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IN RF F OUT RF+
16/30dB
Short Circuit
Protection
OUT RF-
& Diagnostic
IN RR R OUT RR+
16/30dB
PW_GND
THERMAL DATA
Symbol Description Value Unit
Rth j-case Thermal Resistance Junction-case Max 1 °C/W
PIN CONNECTION
27 TAB
26 DATA
25 PW_GND RR
24 OUT RR-
23 CK
22 OUT RR+
21 VCC2
20 OUT RF-
19 PW_GND RF
18 OUT RF+
17 AC GND
16 IN RF
15 IN RR
14 S_GND
13 IN LR
12 IN LF
11 SVR
10 OUT LF+
9 PW_GND LF
8 OUT LF-
7 VCC1
6 OUT LR+
5 CD-OUT
4 OUT LR-
3 PW_GND LR
2 STBY
1 TAB
D00AU1230
2/20
TDA7563
C8 C7
0.1µF 3300µF
Vcc1 Vcc2
V(4V .. VCC)
7 21 +
2 18
19 OUT RF
DATA 26
20
I2C BUS -
+
CLK 23 22
C1 0.22µF 23 OUT RR
IN RF 16 24
-
+
C2 0.22µF 10
IN RR 15 9 OUT LF
8
C3 0.22µF -
+
IN LF 12 6
3 OUT LR
C4 0.22µF
4
IN LR 13 -
TAB
S-GND 1, 27
14 17 11 5
47K
C5 C6 V
1µF 10µF
D00AU1231A
CD OUT
3/20
TDA7563
ELECTRICAL CHARACTERISTICS (Refer to the test circuit, VS = 14.4V; RL = 4Ω; f = 1KHz; GV = 30dB;
Tamb = 25°C; unless otherwise specified.)
Symbol Parameter Test Condition Min. Typ. Max. Unit
POWER AMPLIFIER
VS Supply Voltage Range 8 18 V
Id Total Quiescent Drain Current 170 300 mA
PO Output Power EIAJ (VS = 13.7V) 35 40 W
THD = 10% 25 28 W
THD = 1% 22 W
RL = 2Ω; EIAJ (VS = 13.7V) 55 62 W
RL = 2Ω; THD 10% 40 46 W
RL = 2Ω; THD 1% 35 W
RL = 2Ω; MAX POWER 72 W
THD Total Harmonic Distortion PO = 1W to 10W; STD MODE 0.03 0.1 %
HE MODE; PO = 1.5W 0.02 0.1 %
HE MODE; PO = 8W 0.15 0.5 %
PO = 1-10W, f = 10kHz 0.2 0.5 %
GV = 16dB; STD Mode 0.02 0.05 %
VO = 0.1 to 5V RMS
CT Cross Talk f = 1KHz to 10KHz, R G = 600Ω 50 60 dB
RIN Input Impedance 60 100 130 KΩ
GV1 Voltage Gain 1 29.5 30 30.5 dB
∆GV1 Voltage Gain Match 1 -1 1 dB
GV2 Voltage Gain 2 15.5 16 16.5 dB
∆GV2 Voltage Gain Match 2 -1 1 dB
EIN1 Output Noise Voltage 1 Rg = 600Ω 50 100 µV
20Hz to 22kHz
EIN2 Output Noise Voltage 2 Rg = 600Ω; GV = 16dB 15 30 µV
20Hz to 22kHz
SVR Supply Voltage Rejection f = 100Hz to 10kHz; Vr = 1Vpk; 50 60 dB
Rg = 600Ω
BW Power Bandwidth 100 KHz
ASB Stand-by Attenuation 90 110 dB
ISB Stand-by Current 2 100 µA
