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Acta Materialia
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a r t i c l e i n f o a b s t r a c t
Article history: Cold spraying is a solid-state powder deposition process with several unique characteristics, allowing
Received 1 April 2016 production of coatings or bulk components from a wide range of materials. The process has attracted
Received in revised form much attention from academia and industry over the past two decades. The technical interest in cold
13 June 2016
spraying is twofold: first as a coating process for applications in surface technology, and second as a
Accepted 14 June 2016
Available online 27 June 2016
solid-state additive manufacturing process, offering an alternative to selective laser melting or electron
beam melting methods. Moreover, cold spraying can be used to study materials behaviour under
extremely high strain rates, high pressures and high cooling rates. The cold spraying process is thus
Keywords:
Cold spraying
considered to be relevant for various industrial applications, as well as for fundamental studies in ma-
Coating terials science. This article aims to provide an overview of the cold spray process, the current under-
Additive manufacturing standing of the deposition mechanisms, and the related models and experiments, from a materials
Deposition mechanism science perspective.
Deformation © 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
http://dx.doi.org/10.1016/j.actamat.2016.06.034
1359-6454/© 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
H. Assadi et al. / Acta Materialia 116 (2016) 382e407 383
processes, as in Refs. [24,25]. In view of relevant physical phe- reaching supersonic velocities [13,27]. Fig. 2 shows an overview of a
nomena, however, CS is most closely related to explosive powder high-pressure CS system. In this system, a fluidised powder feed-
shock compaction, magnetic pulse welding (MPW) [26] and stock is fed to the process gas upstream, i.e. at high pressure before
explosive welding. Likewise, some of the conventional thermal entering the nozzle. The particles of the powder are thus acceler-
spraying processes, such as arc or plasma spraying where there is ated by the process gas, reaching high velocities of up to 1200 m/s
extensive melting and resolidification, may be best compared to or more. The particle temperature upon impact can be 1000 K or
fusion welding from the viewpoint of solidification science. This more, depending on the process conditions. Powder preheating is
paper covers principles of CS, put into perspective by considering attained through a powder heater installed between the powder
common features of material deposition methods using high- feeder and the gun [28], or more conventionally, through an
velocity impact. A brief review of the key CS parameters and elongated prechamber just before the nozzle.
typical material systems are also presented. The focus of the present paper is on high-pressure CS, where the
gas pressure is typically above 1 MPa, the particles are micron-
2. Principle and setup sized, and the operation is conducted at open air or under near-
atmospheric pressure. Variations and modifications of CS are not
The main technical objective in CS is to ensure that the particles covered in this review. Some of these variations are briefly
of the feedstock powder impinge the substrate at or beyond a mentioned below.
critical velocity. This is achieved by means of a pressurised and
preheated process gas e typically nitrogen, in some cases helium e 2.1. Low-pressure cold spray
that expands through a (converging/diverging) de Laval nozzle,
Low-pressure cold spray system and high-pressure system were
developed in parallel. There is substantial difference between the
1
1 indicates dimensionless quantity. two processes in terms of the size and the cost of the available
384 H. Assadi et al. / Acta Materialia 116 (2016) 382e407
Fig. 1. Trend of interest in cold spray research as measured by the number of publi-
cations per year, as compared to that in plasma spraying and high-velocity oxy-fuel
spraying (data extracted from scopus.com).
s ¼ ð A þ Bεn Þ 1 þ C ln_ε* 1 qm (1)
Fig. 4. Lagrangian-based FEM simulation of impact of a copper particle on copper substrate, assuming adiabatic conditions [40]. The contours and the arrows correspond to strain
and velocity fields, respectively.
such as temperature, during impact of a copper particle on a steel to be fully adiabatic or not; ASI may occur prematurely if heat
substrate for different impact velocities. These simulations indi- transfer is not considered. The role of heat transfer can be used as a
cated formation of material jets at the outer rim of the contact zone, basis to study the effect of particle size on the occurrence of ASI
similar to that observed in explosive welding, at impact velocities during impact [45]. According to Eq. (2), deformation in larger
higher than 400 m/s. Following this work, Assadi et al. simulated particles is more adiabatic, so that ASI becomes more prominent
particle impact using the Lagrangian formulation in Abaqus/ with increasing particle size. As shown in Fig. 6, ASI occurs only
Explicit [40], with a focus on the evolution of the field variables when both particle impact velocity and particle size are beyond a
near the interacting surfaces. Examples of the simulated deforma- certain value.
tion patterns are shown in Fig. 4. The prediction of ASI preceded experimental evidence, and
A main outcome of these simulations was to demonstrate that hence may be regarded as a significant outcome of simulations. An
adiabatic shear instability (ASI) could occur at the particle/substrate equally important prediction concerned the location and the extent
interface during particle impact. ASI was signified by sudden and of ASI. As shown in Fig. 7, ASI occurs initially at the outer rim of the
prominent rise in the plastic strain at the interacting surfaces, Fig. 5. particle/substrate contact zone. With the increase of particle
A number of factors e both physical and computational e were impact velocity, the ASI area extends from the circumference of the
found to influence the occurrence of ASI in the simulation of par- crater towards its centre. According to this prediction, the ASI never
ticle impact. Physical factors include density, strength, melting reaches the centre of crater regardless of the particle impact
temperature and specific heat of the interacting materials. These velocity.
