwitch-GX features to reduce system cost and power (C1). The extended maximum duty cycle and the higher
supply size and to improve efficiency. This design delivers reflected voltage possible with the RCD clamp also permit the
30 W at 12 V, from an 85 to 265 VAC input, at an ambient of use of a higher primary to secondary turns ratio for T1 which
50 °C, in an open frame configuration. A nominal efficiency reduces the peak reverse voltage experienced by the secondary
of 80% at full load is achieved using TOP244Y. rectifier D8. As a result a 60 V Schottky rectifier can be used
for up to 15 V outputs, which greatly improves power supply
The current limit is externally set by resistors R1 and R2 to a efficiency. The frequency reduction feature of the
value just above the low line operating peak DRAIN current TOPSwitch-GX eliminates the need for any dummy loading
of approximately 70% of the default current limit. This allows for regulation at no load and reduces the no load/standby
use of a smaller transformer core size and/or higher transformer consumption of the power supply. Frequency jitter provides
primary inductance for a given output power, reducing improved margin for conducted EMI meeting the CISPR 22
TOPSwitch-GX power dissipation, while at the same time (FCC B) specification.
avoiding transformer core saturation during startup and output
transient conditions. The resistors R1 & R2 provide a signal Output regulation is achieved by using a simple Zener sense
that reduces the current limit with increasing line voltage, which circuit for low cost. The output voltage is determined by the
in turn limits the maximum overload power at high input line Zener diode (VR2) voltage and the voltage drops across the
voltage. This function in combination with the built-in soft- optocoupler (U2) LED and resistor R6. Resistor R8 provides
start feature of TOPSwitch-GX, allows the use of a low cost bias current to Zener VR2 for typical regulation of ±5% at the
RCD clamp (R3, C3 and D1) with a higher reflected voltage, 12 V output level, over line and load and component
by safely limiting the TOPSwitch-GX drain voltage, with variations.
adequate margin under worst case conditions. Resistor R4
PERFORMANCE SUMMARY
Output Power: 30 W
CY1
Regulation: ± 4% 2.2 nF
Efficiency: ≥ 79% C14 R15
Ripple: ≤ 50 mV pk-pk 1 nF 150 Ω
L3 12 V
3.3 µH @ 2.5 A
C3 R3
4.7 nF 68 kΩ
2W D8 C10 C11 C12
1 kV 220 µF
MBR1060 560 µF 560 µF
35 V 35 V 35 V
BR1
600 V D1 RTN
2A UF4005
R4 D2
L1 2 MΩ 1N4148 R6
20 mH 1/2 W 150 Ω R8
R1 T1 C6 150 Ω
4.7 MΩ 0.1 µF
C1 1/2 W U2
CX1 68 µF LTV817A
100 nF 400 V D L TOPSwitch-GX
250 VAC U1 CONTROL
TOP244Y C
R5
F1 S X F 6.8 Ω VR2
J1 3.15 A 1N5240C
85-265 VAC
10 V, 2%
L R2 C5
9.09 kΩ 47 µF
10 V
N
PI-2657-040501
Figure 41. 30 W Power Supply using External Current Limit Programming and Line Sensing for UV and OV.
I
4/03 21
TOP242-250
A High Efficiency, Enclosed, 70 W, Universal Adapter Supply damage. Capacitor C11 has been added in parallel with VR1 to
The circuit shown in figure 42 takes advantage of several of the reduce Zener clamp dissipation. With a switching frequency of
TOPSwitch-GX features to reduce cost, power supply size and 132 kHz a PQ26/20 core can be used to provide 70 W. To
increase efficiency. This design delivers 70 W at 19 V, from an maximize efficiency, by reducing winding losses, two output
85 to 265 VAC input, at an ambient of 40 °C, in a small sealed windings are used each with their own dual 100 V Schottky
adapter case (4” x 2.15” x 1”). Full load efficiency is 85% at rectifier (D2 and D3). The frequency reduction feature of the
85 VAC rising to 90% at 230 VAC input. TOPSwitch-GX eliminates any dummy loading to maintain
regulation at no-load and reduces the no-load consumption of the
Due to the thermal environment of a sealed adapter a TOP249Y power supply to only 520 mW at 230 VAC input. Frequency
is used to minimize device dissipation. Resistors R9 and R10 jittering provides conducted EMI meeting the CISPR 22
externally program the current limit level to just above the (FCC B) / EN55022B specification, using simple filter compo-
operating peak DRAIN current at full load and low line. This nents (C7, L2, L3 and C6) even with the output earth grounded.
allows the use of a smaller transformer core size without
saturation during startup or output load transients. Resistors R9 To regulate the output an optocoupler (U2) is used with a
and R10 also reduce the current limit with increasing line secondary reference sensing the output voltage via a resistor
voltage, limiting the maximum overload power at high input divider (U3, R4, R5, R6). Diode D4 and C15 filter and smooth
line voltage, removing the need for any protection circuitry on
the secondary. Resistor R11 implements an under voltage and
the output of the bias winding. Capacitor C15 (1µF) prevents the
bias voltage from falling during zero to full load transients.
over voltage sense as well as providing line feed forward for Resistor R8 provides filtering of leakage inductance spikes
reduced output line frequency ripple. With resistor R11 set at
2 MΩ the power supply does not start operating until the DC rail
keeping the bias voltage constant even at high output loads.
Resistor R7, C9 and C10 together with C5 and R3 provide loop
1
voltage reaches 100 VDC. On removal of the AC input the UV compensation.
sense prevents the output glitching as C1 discharges,
turning off the TOPSwitch-GX when the output regulation is lost
Data Sheets
Due to the large primary currents, all the small signal control
2
or when the input voltage falls to below 40 V, whichever components are connected to a separate source node that is Kelvin
occurs first. This same value of R11 sets the OV threshold to
450 V. If exceeded, for example during a line surge,
Application Notes
connected to the source pin of the TOPSwitch-GX. For improved
common mode surge immunity the bias winding common re-
3
TOPSwitch-GX stops switching for the duration of the surge turns directly to the DC bulk capacitor (C1).
extending the high voltage withstand to 700 V without device Design Ideas 4
C7 2.2 nF PERFORMANCE SUMMARY
D2
C13 C12 C11
0.33 µF 0.022 µF 0.01 µF
400 V 400 V 400 V Y1 Safety
MBR20100 Output Power:
Regulation:
Design Tools
70 W
± 4%
5
Efficiency: ≥ 84%
Ripple: ≤ 120 mV pk-pk
VR1 D3 Quality and Reliability

