PCB Design & Manufacturing CURRICULUM

PCB DESIGN & MANUFACTURING
Ministry of Micro, Small and Medium

Enterprises, New Delhi
(MSME-Technology Centre)
STRUCTURE OF THE TRAINING PROGRAM
Module-I: Basic Electricity and Electronics
Module-II: Manual PCB Design
Module-III: Computer Familiarization & Computer Aided PCB Design
Module-IV: PCB Production Overview, Material & Safety
Module-V: Film Master Preparation, Board Cleaning, Screen Printing, Photo Printing & Masking
Module-VI: Mechanical Machining Operation & HAL
Module-VII: Chemical Area
Module-VIII: PCB Inspection and Quality Control
SEMESTER: I
COURSE NAME: Basic Electricity and Electronics
COURSE CODE: PCBD/BEE
COURSE OUTCOMES: After completion of course student should be able to:
 Describe advantage of electricity.
 Observe safety precautions while working with electricity.
 Explain DC series and DC parallel circuits and its utility in electrical technology.
 Explain the working principles of cells and batteries.
 Explain fundamental of AC, sinusoidal curve, alternating quantity, cycle, time period, frequency, instantaneous value, maximum value,
average value, RMS value form factor.
 Explain Ohm’s law.
 Explain semi conductor theory.
 Explain working principal of diode and its uses.
 Explain working principal of transistor and its uses.
 Calculate the value of resistance with the colour code.
 Test the electronic component as per its specifications.
 Refer the data book of component for extra, required information and also for equivalents.
 State the need and importance of symbols.
 Draw and identify the symbols for components and instrument used in electronic assembly.
 Use of various electronic instruments.
 Explain the binary number system.
 Convert number from one number system to other.
 Explain the logic families (Nomenclature and brief features).
 Identify different packaging system.
Page 1 of 19
 Describe logic rules.
 Explain digital logic system.
 Draw basic logic symbols.
THEORY HOURS: 73 PRACTICAL HOURS: 109 THEORY MARKS: 150 PRACTICAL MARKS: 225
Unit No. Unit Name Unit level outcomes Contents (chapters/topics) TH hours PR hours Marks
After completion of this unit Advantages of electrical energy.
student should be able to: Sources of energy.
 Describe advantage of Safety precautions with electricity.
electricity. Ohm’s law, voltage, current and resistance.
 Observe safety Laws of resistance.
precautions while working Resistivity, Conductivity, Conductor.
with electricity. Insulator and semiconductor.
 Explain DC series and DC Types of units.
parallel circuits and its Fundamental and derived units.
utility in electrical Force, Mass, Weight, Work, Power, Energy.
technology. Units in SI, CGS and FPS systems.
UNIT-I Basic Electricity  Explain the working Use of alternating currents. 15 27 87
principles of cells and Time period and frequency.
batteries. Equation for waveform of sinusoidal quantities
 Explain fundamental of (current or voltage).
AC, sinusoidal curve, Alternating current.
alternating quantity, cycle, Instantaneous, maximum value and average or
time period, frequency, mean value, RMS, or effective value of alternating
instantaneous value, current or voltage.
maximum value, average Phase and phase difference.
value, RMS value form
factor.
 Explain Ohm’s law.
Page 2 of 19
After completion of this unit Structure of matter.
student should be able to: Conductors, Insulators and Semiconductors.
 Explain semi conductor Active and Passive Components.
theory. Resistance.
 Explain working principal Capacitor.
of diode and its uses. Inductor.
 Explain working principal Semiconductor physics.
of transistor and its uses. PN junction diode characteristics.
 Calculate the value of Forward & Reverse biasing of a diode.
resistance with the colour Zener diode characteristics.
code. Halfwave & Fullwave rectifier.
 Test the electronic Filter circuits.
component as per its Simple voltage regulator circuit.
UNIT-II Basic Electronics 20 28 99
specifications. Amplifiers.
 Refer the data book of Oscillators.
component for extra, Switching circuits.
required information and Transistor.
also for equivalents. IC.
 State the need and UJT.
FET.
importance of symbols.
SCR.
 Draw and identify the DIAC.
symbols for components TRIAC.
used in electronic Transformer.
assembly.
After completion of this unit Multimeter.

student should be able to: Vernier Calliper.
Electronic  Draw and identify the Micrometer.
UNIT-III symbols for instrument Oscilloscope.
Instruments 15 30 93
used in electronic Function Generator.
Power Supply.
assembly.
 Use of various electronic
Page 3 of 19
instruments.
After completion of this unit Binary Numbers.