factors will be discussed in more detail in the next section on Several other studies have used FEM to investigate particle
bonding criteria. A most important computational factor is the impact and deformation under various impact conditions and
mesh size, which strongly affects ASI; the coarser the mesh, the material combinations [45,52e58]. Most of these studies are based
higher the threshold impact velocity to induce shear instability. on Lagrangian formulation implemented in commercial software. A
Another computational factor is whether deformation is considered general feature in Lagrangian-based FEM (L-FEM) simulations is
Fig. 5. Calculated development of (a) maximum plastic strain and (b) maximum temperature on the surface of a copper particle impacting onto a copper substrate. Adiabatic shear
instability is indicated by a sudden rise in these variables, if the impact velocity exceeds 550 m/s by 30 m/s [40].
H. Assadi et al. / Acta Materialia 116 (2016) 382e407 387
Fig. 6. Calculated development of maximum temperature on the surface of (a) 5 mm, and (b) 15 mm copper particle impacting onto a copper substrate at different impact velocities.
Adiabatic shear instability occurs only in the larger particle, at or beyond 500 m/s [45].
that they can demonstrate ASI at the particle/substrate interface at Both Lagrangian and Eulerian finite-element methods are
high impact velocities. L-FEM is also considered to be computa- mesh-based. There have also been attempts to simulate particle
tionally more efficient. Nevertheless, L-FEM can be associated with impact using mesh-free methods, such as smoothed-particle hy-
excessive mesh distortion and hence unrealistic development of drodynamics (SPH) and molecular dynamics (MD). SPH is in
the deformation pattern. This problem does not exist in Eulerian- principle a Lagrangian method in the sense that the nodes move
based FEM (E-FEM), which offers a more realistic account of the with the material. Examples of application of SPH to cold spray
deformation geometry, Fig. 8. research include the work by Manap et al. [60] and Li et al. [61].
Despite achieving realistic deformation patterns, most of the SPH does not have the problems associated with mesh-based
existing examples of particle impact simulation using E-FEM are in methods, but at the price of a generally low spatial resolution.
quasi-2D domains and also lack sufficient resolution to show ASI Similar to mesh-based methods, SPH does not simulate directly
unequivocally. Moreover, definition of surface interaction is not the process of bonding and rebounding. MD in contrast resolves
straightforward in E-FEM; by default the respective interacting material deformation on atomistic length scales e and can hence
bodies ‘bond’ together as soon as they come into contact. Note that be used to simulate bonding e but it is limited to small systems,
continuum-level modelling methods as mentioned above do not namely to nanoparticles. The few existing examples of simulation
directly simulate the process of bonding and rebounding. Instead, of particle impacts using MD are limited to ceramic nanoparticles,
they simulate the physical phenomena that relate to bonding, which are relevant to aerosol deposition [62,63]. The main ob-
namely plastic deformation and heat transfer. The bonding in jectives in these simulations are: (1) to shed light on the bonding
standard E-FEM is therefore only artificial. With the implementa- mechanism, and (2) to understand mechanism of deformation in
tion of E-FEM in commercial software, nevertheless, this method is essentially non-deformable ceramic materials. Unlike continuum-
again being used more commonly in the study of particle impact in level methods, MD is particularly suitable to simulate the process
CS; see e.g. Ref. [56]. Contrary to the initial presumptions, ASI may of bonding. Preliminary results of MD simulations show that
be appropriately diagnosed in E-FEM [59]. An interesting example deformation of brittle materials may be possible through
of the application of E-FEM to particle impact in CS is the study of consecutive fracture and bonding, which is associated with grain
the deformation behaviour of oxide films on metallic particles by refinement, Fig. 10. Bonding can nevertheless happen only at
Yin et al. [56]. Interestingly, the concept of a surface oxide layer may certain combinations of particle size and particle impact velocity;
be employed as a basis to simulate bonding and rebounding. Fig. 9 high velocities or large particles may lead to fragmentation
shows an example of how this might be achieved. In this way, the instead of deformation and bonding. There are no indications of
bonding and rebounding process are simulated directly, without ASI or material jetting in the existing MD simulations of particle
the need to diagnose ASI. impact.
Fig. 7. Calculated development of (a) the temperature profiles along a meridian path on a copper particle impacting onto a copper substrate, and (b) the corresponding areas of
shear instability at the particle/substrate interface, for different impact velocities [51]. The dashed line in (a) indicates the threshold of the area shear instability, while the arrows
indicate the outer rim of the contact zone. The weighted distance in (a) is the square root of the respective inscribed contact area normalised with reference to the initial particle
surface area.
388 H. Assadi et al. / Acta Materialia 116 (2016) 382e407
Fig. 8. Comparison between large-scale impact experiment [45] and Eulerian-based FEM simulation, for 20-mm copper ball impacted onto a steel substrate at 750 m/s.