No Load Consumption: < 0.52 W @ 230 VAC 6
P6KE- MBR20100
C3 C14
200 820 µF L1 0.1 µF 19 V
@ 3.6 A
BR1
RS805 D1
UF4006
Package Information
25 V 200 µH 50 V
7
8A 600 V
C2 C4
DPA-Switch
D4 820 µF
25 V
DC-DC
R1
270 Ω
820 µFSeminar
25 V
RTN
8
L2 R11 1N4148
820 µH 2 MΩ R4
U2 31.6 kΩ
2A 1/2 W R8
C1
150 µF
LinkSwitchT1& TinySwitch-II
C15
AC-DC
R2 Seminar 4.7 Ω
PC817A 1% 9
1 kΩ R5
C6 400 V 1 µF 562 Ω
TOPSwitch-GX
0.1 µF D L 50 V C9 1%
X2
RT1
L3
75 µH R9
CONTROL
C U1 TOPSwitch-GX AC-DC Seminar 10
TOP249Y 4.7 nF 50 V
10 Ω t° 2A 13 MΩ C10
1.7 A R3 0.1 µF
S X F R7
J1
F1
3.15 A Sales
R10
Representatives
C8 U3 and Distributors 11
6.8 Ω 56 kΩ 50 V
85-265 VAC
0.1 µF R6 TL431
20.5 kΩ 4.75 kΩ
L 50 V C5
47 µF 1%
16 V
N All resistors 1/8 W 5% unless otherwise stated.
PI-2691-042203
Figure 42. 70 W Power Supply using Current Limit Reduction with Line and Line Sensing for UV and OV.
I
22 4/03
TOP242-250
A High Efficiency, 250 W, 250 – 380 VDC Input Power Supply However, VR1 is essential to limit the peak drain voltage
The circuit shown in figure 43 delivers 250 W (48 V @ 5.2 A) during start-up and/or overload conditions to below the 700 V
at 84% efficiency using a TOP249 from a 250 to 380 VDC rating of the TOPSwitch-GX MOSFET.
input. DC input is shown, as typically at this power level a
p.f.c. boost stage would preceed this supply, providing the DC The secondary is rectifed and smoothed by D2 and C9, C10
input (C1 is included to provide local decoupling). Flyback and C11. Three capacitors are used to meet the secondary ripple
topology is still useable at this power level due to the high current requirement. Inductor L2 and C12 provide switching
output voltage, keeping the secondary peak currents low enough noise filtering.
so that the output diode and capacitors are reasonably sized.
A simple Zener sensing chain regulates the output voltage. The
In this example the TOP249 is at the upper limit of its power sum of the voltage drop of VR2, VR3 and VR4 plus the LED
capability and the current limit is set to the internal maximum drop of U2 gives the desired output voltage. Resistor R6
by connecting the X pin to SOURCE. However, line sensing limits LED current and sets overall control loop DC gain.
is implemented by connecting a 2 MΩ resistor from the L pin Diode D4 and C14 provide secondary soft-finish, feeding
to the DC rail. If the DC input rail rises above 450 VDC, then current into the CONTROL pin prior to output regulation and
TOPSwitch-GX will stop switching until the voltage returns to thus ensuring that the output voltage reaches regulation at start-
normal, preventing device damage. up under low line, full load conditions. Resistor R9 provides a
discharge path for C14. Capacitor C13 and R8 provide control
Due to the high primary current, a low leakage inductance loop compensation and are required due to the gain associated
transformer is essential. Therefore, a sandwich winding with with such a high output voltage.
a copper foil secondary was used. Even with this technique
the leakage inductance energy is beyond the power capability Sufficient heat sinking is required to keep the TOPSwitch-GX
of a simple Zener clamp. Therefore, R2, R3 and C6 are added device below 110 °C when operating under full load, low line
in parallel to VR1. These have been sized such that during and maximum ambient temperature. Airflow may also be
normal operation very little power is dissipated by VR1, the required if a large heat sink area is not acceptable.
leakage energy instead being dissipated by R2 and R3.
C7
2.2 nF Y1 D2
R2 R3 C6 MUR1640CT
C10 C11 L2
VR1 68 kΩ 68 kΩ 4.7 nF 560 µF 560 µF 3 µH 8A
+250 - 380 VDC P6KE200 2W 2W 1 kV 63 V 63 V 48 V @ 5.2 A
C9 C12
560 µF 68 µF
63 V 63 V
D1
BYV26C D2 RTN
1N4148 U2
LTV817A
R1
2 MΩ
1/2 W T1 R9
C4 10 kΩ
C1 1 µF
22 µF 50 V
R6
400 V 100 Ω
TOPSwitch-GX
D L TOP249Y C13
PERFORMANCE SUMMARY 150 nF D4
CONTROL U1 63 V 1N4148
Output Power: 250 W C
VR2 22 V
Line Regulation: ± 1% BZX79B22
Load Regulation: ± 5% R4
S X F 6.8 Ω C14
Efficiency: ≥ 85% VR3 12 V 22 µF
Ripple: < 100 mV pk-pk C3 BZX79B12 R8
0.1 µF C3 56 Ω 63 V
No Load Consumption: ≤ 1.4 W (300 VDC) 47 µF
50 V VR4 12 V
10 V BZX79B12
0V
All resistor 1/8 W 5% unless
otherwise stated. PI-2692-042203
Figure 43. 250 W, 48 V Power Supply using TOP249.
I
4/03 23
TOP242-250
Multiple Output, 60 W, 185-265 VAC Input Power Supply to the relatively large size of C2). An optional MOV (RV1)
Figure 44 shows a multiple output supply typical for high end extends the differential surge protection to 6 kV from 4 kV.
set-top boxes or cable decoders containing high capacity hard
disks for recording. The supply delivers an output power of Leakage inductance clamping is provided by VR1, R5 and C5,
45 W cont./60 W peak (thermally limited) from an input keeping the DRAIN voltage below 700 V under all conditions.
voltage of 185 to 265 VAC. Efficiency at 45 W, 185 VAC is Resistor R5 and capacitor C5 are selected such that VR1
≥ 75%. dissipates very little power except during overload conditions.
The frequency jittering feature of TOPSwitch-GX allows the
The 3.3 V and 5 V outputs are regulated to ±5% without the circuit shown to meet CISPR22B with simple EMI filtering
need for secondary linear regulators. DC stacking (the (C1, L1 and C6) and the output grounded.
secondary winding reference for the other output voltages is
connected to the cathode of D10 rather than the anode) is used The secondaries are rectified and smoothed by D7 to D11, C7,
to minimize the voltage error for the higher voltage outputs. C9, C11, C13, C14, C16 and C17. Diode D11 for the 3.3 V
output is a Schottky diode to maximize efficiency. Diode D10
Due to the high ambient operating temperature requirement for the 5 V output is a PN type to center the 5 V output at 5 V.
typical of a set-top box (60 °C) the TOP246Y is used to The 3.3 V and 5 V output require two capacitors in parallel to
reduce conduction losses and minimize heat sink size. Resis-
tor R2 sets the device current limit to 80% of typical to limit
meet the ripple current requirement. Switching noise filtering
is provided by L2 to L5 and C8, C10, C12, C15 and C18.
overload power. The line sense resistor (R1) protects the Resistor R6 prevents peak charging of the lightly loaded 30 V
TOPSwitch-GX from line surges and transients by sensing when
the DC rail voltage rises to above 450 V. In this condition the
output. The outputs are regulated using a secondary reference
(U3). Both the 3.3 V and 5 V outputs are sensed via R11 and
1
TOPSwitch-GX stops switching, extending the input voltage R10. Resistor R8 provides bias for U3 and R7 sets the overall
withstand to 496 VAC which is ideal for countries with poor
power quality. A thermistor (RT1) is used to prevent
Data Sheets
DC gain. Resistor R9, C19, R3 and C5 provide loop compen-
sation. A soft-finish capacitor (C20) eliminates output
2
premature failure of the fuse by limiting the inrush current (due overshoot.
Application Notes 3
PERFORMANCE SUMMARY
Output Power: 45 W Cont./60 W Peak Design Ideas 4
Regulation:
R6 D7
3.3 V: ± 5% 10 Ω UF4003 30 V @
5 V: ± 5% 0.03 A
12 V:
18 V:
± 7%
± 7%
D8
UF5402
C7
47 µF
50 V
L2
3.3 µH
3A
Design Tools C8
10 µF
50 V 18 V @
5
0.5 A
30 V: ± 8% C9 L3 C10
Efficiency: ≥75% D9 330 µF 3.3 µH 100 µF
No Load Consumption: 0.6 W
C6
UF5402 25 V
C11 C13
C16
3A
C12
25 V 12 V @
0.6 A 6
390 µF 1000 µF 1000 µF L4 100 µF
2.2 nF 35 V 25 V 25 V 3.3 µH
Y1 25 V
VR1 5A 5V@
R5 3.2 A
P6KE170 68 kΩ
2W
D10
C14
1000 µF
Package Information
L5 C15
3.3 µH 220 µF
7
BYV32-200 25 V 5A 165 V 3.3 V @
C5 3A
1 nF C18
400 V
D1-D4
1N4007 V D6
D11
MBR1045
C17
1000 µF
25 V
220 µF
16 V
RTN
8
1N4937
L1
20 mH
C2
68 µF
400 V
LinkSwitch & TinySwitch-II AC-DC Seminar R10
9
D6 C3 R7
0.8A 1N4148 1 µF 15.0
R1 150 Ω kΩ
2 MΩ 50 V
C1 T1 U2
0.1 µF
X1
1/2 W
TOPSwitch-GX AC-DC Seminar 10 LTV817 R8
1 kΩ R11
9.53
kΩ
RV1 D L TOPSwitch-GX
275 V CONTROL R9 C19
14 mm C
3.3 kΩ 0.1 µF
J1
F1
3.15 A
RT1
TOP246Y
U1 S X F
C3
0.1 µF
50 V
R3
6.8 Ω
185-265 VAC
t°
10 Ω R2 C5 C20 U3
L TL431 R12
1.7 A 9.08 kΩ 47 µF 22 µF
10 V 10 V 10 k
N
PI-2693-042203
Figure 44. 60 W Multiple Output Power Supply using TOP246.
I
24 4/03
TOP242-250
Processor Controlled Supply Turn On/Off safely parking the print heads in the storage position. In the
A low cost momentary contact switch can be used to turn the case of products with a disk drive, the shutdown procedure
TOPSwitch-GX power on and off under microprocessor may include saving data or settings to the disk. After the shut-
control that may be required in some applications such as down procedure is complete, when it is safe to turn off the
printers. The low power remote off feature allows an elegant power supply, the microprocessor releases the M pin by
implementation of this function with very few external turning the optocoupler U4 off. If the manual switch and the
components as shown in Figure 45. Whenever the push button optocouplers U3 and U4 are not located close to the M pin, a
momentary contact switch P1 is closed by the user, the capacitor CM may be needed to prevent noise coupling to the
optocoupler U3 is activated to inform the microprocessor of pin when it is open.
this action. Initially, when the power supply is off (M pin is
floating), closing of P1 turns the power supply on by shorting The power supply could also be turned on remotely through a
the M pin of the TOPSwitch-GX to SOURCE through a diode local area network or a parallel or serial port by driving the
(remote on). When the secondary output voltage VCC is optocoupler U4 input LED with a logic signal. Sometimes it is
established, the microprocessor comes alive and recognizes that easier to send a train of logic pulses through a cable (due to AC
the switch P1 is closed through the switch status input that is coupling of cable, for example) instead of a DC logic level as
driven by the optocoupler U3 output. The microprocessor then a wake up signal. In this case, a simple RC filter can be used to
sends a power supply control signal to hold the power supply generate a DC level to drive U4 (not shown in Figure 45). This
in the on-state through the optocoupler U4. If the user presses remote on feature can be used to wake up peripherals such as
the switch P1 again to command a turn off, the microprocessor printers, scanners, external modems, disk drives, etc., as needed
detects this through the optocoupler U3 and initiates a shut- from a computer. Peripherals are usually designed to turn off
down procedure that is product specific. For example, in the automatically if they are not being used for a period of time, to
case of the inkjet printer, the shutdown procedure may include save power.
VCC
(+5 V)
External
Wake-up
High Voltage Signal
DC Input
MICRO Power
PROCESSOR/ Supply
100 kΩ CONTROLLER ON/OFF
U2 Control
27 kΩ
LOGIC LOGIC 1N4148

1N4148
INPUT OUTPUT 6.8 kΩ
D M TOPSwitch-GX
U4
CONTROL
U3 C
6.8 kΩ
CM 47 µF
S F U1 U3
P1 1 nF P1 Switch
LTV817A Status U4
- LTV817A
RETURN
PI-2561-042303
Figure 45. Remote ON/OFF using Microcontroller.
I
4/03 25
TOP242-250
In addition to using a minimum number of components, sequence when it detects the first closure of the switch, and
TOPSwitch-GX provides many technical advantages in this type subsequent bouncing of the switch has no effect. If necessary,
of application: the microprocessor could implement the switch debouncing
in software during turn-off, or a filter capacitor can be used
1. Extremely low power consumption in the off mode: 80 mW at the switch status input.
typical at 110 VAC and 160 mW typical at 230 VAC. This
is because in the remote/off mode the TOPSwitch-GX 4. No external current limiting circuitry is needed for the
consumes very little power, and the external circuitry does operation of the U4 optocoupler output due to internal
not consume any current (either M, L or X pin is open) from limiting of M pin current.
the high voltage DC input.
5. No high voltage resistors to the input DC voltage rail are
2. A very low cost, low voltage/current, momentary contact required to power the external circuitry in the primary. Even
switch can be used. the LED current for U3 can be derived from the CONTROL
pin. This not only saves components and simplifies layout,
3. No debouncing circuitry for the momentary switch is required. but also eliminates the power loss associated with the high
During turn-on, the start-up time of the power supply voltage resistors in both on and off states.
(typically 10 to 20 ms) plus the microprocessor initiation
time act as a debouncing filter, allowing a turn-on only if the 6. Robust design: There is no on/off latch that can be accidentally
switch is depressed firmly for at least the above delay time. triggered by transients. Instead, the power supply is held in
During turn-off, the microprocessor initiates the shutdown Product Selector Guide
the on-state through the secondary side microprocessor. 1
Data Sheets 2
Application Notes 3
Design Ideas 4
Design Tools 5

