Seminar Report

On
LIQUID COOL TECHNOLOGY
Submitted In Partial Fulfillment of Award of Degree of Bachelor of
Technology In Electronics & Communication Engineering

Submitted

by
KHURSHEED HASHAN KHAN
2K17
B.Tech (ECE)
( CSJMA17001390082)

Under Supervision
Of

Er. PREETI SINGH

Assistant professor

Submitted
to
Department of Electronics & Communication Engineering,
U.I.E.T. CSJM University, Kanpur
2019-2020
UNIVERSITY INSTITUTE OF ENGINEERING AND TECHNOLOGY
C.S.J.M. UNIVERSITY KANPUR

DEPARTMENT OF ELECTRONICS AND COMMUNICATION

CERTIFICATE
This is to certify that the Seminar entitled ―LIQUID COOL TECHNOLOGY‖ has been
submitted by KHURSHEED HASAN KHAN under my guidance in partial fulfillment of
the degree of Bachelor of Technology in “ELECTRONICS AND COMMUNICATION”,
from UNIVERSITY INSTITUTE OF ENGINEERING AND TECHNOLOGY C.S.J.M.
UNIVERSITY KANPUR during the academic year 2019-2020.

HEAD OF DEPARTMENT SEMINAR GUIDE SEMINAR INCHARGE

Er.ANAND Kr. GUPTA Er. PREETI SINGH Er. A.K. SRIVASTAVA
 ACKNOWLEDGEMENT

It is a matter of great pleasure for me to submit this seminar report on ―LIQUID COOL
TECHNOLOGY‖, as a part of curriculum for award of ―Bachelor of Technology in
Electronics and Communication Engineering‖, from UNIVERSITY INSTITUTE OF
ENGINEERING AND TECHNOLOGY,C.S.J.M. UNIVERSITY KANPUR.

I extend my sincere gratitude towards my seminar guider Er. PREETI SINGH, for her
constant encouragement and guidance. I am also thankful to Er. AJEET SRIVASTAVA and
Er. SOMESH KR MALHOTRA, the seminar in-charge and the class co-ordinator for their
valuable support.

I take this opportunity to thank all those who have helped me in various ways for preparing
my seminar. Last but not the least, I am thankful to my parents, who have encouraged and
inspired me with their blessings.

I am also thankful to all my friends for helping me in all possible ways they could.

KHURSHEED HASAN KHAN

B.Tech(E.C.E-2K17)