Overall, numerical simulation of particle impact in CS has shown through consecutive fracture and bonding. In this case, large par-
the following important features. For the case of metallic materials, ticles are more susceptible to fragmentation.
the deformation is highly non-uniform. It may be associated with
the occurrence of ASI, which forms initially at the outer rim of the 3.2. Bonding criteria
contact zone and extends e with increasing impact velocity e to-
wards the centre. The ASI region never fully covers the contact In cold spray deposition, there are two distinct types of bonding
zone. Moreover, when considering heat transfer, the threshold that should be distinguished from one another: (i) particle-to-
impact velocity to induce ASI is shown to increase with decreasing substrate bonding, which is necessary for the formation of the
particle size. That is, large particles are more prone to ASI. For the first layer of particles, hence relevant for the adhesion strength of
case of brittle materials and nanoparticles, deformation may occur the coating to the substrate, and (ii) particle-to-particle bonding,
Fig. 9. Simulation of bonding and rebounding of superficially oxidised copper particle impacting onto a copper substrate, using Eulerian-based FEM. The oxide layer is described by
a pressure-dependent yield model, allowing dilation under tensile stress [245]. The model parameters are set in such a way that rebounding occurs only when the impact velocity is
below 260 m/s, in agreement with the results of large-scale impact tests [45].
H. Assadi et al. / Acta Materialia 116 (2016) 382e407 389
Fig. 10. Results of MD simulations for a 35-nm ‘brittle’ particle impacting a rigid substrate at 375 m/s, showing (a) snapshot of the atomic positions, (b) Fast Fourier transform (FFT),
i.e. ‘diffraction pattern’ of this, and (c) inverse FFT of a filtered diffraction pattern to make the grain structure more visible [63]. The letters in (a) signify the grains formed as a result
of impact.
which concerns the build-up of the cold-sprayed deposit, hence compress and stretch the interfacial region via plastic deformation,
relevant for the cohesive strength and physical properties of the as shown schematically in Fig. 11. As will be discussed below,
deposited material. A major part of the published work on CS fo- bonding in CS is conceived to relate to this type of interfacial
cuses on the latter basic question, although there is equally much deformation, which leads to breakup of oxide layers and contact of
interest in the former from a practical viewpoint, particularly in metallic surfaces at atomic level. Thus, the oxide layer should be
applications where coating and substrate materials are dissimilar. considered as a geometrical constraint and not an ‘energy barrier’
Generally, bonding takes place as soon as atomically-flat clean to metallurgical bonding.
surfaces of two components are brought into contact. In principle,
this can occur without a need for heating, fusion or mechanical 3.2.1. The role of shear instability
interlocking. In practice, however, surfaces of metallic components The results of modelling of particle impact and deformation as
are rarely flat and are usually covered by an oxide layer. In order to discussed in section 3.1 do not directly explain the physics of
induce solid-state bonding, therefore, the surface oxide layers bonding in CS. Nevertheless, they shed light on the mechanism of
should be removed or broken up to allow exposure and tight interface deformation (Figs. 4e6) and oxide breakup (Fig. 9), which
contact of clean metallic surfaces. One way to achieve this is to are prerequisites for solid-state bonding. As suggested by various
Fig. 11. Schematics of interfacial plastic deformation resulting in cold welding. Under high strains, there is contact between fresh metallic surfaces and grain boundaries are formed
between the two metals.
390 H. Assadi et al. / Acta Materialia 116 (2016) 382e407
Fig. 13. Lagrangian-based FEM simulation of impact at 400 m/s of copper on copper, for (a) diameter of 50 mm, 100 ns after initial contact, and (b) diameter of 50 mm, 100 ms after
initial contact. The mesh size in (b) is also 1000 times larger than that in (a). Heat conduction and strain-rate hardening are not considered.
H. Assadi et al. / Acta Materialia 116 (2016) 382e407 391
Fig. 14. Microstructure of Al-3 wt. % Cu plates, bonded together using an impact velocity (velocity of the flyer plate in the vertical direction) of 285 m/s and an impact angle of 8.6 .
The dark precipitates (q0 phase) are stretched up to more than 10 times their original length near the bond zone [65]. Equiaxed nanograins are formed at the interface.
explosive welding. Based on the elongation of the precipitates in Study of explosive welding thus reveals common characteristics
this example, the plastic strain in this region is accurately evaluated of solid-state bonding due to high-velocity impact, as follows:
to be in excess of 1000%, which is a manifestation of ASI at the Bonding (a) occurs above a certain impact velocity; (b) does not
contact surfaces. In this example, there is a grain-refined region at occur below a certain impact angle; (c) results from ASI; (d) is
the centre of the bond zone. The grain refinement may have associated with large plastic strains of above 1000%; (d) features
resulted from dynamic recrystallization, though it was originally recrystallization and grain-refinement. The analogy between
attributed to melting and re-solidification [65]. Similar micro- bonding characteristics in explosive welding and CS has also been
structural features have also been observed in magnetic pulse considered as a basis to devise laser shock experiments [67] as a
welding [66]. micron-scale physical model of particle impact in CS. These ex-
In explosive welding bonding takes place for certain combina- periments resemble explosive welding geometrically, but relate to
tions of impact angle and impact velocity, Fig. 15. For the case of particle impact in terms of system size.