AM Mute Attenuation 80 100 dB
VOS Offset Voltage Mute & Play -100 0 100 mV
VAM Min. Supply Mute Threshold 7 7.5 8 V
TON Turn ON Delay D2/D1 (IB1) 0 to 1 5 20 ms
TOFF Turn OFF Delay D2/D1 (IB1) 1 to 0 5 20 ms
VSBY St-By/Mute pin for St-By 0 1.5 V
VMU St-By/Mute pin for Mute 3.5 5 V
VOP St-By/Mute pin for Operating 7 VS V
IMU St-By/Mute pin Current VSTBY/MUTE = 8.5V 20 40 µA
VSTBY/MUTE < 1.5V 0 10 µA
CDLK Clip Det High Leakage Current CD off 0 15 µA
CDSAT Clip Det Sat. Voltage CD on; ICD = 1mA 300 mV
CDTHD Clip Det THD level D0 (IB1) = 1 5 10 15 %
D0 (IB1) = 0 1 2 3 %
4/20
TDA7563
5/20
TDA7563
Figure 2. Quiescent Current vs. Supply Figure 3. Output Power vs. Supply Voltage (4Ω)
Voltage
Id (mA)
250 Po (W)
70
230 65
Po-max
Vin = 0 60
210 NO LOADS
55 RL = 4 Ohm
190 f = 1 KHz
50
THD = 10 %
170 45
40
150 35
130 30
25
110 THD = 1 %
20
90 15
10
70
8 10 12 14 16 18 5
8 9 10 11 12 13 14 15 16 17 18
Vs (V)
Figure 4. Output Power vs. Supply Voltage (2Ω) Figure 5. Distortion vs. Output Power (4Ω, STD)
90 STANDARD MODE
Po-max Vs = 14.4 V
80 RL = 4 Ohm
RL = 2 Ohm 1
70 f = 1 KHz
60 THD = 10 %
f = 10 KHz
50
40 0.1
f = 1 KHz
30
THD = 1 %
20
10 0.01
8 9 10 11 12 13 14 15 16 0.1 1 10
Po (W)
Vs (V)
Figure 6. Distortion vs. Output Power Figure 7. Distortion vs. Output Power (2Ω, STD)
(4Ω, HI-EFF)
THD (%) THD (%)
10 10
f = 1 KHz
0.1
f = 1 KHz
0.01
0.001 0.01
0.1 1 10 0.1 1 10
Po (W) Po (W)
6/20
TDA7563
Figure 8. Distortion vs. Frequency (4Ω) Figure 9. Distortion vs. Frequency (2Ω)
STANDARD MODE
STANDARD MODE Vs = 14.4 V
1 Vs = 14.4 V RL = 2 Ohm
RL = 4 Ohm 1
Po = 4 W
Po = 4 W
0.1 0.1
0.01 0.01
10 100 1000 10000 10 100 1000 10000
f (Hz) f (Hz)
Figure 10. Crosstalk vs. Frequency Figure 11. Supply Voltage Rejection vs.
Frequency
CROSSTALK (dB) SVR (dB)
90 90
80 80
70 70
60 60
50 STANDARD MODE 50
RL = 4 Ohm
Po = 4 W STD & HE MODE
40 Rg = 600 Ohm 40 Rg = 600 Ohm
Vripple = 1 Vpk
30 30
20 20
10 100 1000 10000 10 100 1000 10000
f (Hz)
f (Hz)
Figure 12. Power Dissipation & Efficiency vs. Figure 13. Power Dissipation & Efficiency vs.