CSJMA17001390082
 Table of Content

1 Certificate (i)

2 Abstract (ii)

3 Acknowledgement (iii)

4 List of figures (v)

5 Introduction of liquid cooling technology 1-1

6 Concept of liquid cooling technology 2-5

7 Working of liquid cooling technology 6-6

8 Parts of liquid cooling technology 7-9

9 Evolution of liquid cooling technology 10-10

10 Liquid cooling technology in phones 11-11

11 Working of liquid cooling in phones 12-14

12 Need of liquid cooling in phones 15-15

13 Future of liquid cooling in phones 16-17

14 Advantages of liquid cooling technology 18-18

15 Disadvantages of liquid cooling technology 19-19

16 Conclusion 20-20

17 References 21-21
 LIST OF FIGURES
1 Liquid cooling assembled system 1

2 Radiator 2

3 Cooling in CPU 3

4 Thermal paste in processor 4

5 Liquid cooling setup 5-6

6 Pump tops 7

7 Water blocks 7

8 Fitting and tubing 8

9 Coolant 9

10 Thermal paste 9

11 Evolution of liquid cooling technology 10

12 Liquid cool technology in phones 11

13 Water carbon cooling system in phones 13

14 Future aspects 17
 ABSTRACT
Over the past few years, CPU speeds have been increasing at a dramatic rate. In order to
generate the new speeds, CPUs have more transistors, are drawing more power and have
higher clock rates. This leads to greater heat produced by the CPU in the computer. CPU heat
sinks have been added to all modern PC CPUs to help try to alleviate some of the heat from
the processor into the surrounding environment, but as the fans get louder and larger new
solutions are being looked into, namely liquid cooling.
Liquid cooling is essentially a radiator for the CPU inside of the computer. Just like a radiator
for a car, a liquid cooling system circulates a liquid through a heat sink attached to the
processor inside of the computer. As the liquid passes through the heat sink, heat is
transferred from the hot processor to the cooler liquid. The hot liquid then moves out to a
radiator at the back of the case and transfers the heat to the ambient air outside of the case.
The cooled liquid then travels back through the system to the CPU to continue the process.
This method can also be used in combination with other traditional cooling methods such as
those that use air. The application to microelectronics is either indirect or direct. The former
pertains to the category that utilizes cold plate cooling, which uses water as coolant while, in
the latter (also referred to as liquid immersion cooling), the surface of the chips comes in
contact with the liquid since there is no wall separating the heat source from the coolant. This
immersion cooling also offer a higher transfer coefficient, although this depends on the
specific coolant used and mode of convective heat transfer. One of the main benefits
achieved is the reduction of noise and it is also more efficient. Some of the drawbacks
include the risk entailed with the close proximity of liquid to electronics as well as its cost.
Liquid cooling systems are more expensive than fan sets, which require less components such
as reservoir, pump, water blocks, hose, and radiator.
 INTRODUCTION
Liquid cooling is the reduction of heat in electronic and mechanical devices through
exploiting the properties of liquids.
Liquid cooling is a firmly established cooling method in many current technologies.
Automobiles, mainframes and the systems of computer enthusiasts have used water cooling
for many years. The methods and coolants can differ between and within these categories.
In computer cooling, the most common form of liquid cooling involves a closed system of
tubes that carries the liquid from one component involved in cooling to another. These
systems are generally referred to as loops. There are some parts common to all liquid cooling
loops: pumps, tubing, water blocks, and radiators.
The pump pushes the liquid though a loop and must be primed in order to start circulating the
liquid. Pumps burn out when spinning empty as they too rely on the fluid they circulate for
cooling. The tubing is most commonly flexible plastic, often clear but sometimes colored and
even UV reactive. Some users have used hard plastic or copper pipe with bend fittings or
formed soft copper piping. After the pump, the tubing typically carries the liquid to the
radiator where it is cooled of the pumps heat load. Then the liquid moves on to the
components that need cooling. The liquid is run through water blocks. A water block is
similar in function to a heat sink but the cooled surface area is enclosed within the block.
Thermal contact with components is enhanced by thermal compound. Due to the liquid’s
thermal capacity (about 30 times that of air), the surface area inside is much smaller than
today’s typically large high-end air cooling heat sinks.

(Fig 1)
 CONCEPT OF LIQUID COOL TECHNOLOGY
Computer technology is constantly evolving. As new components are introduced onto the
market, they require better methods of cooling. We are familiar with the standard heat sink,
consisting of a copper base with fins which is cooled by 1 or 2 fans. Liquid Cooling, on the
contrary, is a different type of cooling that we may all not be so familiar with. In fact, we
commonly ask ourselves what liquid cooling is. To simply put it, liquid cooling is a closed
loop system that incorporates water as a means of cooling. You may ask yourself, "Water?
How can water and pc cooling go together?" You've come to the right place. In this guide, I
will be teaching you about the essentials of liquid cooling, what you will need, and how to
get started.
First off, I have some abbreviations listed below that I will use so that I don't have to write
out the complete phrase. This is a legend in case you are not clear about an abbreviation.
Radiator: Rad
Radiators are heat exchangers used for cooling internal combustion engines, mainly
in automobiles but,alsoin piston-engine-aircraft, railway locomotives, motorcycles, stationary
generating plant or any similar use of such an engine.
Internal combustion engines are often cooled by circulating a liquid called engine
coolant through the engine block, where it is heated, then through a radiator where it loses
heat to the atmosphere, and then returned to the engine. Engine coolant is usually water-
based, but may also be oil. It is common to employ a water pump to force the engine coolant
to circulate, and also for an axial fan to force air through the radiator.