Al-3 wt. % Cu plates, bonding occurs only if the impact velocity of An alternative large-scale physical model of CS was set up by
the flyer plate is between 200 and 500 m/s, and the impact angle is Schmidt et al. [45], where 20-mm spherical projectiles (balls) were
within a certain range. The impact angle and the impact velocity shot onto a substrate using a military gun. As compared to explosive
determine the velocity of the collision point e the point of contact welding, these experiments were geometrically more similar to CS,
between the flyer plate and substrate e which should be below the with the additional advantage that the impact velocity could be
speed of sound for successful bonding. accurately measured and controlled. Examples of ball impact tests
are shown in Fig. 16. In analogy with the observations in explosive
welding, the plastic strain near the interface can be in excess of
1000%, as evaluated considering elongation of grains in the steel
substrate. There is also grain refinement indicating dynamic
recrystallization in the copper ball near the interface. The magni-
tude of strain and the extent of recrystallization depend, never-
theless, on the location in the contact zone; deformation and grain
refinement is less prominent at the centre of the contact zone as
compared to its periphery. A most important feature is that
metallurgical bonding does not occur at the central region of the
contact zone e i.e. around the ‘south pole’ of the particle, the first
point of contact with the substrate. The prediction that there is no
bonding at the south pole of large-scale impact has been verified
experimentally e via tensile testing of miniature specimens cut out
from different locations over the interface e for copper on copper,
copper on steel, and steel on steel [68]. Lack of bonding at the
centre of contact zone of the interface is visually evident for the
case of copper on aluminium, Fig. 16d.
Fig. 16. Large impact tests with 20 mm copper ball shot onto (a)e(c) steel, and (d) aluminium substrates. The grains of the steel substrate (b) are elongated more than 10 times (c),
and the grains of the copper ball (a) are severely refined near the interface [45]. There is no indication of bonding at the centre of impact zone in (d) [140]. The average width of the
perspective shown in (d) is approximately 60 mm.
These experiments produce samples that are most closely related experimental evaluation of the plastic strain near the contact re-
to real cold-spray deposition, both in geometry and in length scale, gion is not feasible. Therefore, ASI and severe plastic deformation of
though with differences in surface temperature of the substrate. A the interfacial region may only be indirectly diagnosed, e.g. in view
major downside of wipe-test is that the impact conditions of the of features related to jet formation or bonding.
individual deposited particles are never exactly known. Moreover, Fig. 17 shows examples of such features; they clearly indicate jet
unlike in explosive welding (Fig. 14) or large impact tests (Fig. 16), formation and bonding during impact of single micron-sized
Fig. 17. SEM micrographs of single particle impacts in cold spraying, showing (a) jetting [40], (b) residues of a rebounded particle on the substrate at the outer rim of the contact
zone [51], (c) residues of substrate on a detached particle (by ultrasonic cavitation), and (d) imprint on the substrate, as a result of impact and detachment of a part of substrate
material, related to (c) [69].
H. Assadi et al. / Acta Materialia 116 (2016) 382e407 393
the constituents has sufficient ductility to embed the other. In this particles cool down to temperatures below Tg. Impact temperatures
case, bonding between soft and hard particles would not be a have been estimated to be 130e340 C for CS of NiTiZrSiSn or
critical issue, as long as there is sufficient bonding between the soft Zr55Al10Ni5Cu30 with helium [16,84,85], well below the respective
embedding particles. Clearly, this works out only if the volume glass transition temperatures. It has been argued that the temper-
fraction of the hard constituent is meant to be below a certain limit. ature may rise locally at the particle-substrate interface [89]. The
This is so because the amount of hard phase in the deposit is always temperature may indeed rise locally to very high values in BMGs
lower than that in the feedstock; it reaches a saturation limit due to shear banding [83,87]. On the other hand, as a precursor to
depending on the size and properties of the hard and soft shear banding, disorder by deformation may be responsible for
constituents. local strain and strain-rate softening of metallic glasses [90,91]. It is
not yet clear which mechanism plays a more dominant role in cold-
spray deposition of BMGs.
3.2.6. Bonding of brittle materials Despite the very short exposure of particles to the gas stream
A broader question concerns the mechanism of bonding for (about maximum 0.003 s), a significant amount of the originally
intrinsically brittle materials, such as ceramics, metallic glasses and amorphous structure may crystallize at increased gas tempera-
WC-metal composites (cermets). Ceramic materials have been tures. The crystallization mostly occurs at the particle-particle in-
successfully deposited by aerosol deposition or vacuum cold terfaces, as shown by TEM investigations [89,92,93]. This is because
spraying. Also, high-pressure CS has been used for the deposition of of exceeding the corresponding crystallization temperature, Tx, and
metallic glasses. Despite the sporadically successful experiments, incubation time [87]. To verify this, one would need to work out the
CS of brittle materials is yet to be fully explored. For the case of thermal history of the interfacial region [89,92], which is deter-
ceramic materials, initial theoretical investigations using molecular mined by the interplay between the heat conduction and the heat
dynamics (discussed above) indicate that deposition is possible generation by deformation. Such an analysis is complicated
between two limiting impact velocities, Fig. 19. because the incubation time for crystallization decreases drastically
In addition, deposition of ceramics by AD seems to be viable with increasing strain rate [94,95].