I
26 4/03
TOP242-250
Key Application Considerations

TOPSwitch-II vs. TOPSwitch-GX
Table 4 compares the features and performance differences Other features increase the robustness of design allowing cost
between TOPSwitch-GX and TOPSwitch-II. Many of the new savings in the transformer and other power components.
features eliminate the need for additional discrete components.
Function TOPSwitch-II TOPSwitch-GX Figures TOPSwitch-GX Advantages
Soft-Start N/A* 10 ms • Limits peak current and voltage

component stresses during start-up
• Eliminates external components
used for soft-start in most
applications
• Reduces or eliminates output
overshoot
External Current Limit N/A* Programmable 11,20,21, • Smaller transformer
100% to 30% of 24,25,27, • Higher efficiency
default current 28,34,35, • Allows power limiting (constant over-
limit 38,39 load power independent of line
voltage
• Allows use of larger device for lower
losses, higher efficiency and smaller
heatsink
DCMAX 67% 78% 7 • Smaller input cap (wider dynamic
range)
• Higher power capability (when used
with RCD clamp for large VOR)
• Allows use of Schottky secondary
rectifier diode for up to 15 V output
for high efficiency
Line Feed Forward with N/A* 78% to 38% 7,11,17, • Rejects line ripple
DCMAX Reduction 26,27,28,
31,40
Line OV Shutdown N/A* Single resistor 11,17,19, • Increases voltage withstand cap-
programmable 26,27,28, ability against line surge
31,33,40
Line UV Detection N/A* Single resistor 11,17,18, • Prevents auto-restart glitches
programmable 26,27,28, during power down
31,32,40
Switching Frequency 100 kHz ±10% 132 kHz ±6% 13,15 • Smaller transformer
• Below start of conducted EMI limits
Switching Frequency N/A* 66 kHz ±7% 14,15 • Lower losses when using RC and
Option (Y, R and F RCD snubber for noise reduction in
Packages) video applications
• Allows for higher efficiency in
standby mode
• Lower EMI (second harmonic below
150 kHz)
Frequency Jitter N/A* ±4 kHz@132 kHz 9,46 • Reduces conducted EMI
±2 kHz@66 kHz
Frequency Reduction N/A* At a Duty Cycle 7 • Zero load regulation without dummy
below 10% load
• Low power consumption at no load
Table 4. Comparison Between TOPSwitch-II and TOPSwitch-GX. (continued on next page) *Not available
I
4/03 27
TOP242-250
Function TOPSwitch-II TOPSwitch-GX Figures TOPSwitch-GX Advantages
Remote ON/OFF N/A* Single transistor 11, 22, • Fast on/off (cycle by cycle)
or optocoupler 23, 24, • Active-on or active-off control
interface or manual 25, 26, • Low consumption in remote off state
switch 27, 29, • Active-on control for fail-safe
36, 37, • Eliminates expensive in-line on/off
38, 39, switch
40 • Allows processor controlled turn
on/off
• Permits shutdown/wake-up of
peripherals via LAN or parallel port
Synchronization N/A* Single transistor • Synchronization to external lower
or optocoupler frequency signal
interface • Starts new switching cycle on
General Information & Table of Contentsdemand
Thermal Shutdown 125 °C min. Hysteretic 130 °C • Automatic recovery from thermal
Latched min. Shutdown (with fault
75 °C hysteresis) Product
• Selector Guide
Large hysteresis prevents circuit 1
board overheating
Current Limit Tolerance ±10% (@25 °C) ±7% (@25 °C) • 10% higher power capability due to
-8% (0 °C to100 °C) -4% Typical Data Sheets
tighter tolerance 2
(0 °C to 100 °C)
DRAIN DIP 0.037" / 0.94 mm 0.137" / 3.48 mm • Greater immunity to arcing as a
Creepage SMD 0.037" / 0.94 mm 0.137" / 3.48 mm Application Notes
result of build-up of dust, debris and 3
at Package TO-220 0.046" / 1.17 mm 0.068" / 1.73 mm other contaminants
DRAIN Creepage at
PCB for Y, R and F
0.045" / 1.14 mm
(R and F
0.113" / 2.87 mm
(preformed leads)
Design Ideas
• Preformed leads accommodate
large creepage for PCB layout
4
Packages Package N/A*) • Easier to meet Safety (UL/VDE)
Table 4 (cont). Comparison Between TOPSwitch-II and TOPSwitch-GX. *Not available Design Tools 5
TOPSwitch-FX vs. TOPSwitch-GX
Table 5 compares the features and performance differences Other features increase the robustness of design allowing cost
between TOPSwitch-GX and TOPSwitch-FX. Many of the new savings in the transformer and other power components.
features eliminate the need for additional discrete components.
Function TOPSwitch-FX DPA-Switch

TOPSwitch-GX DC-DCAdvantages
TOPSwitch-GX Seminar 8
Light Load Operation Cycle skipping Frequency and Duty Cycle • Improves light load efficiency
LinkSwitch & TinySwitch-II
reduction AC-DC
• Reduces Seminar
no-load consumption 9
Line Sensing/Externally Line sensing and Line sensing and externally • Additional design flexibility allows all
Set Current Limit externally set set current limit possible features to be used simultaneously
(Y, R and F Packages) current limit TOPSwitch-GX AC-DC Seminar 10
simultaneously
mutually (functions split onto
exclusive (M pin) L and X pins)
Current Limit 100-40%
100-30%
and Distributors 11
• Minimizes transformer core size
Programming in highly continuous designs
Range
Table 5. Comparison Between TOPSwitch-FX and TOPSwitch-GX. (continued on next page)
I
28 4/03
TOP242-250
Function TOPSwitch-FX TOPSwitch-GX TOPSwitch-GX Advantages
P/G Package Current Identical to Y TOP243P or G and • Matches device current limit to
Limits packages TOP244P or G internal package dissipation capability
current limits reduced • Allows more continuous design to
lower device dissipation (lower RMS
currents)
Y/R/F Package Current 100% (R and F 90% (for equivalent RDS (ON)) • Minimizes transformer core size
Limits package N/A*) • Optimizes efficiency for most
applications
Thermal Shutdown 125 °C min. 130 °C min. 75 °C • Allows higher output powers in
70 °C hysteresis hysteresis high ambient temperature
applications
Maximum Duty Cycle 90 µA 60 µA • Reduces output line frequency
Reduction Threshold ripple at low line
• DMAX reduction optimized for
forward design
Line Under-Voltage N/A* 40% of positive (turn-on) • Provides a well defined turn-off
Negative (turn-off) threshold threshold as the line voltage falls
Threshold
Soft-Start 10 ms (duty cycle) 10 ms (duty cycle + current • Gradually increasing current limit
limit) in addition to duty cycle during soft-
start further reduces peak current
and voltage
• Further reduces component
stresses during start up
Table 5 (cont). Comparison Between TOPSwitch-FX and TOPSwitch-GX. *Not available
TOPSwitch-GX Design Considerations Input Capacitor