(Fig 2)
Processor: CPU, GPU
Computer cooling is required to remove the waste heat produced by computer components, to
keep components within permissible operating temperature limits. Components that are
susceptible to temporary malfunction or permanent failure if overheated include integrated
circuits such as central processing units (CPUs), chipset, graphics cards, and hard disk drives.
Components are often designed to generate as little heat as possible, and computers and
operating systems may be designed to reduce power consumption and consequent heating
according to workload, but more heat may still be produced than can be removed without
attention to cooling. Use of heat sinks cooled by airflow reduces the temperature rise
produced by a given amount of heat. Attention to patterns of airflow can prevent the
development of hotspots. Computer fans are widely used along with heatsink fans to reduce
temperature by actively exhausting hot air. There are also more exotic cooling techniques,
such as liquid cooling. All modern day processors are designed to cut out or reduce their
voltage or clock speed if the internal temperature of the processor exceeds a specified limit.
Cooling may be designed to reduce the ambient temperature within the case of a computer,
such as by exhausting hot air, or to cool a single component or small area (spot cooling).
Components commonly individually cooled include the CPU, Graphics processing
unit (GPU) and the northbridge .

(Fig 3)
TIM: Thermal Paste
Thermal grease (also called CPU grease, heat paste, heat sink compound, heat sink
paste, thermal compound, thermal gel, thermal interface material, or thermal paste) is a
thermally conductive (but usually electrically insulating) compound, which is commonly
used as an interface between heat sinks and heat sources such as high-
power semiconductor devices. The main role of thermal grease is to eliminate air gaps or
spaces (which act as thermal insulation) from the interface area in order to maximize heat
transfer and dissipation. Thermal grease is an example of a thermal interface material.
As opposed to thermal adhesive, thermal grease does not add mechanical strength to the bond
between heat source and heat sink. It will have to be coupled with a mechanical fixation
mechanism such as screws, applying pressure between the two, spreading the thermal grease
onto the heat source.

(Fig 4)
Loop: Liquid Cooling Setup
Liquid cooling is the reduction of heat in electronic and mechanical devices through
exploiting the properties of liquids.
Liquid cooling is a firmly established cooling method in many current technologies.
Automobiles, mainframes and the systems of computer enthusiasts have used water cooling
for many years. The methods and coolants can differ between and within these categories.

(Fig 6 )
 WORKING OF LIQUID COOL SYSTEM
To simply put it in words, liquid cooling works by removing heat from your cpu and gpu
through liquid which travels through a set of tubes that connects to a radiator. Water has a
thermal conductivity of 0.6062 W/ (m*K) whereas the thermal conductivity of air is only
0.0262. This means heat can be drawn away from components more efficiently with water.
It all starts with your processor, video card, and in some cases your motherboard. Water
blocks are placed on your processor and video card and act like a normal heat sink but cannot
be cooled by a fan. Your water blocks, pump, radiators, and reservoir all have fittings
installed which allows the tubing to be installed. The pump is responsible for moving liquid
throughout the liquid cooling setup. There are a variety of ways that a loop is set up but that
will be covered later in this guide. As your cpu gives off heat, water travels through the water
block which collects heat much like a copper pipe heat. The heat travels through the water in
the tubing to the radiator(s) where the heat is dissipated throughout the radiator fins. The fans
mounted to the radiator transfer air throughout the radiator cooling the radiator.
A liquid-cooling system for a PC works a lot like the cooling system of a car. Both take
advantage of a basic principle of thermodynamics - that heat moves from warmer objects to
cooler objects. As the cooler object gets warmer, the warmer object gets cooler. You can
experience this principle firsthand by putting your hand flat on a cool spot on your desk for
several seconds. When you lift your hand, your palm will be a little cooler, and the spot
where your hand was will be a little warmer.