only when the particle size is below a certain limit. The role of Interestingly, the deposition efficiency of BMGs passes through a
particle size is also evident in CS of ceramics and cermets. In both maximum by increasing the process gas temperature or pressure
cases, deposition has been successful only when agglomerates of [87,96]. Too high pressures or temperatures lead to particle
small particulates with certain levels of porosity were used. There is detachment and rebound [96,97]. An example of partial detach-
so far little information on the mechanism of deformation and ment of a particle is shown in Fig. 20. Detachment occurs whenever
bonding of such agglomerates. the interface is liquefied (T > Tg) and so, cannot withstand the
Bulk metallic glasses (BMGs) may also be classified as intrinsi- rebounding elastic forces. Successful deposition occurs only if the
cally brittle materials. Nevertheless, metallic glasses exhibit interface cools down fast enough, so that the viscosity increases to
different modes of deformation based on the temperature, loading sufficiently high values, or the temperature falls below Tg. This
conditions and geometry [83]. The deposition mechanism of conjecture has been experimentally verified, by demonstrating
metallic glasses is equally complex and not yet fully understood. decreased deposition efficiencies attained on preheated substrates
Some features in bonding and deposition of metallic glasses by CS [96].
are discussed below.
Study of individual splat morphologies indicates a mixture of
shear banding and localised viscous flow throughout the particle. 3.3. Quantification of the critical condition for bonding
There is also interface softening as a result of ASI, similar to that in
crystalline materials [84,85]. A presumption is that the particle The critical velocity for bonding in CS can be evaluated experi-
temperature should be above Tg, allowing for viscous flow of the mentally, by correlating the (measured or calculated) particle
material in the undercooled liquid state [86]. Recent investigations impact velocity with the measured deposition efficiency (DE) of the
on Fe73Cr2Si11B11C3 attribute successful deposition to viscous flow corresponding powder [27]. It can also be estimated through nu-
at high (>103) Reynolds numbers [87,88]. This interpretation merical simulation of particle impact, considering that bonding and
cannot explain experiments with helium as process gas, where ASI occur at the same particle impact velocity [40]. Moreover, the
following expression has been used to fit the evaluated critical
velocities for identical coating/substrate materials [45]:
qffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi
vcr ¼ as=r þ bcp Tm Tp (3)
s ¼ sUTS ð1 qÞ (4)
Fig. 20. Example of particle rebounds and interface separation during cold spraying of amorphous Cu50Zr50 particle; (a) schematics, and (b) SEM of partial detachment [96].
function of adiabaticity [98]. The size-dependence of critical ve- thermal energy of particle required for bonding at zero kinetic
locity has been worked out and verified experimentally for copper. energy. Likewise, the reference kinetic energy Ek0 may be inter-
The size dependence for nickel has been estimated using FEM preted as the minimum kinetic energy of particle required for
simulations [99]. bonding at zero thermal energy. Thus, Eq. (6) is nothing more than a
Prediction of the critical velocity and its dependence on particle rearrangement of Eq. (3), in which Ek0 is simply 12v2cr at Tp ¼ Tref . In
size has also been estimated through alternative criteria for view of these considerations, a dimensionless energy-based
bonding. Examples of alternative criteria for bonding include those deposition parameter can be defined as follows:
based on the adhesion energy and rebound energy [100], and on
the evolution of maximum plastic strain, as worked out by E-FEM
. .
hE ¼ Ek þ Eth where Ek ¼ Ek Ek0 and Eth ¼ Eth Eth
0
(7)
simulations [101]. Moreover, the critical velocity has been shown to
be influenced by surface oxidation of the particles of the feedstock In fact, hE may be considered as a general characteristic
[102e104]. Higher surface oxidation normally results in increased parameter for both thermal and cold spraying, and the necessary
critical velocity. Clearly, smaller particles are more affected by condition for deposition can be expressed as:
surface oxidation, because of their larger surface to volume ratio.
Thus, surface oxidation should be considered as a factor in the
study of size-dependence of the critical velocity, in addition to that
hE 1 (8)
relating to adiabaticity. Further work is needed to refine the A property of the above criterion for deposition is that it does
analytical basis for the prediction of the critical velocity, for not concern the question of exceeding a critical velocity; instead, it
instance, to include the effect of oxide layer, non-linear thermal concerns exceeding a critical normalized energy content. Based on
softening behaviour, or the effect of substrate material properties. this, the window of deposition can be plotted on an energy dia-
Considering the role of particle temperature in bonding, Fig. 18, gram, where the critical conditions are signified by a straight line,
one may equally think of a ‘critical temperature’ for bonding. That 0 and E0 on the corresponding axes, Fig 21.
connecting Eth k
is, at a fixed impact velocity, increasing particle temperature
beyond a certain value results in bonding. Based on this viewpoint,
the critical condition for bonding may be formulated more gener-
ally in terms of the total energy of the particle upon impact, as
described below. It should be stressed nevertheless that the
following formulation does not include new theoretical analyses; it
is only a rewriting of the above criterion for bonding in terms of
newly defined parameters. The total energy per unit mass of a
particle can be considered to be the sum of two parts, the kinetic
energy and a nominal thermal energy, as follows
1
E ¼ Ek þ Eth where Ek ¼ v2p and Eth ¼ cp Tp Tref (5)
2
Note that the nominal thermal energy as defined here is
different from the real thermal energy, in that it disregards the
latent heat of fusion at temperatures higher than Tm. At the critical
impact condition for bonding, the following relations hold:
0
Eth jcr ¼ Eth q; where Eth
0
¼ cp ðTm Tref Þ (6a)
Fig. 22. Tensile (cohesive) strength of cold-sprayed copper coatings as a function of (a) particle impact velocity, and (b) ratio of particle impact velocity to the critical velocity [98].