The input capacitor must be chosen to provide the minimum DC
Power Table voltage required for the TOPSwitch-GX converter to maintain
Data sheet power table (Table 1) represents the maximum practi- regulation at the lowest specified input voltage and maximum
cal continuous output power based on the following conditions: output power. Since TOPSwitch-GX has a higher DCMAX than
TOP242 to TOP246: 12 V output, Schottky output diode, 150 V TOPSwitch-II, it is possible to use a smaller input capacitor.
reflected voltage (VOR) and efficiency estimates from curves con- For TOPSwitch-GX, a capacitance of 2 µF per watt is possible
tained in application note AN-29. TOP247 to TOP250: Higher for universal input with an appropriately designed transformer.
output voltages, with a maximum output current of 6 A.
Primary Clamp and Output Reflected Voltage VOR
For all devices, a 100 VDC minimum for 85-265 VAC and A primary clamp is necessary to limit the peak TOPSwitch-GX
250 VDC minimum for 230 VAC are assumed and sufficient heat drain to source voltage. A Zener clamp requires few parts and
sinking to keep device temperature ≤100 °C. Power takes up little board space. For good efficiency, the clamp
levels shown in the power table for the R package device Zener should be selected to be at least 1.5 times the output
assume 6.45 cm2 of 610 g/m2 copper heat sink area in an reflected voltage VOR as this keeps the leakage spike conduc-
enclosed adapter, or 19.4 cm2 in an open frame. tion time short. When using a Zener clamp in a universal input
application, a VOR of less than 135 V is recommended to allow
TOPSwitch-GX Selection for the absolute tolerances and temperature variations of the
Selecting the optimum TOPSwitch-GX depends upon required Zener. This will ensure efficient operation of the clamp circuit
maximum output power, efficiency, heat sinking constraints and will also keep the maximum drain voltage below the rated
and cost goals. With the option to externally reduce current breakdown voltage of the TOPSwitch-GX MOSFET.
limit, a larger TOPSwitch-GX may be used for lower power
applications where higher efficiency is needed or minimal heat
sinking is available.
I
4/03 29
TOP242-250
A high VOR is required to take full advantage of the wider DCMAX For 10 W or below, it is possible to use a simple inductor in
of TOPSwitch-GX. An RCD clamp provides tighter clamp place of a more costly AC input common mode choke to meet
voltage tolerance than a Zener clamp and allows a VOR as high as worldwide conducted EMI limits.
150 V. RCD clamp dissipation can be minimized by reducing
the external current limit as a function of input line voltage (see Transformer Design
Figure 21 and 35). The RCD clamp is more cost effective than It is recommended that the transformer be designed for
the Zener clamp but requires more careful design (see quick maximum operating flux density of 3000 Gauss and a peak flux
design checklist). density of 4200 Gauss at maximum current limit. The turns ratio
should be chosen for a reflected voltage (VOR) no greater than
Output Diode 135 V when using a Zener clamp, or 150 V (max) when using
The output diode is selected for peak inverse voltage, output RCD clamp with current limit reduction with line voltage
current, and thermal conditions in the application (including (overload protection).
heatsinking, air circulation, etc.). The higher DC MAX of
TOPSwitch-GX along with an appropriate transformer turns ratio For designs where operating current is significantly lower than
can allow the use of a 60 V Schoktty diode for higher efficiency the default current limit, it is recommended to use an externally
on output voltages as high as 15 V (see Figure 41. A 12 V, 30 W set current limit close to the operating peak current to reduce
design using a 60 V Schottky for the output diode). General Information & Table of Contents
peak flux density and peak power (see Figures 20 and 34). In
most applications, the tighter current limit tolerance, higher
Bias Winding Capacitor
80
PI-2576-010600
Due to the low frequency operation at no-load a 1 µF bias
winding capacitor is recommended. 70 TOPSwitch-II (no jitter)
60
Data Sheets 2
Amplitude (dBµV)
Soft-Start 50
Generally a power supply experiences maximum stress at
40
start-up before the feedback loop achieves regulation. For a
period of 10 ms the on-chip soft-start linearly increases the duty
cycle from zero to the default DCMAX at turn on. In addition, the
30
Application Notes 3
20
primary current limit increases from 85% to 100% over the same -10
period. This causes the output voltage to rise in an orderly
manner allowing time for the feedback loop to take control of the
0 Design Ideas 4
EN55022B (QP)
duty cycle. This reduces the stress on the TOPSwitch-GX -10 EN55022B (AV)
MOSFET, clamp circuit and output diode(s), and helps prevent
transformer saturation during start-up. Also soft-start limits the
-20
0.15 1
Design10Tools
30
5
amount of output voltage overshoot, and in many applications Frequency (MHz)
eliminates the need for a soft-finish capacitor. Quality and Reliability
Figure 46a. TOPSwitch-II Full Range EMI Scan 6
(100 kHz, no jitter).
EMI
The frequency jitter feature modulates the switching frequency 80
PI-2577-010600
over a narrow band as a means to reduce conducted EMI peaks 70 TOPSwitch-GX (with jitter)
associated with the harmonics of the fundamental switching 60
frequency. This is particularly beneficial for average detection DPA-Switch DC-DC Seminar 8
Amplitude (dBµV)
50
mode. As can be seen in Figure 46, the benefits of jitter increase
with the order of the switching harmonic due to an increase in 40
frequency deviation. LinkSwitch & TinySwitch-II
30 AC-DC Seminar 9
20
The FREQUENCY pin of TOPSwitch-GX offers a switching
frequency option of 132 kHz or 66 kHz. In applications that
require heavy snubbers on the drain node for reducing high
TOPSwitch-GX
-10
0
AC-DC Seminar 10
frequency radiated noise (for example, video noise sensitive EN55022B (QP)
-10 EN55022B (AV)
applications such as VCR, DVD, monitor, TV, etc.), operating at
-20
66 kHz will reduce snubber loss resulting in better efficiency.
and Distributors 11
0.15 1 10 30
Also, in applications where transformer size is not a concern, use
Frequency (MHz)
of the 66 kHz option will provide lower EMI and higher
efficiency. Note that the second harmonic of 66 kHz is still Figure 46b. TOPSwitch-GX Full Range EMI Scan (132 kHz,
below 150 kHz, above which the conducted EMI specifications with jitter) with Identical Circuitry and
Conditions.
get much tighter.
I
30 4/03
TOP242-250
switching frequency and soft-start features of TOPSwitch-GX Y-Capacitor

contribute to a smaller transformer when compared to The Y-capacitor should be connected close to the secondary
TOPSwitch-II. output return pin(s) and the positive primary DC input pin of
the transformer.
Standby Consumption
Frequency reduction can significantly reduce power loss at light Heat Sinking
or no load, especially when a Zener clamp is used. For very The tab of the Y package (TO-220) or F package (TO-262) is
low secondary power consumption use a TL431 regulator for internally electrically tied to the SOURCE pin. To avoid circu-
feedback control. Alternately, switching losses can be lating currents, a heat sink attached to the tab should not be
significantly reduced by changing from 132 kHz in normal electrically tied to any primary ground/source nodes on the PC
operation to 66 kHz under light load conditions. board.
TOPSwitch-GX Layout Considerations When using a P (DIP-8), G (SMD-8) or R (TO-263) package,

a copper area underneath the package connected to the
As TOPSwitch-GX has additional pins and operates at much SOURCE pins will act as an effective heat sink. On double
higher power levels compared to previous TOPSwitch sided boards (Figure 49), top side and bottom side areas
families, the following guidelines should be carefully connected with vias can be used to increase the effective heat
followed. sinking area.
Primary Side Connections In addition, sufficient copper area should be provided at the
Use a single point (Kelvin) connection at the negative terminal anode and cathode leads of the output diode(s) for heat
of the input filter capacitor for TOPSwitch-GX source pin and sinking.
bias winding return. This improves surge capabilities by
returning surge currents from the bias winding directly to the In Figures 47, 48 and 49 a narrow trace is shown between the
input filter capacitor. output rectifier and output filter capacitor. This trace acts as a
thermal relief between the rectifier and filter capacitor to
The CONTROL pin bypass capacitor should be located as prevent excessive heating of the capacitor.
close as possible to the SOURCE and CONTROL pins and its
SOURCE connection trace should not be shared by the main Quick Design Checklist
MOSFET switching currents. All SOURCE pin referenced
components connected to the MULTI-FUNCTION, LINE- As with any power supply design, all TOPSwitch-GX designs
SENSE or EXTERNAL CURRENT LIMIT pins should also should be verified on the bench to make sure that components
be located closely between their respective pin and SOURCE. specifications are not exceeded under worst case conditions.
Once again the SOURCE connection trace of these The following minimum set of tests is strongly recommended:
components should not be shared by the main MOSFET
switching currents. It is very critical that SOURCE pin 1. Maximum drain voltage – Verify that peak VDS does not
switching currents are returned to the input capacitor negative exceed 675 V at highest input voltage and maximum over-
terminal through a seperate trace that is not shared by the load output power. Maximum overload output power
components connected to CONTROL, MULTI-FUNCTION, occurs when the output is overloaded to a level just before
LINE-SENSE or EXTERNAL CURRENT LIMIT pins. This the power supply goes into auto-restart (loss of regulation).
is because the SOURCE pin is also the controller ground
reference pin. 2. Maximum drain current – At maximum ambient tempera-
ture, maximum input voltage and maximum output load,
Any traces to the M, L or X pins should be kept as short as verify drain current waveforms at start-up for any signs of
possible and away from the DRAIN trace to prevent noise transformer saturation and excessive leading edge current
coupling. LINE-SENSE resistor (R1 in figures 47-49) should spikes. TOPSwitch-GX has a leading edge blanking time
be located close to the M or L pin to minimize the trace length of 220 ns to prevent premature termination of the on-cycle.
on the M or L pin side. Verify that the leading edge current spike is below the
allowed current limit envelope (see Figure 52) for the drain
In addition to the 47 µF CONTROL pin capacitor, a high current waveform at the end of the 220 ns blanking period.
frequency bypass capacitor in parallel may be used for better
noise immunity. The feedback optocoupler output should also 3. Thermal check – At maximum output power, minimum
be located close to the CONTROL and SOURCE pins of input voltage and maximum ambient temperature, verify
TOPSwitch-GX. that temperature specifications are not exceeded for
TOPSwitch-GX, transformer, output diodes and output
I
4/03 31
TOP242-250
Safety Spacing Maximize hatched copper

areas ( ) for optimum
Y1- heat sinking
Capacitor
+ Output Rectifier
HV Output Filter Capacitor
Input Filter Capacitor
- PRI T
r
BIAS a SEC
n
s
PRI f
S S D o
r
m
e
TOPSwitch-GX
GeneralBIAS
r
TOP VIEW
M S S C
Opto-
R1 coupler
R2 - Data
DC +
Out
Sheets 2
PI-2670-042301
Figure 47. Layout Considerations for TOPSwitch-GX using P or G Packages. Application Notes 3
Design Ideas 4
Safety Spacing
+
Y1-
Capacitor
Design Tools
Maximize hatched copper 5
areas ( ) for optimum
heat sinking
HV Input Filter Capacitor Quality and Reliability
Output Rectifier 6
Output Filter Capacitor
-
T
r SEC
a
TOPSwitch-GX
n
s
8
D
f
o
LinkSwitch
X & TinySwitch-II AC-DC Seminar r
m
9
L
C e
TOP VIEW r
Opto- and Distributors 11
R1 Heat Sink coupler
- DC +
Out
PI-2669-042301
Figure 48. Layout Considerations for TOPSwitch-GX using Y or F Package.
I
32 4/03
TOP242-250
Solder Side Output Filter Capacitors

Safety Spacing
Component Side
Y1-
+ Capacitor
TOP VIEW
HV
T
PRI r
Input Filter
a
n
Capacitor PRI s
- SEC
f
R1a - 1c o
r
m
BIAS e
r
D
S
X
L - DC +
C Out
Opto- Maximize hatched copper
coupler
areas( ) for optimum
TOPSwitch-GX heat sinking
PI-2734-043001
Figure 49. Layout Considerations for TOPSwitch-GX using R Package.
capacitors. Enough thermal margin should be allowed for Design Tools

the part-to-part variation of the RDS(ON) of TOPSwitch-GX
For a discussion on utilizing TOPSwitch-GX in a forward
as specified in the data sheet. The margin required can converter configuration, please refer to the TOPSwitch-GX
either be calculated from the tolerances or it can be Forward Design Methodology Application Note.
accounted for by connecting an external resistance in
series with the DRAIN pin and attached to the same Up-to-date information on design tools can be found at the
heatsink, having a resistance value that is equal to the Power Integrations Web site: www.powerint.com
difference between the measured RDS(ON) of the device
under test and the worst case maximum specification.
I
4/03 33
TOP242-250
ABSOLUTE MAXIMUM RATINGS(1)

