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Abstract–In this study, the bending process of PCB during both models were compared. The bending process was
depaneling is simulated. The stress response during the bending replicated by using a displacement scheme, where one end of
process is evaluated using a computational program Ansys. Two the PCB plate is constrained and the displacement is applied
PCB plate model were developed:One of the model with centric at the other end. The displacements heights of the PCB plates
through hole and other model without hole. The stress response
were ranged from 1cm to 5cm.
of the two models are compared. From the simulation, it has
been observed that the value of stress response of the PCB
increases with increasing displacement height. The without hole II METHODOLOGY
PCB model exhibited a slightly higher stress response compared
to the with centric through hole PCB model. Highest stress A commercial computational program Ansys was utilized to
response for both models were recorded at the displacement perform the simulation. Two 3D models were developed
height of 5cm. using 20 Node Quadratic Hexahedron (Solid 186). One
Keywords-Printed circuit board(PCB); depaneling process;
model will feature a PCB plate without hole and the other
centric through holes model will feature a PCB plate with a centric through hole.
The 3D models were then meshed with 69867 number of
elements for the PCB plate without hole model and 68872
I INTRODUCTION number of elements for the PCB plate with centric through
hole model. The dimension of the PCB plate models are
In the electronic industry, the printed circuit board 175mm vs 250mm and the thickness is 1mm. As for the
(PCB) is the moral fiber for surface mounted components centric through hole model, the diameter of the hole is 30 mm
during packaging assembly. The numbers of PCBs production and it is placed at the center of the model. The 3D model is
has increased due to the rapid growth in the electronic shown in Fig. 1. The material properties used in the analysis
technologies [1].The printed circuit board operates as an is shown in Table 1.
instinctive support and it connects passive and active TABLE 1
MATERIAL PROPERTIES OF FR4
components by means of conductive conduit. The purposes
of PCB board are as follows, 1.To electrically interconnect Material FR4
the components, 2.To provide mechanical support to the Young Modulus ,E (Pa) 22x109
electronic components and 3. To provide power and dissipate Poison Ratio 0.136
the heat generated by mounted components [2]. Density (kg/m³) 1850
Currently, all the electronic devices are produced in
a batch form due to mass production. After completing the In the both 3D model, the loading and the boundary
board level assembly, the printed circuit boards are subjected conditions were applied as follows:
to depaneling process which individualizes the PCBs. During i. Displacement
the depaneling process, the PCBs plates are subjected to As the design is in three dimension, there will be x,y
mechanical bending process. This bending process may and z axis. the displacement is given at the right end
induce stress on the PCBs which may damage and reduce the of the pcb plate in the positive y direction . The
reliability of the PCBs [3,4]. There are some works done value of displacement height are in range of 1cm to
based on computational system to detect the defects of 5cm.
mounted components on PCB during PCB handling process ii. Fixed Support
[5,6]. Hence, there is a necessity to evaluate the stress The left end of the pcb plate is contrained by
response of a PCB plate during the bending process. applying fixed support. This will result in no
Therefore, in this study, the bending process of the movement at this end of the pcb plate.
PCB plate is simulated using a commercial computational
program, Ansys. The stress response during bending process In this study, the stress response of the PCB plates during the
is examined. To evaluate the stress response, two types of bending process was evaluated by using the Von Mises Stress
PCB designed were used, one model with centric through as a criterion.
hole and one model without hole. The centric through hole
model was utilized to observed if it has any impact on the
stress response of the PCB plates. The stress responses of
From the Fig. 3., the maximum stress obtained on both PCB
(a)
plate are different based on the PCB plate characteristics. For
Displacement PCB plate without hole, the maximum stress onto the plate is
direction slighty higher compared the PCB plate with centric through
hole. For 2cm of displacement height, the stress response of
PCB plate without hole is 1069000Pa and the stress response
of PCB plate with centric through hole is 1059400Pa.
Constraint
area 1200000
1000000
1cm, 2cm, 3cm, 4cm, and 5cm were applied to both PCB 1500000
plates.
As shown in Fig. 2. ,it can be observed that the maximum 1000000
stress on both PCB plates are different based on the PCB
plate characteristics. For PCB plate without hole, the 500000 Without hole
maximum stress onto the board is slighty higher compared the With hole
PCB plate with centric through hole which produces less 0
maximum stress. For displacement height of 1cm the stress
onto of PCB plate without hole is 534500 Pa and the stress 0 0.2 0.4 0.6 0.8 1
Time (s)
onto of PCB plate with centric through hole is 529690 Pa
Fig 4. Stress vs Time for displacement height of 3cm
600000
500000 For the displacement height of 4cm , the stress response of
Von Mises Stress (Pa)
0
0 0.2 0.4 0.6 0.8 1
Time (s)
Fig. 2. Stress vs Time for displacement height of 1cm
642
IEEE-ICSE2012 Proc., 2012, Kuala Lumpur, Malaysia
PCB.
2000000
1500000
1000000
500000 Without hole
With hole
0
0 0.2 0.4 0.6 0.8 1
Time (s) Constraint
Fig 5. Stress vs Time for displacement height of 4cm area
(a)
Based on the Fig. 6, for 5cm of displacement height, the stress
response of PCB plate without hole is 2672500 Pa and the
stress response of PCB plate with centric through hole is
2648500 Pa.
3000000
Von Mises Stress (Pa)
2500000
2000000 Constraint
area
1500000
1000000
Without hole
500000 (b)
With hole Fig 7. Stress contour of the PCB plates. (a) without hole and (b) with centric
0 through hole
Hence, by comparing the over all results, the PCB plate with The stress response between plate PCB with centric
without hole exhibited a slightly higher stress response through hole and without hole were simulated in this study.
compared to the PCB plate with centric through hole. The The simulation were executed using Ansys version 11. From
mechanical bending exerts a curvature bend on the PCB plate the simulation, it has been observed that the value of stress
structure [3]. During bending process, stress is exerted at the response of the PCB increases with increasing displacement
opposite of the PCB plate which is dispersed along the width height for both PCB models. However, the without hole PCB
and length direction of the PCB plates[7] which can be model exhibited a slightly higher stress response when
observed in Fig7(a). The high stress region along the width compared to the centric through hole PCB model. The hole
and length direction of the PCB may invoke damage to the structure had a less significant effect on the stress response of
solder joints of the mounted components. This may lead to the PCB plate. This may be due to the position of the hole
solder joint crack formation[3]. Hence, a single centric structure which is futher away from the constrained area of
through hole was placed at the center of the PCB. This was the PCB plate. Highest stress response was obtained at the
done to evalute if the hole structure assited in reducing the displacement height of 5cm for both models.
high stress region near the constarined are of the PCB.
However, the hole structure had little effect in reducing the ACKNOWLEDMENT
high stress region near the constarined area. This is due to the
distance and position of the hole structure which is futher The author would like to thank and acknowledge School of
away from the constrained area which can be visualized in. Microelectronic Engineering, Universiti Malaysia Perlis for
Fig 7(b) . Therefore , it can be concluded that the position of their support and facilities.
the hole may have a significant effect if it was placed near the
643
IEEE-ICSE2012 Proc., 2012, Kuala Lumpur, Malaysia
REFERENCES
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