There is a unique correlation between the cohesive strength and the velocity ratio, regardless of the particle size and spraying conditions.
The postulation of the energy parameter is different from that of impact) combined with thermal misfit may result in complex re-
the velocity ratio h ¼ vp =vcr [98], in that the two components of sidual stress profiles. These unfavourable effects can be alleviated
energy in hE are normalised individually. This means that there is by appropriate post heat treatments, or by substrate preheating, to
no unique critical energy for bonding. It can be shown that the induce recovery and recrystallization. A brief discussion of the
following relationship exists between the normalised energy microstructures and properties of cold-sprayed deposits are given
parameter and the velocity ratio: below.
hE ¼ h2 ð1 qÞ þ q (9)
4.1. Microstructure
The above relationship implies that at higher particle temper-
atures, the energy parameter becomes independent of the velocity
There are three important microstructural features that are
ratio. Likewise, the energy parameter correlates well with the
commonly found in most cold-sprayed deposits: (1) severe plastic
velocity ratio at lower temperatures.
deformation as signified by a high density of dislocations and other
defects, (2) grain refinement due to dynamic recrystallization,
4. Deposit characteristics particularly near the interfaces, and (3) non-bonded interfaces,
namely at the centre of impact zones. These features appear to be
CS should be considered both as a coating method and as an common not only in cold spraying, but also in the closely-related
alternative to conventional AM for the production of bulk compo- process of warm spraying [105]. Another aspect of cold-sprayed
nents. Therefore, the relevant deposit properties concern both microstructures is that they are highly anisotropic [106]. Proper-
standard coating properties, such as adhesion strength, and the ties of cold-sprayed deposits are to a large extent influenced by
common bulk properties. Examination of various properties of these features. Fig. 23 shows an example of the microstructure of
cold-sprayed deposits shows that in many cases there is a unique cold-sprayed copper, showing various types of lattice defects near a
correlation between the property and the normalised impact particle-particle interface.
velocity, h ¼ v=vcr [98]. This is shown, as an example, for copper in Dislocations are among the most prominent defects in cold
Fig. 22. sprayed deposits. They can be homogeneously distributed or pile
It should be noted that the correlation between properties and up into dislocation walls. Moreover, dislocations can form persis-
velocity ratio is not universal, and that it is best applicable to low tent nano-sized loops that do not vanish by annealing, with im-
particle temperatures. For instance, near the melting temperature plications on the mechanical and electrical properties of the
the critical velocity approaches zero and hence the velocity ratio deposit [108]. The density of dislocations can be different from one
becomes infinitely large. At higher temperatures, therefore, the material to the other; e.g. it is normally higher for aluminium as
data might be better interpreted in view of the energy parameter, compared to copper and nickel [109], presumably due to differ-
Eq. (7). This needs to be explored in future work. In any case, ences in the stacking fault energy. On the other hand, the disloca-
interpretation of cold-sprayed deposit properties can be discussed tion density can be very low in nanograins of aluminium alloys; i.e.
conveniently in view of these normalised velocity or energy in feedstock materials that are already nanocrystalline before
parameters. spraying [110]. This is regarded as a common feature in the defor-
On a microscopic level, properties of cold-sprayed deposits are mation of nanocrystalline materials, where grain boundaries play a
inherited from their microstructure and state of deformation. major role in the mechanism of plastic deformation.
Generally, cold-sprayed deposits that are produced under optimum An example of electron backscatter diffraction (EBSD) maps of
conditions exhibit microstructures and properties similar to those cold-sprayed copper is shown in Fig. 24. The figure shows regions of
of highly cold-worked bulk material, e.g. high yield strength and highly deformed materials near the particle-particle interfaces, but
low elongation to failure. Moreover, high densities of lattice defects also a relatively high amount of misorientation within the particles.
restrict electron mobility and thus degrade conductivity. The same In the image quality (IQ) map the grey level correlates roughly with
applies to the central regions of the particle-particle interfaces, the severity of plastic deformation and lattice defects. Moreover,
which are not metallurgically bonded. The non-bonded interfaces the bright streaks (green in the colour version) in the kernel
also act as crack nuclei under tensile loading. Further to these average misorientation (KAM) map correspond to rotation gradi-
structural deficiencies, the shot-peening effect (due to particle ents, which correlate roughly with the density of GNDs. Note that
H. Assadi et al. / Acta Materialia 116 (2016) 382e407 397
Fig. 23. TEM micrograph of a cold-sprayed copper coating, showing various micro-
structural features, including (A) dislocation walls, (B) elongated nanograins, (C)
equiaxed nanograins, and (D) a micron-sized dislocation-free grain containing twins
[107].
