BT169D L Datasheet

TO
2-9
BT169D-L
SCR
Rev. 6 — 20 March 2012 Product data sheet
1. Product profile
1.1 General description

Planar passivated very sensitive gate Silicon Controlled Rectifier in a SOT54 (TO-92)
plastic package.
1.2 Features and benefits

 Planar passivated for voltage  Very sensitive gate
ruggedness and reliability
1.3 Applications
 Ignition circuits  Protection / shut-down circuits: lighting
 Low power latching circuits ballasts
 Protection / shut-down circuits:
Switched Mode Power Supplies
1.4 Quick reference data

Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDRM repetitive peak off-state - - 400 V
voltage
VRRM repetitive peak reverse voltage - - 400 V
ITSM non-repetitive peak on-state half sine wave; Tj(init) = 25 °C; - - 8 A
current tp = 10 ms; see Figure 4; see Figure 5
IT(RMS) RMS on-state current half sine wave; Tlead ≤ 83 °C; - - 0.8 A
see Figure 1; see Figure 2
Static characteristics
IGT gate trigger current VD = 12 V; IT = 10 mA; Tj = 25 °C; - - 50 µA
see Figure 7
IH holding current VD = 12 V; Tj = 25 °C; see Figure 9 - 0.4 1 mA
IL latching current VD = 12 V; IG = 0.5 mA; Tj = 25 °C; - 2 4 mA
see Figure 8
NXP Semiconductors BT169D-L
SCR
2. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 A anode
A K
2 G gate
G
3 K cathode sym037
321
SOT54 (TO-92)
3. Ordering information
Table 3. Ordering information
Type number Package
Name Description Version
BT169D-L TO-92 plastic single-ended leaded (through hole) package; 3 leads SOT54
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state voltage - 400 V
VRRM repetitive peak reverse voltage - 400 V
IT(AV) average on-state current half sine wave; Tlead ≤ 83 °C; see Figure 3 - 0.5 A
IT(RMS) RMS on-state current half sine wave; Tlead ≤ 83 °C; see Figure 1; - 0.8 A
see Figure 2
ITSM non-repetitive peak on-state half sine wave; Tj(init) = 25 °C; tp = 8.3 ms - 9 A
current half sine wave; Tj(init) = 25 °C; tp = 10 ms; - 8 A
see Figure 4; see Figure 5
I2t I2t for fusing tp = 10 ms; sine-wave pulse - 0.32 A2s
dIT/dt rate of rise of on-state current IT = 2 A; IG = 10 mA; dIG/dt = 100 mA/µs - 50 A/µs
IGM peak gate current - 1 A
VRGM peak reverse gate voltage - 5 V
PGM peak gate power - 2 W
PG(AV) average gate power over any 20 ms period - 0.1 W
Tstg storage temperature -40 150 °C
Tj junction temperature - 125 °C
BT169D-L All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 6 — 20 March 2012 2 of 12

SCR
001aab449 001aab450
2 1
IT(RMS)
IT(RMS)
(A)
(A) (1)
0.8
1.5
0.6
0.4
0.5
0.2
0 0
10−2 10−1 1 10 −50 0 50 100 150
surge duration (s) Tlead (°C)
Fig 1. RMS on-state current as a function of surge Fig 2. RMS on-state current as a function of lead
duration for sinusoidal currents temperature; maximum values
001aab446
0.8 77
a=
Ptot 1.57 Tlead(max)
(W) (°C)
1.9
0.6 89
2.2
2.8
0.4 101
4 conduction form
angle factor
(degrees) a
30 4
0.2 113
60 2.8
α
90 2.2
120 1.9
180 1.57
0 125
0 0.1 0.2 0.3 0.4 0.5 0.6
IT(AV) (A)
Fig 3. Total power dissipation as a function of average on-state current; maximum values

SCR
001aab499
10
ITSM
(A)
8
4
IT ITSM
tp t
Tj(init) = 25 °C max
0
1 10 102 103
number of cycles
Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
001aab497
103
IT ITSM
ITSM
(A)
102 tp t
Tj(init) = 25 °C max
10
1
10−5 10−4 10−3 10−2
tp (s)
Fig 5. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values

SCR
5. Thermal characteristics
Table 5. Thermal characteristics
Rth(j-lead) thermal resistance from junction to see Figure 6 - - 60 K/W
lead
Rth(j-a) thermal resistance from junction to printed circuit board mounted: - 150 - K/W
ambient lead length = 4 mm
001aab451
102
Zth(j-lead)
(K/W)
10
tp
P δ=
T
10−1
tp t
T
10−2
10−5 10−4 10−3 10−2 10−1 1 10
tp (s)
Fig 6. Transient thermal impedance from junction to lead as a function of pulse width