Output Power (4Ω, STD, SINE) Output Power (4Ω, HI-EFF, SINE)
Ptot (W) n (%) Ptot (W) n (%)
90 90 90 90
STANDARD MODE n HI-EFF MODE
80 80 80 Vs = 14.4 V 80
Vs = 14.4 V
RL = 4 x 4 Ohm n
RL = 4 x 4 Ohm
70 f = 1 KHz SINE 70 70 f = 1 KHz SINE 70
60 60 60 60
50 50 50 50
Ptot
40 40 40 40
Ptot
30 30 30 30
20 20 20 20
10 10 10 10
0 0 0 0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 0.1 1 10
Po (W) Po (W)
7/20
TDA7563
Figure 14. Power Dissipation vs. Average Ou- Figure 15. Power Dissipation vs. Average Ou-
put Power (Audio Program Simula- put Power (Audio Program Simula-
tion, 4Ω) tion, 2Ω)
Ptot (W) Ptot (W)
45 90
40 80
Vs = 14 V STD MODE
35 RL = 4 x 4 Ohm 70
GAUSSIAN NOISE Vs = 14 V STD MODE
60 RL = 4 x 2 Ohm
30 GAUSSIAN NOISE
CLIP 50
25 STAR T
CLIP
40 START
20 HI-EFF MODE
15 30
HI-EFF MODE
10 20
5 10
0
0
0 1 2 3 4 5 6 7 8 9
0 1 2 3 4 5
Po (W) Po (W)
8/20
TDA7563
Vs~5V I (mA)
Isource Isource
Isink
CH+
CH-
Isink
~100mS t (ms)
Measure time
Fig. 17 and 18 show SVR and OUTPUT waveforms at the turn-on (stand-by out) with and without TURN-
ON DIAGNOSTIC.
Vsvr
Out
Permanent diagnostic
acquisition time (100mS Typ)
Diagnostic Enable t
Bias (power amp turn-on)
(Permanent) FAULT
event Read Data
I2CB DATA
9/20
TDA7563
Vsvr
Out Turn-on diagnostic
acquisition time (100mS Typ) Permanent diagnostic
acquisition time (100mS Typ)
t
Diagnostic Enable Turn-on Diagnostics data (output) FAULT
Diagnostic Enable
(Turn-on) permitted time
(Permanent) event
I2CB DATA
The information related to the outputs status is read and memorized at the end of the current pulse top.
The acquisition time is 100 ms (typ.). No audible noise is generated in the process. As for SHORT TO
GND / Vs the fault-detection thresholds remain unchanged from 30 dB to 16 dB gain setting. They are as
follows:
Concerning SHORT ACROSS THE SPEAKER / OPEN SPEAKER, the threshold varies from 30 dB to 16
dB gain setting, since different loads are expected (either normal speaker’s impedance or high imped-
ance). The values in case of 30 dB gain are as follows:
If the Line-Driver mode (Gv= 16 dB and Line Driver Mode diagnostic = 1) is selected, the same thresh-
olds will change as follows:
10/20
TDA7563
Out
1mS 1mS 1mS 1mS
1-2mS
t
Overcurrent and short
circuit protection intervention Short circuit removed
(i.e. short circuit to GND)
t
Overcurrent and short
Short circuit removed
(i.e. short circuit to GND)
11/20
TDA7563
S. GND (so) / S. GND (sk) in the above table the short is removed and micro reads I2C. The
make a distinction according to which of the 2 short to Gnd is still present in bytes, because it is
outputs is shorted to ground (test-current source the result of the previous cycle. If another I2C
side= so, test-current sink side = sk). More pre- reading operation occurs, the bytes do not show
cisely, in Channels LF and RR, so = CH+, sk = the short). In general to observe a change in Di-
CH-; in Channels LR and RF, so = CH-, sk = CH+ agnostic bytes, two I2C reading operations are
. necessary.
In Permanent Diagnostic the table is the same,
with only a difference concerning Open Load(*) , THERMAL PROTECTION
which is not among the recognisable faults. Thermal protection is implemented through ther-
Should an Open Load be present during the de- mal foldback (fig. 21). Thermal foldback begins
vice’s normal working, it would be detected at a limiting the audio input to the amplifier stage as
subsequent Turn on Diagnostic cycle (i.e. at the the junction temperatures rise above the normal
successive Car Radio Turn on). operating range. This effectively limits the output
power capability of the device thus reducing the
FAULTS AVAILABILITY temperature to acceptable levels without totally
2 interrupting the operation of the device. The out-
All the results coming from I Cbus, by read opera- put power will decrease to the point at which ther-
tions, are the consequence of measurements in- mal equilibrium is reached. Thermal equilibrium
side a defined period of time. If the fault is stable will be reached when the reduction in output
throughout the whole period, it will be sent out. power reduces the dissipated power such that the
To guarantee always resident functions, every die temperature falls below the thermal foldback
kind of diagnostic cycles (Turn on, Permanent, threshold. Should the device cool, the audio level
Offset) will be reactivate after any I2C reading op- will increase until a new thermal equilibrium is
eration. So, when the micro reads the I2C, a new reached or the amplifier reaches full power. Ther-
cycle will be able to start, but the read data will mal foldback will reduce the audio output level in
come from the previous diag. cycle (i.e. The de- a linear manner.
vice is in Turn On state, with a short to Gnd, then
12/20
TDA7563
TH. WARN.