Table 1
Summary of the effect of process parameters on the impact conditions.
critical velocity and for numerical simulations of particle impact. subsequent layers. This effect is nevertheless limited only to a few
While this is a valid assumption for density and heat capacity, the particle layers, i.e. to a few tens of microns. After about 50 mm,
strength and plastic properties of micron-sized particles as used for the already deposited material deforms in the same way as in a
CS may be substantially different from that of bulk material. For much thicker deposit.
some materials e such as MCrAlYs, which are produced in the For very soft substrates such as polymers cold-spray deposition
powder form e the bulk material data may not even exist. There- may require using relatively low particle velocities and tempera-
fore, it may be necessary to obtain mechanical strength of the single tures, to allow successful deposition without eroding the substrate
particles, e.g. through single particle compression tests as described away. Examples of metallic coatings on polymer substrates are
in Ref. [41]. In combination with numerical simulation of particle given in Refs. [153e157]. Low velocities may also be used for
compression, a simple correlation has been worked out between coating deposition of metals on ceramics, to avoid fracture of the
the ultimate tensile strength and the force, F*, at a displacement generally brittle substrate. Additionally, deposition of metals on
equal to half of the initial particle diameter, dp , as follows: ceramics may be facilitated by using an interlayer [158] e or by
substrate preheating, as discussed below.
F* Particle bonding is influenced not only by the particle temper-
sUTS zð0:9±0:1Þ (10)
d2p ature, but also by the surface temperature of the substrate or the
already deposited layers on which the particles impact [159]. Note
For the case of copper particles, the single-particle compression that the surface temperature is different from the initial substrate
tests have shown a significant difference between particle and bulk temperature. It is influenced by various factors including the initial
properties. substrate temperature, spraying conditions, spraying kinematics
and the thermal properties and dimensions of the substrate. The
effect of substrate preheating on bonding is demonstrated for CS of
5.3. Substrate
magnesium [160], aluminium [161], copper [162,163], nickel [164]
and steel 316L [165]. The trend and the intensity of this effect
Substrate hardness influences the adhesion between the coating
depend on the combination of coating-substrate materials and on
and the substrate. This can be explained in terms of particle
the surface oxidation of the substrate, which may occur due to
deceleration, or the ‘impact power’, which is the rate of kinetic
excessive preheating time or temperature [166]. For the case of
energy dissipation during impact of a single particle. In CS, the
copper sprayed on ceramic (alumina) substrates, increased sub-
impact power is typically around 50 W. For harder substrates, the
strate temperature resulted in significant increase of not only the
impact power is higher and the heat generation is restricted to
adhesive strength, but also the overall coating quality [167]. This
smaller volumes, leading to more pronounced temperature rise and
may be attributed to partial recovery of the deposit during
facilitated ASI on the particle side. Likewise, an impacting particle
spraying.
penetrates more deeply into a softer substrate, facilitating ASI on
Substrate roughness may also play a role; e.g. it can lead to
the substrate side, while particle deceleration and the corre-
higher deposition efficiency of the first layer [168]. However, it may
sponding impact power may be lower. The adhesion strength is
not necessarily result in increased bond strength [169]. An example
influenced by the combination of impact power and the distribu-
of the effect of various surface preparation methods on CS of an
tion of energy dissipation in particle and substrate. Therefore,
aluminium alloy is given in Ref. [170].
hardness of the substrate is an important consideration for the
adhesion strength.
Mechanical properties of the substrate influence not only the 5.4. Sprayability and parameter selection
adhesion strength, but also the intrinsic properties of the coating
such as the flattening ratio of the particles [152]. This is because Conventionally, the critical velocity has been taken as a measure
of the effect of substrate hardness on the deformation behaviour of sprayability of various materials. This can nevertheless be
of the already deposited layers. For instance, a hard substrate misleading. As mentioned above, many cold-spray properties
constrains the deformation of the first layer of deposited parti- depend on not only the critical velocity but also the particle impact
cles, thus influences the cohesion between the first and conditions. Therefore, sprayability should be more appropriately
400 H. Assadi et al. / Acta Materialia 116 (2016) 382e407
discussed in view of the velocity ratio, h, or of the energy parameter 6. Materials and applications
hE .
Table 2 shows a selection of materials, sorted based on the Cold spraying can be used for coating, repair and additive
respective critical velocities, and also sorted based on the calculated manufacturing (AM). CS deposition of almost all metallic materials
velocity ratios for different particle sizes and spraying conditions. and metal-ceramic composites to any thickness above 50 mm is
The dark grey (green in colour version) background indicates technically achievable. For a review of successfully cold-sprayed
sprayability, while the light grey (orange in colour version) back- and studied material systems and applications see e.g.
ground signifies melting and high risk of nozzle clogging. It should Refs. [20,171e174]. Fig. 26 shows a few examples of cold-sprayed
be noted that not only low-melting point materials, but also nickel coatings, as investigated by the authors and co-workers at Hel-
and nickel alloys are prone to nozzle clogging at high process gas mut Schmidt University.
temperatures, thus practically limiting sprayability. Countermea- Table 3 gives a summary of materials and applications in CS. The
sures include water cooling as well as using nozzle materials that list is non-exhaustive, partly because of the nondisclosure of the
are resistant to clogging. Moreover, nozzle clogging can be avoided work that is performed outside academia. The applications can be
by using helium instead of nitrogen as process gas e though this categorised based on the intended purpose, as follows: (i) to obtain
may be commercially justified only in special cases e so that the high purity deposits, (ii) to obtain superior properties through well-
same value of h is achieved at lower temperatures. bonded interfaces and (iii) to ensure low heat input to the substrate.