DRAIN Voltage ............................................ -0.3 to 700 V CONTROL Current ............................................... 100 mA
DRAIN Peak Current: TOP242 ............................... 0.72 A LINE SENSE Pin Voltage ................................ -0.3 to 9 V
TOP243 ............................... 1.44 A CURRENT LIMIT Pin Voltage ..................... -0.3 to 4.5 V
TOP244 ............................... 2.16 A MULTI-FUNCTION Pin Voltage .................... -0.3 to 9 V
TOP245 ............................... 2.88 A FREQUENCY Pin Voltage ............................... -0.3 to 9 V
TOP246 ............................... 4.32 A Storage Temperature ..................................... -65 to 150 °C
Operating Junction Temperature (2) ............... -40 to 150 °C
TOP247 ............................... 5.76 A
Lead Temperature (3) ............................................... 260 °C
TOP248 ............................... 7.20 A
Notes:
TOP249 ............................... 8.64 A 1. All voltages referenced to SOURCE, TA = 25 °C.
TOP250 ............................. 10.08 A 2. Normally limited by internal circuitry.
CONTROL Voltage .......................................... -0.3 to 9 V 3. 1/16" from case for 5 seconds.
THERMAL IMPEDANCE
Thermal Impedance: Y or F Package: Notes:
(θJA) (1) ....................................... 80 °C/W 1. Free standing with no heatsink.
(θJC) (2) ......................................... 2 °C/W 2. Measured at the back surface of tab. 1
P or G Package: 3. Soldered to 0.36 sq. inch (232 mm2), 2 oz. (610 gm/m2) copper clad.
(3)
(θJA) ...................... 70 °C/W ; 60 °C/W (4) 4. Soldered to 1 sq. inch (645 mm2), 2 oz. (610 gm/m2) copper clad.
Data Sheets
(θJC) ....................................... 11 °C/W 5. Measured on the SOURCE pin close to plastic interface.
(5) 2
R Package: 6. Soldered to 3 sq. inch (1935 mm2), 2 oz. (610 gm/m2) copper
(7)
(θJA) ... 80 °C/W ; 40 °C/W ; 30 °C/W (4) (6) clad.
Application Notes
(θJC) (5) ......................................... 2 °C/W 7. Soldered to foot print area, 2 oz. (610 gm/m2) copper clad. 3
Conditions Design Ideas 4
(Unless Otherwise Specified)
Parameter Symbol Min Typ Max Units
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 °C
Design Tools 5
CONTROL FUNCTIONS Quality and Reliability 6

FREQUENCY Pin
Switching IC = 3 mA; Connected to SOURCE
124 132 140
Frequency fOSC
TJ = 25 °C FREQUENCY Pin
Package Information
kHz 7
(average) Connected to CONTROL
61.5 66 70.5
Duty Cycle at DPA-Switch DC-DC Seminar 8

ONSET of Fre- DC(ONSET) 10 %
quency Reduction
Switching 132 kHz Operation 30
Frequency near fOSC (DMIN) kHz
0% Duty Cycle TOPSwitch-GX AC-DC
66 kHz Operation 15 Seminar 10
Frequency Jitter 132 kHz Operation ±4
∆f kHz
Deviation Sales Representatives
66 kHz Operation and
± 2 Distributors 11
Frequency Jitter fM
Modulation Rate 250 Hz
I
34 4/03
TOP242-250
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 °C
CONTROL FUNCTIONS
IL ≤ IL (DC) or IM ≤ IM(DC) 75 78 83
IL or IM = 190 µA
28 38 50
TOP242-245
Maximum Duty IL or IM = 100 µA
DCMAX 66.5
Cycle IC = ICD1 TOP242-245 %
IL or IM = 190 µA
33 41.3 49.5
TOP246-250
IL or IM = 100 µA
60 66.8 73.5
TOP246-250
Soft Start Time tSOFT TJ = 25 °C; DCMIN to DCMAX 10 15 ms
PWM Gain DCreg IC = 4 mA; TJ = 25 °C -28 -23 -18 %/mA
PWM Gain See Note A -0.01 %/mA/°C

Temperature Drift
TOP242-245 1.2 2.0 3.0
External Bias lB See Figure 7 TOP246-249 1.6 2.6 4.0
Current mA
TOP250 1.7 2.7 4.2
CONTROL TOP242-245 6.0 7.0

Current at 0% lC(OFF) TJ = 25 °C TOP246-249 6.6 8.0 mA
Duty Cycle TOP250 7.3 8.5
Dynamic ZC IC = 4 mA; TJ = 25 °C
Impedance 10 15 22 Ω
See Figure 51
Dynamic
Impedance 0.18 %/°C
Temperature Drift
CONTROL Pin 7 kHz
Internal Filter Pole
SHUTDOWN/AUTO-RESTART
CONTROL Pin VC = 0 V -5.0 -3.5 -2.0
lC (CH) TJ = 25 °C mA
Charging Current VC = 5 V -3.0 -1.8 -0.6
Charging Current
See Note A 0.5 %/°C
Temperature Drift
I
4/03 35
TOP242-250
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 °C
SHUTDOWN/AUTO-RESTART
Auto-restart Upper VC(AR)U V
5.8
Threshold Voltage
Auto-restart Lower VC(AR)L 4.5 4.8 5.1 V
Threshold Voltage
Auto-restart VC(AR)hyst 0.8 1.0 V
Hysteresis Voltage
Auto-restart Duty 4 8 %
DC(AR)
Cycle
Auto-restart
f(AR) 1.0 Hz
Frequency
MULTI-FUNCTION (M), LINE-SENSE (L) AND EXTERNAL CURRENT LIMIT (X) INPUTS
Data Sheets 2
Line Under-Voltage
Threshold Current
Threshold 44Application
50 54 Notes
µA
3
lUV TJ = 25 °C
and Hysteresis
Hysteresis 30 µA
(M or L Pin)
Design Ideas 4
Line Over-Voltage
Threshold 210 225 240 µA
or Remote ON/
OFF Threshold IOV TJ = 25 °C Design Tools 5
Current and Hys- Hysteresis 8 µA
teresis (M or L Pin)
L Pin Voltage
VL(TH) 0.5 1.0 1.6 V
Threshold
Remote ON/OFF Threshold
Package
-35 -27
Information
-20 µA
7
Negative Threshold IREM (N) TJ = 25 °C
Current and Hyster-
esis (M or X Pin) DPA-Switch DC-DC
Hysteresis 5 Seminar
µA 8
IL (SC) or
L or M Pin Short
Circuit Current IM (SC) LinkSwitch TinySwitch-II
V , V&= VL M 300 AC-DC
400
C Seminar
520 µA 9
IX (SC) or Normal Mode -300 -240 -180
X or M Pin Short VX, VM = 0 V µA
Circuit Current IM (SC) TOPSwitch-GX
-110 AC-DC
Auto-restart Mode
-90 -70Seminar 10
lL or lM = 50 µA 1.90 2.50 3.00
L or M Pin Voltage VL, VM V
(Positive Current) Sales Representatives
l or l = 225 µA
L 2.30 and
2.90 Distributors
M 3.30 11
X Pin Voltage lX = -50 µA 1.26 1.33 1.40
VX V
(Negative Current) lX = -150 µA 1.18 1.24 1.30
M Pin Voltage lM = -50 µA 1.24 1.31 1.39
VM V
(Negative Current) lM = -150 µA 1.13 1.19 1.25
I
36 4/03
TOP242-250
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 °C
MULTI-FUNCTION (M), LINE-SENSE (L) AND EXTERNAL CURRENT LIMIT (X) INPUTS
Maximum Duty
Cycle Reduction IL (DC) or
TJ = 25 °C 40 60 75 µA
Onset Threshold IM (DC)
Current
Remote OFF X, L or M Pin 0.6 1.0
ID(RMT) See Figure 70 Floating
DRAIN Supply mA
Current VDRAIN = 150 V L or M Pin Shorted 1.0 1.6
to CONTROL
Remote ON Delay tR(ON) From Remote On to Drain Turn-On 2.5 µs

See Note B
Remote OFF Minimum Time Before Drain Turn-On

tR(OFF) to Disable Cycle 2.5 µs
Setup Time
See Note B
FREQUENCY INPUT
FREQUENCY Pin VF 2.9 V
See Note B
Threshold Voltage
FREQUENCY Pin IF VF = VC 10 40 100 µA
Input Current
CIRCUIT PROTECTION
TOP242 P/G Internal
TOP242 Y/R/F 0.418 0.45 0.481
TJ= 25 °C di/dt=90 mA/µs
TOP243 P/G Internal

