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Specification
Freq.
1710~178 1850~191 1922~197 1852~190 1710~175
B a n d [ MH z
824~849 880~915 5 0 7 7 5 880~915 824~849
]
869~894 925~960 1805~188 1930~199 2112~216 1932~198 2110~215 925~960 869~894
Uplink/
0 0 7 7 5
D o wn l i n k
UL: UL: UL: UL: UL:
9612~988 9262~953 1313~151 2712~286 4132~423
0~124
ARFCN 8 8 3 3 3
128~251 & 975~10 512~885 512~810
range DL: DL: DL: DL: DL:
23 10562~1083 9 6 6 2 ~ 9 9 3 1 5 3 8 ~ 1 7 3 2 9 3 7 ~ 3 0 8 4 3 5 7 ~ 4 4 5
8 8 7 8 8
T x/ R x
4 5 MH z 4 5 MH z 9 5 MH z 8 0 MH z 1 9 0 MH z 8 0 MH z 4 0 0 MH z 4 5 MH z 4 5 MH z
spacing
S e n s i t i vi t - - - - -
-102dBm -102dBm -100dBm -100dBm
y 106.7dBm 106.7dBm 106.7dBm 106.7dBm 106.7dBm
TDMA
8 8 8 8 8 8 8 8 8
Mu x
Cell
35Km 35Km 2Km 2Km 2Km 2Km 2Km 2Km 2Km
Radius
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2. Specification
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2. Specification
[SM-J330F/FN]
2-3. LTE General Specification
LTE Band1 LTE Band2 LTE Band3 LTE Band4 LTE Band5 LTE Band7 LTE Band8
Freq.
B a n d [ MH z] 1920~1980 1850~1910 1710~1785 2520~2570 824~849 2500~2570 880~914.9
Uplink/ 2110~2170 1930~1990 1805~1880 1805~1880 869~894 1805~1880 925~959.9
D o wn l i n k
UL: UL: UL: UL: UL: UL:
UL:
18000~1859 18650~1915 19200~1995 20750~2144 20400~2064 20750~2144
ARFCN 21450-21799
9 0 0 9 9 9
range DL:
DL: DL: DL: DL: DL: DL:
3450-3799
0~599 650~1150 1805~1880 2750~3449 2400~2649 2750~3449
Tx/Rx
1 9 0 MH z 9 0 MH z 9 5 MH z 4 0 0 MH z 4 5 MH z 1 2 0 MH z 4 5 MH Z
spacing
S e n s i t i vi t
(QPSK) -94 dBm -92 dBm -92 dBm -92 dBm -92 dBm -95dBm -95dBm
( BW 1 0 MH z )
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2. Specification
LTE
LTE Band17 LTE Band 38 LTE Band 40
Band20
Freq.
B a n d [ MH z] 704~716 832~862
2570~2620 2300~2400
Uplink/ 734~746 791~821
D o wn l i n k
UL: UL:
24150~24450 24150~24450 UL, DL :
ARFCN range UL, DL : 2300~2400
DL: DL: 2570~2620
6150~6450 6150~6450
T x/ R x s p a c i n g 30MHz 41Mhz - -
MS P o we r
-35~25.7dBm -35~25.7dBm -35~25.7 dBm -35~25.7 dBm
( MP R )
S e n s i t i vi t
(QPSK) -94dBm -94dBm -97dBm -97dBm
( BW 1 0 MH z )
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2. Specification
[SM-J330G]
2-3. LTE General Specification
LTE Band1 LTE Band2 LTE Band3 LTE Band4 LTE Band5 LTE Band7 LTE Band8
Freq.
B a n d [ MH z] 1920~1980 1850~1910 1710~1785 2520~2570 824~849 2500~2570 880~914.9
Uplink/ 2110~2170 1930~1990 1805~1880 1805~1880 869~894 1805~1880 925~959.9
D o wn l i n k
UL: UL: UL: UL: UL: UL:
UL:
18000~1859 18650~1915 19200~1995 20750~2144 20400~2064 20750~2144
ARFCN 21450-21799
9 0 0 9 9 9
range DL:
DL: DL: DL: DL: DL: DL:
3450-3799
0~599 650~1150 1805~1880 2750~3449 2400~2649 2750~3449
Tx/Rx
1 9 0 MH z 9 0 MH z 9 5 MH z 4 0 0 MH z 4 5 MH z 1 2 0 MH z 4 5 MH Z
spacing
S e n s i t i vi t
(QPSK) -94 dBm -92 dBm -92 dBm -92 dBm -92 dBm -95dBm -95dBm
( BW 1 0 MH z )
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2. Specification
LTE Band17 LTE Band20 LTE Band28 LTE Band 38 LTE Band 40
Freq.