student should be able to: Binary Switch.
 Explain the binary number Number System.
system. Conversion from one number system to other.
 Convert number from one Basic Logic Operations and Logic Expressions.
Truth Table.
number system to other.
Logic Gates and Circuit Diagrams.
 Explain the logic families
UNIT-IV Digital Electronics (Nomenclature and brief
23 24 96
features).
 Identify different
packaging system.
 Describe logic rules.
 Explain digital logic
system.
 Draw basic logic symbols.
SEMESTER: I
COURSE NAME: Manual PCB Design
COURSE CODE: PCBD/MPCB
 State rules and regulations of PCB design.
 Place the components.
 Minimize the size of PCB.
 Convert schematic diagram to layout diagram.
 Place ground lines and power supply.
 Maintain the mounting holes.
 Maintain the angular ring.
 Maintain the air gaps.
 Maintain the track width.
Page 4 of 19
 Do tracking of PCB tracks and pads.
 Explain through holes.
 Generate drilling drawing.
 Generate mechanical drawings.
Unit Unit Name Unit level outcomes Contents (chapters/topics) TH PR hours Marks
No. hours
After completion of this Conductor width.
unit student should be Signal tracks.
able to: Power/ground tracks.
 State rules and Voltage/ground coding.
Board Layout regulations of PCB Output coding.
UNIT-I 15 21 74
Ground Rules design. Feed through the templates.
 Place the Describe component layout.
components. Mounting components pad spacing.
Hole diameter.
Pad size.
After completion of this Electronic Symbols.
unit student should be Reference designations.
able to: Fundamental of schematic layout.
 Minimize the size of Define and read schematic.
PCB.
UNIT-II Schematics 15 22 77
 Convert schematic
diagram to layout
diagram.
 Place ground lines
and power supply.
After completion of this PCB production overview.
unit student should be Mechanical insertion.
UNIT- Production able to: Tooling holes.
15 22 76
III Considerations  Maintain the Component holes.
mounting holes. Edge clearance.
 Maintain the Unused area.
Page 5 of 19
angular ring. IC configurations.
 Maintain the air
gaps.
 Maintain the track
width.
After completion of this Tape and pads.
unit student should be Taping standards.
able to: Multipad.
 Do tracking of PCB Stick on patterns.
UNIT- Art Master Tape tracks and pads. Corner strips.
13 23 74
IV Up  Explain through Component designation marking.
holes. Handling and storage of PC artwork.
Camera for photo reduction and separation of blue and red
artwork.
Ground planes.
After completion of this Fabrication drawing.
unit student should be Assembly drawing.
able to: Silk screen.
Different  Generate drilling Inspection of artwork and drawings.
UNIT-V 15 21 74
Drawings drawing.
 Generate
mechanical
drawings.
SEMESTER: I
COURSE NAME: Computer Familiarization & Computer Aided PCB Design
COURSE CODE: PCBD/CAD
 Draw block diagram of a computer.
 Explain the working of a computer.
 Work on a computer system.
 How to work on different operating systems.
 How to take printout.
 Explain CAD fundamentals.
Page 6 of 19
 Draw schematic diagram.
 Place schematic components.
 Edit a library path.
 Do wiring.
 Generate netlist.
 Outline designing.
 Placement of component for layout designing.
 Library editing in layout.
 Tracking.
 NC Drill file generation.
 Gerber file generation.
 Convert Design file to Gerber file and vice versa.
No. hours
After completion of this Computer Block Diagram.
unit student should be Computer History.
able to: Types of computers and their main specifications.
 Draw block diagram Computer operation systems and their applications.
of a computer. Design work station.
 Explain the working Graphics terminal.
of a computer. Input & Output devices.
Computer  Work on a
UNIT-I 23 35 119
Familiarization
computer system.
 How to work on
different operating
systems.
 How to take
printout.
UNIT-II CAD Fundamental After completion of this Introduction to CAD. 25 36 131
Page 7 of 19
unit student should be Design process.
able to: Use of computer for Designing.
 Explain CAD Advantages of CAD.
fundamentals.
 Draw schematic
diagram.
 Place schematic
components.
 Edit a library path.
 Do wiring.
 Generate netlist.
After completion of this Use of software like Or-CAD, CAD STAR, Protel, Altium.
unit student should be Applications and facilities of software.
able to: Library- the library path, block diagram of the library system,
 Outline designing. introduction to the parts library, the format of a part library, parts
 Placement of format description, introduction to PCB component library,
component for introduction to the schematic symbol library.
layout designing. Post processing procedures in PCB and schematics.
Routing applications with auto router, route editor and batch
 Library editing in
router.
UNIT- PCB Design layout. Different types of reports.
25 36 125
III Software  Tracking. Hardware requirements for use of Protel PCB software.
 Generate NC drill
files.
 Generate Gerber
file.
 Convert design file
to Gerber file and
vice versa.
Page 8 of 19
SEMESTER: I
COURSE NAME: PCB Production Overview, Materials & Safety
COURSE CODE: PCBD/POMS
 How to manufacture the PCB.
 Define the artworks required to manufacture a PCB.
 Read mechanical and drilling drawing.
 Name the types of laminates.
 Find out the thickness of laminates.
 Properties of glass epoxy laminates.
 Properties of Teflon.
 Properties of Aluminum based laminates.
 Properties of double sided laminates.
 Characteristics of Lith film.
 Characteristics and developing of five star films.
 Characteristics and developing of Chromolin film.
 Characteristics of Photo Polymer Dry Film Resist.
 How to handle the chemicals.
 How to handle the laminates.
 How to handle the films.
No. hours
After completion of this Evolution of PCB.
unit student should be Overview of PCB needs.
able to: Type and Applications.
 How to Art Work & brief idea on art work preparation.
UNIT-I Overview of PCB manufacture the Trends practices in PCB Manufacturing. 16 25 94
PCB.
 Define the artworks
required to
manufacture a PCB.
Page 9 of 19
 Read mechanical
and drilling
drawing.
After completion of this Laminates.