TJ= 25 °C di/dt=150 mA/µs 0.697 0.75 0.802
TOP243 Y/R/F Internal

TJ= 25 °C di/dt=180 mA/µs 0.837 0.90 0.963
TOP244 P/G Internal
TJ= 25 °C 0.930 1.00 1.070
Self Protection di/dt=200 mA/µs
Current Limit ILIMIT A
(See Note C) TJ= 25 °C di/dt=270 mA/µs 1.256 1.35 1.445
TJ= 25 °C di/dt=360 mA/µs 1.674 1.80 1.926
TJ= 25 °C di/dt=540 mA/µs 2.511 2.70 2.889
TJ= 25 °C di/dt=720 mA/µs 3.348 3.60 3.852
TJ= 25 °C di/dt=900 mA/µs 4.185 4.50 4.815
I
4/03 37
TOP242-250
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 °C
CIRCUIT PROTECTION
Self Protection TJ= 25 °C di/dt=1080 mA/µs
5.022 5.40 5.778
ILIMIT
Current Limit A
(See Note C) TJ= 25 °C 5.859 6.30 6.741
di/dt=1260 mA/µs
≤ 85 VAC 0.75 x
(Rectified Line Input) ILIMIT(MIN)
Initial Current Limit IINIT See Note B A
265 VAC 0.6 x
(Rectified Line Input) ILIMIT(MIN)
Leading Edge See Figure 52
tLEB 220 ns
Blanking Time TJ = 25 °C, IC = 4 mA
Current Limit Delay tIL(D) IC = 4 mA 100 ns
Data Sheets 2
Thermal Shutdown 130 140 150 °C
Temperature
Application Notes 3
Thermal Shutdown 75 °C
Hysteresis
Power-up Reset
Design Ideas 4
VC(RESET) Figure 53, S1 Open 1.75 3.0 4.25 V
Threshold Voltage
OUTPUT Design Tools 5
TOP242 TJ = 25 °C 15.6 18.0
ID = 50 mA TJ = 100 °C Quality 25.7
and Reliability
30.0 6
TOP243 TJ = 25 °C 7.80 9.00
ID = 100 mA TJ = 100 °C Package Information
12.9 15.0 7
TOP244 TJ = 25 °C 5.20 6.00
ID = 150 mA TJ = 100 °C 8.60 10.0
DPA-Switch DC-DC
TJ = 25 °C 3.90
Seminar
4.50
8
ON-State TOP245
RDS(ON) ID = 200 mA TJ = 100 °C 6.45 7.50 Ω
Resistance
LinkSwitch
TOP246 & TinySwitch-II
T = 25 °C AC-DC Seminar
J 2.60 3.00 9
ID = 300 mA TJ = 100 °C 4.30 5.00
TJ = 25 °C
TOP247
ID = 400 mA
TJ = 100 °C
1.95 2.25
3.22 3.75
TOP248 TJ = 25 °C 1.56 1.80
Sales
I = 500 mARepresentatives and Distributors 11
D
TJ = 100 °C 2.58 3.00
TOP249 TJ = 25 °C 1.30 1.50
ID = 600 mA TJ = 100 °C 2.15 2.50
I
38 4/03
TOP242-250
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 °C
OUTPUT
ON-State TOP250 TJ = 25 °C 1.10 1.28
RDS(ON) Ω
Resistance ID = 700 mA TJ = 100 °C 1.85 2.15
Off-State Drain VL, VM = Floating; IC = 4 mA
IDSS 470 µA
Leakage Current VDS = 560 V; TJ = 125 °C
Breakdown VL, VM = Floating; IC = 4mA
BVDSS 700 V
Voltage See Note D, TJ = 25 °C
Rise Time tR 100 ns

Measured in a Typical
Flyback Converter Application
Fall Time tF 50 ns
SUPPLY VOLTAGE CHARACTERISTICS

DRAIN Supply See Note E 36 V
Voltage
Shunt Regulator VC(SHUNT) IC = 4 mA 5.60 5.85 6.10 V
Voltage
Shunt Regulator ±50 ppm/°C
Temperature Drift
Output TOP242-245 1.0 1.6 2.5
lCD1 MOSFET Enabled TOP246-249 1.2 2.2 3.2
Control Supply/ VX, VL, VM = 0 V TOP250 1.3 2.4 3.65 mA
Discharge Current
Output
lCD2 MOSFET Disabled 0.3 0.6 1.3
VX, VL, VM = 0 V
NOTES:
A. For specifications with negative values, a negative temperature coefficient corresponds to an increase in
magnitude with increasing temperature, and a positive temperature coefficient corresponds to a decrease in
magnitude with increasing temperature.
B. Guaranteed by characterization. Not tested in production.
C. For externally adjusted current limit values, please refer to Figure 55 (Current Limit vs. External Current Limit
Resistance) in the Typical Performance Characteristics section.
D. Breakdown voltage may be checked against minimum BVDSS specification by ramping the DRAIN pin voltage up to
but not exceeding minimum BVDSS.
E. It is possible to start up and operate TOPSwitch-GX at DRAIN voltages well below 36 V. However, the
CONTROL pin charging current is reduced, which affects start-up time, auto-restart frequency, and auto-restart
duty cycle. Refer to Figure 67, the characteristic graph on CONTROL pin charge current (IC) vs. DRAIN voltage
for low voltage operation characteristics.
I
4/03 39
TOP242-250
t2
t1
HV
90% 90%
DRAIN t
D= 1
VOLTAGE t2
10%
0V
PI-2039-033001
Figure 50. Duty Cycle Measurement.
PI-2022-033001
tLEB (Blanking Time)
120 1.3
PI-1939-091996
1.2
DRAIN Current (normalized)

CONTROL Pin Current (mA)
100 1.1 Product Selector Guide 1

1.0
80 0.9
0.8
IINIT(MIN) @ 85 VAC Data Sheets 2
0.7
60 IINIT(MIN) @ 265 VAC
0.6
40
0.5
0.4
Application Notes
ILIMIT(MAX) @ 25 °C
3
Dynamic 1 ILIMIT(MIN) @ 25 °C
= 0.3
Impedance Slope
20 0.2
0.1
Design Ideas 4
0 0
0 2 4 6 8 10 0 1 2 3 4 5 6 7 8
CONTROL Pin Voltage (V)
Design Tools
Time (µs) 5
Figure 51. CONTROL Pin I-V Characteristic. Figure 52. Drain Current Operating Envelope.
Y or R Package (X and L Pin)
Package Information P or G Package (M Pin)
7
S1 470 Ω 0-100 kΩ
5W 0-100 kΩ
DPA-Switch DC-DC Seminar S5

8
5-50 V M
5-50 V
0-60 kΩ
40 V LinkSwitch & TinySwitch-II AC-DC Seminar L D
9
470 Ω CONTROL
C C TOPSwitch-GX
S2 TOPSwitch-GX AC-DC Seminar 10 F X S
S4
0-15 V
S3
47 µF 0.1 µF
Sales Representatives and Distributors 11 0-60 kΩ
NOTES: 1. This test circuit is not applicable for current limit or output characteristic measurements.
2. For P and G packages, short all SOURCE pins together. PI-2631-042303
Figure 53. TOPSwitch-GX General Test Circuit.
I
40 4/03
TOP242-250
BENCH TEST PRECAUTIONS FOR EVALUATION OF ELECTRICAL CHARACTERISTICS
The following precautions should be followed when testing while in this auto-restart mode, there is only a 12.5% chance
TOPSwitch-GX by itself outside of a power supply. The sche- that the CONTROL pin oscillation will be in the correct state
matic shown in Figure 53 is suggested for laboratory testing of (drain active state) so that the continuous drain voltage wave-
TOPSwitch-GX. form may be observed. It is recommended that the VC power
supply be turned on first and the DRAIN pin power supply
When the DRAIN pin supply is turned on, the part will be in second if continuous drain voltage waveforms are to be
the auto-restart mode. The CONTROL pin voltage will be observed. The 12.5% chance of being in the correct state is
oscillating at a low frequency between 4.8 and 5.8 V and the due to the divide-by-8 counter. Temporarily shorting the
drain is turned on every eighth cycle of the CONTROL pin CONTROL pin to the SOURCE pin will reset TOPSwitch-GX,
oscillation. If the CONTROL pin power supply is turned on which then will come up in the correct state.
Typical Performance Characteristics

PI-2653-042203
1.1
Scaling Factors:
1.0 TOP242 P/G/Y/R/F: .45 200
TOP243 P/G: .75
0.9 TOP243 Y/R/F: .90 180
TOP244 P/G: 1
Current Limit (A)
0.8 TOP244 Y/R/F: 1.35 160
di/dt (mA/µs)
TOP245 Y/R/F: 1.80
0.7 TOP246 Y/R/F: 2.70 140
TOP247 Y/R/F: 3.60
0.6 TOP248 Y/R/F 4.50 120
TOP249 Y/R/F: 5.40
0.5 TOP250 Y/R/F: 6.32 100
0.4 80
0.3 60
0.2 40
-250 -200 -150 -100 -50 0
IM (µA)
Figure 54. Current Limit vs. MULTI-FUNCTION Pin Current.
PI-2652-042303
1.1
Scaling Factors:
1.0 TOP242 P/G/Y/R/F: .45 200
TOP243 P/G: .75
0.9 TOP243 Y/R/F: .90 180
TOP244 P/G: 1
Current Limit (A)
0.8 TOP244 Y/R/F: 1.35 160

di/dt (mA/µs)
Maximum
TOP245 Y/R/F: 1.80
0.7 TOP246 Y/R/F: 2.70
140
Minimum
TOP247 Y/R/F: 3.60
0.6 TOP248 Y/R/F 4.50
120
Typical TOP249 Y/R/F: 5.40
0.5 100
TOP250 Y/R/F: 6.32
0.4 80
Maximum and minimum levels
0.3 are based on characterization. 60
0.2 40
0 5K 10K 15K 20K 25K 30K 35K 40K 45K
External Current Limit Resistor RIL (Ω)
Figure 55. Current Limit vs. External Current Limit Resistance.
I
4/03 41
TOP242-250
Typical Performance Characteristics (cont.)

