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https://doi.org/10.1051/matecconf/201817102003
E3PE 2017
© The Authors, published by EDP Sciences. This is an open access article distributed under the terms of the Creative Commons Attribution
License 4.0 (http://creativecommons.org/licenses/by/4.0/).
MATEC Web of Conferences 171, 02003 (2018) https://doi.org/10.1051/matecconf/201817102003
E3PE 2017
The cooling package is modeled as a thermal resistance carried out by the surrounding air by convection (natural
circuit on basis of R (thermal resistance) or C (thermal convection is considered in our study) and radiation. Usually,
conductance) where the temperature across two locations can a heat spreader is used to ensure the spreading of the heat all
be measured, leading to the calculation of heat dissipation rate over the whole base of the sink and to overcome the size
[5]. difference between the electronic chip and the heat sink.
B. Equations
4) Energy Balance:
∂ ∂ ∂T ∂ ∂T ∂ ∂T
( ρC p T ) = ( k ) + (k ) + (k ) (6)
∂t ∂x ∂x ∂y ∂y ∂z ∂z
2
MATEC Web of Conferences 171, 02003 (2018) https://doi.org/10.1051/matecconf/201817102003
E3PE 2017
Fig.5. Variation of temperature of heat sink walls with function of time under
1250 ( W / m 2 ).
The time needed for the heat sink to reach steady state
temperature is 9.5 min.
Fig.6. Variation of temperature of heat sink walls with function of time under
1250. 2500 and 5000 ( W / m 2 ).
3
MATEC Web of Conferences 171, 02003 (2018) https://doi.org/10.1051/matecconf/201817102003
E3PE 2017
VI. REFERENCES
Fig.7. Variation of temperature of heat sink walls with function of time under [1] Hill, M. (n.d.). Cooling of Electronic Equipments"chapter 15". Higher
5000 ( W / m 2 ) and forced ventilated. education.
[2] Coskun, A. K. 2010. "Energy-efficient variable-flow liquid coolingg in
3D stacjed architectures." DATE,pp 111-116.
Figure 7 shows clearly that the forced ventilation decreases the [3] H. Xie, A. Ali. 2011. "The use of heat pipes in personal computers."
temperature of the heat sink to 353 oK instead of 383 oK which ITHERM 331-340.
is considered an acceptable temperature for a standard [4] Lasance, Clemens J.M. 2005. "Advanced in high-performance cooling
for electronics." Electric cooling magazine 2-8.
operation of electronic chips.
[5] Lee, S. (n.d.). How To Select a Heat Sink. Advanced Thermal
Engineering.
[6] Kandasamy, Ravi. 2007. "Transient cooling of electronics using phase
change material (PCM)-based heat sinks." Elsevier, December 23: 11.
[7] Ahmad hasan, Hassan Hijase, shaimaa Abdelbaqi, Ali Assi, Mohammad
Hamdan. "Comparative Effectiveness of Different Phase Change
Materials to Improve Cooling Performance of Heat sinks for Electronic
Devices." Applied Sciences, 2016: 2-3.
[8] Frank P. Incropera David P. Dewitt , Theodore L. Bergman , Adrienne s.
Lavine Fundemantals of Heat and Mass Transfer [Book]. - [s.l.] : John
willey and sons, 2006.