In most computers, fans do a pretty good job of keeping electronic components cool. But for
people who want to use high-end hardware or coax their PCs into running faster, a fan might
not have enough power for the job. If a computer generates too much heat, liquid cooling,
also known as water cooling, can be a better solution. It might seem a little counterintuitive to
put liquids near delicate electronic equipment, but cooling with water is far more efficient
than cooling with air.

(Fig 7)
 PARTS OF LIQUID COOLING SYSTEM

Pump Tops
Pump Tops are a great way to accessorize your pump and they have added uses to them also.
A pump usually has 3/8" ports. A pump top allows you to add any size barb or compression
fitting to the pump. It will allow you to use 1/2" tubing and pretty much any other size tubing.
Pump Tops also increase the performance of the pump to the maximum. The most common
tops are made for the MCP335, MCP335x2, and the MCP655 pump from Swiftech.

Water Blocks
The water block is placed on your processor (CPU) and video card (GPU). This component
allows liquid to cool the cpu and gpu. They work much like a heat sink but use liquid to cool
instead of a fan. There are two major finishes to water blocks: copper and nickel. Nickel
blocks have the nicest finish and are also the most reliable but come with a high price.
Copper is in a close second and is a bit cheaper than nickel. Copper is also the most common
out there. You also have the option now to liquid cool your motherboard north and south
bridges. The reason you can liquid cool these is because when you overclock your cpu, you
also increase the voltages on your north/south bridge which causes the temperature to go up
for both. This isn't an essential component to liquid cool but you are always welcome to do
so.

(Fig 8)
Fitting & Tubing
In order for you to connect your tubing to the waterblocks, pump, radiator(s), and reservoir,
you need to have fittings. There are a couple of different styles of fittings out there that you
can use. You will find two materials that fittings can be made of; metal and plastic. I do not
recommend plastic fittings because they can easily break or get damaged if not handled
properly. The main thing you have to look for is the correct size of the fitting. Thread size is
universal: 1/4". You will also see that a fitting can be a barb or compression fitting. A fitting's
port size is what you have to pay attention to. There are a variety of tube sizes that have to be
compatible with a fitting size.

(Fig 9)
There are different brands of tubing and sizes to choose from. Primo Chill and Tygon tubing
are brands most used. Primo Chill offers tubing in a variety of colors while Tygon is a simple
clear tubing. These brands offer tubing that can be bent enough while still avoiding kinks.
Make sure your tubing does not have to much of a bend or it will kink which will cause liquid
flow restriction.
Coolant & Additives
When choosing coolant for your setup, it is important to know what you are going to choose.
Stay away from the top brand coolants that have dye added. This includes products that are
UV reactive or colorful coolants. These coolants will create gunk and sludge in your fitting
and blocks over a period of time which will slow the flow of liquid and may damage your
water blocks. It is best to just get Distilled Water, such as at your local Walmart or grocery
store. I would also recommend adding a silver kill coil or a biocide / corrosion proof additive
to your loop. A silver kill coil and biocide will prevent algae growth in your liquid cooling
system. Anti- Corrosive additives will prevent corrosion in your water blocks and fittings.
 (Fig 10)
Thermal paste
There are many thermal pastes out there for you to choose but not all of them are good. For
example, the TIM you get on a stock heat sink with your new cpu is not good. Also, the
"white glue" looking paste is also bad. In fact I wouldn't be surprised if it is glue. You can
also purchase Arctic Silver Thermal paste remover to help you remove old TIM before
applying new TIM. If you don't want to spend the money you can get some rubbing alcohol,
cotton balls, and q-tips to remove it also.

