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DOI 10.1007/s00170-014-5943-z
ORIGINAL ARTICLE
Received: 10 October 2013 / Accepted: 8 May 2014 / Published online: 27 May 2014
# Springer-Verlag London 2014
Abstract The application of miniaturized products is slowly biotechnology etc., reported in Alting et al. [1]. In the present
increasing due to their demand in micro feature-based sys- trend, micro products are designed and produced with more
tems, which needs multitude of functions to be integrated. functionalities and compactness. To meet the above con-
Several lithographic-based technologies are used to manufac- straints and need for reduced size of products, various
ture high-aspect ratio micro features, which has limitations to micro-fabrication techniques are developed. Research find-
produce 3D features. Electro-discharge deposition (EDD) is a ings of micro-nanofabrication technologies like, lithography,
newly developing nonlithographic additive manufacturing FIB, etching technology and replication technology with their
process to produce micro products. The potential of this advantages, limitations (manufacturability, material, econom-
process is that any material which is conductive in nature ic feasibility and dimensions like 1D, 2D, 2.5D, and 3D) are
can be made to deposit over the substrate. In the present paper, discussed in Cui [2] and Brousseau et al. [3]. Micro products
the use of magnetic field in EDD process has been investigat- prone to aggressive environments and enhanced force actua-
ed. It is observed from the results that height and weight of tion are 3D in nature, which is reported in Brousseau et al. [3].
deposition are increased significantly by using magnetic field Dimov et al. [4] discussed that lithographic technologies can
and at the same time width is reduced due to plasma confine- extend their hands only upto 2D and 2.5D features with
ment by magnetic field effects. From the scanning electronic limited material usage. So, complex 3D micro features with
microscope (SEM) images it is observed that there is unifor- high aspect ratios, suitable to unstable environments can be
mity in deposition of the tool material over the substrate. It is produced by nonlithographic based technologies whether by
concluded from the experimental results that, magnetic field is adding or by removing the material to get the final product,
also a one of the significant contributing parameter assisting in reported by Rajurkar et al. [5]. The micro manufacturing can
electro-discharge deposition process. be done both by additive and subtractive process. Subtractive
process in micro scale especially in case of micro machines, it
is very difficult to handle micro tools, workpiece position,
Keywords Electro-discharge deposition process . Magnetic
normally all those positions and its conditions of fittings are
field . SEM . Design of experiments
monitored by using sensors, which consumes huge investment
cost. So, additive process is preferred to subtractive process in
micro scale. EDD process is one of the innovative deposition
1 Introduction methods in which reverse electrical discharge machining
(EDM) principle is used. In reverse EDM, electrodes are
The demand for micro products and its components are grow- connected in reverse polarity, i.e., tool is connected to positive
ing significantly, owing to wide applications in many fields polarity and substrate is connected to negative polarity. The
like, electronics, MEMS, medical, automobile and advantage of EDD is that any conductive material irrespective
of hardness can be used. Gangadhar et al. [6] initially inves-
tigated the transfer of material from tool to work piece during
B. Muralidharan (*) : H. Chelladurai
reverse EDM process. Simao et al. [7] and Goto et al. [8]
Discipline of Mechanical Engineering, PDPM IIITDM Jabalpur,
Jabalpur, MP, India reported that EDD process can be used for modifying the
e-mail: b.murlidharan@gmail.com surface of the material and it is extended to form anti wear
70 Int J Adv Manuf Technol (2015) 76:69–82
−2 −1 0 1 2
1. Current (I), A 3 9 14 19 25
2. Pulse on time (Ton), μs 7.5 20 30 40 50
3. Duty factor (t) 2 5 7 9 12
4. voltage (v),V 2 30 50 70 98
5. Magnetic flux (F), Tesla 0.04 0.07 0.16 0.20 0.40