Aliaje lead-free utilizate la lipirea componentelor electronice

Sn-Ag
Sn-Cu
Sn-Zn
Sn-Sb
Au-Sn
Sn-Bi
In-Sn
Ni-Sn

Sn-Ag-Sb
Sn-Ag-Bi
Sn–Zn–(Bi)
Sn-Cu-Ni
Ni-Sn-P

Sn-Ag-Cu-Sb
Sn-Ag-Bi-Cu
Sn-In-Ag-Sb
Ni-P-Sn-Ag
Compozitii chimice

Sn/Ag: 96.5Sn/3.5Ag; 221°C

Sn-Ag-Cu
95.5Sn/4.0Ag/0.5Cu; 216-219°C
2 95.5Sn/3.8Ag/0.7Cu; 217-219°C
3 95.0Sn/4.0Ag/1.0Cu; 216-219°C
93.6Sn/4.7Ag/1.7Cu; 216-218°C
Sn/Cu: 99.3Sn/0.7Cu; 227°C
Sn/Ag/Cu/Sb: 96.7Sn/2Ag/0.8Cu/0.5Sb
Sn/Ag/Bi: 91.8Sn/3.4Ag/4.8Bi; 200-216°C
Sn/Ag/Bi/Cu: 90Sn/2.0Ag/7.5Bi/0.5Cu;198-212°C
Sn/Bi: 42Sn/58Bi; 138°C
In/Sn: 52In/48Sn; 118°C
Sn/In/Ag/Sb: 86.4Sn/11In/2Ag/0.6Sb
Sn/In/Ag: 77.2Sn/20In/2.8Ag; 189°C
Sn/Sb: 95Sn/5Sb; 232-240°C
Sn/Zn: 91Sn/9Zn; 199°C
Au/Sn: 80Sn/20Au; 280°C
Sn/Ag/Sb: 65Sn/25Ag/10Sb
Sn-Sb; Sn97/Sb3
Ni-Sn; Ni3Sn4