(Fig 11)
 EVOLUTION OF LIQUID COOL
Liquid cooling for electronic components isn’t a new technology – it’s been used since before
1887 for insulating and cooling high-voltage transformers. One of the earliest uses for liquid
cooling compute equipment was in the 1960s, with IBM’s System 360 computers. By the
1980s, liquid cooling was popular for supercomputers and mainframes, the early precursors
to today’s data centers in terms of computer density, power use and heat generation. Now, in
2019, liquid cooling is, once again, becoming the go-to solution for data center cooling.
This transition back to liquid cooling started in early 2000.
2000 Fujitsu released the GS8900 mainframe with a hybrid water cooling system
2005 IBM released a rear-door heat exchanger for use with its dense blade servers, the first
major company to start using water cooling for CMOS processors
2008 IBM introduced the Power 575, a supercomputer using a direct cooling system, with
water-cooled copper plates above the microprocessors, it’s first liquid cooled system for a
mainframe since the ES/9000
2009 Cool IT ships direct contact liquid cooling (aka, liquid-to-chip) Green Revolution
Cooling (now GRC) introduced Carnojet, with single phase liquid immersion cooling
Iceotope launches with immersion tanks on processor blades
2012 Two-phase immersion technology is used by crypto-miners.
2016 Liquid cooling technology has launched in mobile phones by first it was launched by
xiaomi

(Fig 12)
 LIQUID COOLING IN MOBILE PHONES
As phones get more powerful, they also generate more heat. To keep them cooler than ever,
we’re starting to see more phones ship with ―water cooling.‖ But what does that mean?
Modern smartphones are small computers in your pocket—they’re incredibly powerful, with
CPUs and GPUs more capable than full desktop PCs from not long ago. As a result of all this
power in such a small space, keeping the hardware cool has become a challenge for device
manufacturers. Most phone makers have had to think outside the box to find a proper solution
to keeping phones running cool as the performance ramps up—and water cooling seems to be
that solution. But it’s not the same as the water cooling process used in PCs—there isn’t
actual liquid flowing through the system. Talk of ―water cooling‖ in phones has ramped up
lately with the Galaxy Note 9 and Pocophone both using the feature to keep things running
cool. But those aren’t the first phones to use such a system—Samsung introduced a water-
cooling system in the Poco F1. Keep the CPU of POCO F1 fast and cool with our Liquid
Cool Technology, usually reserved for hardcore gaming smartphones. No matter how
intensely you're gaming, the cooled Snapdragon 845 has no problem keeping up its peak
performance and high frequency output. Say goodbye to slow response time and frozen
screens, this phone stays faster than fast.