Vout ON
Vout
TH. SH. TH. SH. Tj ( °C)
START END
Tj ( °C)
I2C PROGRAMMING/READING SEQUENCES ABLE + STAND-BY IN) --- 10ms --- PIN2 = 0
A correct turn on/off sequence respectful of the di- Car Radio Installation: PIN2 > 7V --- 10ms DIAG
agnostic timings and producing no audible noises ENABLE (write) --- 200 ms --- I2C read (repeat
could be as follows (after battery connection): until All faults disappear).
TURN-ON: PIN2 > 7V --- 10ms --- (STAND-BY OFFSET TEST: Device in Play (no signal) --
OUT + DIAG ENABLE) --- 500 ms (min) --- MUT- OFFSET ENABLE - 30ms - I2C reading
ING OUT (repeat I2C reading until high-offset message dis-
appears).
TURN-OFF: MUTING IN --- 20 ms --- (DIAG DIS-
13/20
TDA7563
SDA
SCL
SCL
I2CBUS
SDA
D99AU1032
START STOP
SCL 1 2 3 7 8 9
SDA
MSB
ACKNOWLEDGMENT
START D99AU1033 FROM RECEIVER
14/20
TDA7563
SOFTWARE SPECIFICATIONS
All the functions of the TDA7563 are activated by I2C interface.
The bit 0 of the ”ADDRESS BYTE” defines if the next bytes are write instruction (from µP to TDA7563)
or read instruction (from TDA7563 to µP).
Chip Address:
D7 D0
1 1 0 1 1 0 0 X D8 Hex
X = 0 Write to device
X = 1 Read from device
IB2
D7 X
D6 used for testing
D5 used for testing
Stand-by on - Amplifier not working - (D4 = 0)
D4
Stand-by off - Amplifier working - (D4 = 1)
Power amplifier mode diagnostic (D3 = 0)
D3
Line driver mode diagnostic (D3 = 1)
D2 X
Right Channel
D1 Power amplifier working in standard mode (D1 = 0)
Power amplifier working in high efficiency mode (D1 = 1)
Left Channel
D0 Power amplifier working in standard mode (D0 = 0)
Power amplifier working in high efficiency mode (D0 = 1)
15/20
TDA7563
If R/W = 1, the TDA7563 sends 4 ”Diagnostics Bytes” to µP: DB1, DB2, DB3 and DB4.