B a n d [ MH z] 704~716 832~862 708~743
2570~2620 2300~2400
Uplink/ 734~746 791~821 763~798
D o wn l i n k
UL: UL: UL:
24150~24450 24150~24450 27260~27609 UL, DL : UL, DL :
ARFCN range
DL: DL: DL: 2570~2620 2300~2400
6150~6450 6150~6450 6260~6609
Channel
5/10/15/20 MHz 5 / 1 0 / 1 5 / 2 0 MH z 5 / 1 0 / 1 5 / 2 0 MH z 5 / 1 0 / 1 5 / 2 0 MH z 5/10/15/20 MHz
B a n d wi d t h
MS P o we r
-35~25.7dBm -35~25.7dBm -35~25.7dBm -35~25.7 dBm -35~25.7 dBm
( MP R )
S e n s i t i vi t
(QPSK) -94dBm -94dBm -94dBm -97dBm -97dBm
( BW 1 0 MH z )
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3. Operation Instruction and Installation
Main Function
Item Description
SM-J330F/FN
2G Quad(850/900/1800/1900), WCDMA(1,2,5,8), LTE (1,2,3,4,5,7,8,17,20,38,40)
RF
SM-J330G
2G Quad(850/900/1800/1900), WCDMA(1,2,4,5,8), LTE (1,2,3,4,5,7,8,17,20,28,38,40)
RF
Battery 2,400mAh
SM-J330F/G
GPS, Glonass, Beidou, BT4.2, USB 2.0, WIFI 802.11 b/g/n SISO
Other RF
SM-J330FN
GPS, Glonass, Beidou, BT4.2, USB 2.0, WIFI 802.11 b/g/n SISO, NFC
Other RF
Charger: 5V, 1A
Accessory
Headset (Option)
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9. Reference Abbreviate
Reference Abbreviate
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1. Safety Precautions
Before attempting any repair or detailed tuning, shield the device from RF noise or static
electricity discharges.
Use only demagnetized tools that are specifically designed for small electronic repairs,
as most electronic parts are sensitive to electromagnetic forces.
Use only high quality screwdrivers when servicing products. Low quality screwdrivers can
easily damage the heads of screws.
Use only conductor wire of the properly gauge and insulation for low resistance, because of the low margin
of error of most testing equipment.
We recommend 22-gauge twisted copper wire.
Hand-soldering is not recommended, because printed circuit boards (PCBs) can be easily
damaged, even with relatively low heat. Never use a soldering iron with a power rating of
more than 100 watts and use only lead-free solder with a melting point below 250°C (482°F).
Prior to disassembling the battery charger for repair, ensure that the AC power is disconnected.
Always use the replacement parts that are registered in the SEC system. Third-party replacement parts
may not function properly.
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1. Safety Precautions
Many semiconductors and ESDs in electronic devices are particularly sensitive to static discharge and can
be easily damaged by it. We recommend protecting these components with conductive anti-static bags
when you store or transport them.
Always use an anti-static strap or wristband and remove electrostatic buildup or dissipate
static electricity from your body before repairing ESDs.
Ensure that soldering irons have AC adapter with ground wires and that the ground wires are properly
connected.
Use only desoldering tools with plastic tips to prevent static discharge.
Properly shield the work environment from accidental electrostatic discharge before opening
packages containing ESDs.
The potential for static electricity discharge may be increased in low humidity environments,
such as air-conditioned rooms. Increase the airflow to the working area to decrease the
chance of accidental static electricity discharges.
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6. Level 1 Repair
※ Settings
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6. Level 1 Repair
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6. Level 1 Repair
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6. Level 1 Repair
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6. Level 1 Repair
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6. Level 1 Repair
4. Start downloading the binary files into the device by clicking Start button on the screen.
The green colored "PASS!" sign will appear on the upper-left box.
If the binary files have been successfully downloaded into the device.
6. Once the device boots up, you can check the version of the binary file or name by pressing the
following code in sequence; *#1234#
You can perform Factory Reset by Settings → Accounts → Backup and reset
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6. Level 1 Repair
6-2-1 Preparation
- New IMEI writing Program has been released.
- Supported Model : Models which CAB files are uploaded on HHPsvc INI File
category, instead of ini file.
- Refer to below IMEI writing procedure.
- H/W
- S/W
④Model File Copy Model File under the ‘Model Name’ folder
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6. Level 1 Repair
1. Run DASEUL_SVC_Launcher_v3.0.12.exe
SM-J330F
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6. Level 1 Repair
4. Select Model
SM-J330F
※Once you setup the setting, you don t have to do it again, unless there is change.
From second run of the IMEI program, check IMEI and click Extract & Run.
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6. Level 1 Repair
6. Check IMEI Write / IMEI Check and click IMEI SVC & Repair Option.
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6. Level 1 Repair
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6. Level 1 Repair
11.Click OK to proceed
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6. Level 1 Repair
13. Click OK
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6. Level 1 Repair
G955UOYN1AQC1
J330FOXY1AQE8
G955USQE1AQC1
J330FOXY1AQE8
J330FOXY1AQE8
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6. Level 1 Repair
16. ① Click Start → ②Input IMEI writing ID and Password & OTP → ③Input Ticket No
Model name
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6. Level 1 Repair
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6. Level 1 Repair
6-3. RF Calibration
GH81-11962D
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6. Level 1 Repair
Setting
IF cable
GH81-10952A
Mobile
Phone
RF cable
GH81-11962D
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6. Level 1 Repair
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6. Level 1 Repair
3. Check the 'CAL' and open the model file, then select 'Start' button.
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6. Level 1 Repair
4. Change the Line Type to 'Block Cell' and disable 'Smart Cloud Cell'.
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6. Level 1 Repair
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6. Level 1 Repair
SM-J330F
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