unit student should be Basic ingredients of copper clad laminates, epoxy laminates,
able to: ceramic (CEM) laminates, PTFE laminates.
 Name the types of Specification & test methods of laminates.
laminates. Properties of laminates.
 Find out the Application of laminates.
thickness of
laminates.
Types of  Properties of glass
UNIT-II 16 26 96
Laminates epoxy laminates.
 Properties of
Teflon.
 Properties of
Aluminum based
laminates.
 Properties of
double sided
laminates.
After completion of this Types of chemicals.
unit student should be Type of films.
able to: Types of photo resist.
 Characteristics of
lith film.
UNIT-  Characteristics and
Types of Films 18 26 101
III developing of five
star film.
 Characteristics and
developing of
chromolin film.
 Characteristics of
Page 10 of 19
Photo Polymer Dry
Film Resist.
After completion of this Safety precautions for handling chemicals.
unit student should be
able to:
 How to handle the
UNIT- Safety
chemicals. 16 21 84
IV Precautions
laminates.
films.
SEMESTER: II
COURSE NAME: Film Master Preparation, Board Cleaning, Screen Printing, Photo Printing & Masking
COURSE CODE: PCBD/FMP
 Process for developing and fixing of lith films.
 Process for making negative and positive films.
 Process of retouching of lith films.
 Process for preparation of multi ups.
 Observe precautions to protect the Photo Polymer Dry Film Resist.
 Carry out process of single side lamination.
 Carry out process of double side lamination.
 Carry out process of exposing.
 Carry out process of developing of dry film.
 Fabricate screen.
 Select fabrics.
 Measure tension of screen.
 Prepare stencils.
 Use squeeze.
 Use ink.
Page 11 of 19
 Carry out after printing process for drying.
 Remove the oxidation layer from copper surface by manual cleaning, chemical process.
 Remove the oxidation layer from copper surface by chemical process.
 Remove unwanted copper by using etching process.
 Spray etching.
 Splash etching.
 Bubble etching.
 Tank etching.
No. hours
After completion of this Use of reprographic cameras.
unit student should be Retouching desks.
able to: Orthographic (lith) Film.
 Process for Photo Film Preparation.
developing and Developer.
fixing of lith films. Hardener.
 Process for making Film Washing.
Film Master
UNIT-I negative and Drying. 22 35 98
Preparation
positive films.
 Process of
retouching of lith
films.
 Process for
preparation of multi
ups.
After completion of this Types of photo resist.
unit student should be Types of film master used.
able to: Used principle of dry photo resist laminator.
UNIT-II Photo Printing 22 35 98
 Observe Dip coating equipment.
precautions to Vacuum copying frame developing machine.
protect the Photo Techniques of mounting of film master on laminated board.
Page 12 of 19
Polymer Dry Film
Resist.
 Carry out process of
single side
lamination.
double side
lamination.
exposing.
developing of dry
film.
After completion of this Screen Frame.
unit student should be Screen Printing.
able to: Brushing Technique.
 Fabricate screen.
 Select fabrics.
Screen  Measure tension of
UNIT-
Preparation and screen. 22 35 97
III
Printing  Prepare stencils.
 Use squeeze.
 Use ink.
 Carry out after
printing process for
drying.
After completion of this Etching.
unit student should be Etching Chemical.
able to: Brushing Technique.
UNIT- Etching and  Remove the
22 26 82
IV Brushing oxidation layer from
copper surface by
manual cleaning,
chemical process.
Page 13 of 19
 Remove the
oxidation layer from
copper surface by
chemical process.
 Remove unwanted
copper by using
etching process.
 Spray etching.
 Splash etching.
 Bubble etching.
 Tank etching.
SEMESTER: II
COURSE NAME: Mechanical Machining Operation & HAL
COURSE CODE: PCBD/MMO
 Plan sheet cutting.