DB1
D7 Thermal warning active (D7 = 1)
Diag. cycle not activated or not terminated (D6 = 0)
D6
Diag. cycle terminated (D6 = 1)
D5 X
Channel LF
D4 Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
Channel LF
D3 Normal load (D3 = 0)
Short load (D3 = 1)
Channel LF
Turn-on diag.: No open load (D2 = 0)
D2 Open load detection (D2 = 1)
Offset diag.: No output offset (D2 = 0)
Output offset detection (D2 = 1)
Channel LF
D1 No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
Channel LF
D0 No short to GND (D1 = 0)
Short to GND (D1 = 1)
DB2
Offset detection not activated (D7 = 0)
D7
Offset detection activated (D7 = 1)
D6 X
D5 X
Channel LR
D4 Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
Channel LR
D3 Normal load (D3 = 0)
Short load (D3 = 1)
Channel LR
Turn-on diag.: No open load (D2 = 0)
D2 Open load detection (D2 = 1)
Permanent diag.: No output offset (D2 = 0)
Output offset detection (D2 = 1)
Channel LR
D1 No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
Channel LR
D0 No short to GND (D1 = 0)
Short to GND (D1 = 1)
16/20
TDA7563
DB3
D7 Stand-by status (= IB1 - D4)
D6 Diagnostic status (= IB1 - D6)
D5 X
Channel RF
D4 Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
Channel RF
D3 Normal load (D3 = 0)
Short load (D3 = 1)
Channel RF
Turn-on diag.: No open load (D2 = 0)
D2 Open load detection (D2 = 1)
Permanent diag.: No output offset (D2 = 0)
Output offset detection (D2 = 1)
Channel RF
D1 No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
Channel RF
D0 No short to GND (D1 = 0)
Short to GND (D1 = 1)
DB4
D7 X
D6 X
D5 X
Channel RR
D4 Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
Channel RR
D3 Normal load (D3 = 0)
Short load (D3 = 1)
Channel RR
Turn-on diag.: No open load (D2 = 0)
D2 Open load detection (D2 = 1)
Permanent diag.: No output offset (D2 = 0)
Output offset detection (D2 = 1)
Channel RR
D1 No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
Channel RR
D0 No short to GND (D1 = 0)
Short to GND (D1 = 1)
17/20
TDA7563
3a - Turn-On of the power amplifier with 30dB gain, mute on, diagnostic defeat, CD = 2%.
Start Address byte with D0 = 0 ACK IB1 ACK IB2 ACK STOP
X0000000 XXX1XX11
3b - Turn-Off of the power amplifier
Start Address byte with D0 = 0 ACK IB1 ACK IB2 ACK STOP
X0XXXXXX XXX0XXXX
5 - Offset detection procedure stop and reading operation (the results are valid only for the offset
detection bits (D2 of the bytes DB1, DB2, DB3, DB4).
Start Address byte with D0 = 1 ACK DB1 ACK DB2 ACK DB3 ACK DB4 ACK STOP
The purpose of this test is to check if a D.C. offset (2V typ.) is present on the outputs, produced by in-
put capacitor with anomalous leackage current or humidity between pins.
The delay from 4 to 5 can be selected by software, starting from T.B.D. ms
18/20
TDA7563
mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.45 4.50 4.65 0.175 0.177 0.183 OUTLINE AND
B 1.80 1.90 2.00 0.070 0.074 0.079 MECHANICAL DATA
C 1.40 0.055
D 0.75 0.90 1.05 0.029 0.035 0.041
E 0.37 0.39 0.42 0.014 0.015 0.016
F (1) 0.57 0.022
G 0.80 1.00 1.20 0.031 0.040 0.047
G1 25.75 26.00 26.25 1.014 1.023 1.033
H (2) 28.90 29.23 29.30 1.139 1.150 1.153
H1 17.00 0.669
H2 12.80 0.503
H3 0.80 0.031
L (2) 22.07 22.47 22.87 0.869 0.884 0.904
L1 18.57 18.97 19.37 0.731 0.747 0.762
L2 (2) 15.50 15.70 15.90 0.610 0.618 0.626
L3 7.70 7.85 7.95 0.303 0.309 0.313
L4 5 0.197
L5 3.5 0.138
M 3.70 4.00 4.30 0.145 0.157 0.169
M1 3.60 4.00 4.40 0.142 0.157 0.173
N 2.20 0.086
O 2 0.079
R 1.70 0.067
R1 0.5 0.02
R2 0.3 0.12
R3 1.25 0.049
R4 0.50 0.019
V 5° (Typ.)
V1 3° (Typ.) Flexiwatt27
V2 20° (Typ.)
V3 45° (Typ.)
(1): dam-bar protusion not included
(2): molding protusion included
H
V3 H1
H2 A
H3
O
R3
R4
L4
V1
R2
N
L2
R
L L1
V1
L3
V2
R2 D
R1
L5 R1 R1
E
G G1 F
V M M1
C
V
FLEX27ME
19/20
TDA7563
Information furnished is believed to be accurate and reliable. However, STMicroelectroni cs assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
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20/20
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