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Nanodielectrics Applications—Today
and Tomorrow
Key words: nanodielectrics, nano-sized fillers, epoxy insulation, silicone insulation, applications, rotating
machine insulation, outdoor insulation, GIS spacers, power electronic device insulation
Figure 7. Comparison between micron-sized and nano-sized natural silica filled silicone rubber in
terms of eroded mass loss after inclined plane testing [10].
High-Temperature Applications
Dielectric materials have relatively low thermal conductivity,
and many applications require not only high dielectric strength
but also high thermal conductivity to remove heat. In industry,
epoxy composites containing ~50 wt% micron-sized silica are
currently used as packaging material for power electronic de-
vices like IGBTs, and although silica has high electrical resistiv-
ity and low dielectric constant, its low thermal conductivity is a
limitation of having high thermal conductivity packaging. Other
fillers such as silicon carbide and zinc oxide have high thermal
Figure 8. Eroded mass of silicone rubber composites with mi- conductivity but also have high permittivity, limiting their ap-
cron-sized silica (m) and nano-sized fumed silica (nfs) and with plications in dielectric materials. At low volume fractions, na-
Triton surfactant (T) after exposure to laser ablation (dry-band no-sized fillers do little to improve the thermal conductivity of
arcing). The average eroded mass is represented by the dot; the nanodielectrics [10]. In addition, most studies so far have been
25th and 75th percentiles are represented by the horizontal lines limited to studying the thermal conductivity of nanodielectrics,
of the bars [13]. but thermal expansion and breakdown strength are other impor-
tant properties critical to microelectronic packaging and insula-
tion applications.
heat ablation is obtained, but this comes about only with good
dispersion of the nano-sized filler. Commercial formulations of
high temperature vulcanized silicone rubber containing both mi-
cron-sized and nano-sized silica for injection molding of insula-
tors have been developed [14]. In other work, electrospinning as
a technique to further improve dispersion of nano-sized filler has
shown improvements in the resistance to laser heat ablation of
silicone rubber compositions (Figure 9) [15].
Tomorrow’s Applications
Tomorrow’s applications in the electrical power industry en-
compass a wide spectrum of materials that can be grouped into
four distinct applications that are specific to one or more im-
provements in the dielectric properties, namely, increased stress
applications, higher temperature applications, stress grading ap-
plications, and surface modification applications.