It is interesting to note that the order of materials changes from High purity and well-bonded interfaces result in high electrical and
one column to another in the table. For instance, based on the thermal conductivity, as well as in high mechanical strength and
critical velocity, tantalum appears as the second ‘easiest’ material high corrosion/oxidation resistance. High chemical purity and ho-
for CS, after zinc. With respect to the velocity ratio, however, it is mogeneity of the cold-sprayed deposits make them particularly
not sprayable at 30 bar and 400 C. This is because of high density of suitable for applications in electronics, chemical and biomedical
tantalum particles, making them difficult to accelerate. The oppo- industries. Besides offering unique deposit properties, CS may also
site is true for magnesium. It is also interesting to note that the be a suitable option for applications where the substrate is sensitive
order of materials changes in every case, by changing the spraying to thermal shock e e.g. in the case of coating metals on glass or
condition or the particle size. This means that there is no unique set ceramics, or in the repair of heat-sensitive components. It has also
of optimum particle size, and that a suitable particle size must be been considered as a method to improve fatigue strength of the
selected with respect to the intended spraying conditions. In this substrate [177].
table, copper is the only material that remains sprayable under all As discussed before, properties of cold-sprayed deposits may be
conditions considered. affected by defects and non-bonded interfaces. This problem can
Table 2
Sprayability of selected materials*.
H. Assadi et al. / Acta Materialia 116 (2016) 382e407 401
nevertheless be minimised by using relatively high velocity ratios e ensure orthogonal spraying (h decreases with deviation from right
typically higher than 1.5. Moreover, post spraying heat treatments angle) and constant standoff distance. In practice, material depo-
may be used to increase the extent of bonded areas and to spher- sition is combined with machining, and the final part is often heat
odise the remaining discontinuities. In some cases e e.g. in the treated to improve ductility. The concept of using CS for AM e e.g.
production of Ni-based superalloy turbine blades e post heat to produce titanium parts e is almost as old as the process itself
treatments may not need extra efforts, as they may already be an [178]. Commercial implementation of CS for AM has nevertheless
integral part of the production procedure. been more recent; an example of this for the production of complex
Another technically interesting characteristic of the CS process steel components is shown in Fig. 27.
is the relatively small spray-line width of 6e8 mm, which makes it
suitable for AM applications. For applications in electronics, how-
6.1. Metallic materials
ever, the line width may need to be further reduced. This can be
achieved via masking techniques. In repair or AM applications, CS
There have been many studies on cold spraying of metallic
offers deposition rates that are by about an order of magnitude
materials. The literature on this topic alone already includes a few
higher than those in selective laser deposition techniques. For these
review articles. Table 4 gives only a selection of the published work
applications, elaborate robotics are normally required, mainly to
on CS of different metallic materials. The table excludes the work on
Table 3
An overview of current materials and applications in cold spraying.
Cu, Ag Conductive layers; high power electronics Electronics High chemical homogeneity, no oxidation
Sensors Automotive Similar conductivity as bulk material
Heat transfer layers Energy
Corrosion protection Nuclear industries
Al, Mg alloys Repair Aerospace Low amounts of interface defects
Similar strength as bulk material
Al, Ti alloys, Additive manufacturing Aerospace Low amounts of interface defects
Cu, Steels Manufacturing of injection/die casting moulds Tooling Similar mechanical/fatigue strength as bulk material
Polymer industry High deposition rates
Complex combination of different materials in one component
Ta, Nb, Cu alloys Additive manufacturing Electronics High purity, high chemical homogeneity, no oxidation
Sputter targets Machinery
Ni, Ta, Cathodic corrosion protection Offshore Low amounts of interface defects
High-Cr steels Chemical Ind. High chemical homogeneity, no oxidation
Zn, Al alloys Anodic corrosion protection Offshore High chemical homogeneity, no oxidation
Chemical Dense coatings
Machinery
Cu alloys Tribological performance Maritime technologies Low amounts of interface defects
Cavitation resistance Machinery Similar mechanical strength as bulk material
Steels ferritic austenitic Repair Energy Low amounts of interface defects
Magnetic properties (induction heating) Consumer goods Similar strength as bulk material
Machinery Chemical homogeneity, no oxidation
Ni alloys Hot gas corrosion protection Energy Low amounts of interface defects
Repair Aerospace Chemical homogeneity, no oxidation
Ti alloys Biocompatible parts Medicine Chemical homogeneity, purity, no oxidation
402 H. Assadi et al. / Acta Materialia 116 (2016) 382e407
Table 4
A selection of published work on cold spraying of metallic materials.
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