SCR
6. Characteristics
Table 6. Characteristics
Static characteristics
IGT gate trigger current VD = 12 V; IT = 10 mA; Tj = 25 °C; - - 50 µA
see Figure 7
IL latching current VD = 12 V; IG = 0.5 mA; Tj = 25 °C; - 2 4 mA
see Figure 8
IH holding current VD = 12 V; Tj = 25 °C; see Figure 9 - 0.4 1 mA
VT on-state voltage IT = 1.2 A; Tj = 25 °C; see Figure 10 - 1.25 1.7 V
VGT gate trigger voltage VD = 12 V; IT = 10 mA; Tj = 25 °C; - 0.5 0.8 V
see Figure 11
VD = 12 V; IT = 10 mA; Tj = 125 °C; 0.2 0.3 - V
see Figure 11
ID off-state current VD = 400 V; Tj = 125 °C; RGK = 1 kΩ - 0.05 0.1 mA
VD = 400 V; Tj = 25 °C; RGK = 1 kΩ - - 2 µA
IR reverse current Tj = 125 °C; RGK = 1 kΩ; VR = 400 V - 0.05 0.1 mA
Tj = 25 °C; RGK = 1 kΩ; VR = 400 V - - 2 µA
Dynamic characteristics
dVD/dt rate of rise of off-state voltage VDM = 268 V; Tj = 125 °C; RGK = 1 kΩ; 500 800 - V/µs
exponential waveform; see Figure 12
VDM = 268 V; Tj = 125 °C; exponential - 25 - V/µs
waveform; gate open circuit;
see Figure 12
001aab502 003aag891
3 3
IGT IL(Tj)
IGT(25°C) IL(25 °C)
2 2
1 1
0 0
−50 0 50 100 150 -50 0 50 100 150
Tj (°C) Tj (°C)
Fig 7. Normalized gate trigger current as a function of Fig 8. Normalized latching current as a function of
junction temperature junction temperature

SCR
003aag890 001aab454
3 5
IT
IH(Tj) (A)
IH(25 °C) 4
2
3
2
1
1
(1) (2) (3)
0 0
-50 0 50 100 150 0.4 1.2 2 2.8
Tj (°C) VT (V)
Vo = 1.067 V; Rs = 0.187 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig 9. Normalized holding current as a function of Fig 10. On-state current as a function of on-state
junction temperature voltage
001aab501 001aab507
1.6 104
VGT dVD/dt
VGT(25°C) (V/μs)
(1)
1.2 103
0.8 102
(2)
0.4 10
−50 0 50 100 150 0 50 100 150
Tj (°C) Tj (°C)
Fig 11. Normalized gate trigger voltage as a function of Fig 12. Critical rate of rise of off-state voltage as a
junction temperature function of junction temperature; typical values

SCR
7. Package outline
Plastic single-ended leaded (through hole) package; 3 leads SOT54
d A L
1
e1
2
D e
b1
L1
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A b b1 c D d E e e1 L L1(1)
max.
5.2 0.48 0.66 0.45 4.8 1.7 4.2 14.5
mm 2.54 1.27 2.5
5.0 0.40 0.55 0.38 4.4 1.4 3.6 12.7
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION
04-06-28
SOT54 TO-92 SC-43A
04-11-16
Fig 13. Package outline SOT54 (TO-92)

SCR
8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BT169D-L v.6 20120320 Product data sheet - BT169D-L v.5
Modifications: • Various changes to content.
BT169D-L v.5 20111110 Product data sheet - BT169D-L v.4

SCR
9. Legal information
9.1 Data sheet status

Document status[1] [2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URLhttp://www.nxp.com.
9.2 Definitions Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
Preview — The document is a preview version only. The document is still limitation specifications and product descriptions, at any time and without
subject to formal approval, which may result in modifications or additions. notice. This document supersedes and replaces all information supplied prior
NXP Semiconductors does not give any representations or warranties as to to the publication hereof.
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information. Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
Draft — The document is a draft version only. The content is still under safety-critical systems or equipment, nor in applications where failure or
internal review and subject to formal approval, which may result in malfunction of an NXP Semiconductors product can reasonably be expected
modifications or additions. NXP Semiconductors does not give any to result in personal injury, death or severe property or environmental
representations or warranties as to the accuracy or completeness of damage. NXP Semiconductors and its suppliers accept no liability for
information included herein and shall have no liability for the consequences of inclusion and/or use of NXP Semiconductors products in such equipment or
use of such information. applications and therefore such inclusion and/or use is at the customer’s own
risk.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended Quick reference data — The Quick reference data is an extract of the
for quick reference only and should not be relied upon to contain detailed and product data given in the Limiting values and Characteristics sections of this
full information. For detailed and full information see the relevant full data document, and as such is not complete, exhaustive or legally binding.
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the Applications — Applications that are described herein for any of these
full data sheet shall prevail. products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
Product specification — The information and data provided in a Product specified use without further testing or modification.
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and Customers are responsible for the design and operation of their applications
customer have explicitly agreed otherwise in writing. In no event however, and products using NXP Semiconductors products, and NXP Semiconductors
shall an agreement be valid in which the NXP Semiconductors product is accepts no liability for any assistance with applications or customer product
deemed to offer functions and qualities beyond those described in the design. It is customer’s sole responsibility to determine whether the NXP
Product data sheet. Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
9.3 Disclaimers design and operating safeguards to minimize the risks associated with their
applications and products.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any NXP Semiconductors does not accept any liability related to any default,
representations or warranties, expressed or implied, as to the accuracy or damage, costs or problem which is based on any weakness or default in the
completeness of such information and shall have no liability for the customer’s applications or products, or the application or use by customer’s
consequences of use of such information. NXP Semiconductors takes no third party customer(s). Customer is responsible for doing all necessary
responsibility for the content in this document if provided by an information testing for the customer’s applications and products using NXP
source outside of NXP Semiconductors. Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
In no event shall NXP Semiconductors be liable for any indirect, incidental, customer(s). NXP does not accept any liability in this respect.
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or Limiting values — Stress above one or more limiting values (as defined in
replacement of any products or rework charges) whether or not such the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damages are based on tort (including negligence), warranty, breach of damage to the device. Limiting values are stress ratings only and (proper)
contract or any other legal theory. operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Notwithstanding any damages that customer might incur for any reason Characteristics sections of this document is not warranted. Constant or
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards repeated exposure to limiting values will permanently and irreversibly affect
customer for the products described herein shall be limited in accordance the quality and reliability of the device.
with theTerms and conditions of commercial sale of NXP Semiconductors.