(Fig 13)
 HOW LIQUID COOLING WORKS IN PHONES
With the Poco F1, Xiaomi developed a method of water cooling that uses a copper thermal
heat pipe to disperse heat away from the CPU, especially as the chip works harder. There is a
tiny bit of liquid in this tube—not enough to see if the tube is cut open (many people tested
this when the phone was first released). Instead, the water cooling process works by
condensation. As the processor heats up, the liquid essentially vaporizes, keeping the CPU
cool. The vapor then travels to the opposite end of the of the heat pipe, where it condenses
back into liquid when cooled off. This process, paired with a carbon fiber TIM (Thermal
Interface Material) is a very effective method of cooling phone hardware. Current
smartphones use a similar system, but Samsung expands on the original idea with a ―water
carbon cooling system‖ in the Note 9. With the Note 9, Samsung knew it needed even more
cooling power than it had with the S7 (or any previous phone). It achieved this in two ways:
by incorporating a wider thermal pipe and adding a layer of copper in between two thermal
spreaders to transfer more heat.
The Note 9 cooling system /via Samsung
The entire cooling system works in layers. Just above the processor, there’s a layer of carbon
fiber (which is excellent and transferring heat) below a thin piece of copper. Above this,
there’s another type of unspecified thermal transfer material (we can assume it’s some type of
silicone), and then the copper thermal heat pipe. Just above the pipe is a thermal spreader to
keep the heat from concentrating in one place. Other phones use similar systems—perhaps
not quite as sophisticated—but the basics should be roughly the same. The water generally
amounts to nothing more than vapor in most cases, so it’s less a ―water cooled‖ system and
more of a ―vapor cooled‖ system.
(Fig 14)
 WHY IT IS NEEDED IN PHONES
The basic principle behind liquid cooling in smartphones work on the dissipation of heat. The
cooling system consists of a heat pipe with a liquid inside. This liquid becomes vapour by
absorbing heat from the chipset. The heat is further dissipated, and the ambient temperature is
maintained.
Due to the basic architecture, any processing device will generate heat when current passes
through its circuits. Since these components have resistance, they tend to heat. The bigger the
chip, the higher the temperature because of the more number of components present. So, to
protect these nano chips from burning up, heat dissipation is necessary.
This cooling technology is used in most of the smartphones since the liquid cooling is
reserved for the higher-end ones. It is used to prevent overheating and throttling of the
device.
A metal plate is placed in contact with the CPU surface. It is selected based on its heat
absorption properties. It is further connected to the body of the device. The heat flow takes
place through the metal plate, flows to the phone's body and, is finally dissipated. That's why
the phone gets hot under heavy load.
 FUTURE OF LIQUID COOLING IN PHONES
Many heavy duty phones have been equipped with liquid cooling, but it is far from becoming
a must-have on the feature list. This has to do with the fact that processors are getting more
efficient with every coming generation. Thus, despite our heavy dependency on phones, the
need for the liquid cooling is not that big. The new materials being used nowadays also play a
vital role in the smartphones not relying on liquid cooling to keep calm. Keep reading for
more geeky content. If you’ve worked with a notebook computer resting on your knees for
any length of time, or held a smart phone to your ear for a long chat, you’ll know how hot
these portable devices can get. Given that smaller portable devices such as tablets and phones
are unable to accommodate water-cooling pumps or even fans, manufacturers have relied on
conductive sheets of metal or other materials to carry the heat away from the really hot spots
and keep high temperatures from damaging chips. But it’s increasingly clear that if portable
devices are to continue to improve, we’ll need something better. Engineers at Fujitsu
Laboratories in Kawasaki, Japan, think they have that something. The lab recently announced
development of a loop-shaped heat pipe that could do the job. The device is a super-thin loop
of copper filled with water. At one end is the evaporator, which sits over the smartphone or
tablet’s hottest chip—the CPU—using the heat to boil the water. At the other end is the
condenser, where heat escapes and the water recondenses and flows back to the evaporator.
The new device offers roughtly five times greater heat transfer The real innovation is that the
Fujitsu Lab managed to pack a liquid-cooling system into a frame slim enough for a
smartphone. The actual pipe and evaporator sections are just 0.6 millimeters thick, the
world’s thinnest, according to Fujitsu, while the thermal diffusion plate or condenser they
connect to tops out at 1 mm. Overall, the device forms a somewhat rectangular frame
measuring 107 mm by 58 mm. Engineers at Fujitsu Laboratories in Kawasaki, Japan, think