 Cut sheets by using shearing machine.
 Make mounting holes/slots by using punching machine.
 Final cutting by using angular cutting machine.
 Drill manually using drilling machine.
 CNC programming.
 CNC drilling.
 CNC routing.
 Knows the materials used in HAL machine.
 Understand how to flux before tinning.
 Understand how to tin on single as well as double side PCB.
No. hours
UNIT-I Mechanical After completion of this Construction, working principle & use of shearing machine, 31 50 128
Page 14 of 19
Machines for PCB unit student should be punching machine and angle cutter.
Production able to:
 Plan sheet cutting.
 Cut sheets by using
shearing machines.
 Make mounting
holes/slots by using
punching machines.
 Carry out final
cutting by using
angular cutting
machines.
After completion of this Manual drilling, optical drilling, CNC drilling etc.
unit student should be
able to:
 Drill manually using
drilling machine.
CNC and Manual
UNIT-II  Carry out CNC 33 50 131
Drilling Machine
programming.
 Carry out CNC
drilling.
 Carry out CNC
routing.
After completion of this Fluxing method.
unit student should be Maintenance of machine.
able to: Solder tin method.
 Know the materials
used in HAL
UNIT- Hot Air Leveling
machine. 31 42 116
III Machine
 Understand how to
flux before tinning.
 Understand how to
tin on single as well
as double side PCB.
Page 15 of 19
SEMESTER: II
COURSE NAME: Chemical Area
COURSE CODE: PCBD/CA
 Name the types of chemicals.
 Use of chemicals in PCB.
 Explain how to remove the ink/dry film in PCB after etching process.
 Strip the ink using chemical and mechanical process.
 How to remove the tin.
 Carry out PTH process.
 Carry out electroplating process- Copper.
 Carry out electroplating process- Tin.
 Understand thermal masking process.
 Types of film used in masking.
 Understand PISM.
 Develop of PISM.
No. hours
After completion of this Types of chemicals.
unit student should be Use of chemicals in PCB.
able to: Ink stripping/dry film stripping chemicals.
 Name the types of Tin stripping.
chemicals.
Types of
UNIT-I  Use of chemicals in 40 49 168
Chemicals
PCB.
 Explain how to
remove the ink/dry
film in PCB after
etching process.
Page 16 of 19
 Strip the ink using
chemical and
mechanical process.
 How to remove the
tin.
After completion of this Plating.
unit student should be Masking.
able to:
 Carry out PTH
process.
 Carry out
electroplating
process- Copper.
UNIT-II Plating, Masking  Carry out 40 70 207
electroplating
process- Tin.
 Understand thermal
masking process.
 Types of film used
in masking.
 Understand PISM.
 Develop of PISM.
SEMESTER: II
COURSE NAME: PCB Inspection and Quality Control
COURSE CODE: PCBD/IQC
 Inspect the PCB with the help of BBT technique.
 Inspect open circuit and short circuit.
 Inspect for over etched/under etched.
 Inspect hole size.
 Inspect hole for conformity with pad.
 Inspect for missing/extra hole.
Page 17 of 19
 Inspect overall PCB.
No. hours
After completion of this Name of inspection equipments.
unit student should be Different types of defects.
able to: Inspection method.
 Inspect the PCB Perform inspections.
with the help of BBT
technique.
 Inspect open circuit
and short circuit.
 Inspect for over
UNIT-I Inspection of PCB 78 117 375
etched/under
etched.
 Inspect hole size.
 Inspect hole for
conformity with
pad.
 Inspect for
missing/extra hole.
 Inspect overall PCB.
Page 18 of 19

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PCB DESIGN & MANUFACTURING

Ministry of Micro, Small and Medium

After completion of this unit Multimeter.

After completion of this unit Binary Numbers.

UNIT-II CAD Fundamental After completion of this Introduction to CAD. 25 36 131

After completion of this Laminates.

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