SCR
Terms and conditions of commercial sale — NXP Semiconductors product for such automotive applications, use and specifications, and (b)
products are sold subject to the general terms and conditions of commercial whenever customer uses the product for automotive applications beyond
sale, as published athttp://www.nxp.com/profile/terms, unless otherwise NXP Semiconductors’ specifications such use shall be solely at customer’s
agreed in a valid written individual agreement. In case an individual own risk, and (c) customer fully indemnifies NXP Semiconductors for any
agreement is concluded only the terms and conditions of the respective liability, damages or failed product claims resulting from customer design and
agreement shall apply. NXP Semiconductors hereby expressly objects to use of the product for automotive applications beyond NXP Semiconductors’
applying the customer’s general terms and conditions with regard to the standard warranty and NXP Semiconductors’ product specifications.
purchase of NXP Semiconductors products by customer.
Translations — A non-English (translated) version of a document is for
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construed as an offer to sell products that is open for acceptance or the grant, between the translated and English versions.
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
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Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior Notice: All referenced brands, product names, service names and trademarks
authorization from competent authorities. are the property of their respective owners.
Non-automotive qualified products — Unless this data sheet expressly Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G

states that this specific NXP Semiconductors product is automotive qualified, reenChip,HiPerSmart,HITAG,I²C-bus
the product is not suitable for automotive use. It is neither qualified nor tested logo,ICODE,I-CODE,ITEC,Labelution,MIFARE,MIFARE Plus,MIFARE
in accordance with automotive testing or application requirements. NXP Ultralight,MoReUse,QLPAK,Silicon
Semiconductors accepts no liability for inclusion and/or use of Tuner,SiliconMAX,SmartXA,STARplug,TOPFET,TrenchMOS,TriMedia
non-automotive qualified products in automotive equipment or applications. andUCODE — are trademarks of NXP B.V.
In the event that customer uses the product for design-in and use in HD Radio andHD Radio logo — are trademarks of iBiquity Digital
automotive applications to automotive specifications and standards, customer Corporation.
(a) shall use the product without NXP Semiconductors’ warranty of the
10. Contact information

For more information, please visit:http://www.nxp.com
For sales office addresses, please send an email to:salesaddresses@nxp.com

SCR
11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5
6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .8
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .9
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .10
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .10
9.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
10 Contact information. . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 March 2012
Document identifier: BT169D-L

BT169D L Datasheet

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1.1 General description

1.2 Features and benefits

1.4 Quick reference data

Product data sheet Rev. 6 — 20 March 2012 2 of 12

Product data sheet Rev. 6 — 20 March 2012 3 of 12

Product data sheet Rev. 6 — 20 March 2012 4 of 12

Product data sheet Rev. 6 — 20 March 2012 5 of 12

Product data sheet Rev. 6 — 20 March 2012 6 of 12

Product data sheet Rev. 6 — 20 March 2012 7 of 12

Plastic single-ended leaded (through hole) package; 3 leads SOT54

DIMENSIONS (mm are the original dimensions)

OUTLINE REFERENCES EUROPEAN

Fig 13. Package outline SOT54 (TO-92)

Product data sheet Rev. 6 — 20 March 2012 8 of 12

Product data sheet Rev. 6 — 20 March 2012 9 of 12

9.1 Data sheet status

Product data sheet Rev. 6 — 20 March 2012 10 of 12

Non-automotive qualified products — Unless this data sheet expressly Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G

10. Contact information

For sales office addresses, please send an email to:salesaddresses@nxp.com

Product data sheet Rev. 6 — 20 March 2012 11 of 12

© NXP B.V. 2012. All rights reserved.

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