they have that something. The lab recently announced development of a loop-shaped heat
pipe that could do the job. The device is a super-thin loop of copper filled with water. At one
end is the evaporator, which sits over the smartphone or tablet’s hottest chip—the CPU—
using the heat to boil the water. At the other end is the condenser, where heat escapes and the
water recondenses and flows back to the evaporator.
The new device offers roughtly five times greater heat transfer The real innovation is that the
Fujitsu Lab managed to pack a liquid-cooling system into a frame slim enough for a
smartphone. The actual pipe and evaporator sections are just 0.6 millimeters thick, the
world’s thinnest, according to Fujitsu, while the thermal diffusion plate or condenser they
connect to tops out at 1 mm. Overall, the device forms a somewhat rectangular frame
measuring 107 mm by 58 mm. The heat pipe from the condenser to the evaporator and the
evaporator segment consist of two outer and four inner stacked copper sheets, each measuring
0.1 mm thick. This gives the pipe and evaporator its overall 0.6-mm thickness—way, way
thinner than the 10-mm thick evaporator the lab previously developed. Etched into the inner
copper sheets are patterned holes slightly offset from the adjacent copper layers. These form
a structure of miniature pores that create capillary action and cause the fluid to flow from the
condenser to the evaporator. The heat from the CPU turns the water to vapor, which then
flows through the hollow portion of the heat pipe back to the condenser, where the heat is
dissipated and the vapor changed back into water and recirculated again.
 (Fig 15)
Photo: Fujitsu
Compared to previous thin loop heat pipes, Fujitsu says its new device enables roughly five
times greater heat transfer. What’s more, ―the capillary action enables the liquid to easily
circulate and readily transfer heat no matter how the device is positioned,‖ says Takeshi
Shioga, a researcher at Fujitsu Laboratory’s Product & Systems Engineering Laboratories.
Another of the loop’s merits is that its layout can be customized. ―The position of the
evaporator and condenser can be changed according to the shape of the product,‖ says
Shioga. ―So there’s no necessity to compromise a product’s functionality, performance, or
specifications during the design phase.‖ Fujitsu will refine the design to bring down costs. It
plans to implement it in mobile devices in 2017 and later in communication infrastructure and
medical equipment, as well as in small notebook computers.
 ADVANTAGES OF LIQUID COOLING TECHNILOGY
Less clutter and more space: Traditional air cooling uses fans. A typical air-cooled PC has
several fans installed inside the PC case. These include fans for drawing air inside and
outside the case, specific fans for the graphic card, and other specific fans for the CPU or
processor. More fans are needed for a customized PC with multiple GPU system and/or an
overclocked CPU to improve heat removal. This means consuming more real estate inside the
PC case resulting in a messy and bulky PC setup. One of the advantages of a liquid cooling
system is that it does not take too much space because of its smaller real estate profile. This
allows building a computer with a slimmer profile. More hardware components can also be
installed in place of fans, thus allowing double computer power in the same real estate.
Noise-free PC operation: Fans generate noise that becomes more audible when the PC is
overworked. The PC becomes noisier with too much fans. Another one of the advantages of a
liquid cooling system over air cooling system is that it does not generate the same noise. It is
actually relatively silent. Take note that liquid cooling uses a motor to circulate the liquid
coolant around or across specified PC hardware components. The system also includes a very
low-powered fan and some hybrid systems integrate small fans to improve ventilation inside
the PC case. Nonetheless, both the motor and low-powered fans do not generate discernible
noise.
Better overclocking potential: Overclocking a CPU or raising the frequency of the
processor chip beyond the stock frequency is popular among computer hobbyists and
builders. However, doing so results in too much power consumption and heat generation.
Another advantage of liquid cooling is that it is more efficient in removing excess heat. This
advantage comes from the fact that water or any liquid coolant has higher heat capacity,
density, and thermal conductivity than air. This allows the system to transfer more heat over
greater distances.
Cooling specific components: A higher degree of cooling specification is another one of the
benefits of liquid cooling. This means cooling specific components of the computer to a
greater degree than in traditional air cooling. Remember that air cooling units are bulky and
most setup focuses on placing the fans on the GPU and CPU. Users can cool specific
computer components by placing fans near them. But these would make the entire PC setup
messier and bulkier. Liquid cooling allows heat removal not only from these critical spots.
Users can choose to cool specific components that are also prone to heating such as hard
