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Chapter Three
Section 3.6
Nature and Rationale
Straight fins of (a) uniform and (b) non-uniform cross sections; (c) annular
fin, and (d) pin fin of non-uniform cross section.
Fin Equation
d 2T hP
2
− (T − T ) = 0 (3.67)
dx kAc
d 2
2
− m 2 = 0 (3.69)
dx
Base (x = 0) condition
( 0 ) = Tb − T b
Tip ( x = L) conditions
A. Convection: − kd / dx |x = L = h ( L )
B. Adiabatic: d / dx |x = L = 0
C. Fixed temperature: ( L ) = L
D. Infinite fin (mL 2.65): ( L ) = 0
• Fin Effectiveness:
qf
f
hAc ,bb (3.86)
f with h, k and Ac / P
• Fin Resistance:
b 1
Rt , f = (3.97)
qf hA f f
Arrays
Fin Arrays
• Representative arrays of
(a) rectangular and
(b) annular fins.
b
qt = o ( c ) hAtb =
Rt , o ( c )
NA f f (3.110a)
o ( c ) = 1 − 1 −
At C1
C1 = 1 + f hA f ( Rt, c / Ac , b ) (3.110b)
1
Rt , o ( c ) =
o ( c ) hAt (3.109)
Problem: Turbine Blade Cooling
Schematic:
( )
1/2
m = ( hP/kAc ) = 250 W/m2 K 0.11m/20W/m K 6 10−4 m 2
1/ 2
= 47.87 m-1
and, subject to the assumption of an adiabatic tip, the operating conditions are acceptable.
( ) ( −900 C) = −517W ,
1/ 2
−4
(b) With M = ( hPkAc ) 1/ 2
b = 250W/m K 0.11m 20W/m K 6 10
2
m
2 o
Hence,
qb = −q f = 508W <
Comments: Radiation losses from the blade surface contribute to reducing the blade
temperatures, but what is the effect of assuming an adiabatic tip condition? Calculate
the tip temperature allowing for convection from the gas.
Problem: Chip Heat Sink
Schematic:
Tc = 85oC
Assumptions: (1) Steady-state, (2) One-dimensional heat transfer, (3) Isothermal chip, (4)
Negligible heat transfer from top surface of chip, (5) Negligible temperature rise for air flow,
(6) Uniform convection coefficient associated with air flow through channels and over outer
surface of heat sink, (7) Negligible radiation, (8) Adiabatic fin tips.
Problem: Chip Heat Sink (cont.)
T -T Tc -T
qc = c =
Rtot Rt,c + Rt,b + Rt,o
−6 2
Rt,c = Rt, c / W = 2 10 m K/W / ( 0.02m ) = 0.005 K/W
2 2
( )
Rt,b = Lb / k W
2
= 0.003m / 180 W/m K ( 0.02m ) = 0.042 K/W
2
( )
1 NA f
Rt,o = , o = 1 − 1 − f , At = NA f + Ab
o h At At
-4 2
Af = 2WLf = 2 0.02m 0.015m = 6 10 m
2 2 -3 -4 2
Ab = W – N(tW) = (0.02m) – 11(0.182 10 m 0.02m) = 3.6 10 m
-3 2
At = 6.96 10 m
1/2 2 -3 1/2
With mLf = (2h/kt) Lf = (200 W/m K/180 W/mK 0.182 10 m) (0.015m) =
1.17, tanh mLf = 0.824 and Eq. (3.94) yields
tanh mL f 0.824
f = = = 0.704
mL f 1.17
o = 0.719,
Rt,o = 2.00 K/W, and
qc =
(85 − 20 ) °C = 31.8 W <
( 0.005 + 0.042 + 2.00 ) K/W
Problem: Chip Heat Sink (cont.)
Comments: The heat sink significantly increases the allowable heat dissipation. If it
were not used and heat was simply transferred by convection from the surface of the chip with
h = 100 W/m 2 K, Rtot = 2.05 K/W from Part (a) would be replaced by
Rconv = 1 / hW 2 = 25 K/W, yielding qc = 2.60 W.