1.1 1.2
PI-1123A-033001
PI-176B-033001
1.0
(Normalized to 25 °C)
Output Frequency
Breakdown Voltage
0.8
1.0 0.6
0.4
0.2
0.9 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (°C) General Information & Temperature
Junction Table of (°C) Contents
Figure 56. Breakdown Voltage vs. Temperature. Figure 57. Frequency vs. Temperature.
1.2
1.2
PI-2555-033001
PI-2554-033001
1.0 1.0 Data Sheets 2
Current Limit
Current Limit
0.8 0.8
Application Notes 3
0.6 0.6
0.4 0.4 Design Ideas 4

0.2 0.2
Design Tools 5
0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (°C) Quality and Reliability

Junction Temperature (°C) 6
Figure 58. Internal Current Limit vs. Temperature. Figure 59. External Current Limit vs. Temperature
with RIL =12 kΩ.
1.2 1.2
PI-2553-033001
PI-2552-033001

Under-Voltage Threshold
Overvoltage Threshold
1.0 1.0
0.8 0.8
0.6 0.6
0.4 TOPSwitch-GX
0.4 AC-DC Seminar 10
0.2 0.2
0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (°C) Junction Temperature (°C)
Figure 60. Overvoltage Threshold vs. Temperature. Figure 61. Under-Voltage Threshold vs. Temperature.
I
42 4/03
TOP242-250

6.0 1.6
PI-2688-102700
PI-2689-102300
VX = 1.33 - IXx 0.66 kΩ
LINE SENSE Pin Voltage (V)
EXTERNAL CURRENT LIMIT

5.5 1.4
-200 µA ≤ IX ≤ -25 µA
5.0 1.2
Pin Voltage (V)

4.5 1.0
4.0 0.8
3.5 0.6
3.0 0.4
2.5 0.2
2.0 0
0 100 200 300 400 -240 -180 -120 -60 0
LINE-SENSE Pin Current (µA) EXTERNAL CURRENT LIMIT Pin Current (µA)
Figure 62a. LINE-SENSE Pin Voltage vs. Current. Figure 62b. EXTERNAL CURRENT LIMIT Pin Voltage
vs. Current.
6 1.6
PI-2541-102700
PI-2542-102700
MULTI-FUNCTION Pin Voltage (V)
MULTI-FUNCTION Pin Voltage (V)

VM = 1.37 - IMx 1 kΩ
1.4
5 -200 µA ≤ IM ≤ -25 µA
1.2
4
1.0
3 0.8
0.6
2
0.4
See
1 Expanded
Version 0.2
0 0
-300 -200 -100 0 100 200 300 400 500 -300 -250 -200 -150 -100 -50 0
MULTI-FUNCTION Pin Current (µA) MULTI-FUNCTION Pin Current (µA)
Figure 63a. MULTI-FUNCTION Pin Voltage vs. Current. Figure 63b. MULTI-FUNCTION Pin Voltage vs.
Current (Expanded).
1.2 1.2
PI-2562-033001
PI-2563-033001
Onset Threshold Current
1.0 1.0
CONTROL Current
0.8 0.8
0.6 0.6
0.4 0.4
0.2 0.2
0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (°C) Junction Temperature (°C)
Figure 64. Control Current Out at 0% Duty Cycle vs. Figure 65. Max. Duty Cycle Reduction Onset Threshold
Temperature. Current vs. Temperature.
I
4/03 43
TOP242-250

6 2
PI-2564-101499
PI-2645-010802
VC = 5 V
Charging Current (mA)

1.6
DRAIN Current (A)
CONTROL Pin
4
1.2
Scaling Factors:
3 TOP250 1.17
TOP249 1.00 0.8
TOP248 0.83
2 TOP247 0.67
TOP246 0.50
TOP245 0.33 0.4
1 TOP244 0.25
TCASE = 25 °C TOP243 0.17
TCASE = 100 °C TOP242 0.08
0 0
0 2 4 6 8 10 12 14 16 18 20 0 20 40 60 80 100
DRAIN Voltage (V) General InformationDRAIN
& Table
Voltage (V) of Contents
Figure 66. Output Characteristics. Figure 67. IC vs. DRAIN Voltage.
10000 600
PI-2646-010802
PI-2650-020802
Scaling Factors:
TOP250 1.17
Data Sheets 2
DRAIN Capacitance (pF)
500
TOP249 1.00
Scaling Factors: TOP248 0.83
1000 TOP250 1.17 400 TOP247 0.67
Power (mW)
TOP246 0.50
TOP249 1.00
TOP248 0.83
TOP247 0.67
TOP245 0.33
TOP244 0.25
Application Notes 3
300 TOP243 0.17
TOP246 0.50
TOP245 0.33 TOP242 0.08
100 TOP244 0.25
TOP243 0.17
200 Design Ideas 4
TOP242 0.08
100
Design Tools 5
10 0
0 100 200 300 400 500 600
0 100 200 300 400 500 600
Drain Voltage (V) Quality and (V)
DRAIN Voltage Reliability 6
Figure 68. COSS vs. DRAIN Voltage. Figure 69. DRAIN Capacitance Power.
Remote OFF DRAIN Supply Current
1.2
PI-2690-102700
1.0
0.8
LinkSwitch
0.6
& TinySwitch-II AC-DC Seminar 9
0.4
0.2
Sales
0
Representatives and Distributors 11
-50 0 50 100 150
Junction Temperature (°C)
Figure 70. Remote OFF DRAIN Supply Current
vs. Temperature.
I
44 4/03
TOP242-250
PART ORDERING INFORMATION

TOPSwitch Product Family
GX Series Number
Package Identifier
G Plastic Surface Mount DIP
(242, 243 & 244 only)
P Plastic DIP
Y Plastic TO-220-7C
R Plastic TO-263-7C (available only with TL option)
F Plastic TO-262
Package/Lead Options
TOP 242 G - TL Blank Standard Configurations

TL Tape & Reel, (G Package: 1000 min., R Package: 750 min.)
TO-220-7C
.165 (4.19)
.185 (4.70)
.390 (9.91) .045 (1.14)
.146 (3.71) .420 (10.67) .055 (1.40)
.156 (3.96)
.108 (2.74) REF
+ .234 (5.94)
.261 (6.63)
.461 (11.71) .570 (14.48)

.495 (12.57) REF.
7° TYP. .670 (17.02)
.860 (21.84) REF.
.880 (22.35)
.080 (2.03)
.120 (3.05)
PIN 1 & 7 PIN 2 & 4
PIN 1 .024 (.61) .040 (1.02)

.010 (.25) M
.034 (.86) .060 (1.52)
.050 (1.27) BSC .012 (.30) .040 (1.02)
.024 (.61) .060 (1.52)
.150 (3.81) BSC
.190 (4.83)
.210 (5.33)
.050 (1.27)
.050 (1.27) Notes:
1. Controlling dimensions are inches. Millimeter
dimensions are shown in parentheses.
.050 (1.27) 2. Pin numbers start with Pin 1, and continue
.050 (1.27) from left to right when viewed from the front.
3. Dimensions do not include mold flash or
other protrusions. Mold flash or protrusions
.200 (5.08) .180 (4.58)
shall not exceed .006 (.15mm) on any side.
.100 (2.54) 4. Minimum metal to metal spacing at the pack-
PIN 1 PIN 7 age body for omitted pin locations is .068
inch (1.73 mm).
.150 (3.81) .150 (3.81) 5. Position of terminals to be measured at a
location .25 (6.35) below the package body.
MOUNTING HOLE PATTERN
6. All terminals are solder plated.
Y07C
PI-2644-112202
I
4/03 45
TOP242-250
DIP-8B
⊕ D S .004 (.10) Notes:
-E- 1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
.240 (6.10)
protrusions. Mold flash or protrusions shall not exceed
.260 (6.60)
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
Pin 1 5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
.367 (9.32) 6. Lead width measured at package body.
-D- 7. Lead spacing measured with the leads constrained to be
.387 (9.83)
.057 (1.45) perpendicular to plane T.
.068 (1.73)
(NOTE 6)
.125 (3.18) .015 (.38)
.145 (3.68) MINIMUM
-T-
SEATING .008 (.20)
PLANE .120 (3.05) .015 (.38)
.140 (3.56) Data Sheets 2
.300 (7.62) BSC
.100 (2.54) BSC .048 (1.22) (NOTE 7)
.014 (.36)
.053 (1.35) .300 (7.62) Application Notes
P08B 3
.022 (.56) ⊕ T E D S .010 (.25) M .390 (9.91) PI-2551-041003
SMD-8B
Design Ideas 4
⊕ D S .004 (.10)
Design Tools
Notes:
1. Controlling dimensions are
5
inches. Millimeter sizes are
-E- shown in parentheses.
2. Dimensions shown do not
include mold flash or other
6
protrusions. Mold flash or
protrusions shall not exceed
.240 (6.10)
.260 (6.60)
.372 (9.45)
.388 (9.86) Package Information
.420
.006 (.15) on any side.
3. Pin locations start with Pin 1,
7
⊕ E S .010 (.25) and continue counter-clock
.046 .060 .060 .046 Pin 8 when viewed from the
DPA-Switch DC-DC Seminar top. Pin 6 is omitted.
4. Minimum metal to metal
8
.080 spacing at the package body
Pin 1 Pin 1
for the omitted lead location
.100 (2.54) (BSC) .086
.186
is .137 inch (3.48 mm).
5. Lead width measured at
9
package body.
.286
.367 (9.32) 6. D and E are referenced
-D-
.387 (9.83) TOPSwitch-GX AC-DC Seminar 10
Solder Pad Dimensions datums on the package
body.
.057 (1.45)
.125 (3.18) .068 (1.73)
.145 (3.68) Sales Representatives and Distributors 11
(NOTE 5)
.004 (.10)
.032 (.81) .048 (1.22)
.053 (1.35)
.009 (.23) .004 (.10) .036 (0.91) 0°- 8°
.037 (.94)
.012 (.30) .044 (1.12) G08B
PI-2546-041003
I
46 4/03
TOP242-250
TO-263-7C
.390 (9.91) .245 (6.22)
.420 (10.67) min. .045 (1.14)
.055 (1.40) .055 (1.40)
.066 (1.68)
.225 (5.72)
.326 (8.28) min.
.336 (8.53) .580 (14.73)
.620 (15.75)
.000 (0.00)
.208 (5.28) .010 (0.25)
Ref. .090 (2.29)
-A- .110 (2.79)
.010 (0.25)
LD #1
.012 (0.30)
.024 (0.61) .100 (2.54) .050 (1.27) .024 (0.61)
.034 (0.86) Ref. 0°- 8°
.315 (8.00)
Solder Pad
Dimensions .165 (4.19)
.380 (9.65) .185 (4.70)
.004 (0.10)
.638 (16.21) Notes:

1. Package Outline Exclusive of Mold Flash & Metal Burr.
2. Package Outline Inclusive of Plating Thickness.
.128 (3.25) 3. Foot Length Measured at Intercept Point Between
Datum A Lead Surface.
.050 (1.27) 4. Controlling Dimensions are in Inches. Millimeter
R07C
.038 (0.97) Dimensions are shown in Parentheses. PI-2664-112702
I
4/03 47
TOP242-250
TO-262-7C
.045 (1.14)
.390 (9.91) .055 (1.40)
.420 (10.67) .165 (4.17)
.055 (1.40) .185 (4.70)
.066 (1.68)
.326 (8.28) .495 (12.56)

.336 (8.53) 7° TYP. REF.
.795 (20.18) .595 (15.10)
REF. REF.
.080 (2.03)
.120 (3.05)
PIN 1 & 7 PIN 2 & 4
PIN 1 .024 (.61)

.034 (.86)
General Information & .040
.010 (.25) M Table
(1.02)
.060 (1.52)
of Contents
.050 (1.27) BSC .012 (.30) .040 (1.06)
.024 (.61) .060 (1.52)
.150 (3.81) BSC
Product
.190 (4.83) Selector Guide 1
.210 (5.33)
.050 (1.27)
.050 (1.27) Notes: Data Sheets 2
1. Controlling dimensions are inches. Millimeter
dimensions are shown in parentheses.
.050 (1.27) 2. Pin numbers start with Pin 1, and continue
.050 (1.27)
Application Notes
from left to right when viewed from the front. 3
3. Dimensions do not include mold flash or
other protrusions. Mold flash or protrusions
.200 (5.08) .180 (4.58)
.100 (2.54) Design Ideas
shall not exceed .006 (.15mm) on any side.
4. Minimum metal to metal spacing at the pack- 4
PIN 1 PIN 7 age body for omitted pin locations is .068
inch (1.73 mm).
.150 (3.81) .150 (3.81) Design Tools
5. Position of terminals to be measured at a
location .25 (6.35) below the package body.
5
MOUNTING HOLE PATTERN
6. All terminals are solder plated.
F07C
Quality and Reliability PI-2757-112202 6

I
48 4/03
TOP242-250
Notes
I
4/03 49
TOP242-250
Notes
Data Sheets 2
Application Notes 3
Design Ideas 4
Design Tools 5

I
50 4/03
TOP242-250
Revision Notes Date

D - 11/00
E 1) Added R package (D2PAK). 7/01
2) Corrected abbreviations (s = seconds).
3) Corrected x-axis units in Figure 11 (µA).
4) Added missing external current limit resistor in Figure 25 (RIL).
5) Corrected spelling.
6) Added caption for Table 4.
7) Corrected Breakdown Voltage parameter condition (TJ = 25 °C).
8) Corrected font sizes in figures.
9) Figure 40 replaced.
10) Corrected schematic component values in Figure 44.
F 1) Corrected Power Table value. 9/01
G 1) Added TOP250 device and F package (TO-262). 1/02
2) Added R package Thermal Impedance parameters and adjusted Output Power values in Table 1.
3) Adjusted Off-State Current value.
H 1) Added note to parameter table for Breakdown Voltage measurement. 9/02
2) Miscellaneous text corrections.
I 1) Updated P, Y, R and F package information. 4/03
2) Revised thermal impedances (θJA) for all package types.
3) Expanded Maximum Duty Cycle and deleted Maximum Duty Cycle Reduction Slope parameters.
4) Corrected DIP-8B and SMD-8B Package Drawings.
I
4/03 51
TOP242-250
For the latest updates, visit our Web site: www.powerint.com
PATENT INFORMATION
Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not
assume any liability arising from the use of any device or circuit described herein, nor does it convey any license under its patent rights or the rights of others. 1
The products and applications illustrated herein (including circuits external to the products and transformer construction) may be covered by one or more U.S.
and foreign patents or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations’ patents
may be found at www.powerint.com. Data Sheets 2
LIFE SUPPORT POLICY
POWER INTEGRATIONS' PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES Application Notes 3
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS, INC. As used herein:
1. Life support devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when
Design Ideas
properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 4
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
Design Tools 5
The PI logo, TOPSwitch, TinySwitch, LinkSwitch and EcoSmart are registered trademarks of Power Integrations, Inc.
PI Expert and DPA-Switch are trademarks of Power Integrations, Inc. ©Copyright 2003, Power Integrations, Inc.
WORLD HEADQUARTERS EUROPE & AFRICA SINGAPORE TAIWAN
AMERICAS Power Integrations (Europe) Ltd. Power Integrations, Singapore Power Integrations
Power Integrations, Inc.
5245 Hellyer Avenue
Centennial Court
Easthampstead Road
51 Goldhill Plaza #16-05 Package Information
Republic of Singapore 308900
International Holdings, Inc.
17F-3, No. 510
7
San Jose, CA 95138 USA Bracknell Phone: +65-6358-2160 Chung Hsiao E. Rdl,
Main: +1 408-414-9200 Berkshire, RG12 1YQ Fax: +65-6358-2015 Sec. 5,
Customer Service: United Kingdom DPA-Switch DC-DC Seminar
e-mail: singaporesales@powerint.com Taipei, Taiwan 110, R.O.C. 8
Phone: +1 408-414-9665 Phone: +44-1344-462-300 Phone: +886-2-2727-1221
Fax: +1 408-414-9765 Fax: +44-1344-311-732 Fax: +886-2-2727-1223
e-mail: usasales@powerint.com
e-mail: eurosales@powerint.com e-mail: taiwansales@powerint.com
9
CHINA KOREA JAPAN INDIA (Technical Support)
Power Integrations Power Integrations Power Integrations, K.K. Innovatech
Rm# 1705, Block A, Bao Hua Bldg.
8th Floor, DongSung Building,
Keihin-Tatemono 1st Bldg.
12-20 Shin-Yokohama 2-Chome
#1, 8th Main Road
Vasanthnagar
1016 Hua Qiang Bei Lu 17-8 Yoido-dong, Youngdeungpo-gu, Kohoku-ku, Yokohama-shi, Bangalore, India 560052
Shenzhen Guangdong, 518031 Seoul, 150-874, Korea Kanagawa 222-0033, Japan Phone: +91-80-226-6023
China Phone: Sales Representatives and Distributors 11
+82-2-782-2840 Phone: +81-45-471-1021 Fax: +91-80-228-9727
Phone: +86-755-8367-5143 Fax: +82-2-782-4427 Fax: +81-45-471-3717 e-mail: indiasales@powerint.com
Fax: +86-755-8377-9610 e-mail: koreasales@powerint.com e-mail: japansales@powerint.com
e-mail: chinasales@powerint.com
APPLICATIONS HOTLINE APPLICATIONS FAX

World Wide +1-408-414-9660 World Wide +1-408-414-9760
I
52 4/03

Topswitch GX: - Family

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®

Figure 2a. Functional Block Diagram (Y, R or F Package).

STOP LOGIC HYSTERETIC

Figure 2b. Functional Block Diagram (P or G Package).

Pin Functional Description FREQUENCY (F) Pin: (Y, R or F package only)

remote ON/OFF and synchronization. A connection to For RIL = 12 kΩ

Y Package (TO-220-7C) - Package Information

TOPSwitch-GX Family Functional Description

In addition to the three terminal TOPSwitch features, such as

TOPSwitch-GX offers many new transparent features that do I = 190 µA

TOP242-5 1.6 2.0 5.2 6.0

Quality and Reliability 6

S7 S0 S1 S2 S6 S7 S0 S1 S2 DPA-Switch DC-DC Seminar

oscillator sets the pulse width modulator/current limit latch at

Line Under-Voltage Detection (UV)

Oscillator DPA-Switch DC-DC Seminar 8

LinkSwitch & TinySwitch-II AC-DC Seminar 9

TOPSwitch-GX AC-DC Seminar 10

Figure 10. Synchronization Timing Diagram.

General Information & Table of Contents

Product Selector Guide 1

Quality and Reliability 6

LinkSwitch & TinySwitch-II AC-DC Seminar 9

TOPSwitch-GX AC-DC Seminar 10

Using Feature Pins

LINE-SENSE AND EXTERNAL CURRENT LIMIT PIN TABLE*

Table 2. Typical LINE-SENSE and EXTERNAL CURRENT LIMIT Pin Configurations.

MULTI-FUNCTION PIN TABLE*

Table 3. Typical MULTI-FUNCTION Pin Configurations.

IREM(N) IUV IOV

Disabled when supply I

X and L Pins (Y, R or F Package) and M Pin (P or G Package) Current (µA)

(Negative Current Sense - ON/OFF,

General Information & Table of Contents

Product Selector Guide PI-2634-010802

P and G Package Application Notes 3

LinkSwitch & TinySwitch-II AC-DC Seminar PI-2548-092399 9

TOPSwitch-GX AC-DC Seminar 10

Typical Uses of FREQUENCY (F) Pin

Figure 15. Half Frequency Standby Mode (For High Standby

+ + VUV = IUV x RLS

For Value Shown For Values Shown

DC See fig. 55 for other DC

S X Sales Representatives and Distributors 11 S X

+ VUV = IUV x RLS

VUV = IUV x RLS +

Product Selector Guide 1

Quality and Reliability 6

LinkSwitch & TinySwitch-II AC-DC Seminar 9

TOPSwitch-GX AC-DC Seminar 10

Typical Uses of MULTI-FUNCTION (M) Pin

For Value Shown For Values Shown

Typical Uses of MULTI-FUNCTION (M) Pin (cont.)

Figure 36. Active-on (Fail Safe) Remote ON/OFF.

Product Selector Guide 1

Figure 40. Active-off Remote ON/OFF with LINE-SENSE.

Application Examples provides line sensing, setting UV at 100 VDC and OV at

VR1 D3 Quality and Reliability

Figure 43. 250 W, 48 V Power Supply using TOP249.

Figure 44. 60 W Multiple Output Power Supply using TOP246.

LOGIC LOGIC 1N4148

Figure 45. Remote ON/OFF using Microcontroller.

Quality and Reliability 6