drives, voltage regulator modules, and power supplies. Remember that a liquid cooling
system is more compact and consumes smaller real estate than an air cooling system.
 DISADVANTAGES OF LIQUID COOLING TECHNOLOGY
More costly or expensive: One notable disadvantage of liquid cooling over air cooling is
that it is considerable costly to set up. Fans are prevalent in the market and this
overabundance of supply means they are cheap. The components of a liquid cooling system
can be expensive. Parts obtained from cars and aquariums, among others are the basis of
earlier liquid cooling systems. Several companies nowadays are selling specific liquid
cooling components for personal computers. Expenses for building a liquid cooling system
from scratch can range from USD 300 to USD 500. It is worth mentioning that a complete air
cooling system can cost at around USD 100 to USD 200. However, there is an option for
buying self-contained liquid coolers. The price of these starts at USD 60. This system is
similar to an air cooling system but there is a limit to the degree of modification compared to
a full-blown liquid cooling system.
Complex to install: Setting up a liquid cooling system from scratch can be tricky because it
requires a certain degree of understanding in the fields of electronics and thermodynamics.
This is another considerable disadvantage, especially for newbies. Take note that a good
liquid cooling system should remove excess heat effectively and immediately. Installing the
components of a liquid cooling system also requires more involvement than installing a
typical aftermarket air cooler. Remember that a fan only needs to sit atop a GPU or CPU or
alongside a PC case. The components of liquid cooling requires connecting tubes and wires,
understanding the placement of loops and radiators or fan. Safety is also a primary and
critical consideration. One must ensure that the entire system is resistant from any possible
leaks by testing it outside the PC before implementing it inside. Drops from water or any
liquid will certainly damage electronic components and manufacturers do not entertain
warranty claims based on water-based incidents.
Susceptibility to leaks: Poorly implemented liquid cooling system is likely to result in leaks.
Note that water or liquid coolant can accelerate the corrosion of metal parts and damage
electronic components. Pressure inside tubes can also build up due to too much heat absorbed
by the liquid resulting in leaks.The aforementioned means that another disadvantage of water
cooling is that it is not suitable for newbies or those who have little to no experience in
building a customised PC. One must ensure that fittings and the entire assembly are free from
error. There should also be some form of contingency in terms of a leak. Even a single drop
of liquid can ruin an electronic component.
Susceptibility to leaks thereby make liquid cooling unfavourable. Installing a liquid cooling
system might actually be comparable to solving a problem that does not exist. A poorly
implemented system runs the risk of frying expensive hardware components.
 CONCLUSION
Setting up a liquid cooling system might be one of the hallmarks of building a customized
personal computer. Those who are serious with their custom-built PC should carefully
consider what cooling system works best for them. Choosing between liquid cooling and air
cooling boils down to requirements or the usage needs. A standard air cooling system is
certainly a practical and effective solution for PC users with average PC usage requirements.
The same is true for individuals who have limited financial resources. A liquid cooling
system is ideal for very powerful personal computers built to carry heavy processing tasks
such as gaming and audio and video processing or for an overall computer setup that features
an overclocked CPU or a multiple GPU system. Remember that preventing a computer from
overheating by removing excess internal heat is an essential maintenance consideration.
CPUs can and GPUs can literally burn. Effective cooling can also extend the lifespan of other
computer components such as voltage regulatory components and memory. As a side note,
liquid cooling works well than air cooling because it allows relocation of heat from source to
a more efficient location for cooling. The liquid acts more of a heat carrier and liquid cooling
is designed to remove heat from areas where air is hard and ventilation are hard to introduce.
Liquid Cooling is not a project for everyone. If you at all feel uncomfortable with liquid
cooling, stop, and do yourself a favor and just get an all-in-one cooler. They work great and
will give you the peace of mind. If you read this guide and you feel that you still have
questions, feel free to contact me at any time or write in this thread. I'll be happy to answer
your questions.
 REFERENCES
http://compreviews.about.com/od/cpus/a/LiquidCooling.htm
http://www.computerforum.com/206174-how-liquid-cooling-101-a.html
http://www.pcworld.com/article/227964/pc_liquid_cooling_system_do_it_yours
elf.h
http://xiamoi.mi.com
http://samaung.indian.com.in