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INA2321
SBOS168D − DECEMBER 2000 − REVISED JANUARY 2006
DESCRIPTION 100
The INA321 family is a series of rail-to-rail output, INA321
CMRR (dB)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright 2000-2006, Texas Instruments Incorporated
! !
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SBOS168D − DECEMBER 2000 − REVISED JANUARY 2006
PACKAGE/ORDERING INFORMATION(1)
SPECIFIED
PACKAGE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD TEMPERATURE
DESIGNATOR MARKING NUMBER MEDIA, QUANTITY
RANGE
SINGLE
INA321E MSOP-8 DGK −55°C to +125°C C21 INA321E/250 Tape and Reel, 250
″ ″ ″ ″ ″ INA321E/2K5 Tape and Reel, 2500
INA321EA MSOP-8 DGK −55°C to +125°C C21 INA321EA/250 Tape and Reel, 250
″ ″ ″ ″ ″ INA321EA/2K5 Tape and Reel, 3000
DUAL
INA2321EA TSSOP-14 PW −55°C to +125°C INA2321EA INA2321EA/250 Tape and Reel, 250
″ ″ ″ ″ ″ INA2321EA/2K5 Tape and Reel, 2500
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
PIN CONFIGURATIONS
Top View
INA2321
VIN−A 2 13 VOUTA
RG 1 8 Shutdown
VIN+A 3 12 REFA
VIN− 2 7 V+
V− 4 11 V+
VIN+ 3 6 VOUT
VIN+B 5 10 REFB
V− 4 5 REF
VIN−B 6 9 VOUTB
MSOP−8 (E, EA) RGB 7 8 Shutdown B
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TYPICAL CHARACTERISTICS
At TA = +25°C, VS = 5V, VCM =1/2VS, RL = 25kΩ, and CL = 50pF, unless otherwise noted.
CMRR (dB)
40
Gain (dB)
Gain = 25
30 60
20 Gain = 5
40
10
0
20
−10
−20 0
10 100 1k 10k 100k 1M 10M 10 100 1k 10k 100k
Frequency (Hz) Frequency (Hz)
5
80 VS = 5.0V
70
4
PSRR (dB)
60
50 3 VS = 2.7V
40
2
30
20
1
10
0 0
1 10 100 1k 10k 100k 100 1k 10k 100k 1M 10M
Frequency (Hz) Frequency (Hz)
NOISE vs FREQUENCY
10k 100 0.1Hz TO 10Hz VOLTAGE NOISE
1k 10
VNOISE (nV/√Hz)
INoise (fA/√Hz)
10µv/div
100 1
10 0.1
1 10 100 1k 10k 100k
1s/div
Frequency (Hz)
5
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SBOS168D − DECEMBER 2000 − REVISED JANUARY 2006
4
15
To Positive Rail
3
REF
10
Increasing
2
To Negative Rail
5
1
0 0
0 20k 40k 60k 80k 100k 0 1 2 3 4 5
RLOAD (Ω) Input Common−Mode Voltage (V)
QUIESCENT CURRENT AND SHUTDOWN CURRENT QUIESCENT CURRENT AND SHUTDOWN CURRENT
vs POWER SUPPLY vs TEMPERATURE
50 500 60 600
45 450 55
40 400 50 500
IQ 45
35 350
40 400
30 300 IQ
35
ISD (nA)
ISD (nA)
IQ (µA)
IQ (µA)
25 250 30 300
20 200 25
15 150 20 200
15
10 100
10 100
5 ISD 50 ISD
5
0 0 0 0
2.5 3 3.5 4 4.5 5 5.5 −75 −50 −25 0 25 50 75 100 125 150
Supply Voltage (V) Temperature (_C)
ISC+ 25
15
20
ISC+
ISC (mA)
ISC (mA)
10 ISC− 15
10
5 ISC−
5
0 0
2.5 3 3.5 4 4.5 5 5.5 −75 −50 −25 0 25 50 75 100 125 150
Supply Voltage (V) Temperature (_ C)
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SBOS168D − DECEMBER 2000 − REVISED JANUARY 2006
50mV/div
10µs/div 50µs/div
50mV/div
10µs/div 50µs/div
1V/div
50µs/div 50µs/div
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SBOS168D − DECEMBER 2000 − REVISED JANUARY 2006
70 40
Overshoot (%)
0.01%
60
50 30
40 G = 25
20
30
0.1%
20 10
10
0 0
1 10 100 1000 10 100 1k 10k
Gain (V/V) Load Capacitance (pF)
1V/div
1.5
1
VOUT
Shutdown Mode
0.5
Part Draws Below 1µA Quiescent Current
0
2.3 3 3.5 4 4.5 5 5.5 50µs/div
Supply Voltage (V)
20 16
14
15 12
10
10 8
6
5 4
2
0 0
− 1.0
− 0.9
− 0.8
− 0.7
− 0.6
− 0.5
− 0.4
− 0.3
− 0.2
− 0.1
−2 0
−1 8
−1 6
−1 4
−1 2
−1 0
−8
−6
−4
−2
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
2
4
6
8
10
12
14
16
18
20
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0.8 1k
0.6 100
0.4 10
0.2 0
0 0.1
−75 −50 −25 0 25 50 75 100 125 150 − 75 − 50 − 25 0 25 50 75 100 125 150
Temperature (_C) Temperature (_ C)
100
4
Output Voltage (V)
3
60
2
40
+125°C +25°C − 55_ C
1
20
0 0
0.1 1 10 100 1k 10k 100k 1M 0 2 4 6 8 10 12 14 16 18 20 22 24
Frequency (Hz) Output Current (mA)
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SBOS168D − DECEMBER 2000 − REVISED JANUARY 2006
G = 5 + 5 (R2 / R1 )
DESIRED GAIN
Short VOUT to RG
R1 R2 (V/V) R1 R2
for G = 5
5 OPEN SHORT
RG 10 100kΩ 100kΩ
1 50 10kΩ 90kΩ
100 10kΩ 190kΩ
160kΩ 40kΩ
5
REF
160kΩ
A1 40kΩ 6
2 A3 VO = ((VIN+) − (VIN −)) • G
VIN−
A2
VIN+ 3
VIN+ 3 7
Shutdown (For Single
0.1µF Supply) 0.1µF 8
5 6 VOUT
REF INA321
V+ V− 1
VIN− 2
4
V− RG
+5V
V+
VIN+ Shutdown
Bridge 3 7
Sensor
8
REF(1) 5 6 VOUT
INA321
VIN− 1
2
4
V− NOTE: (1) REF should be adjusted for the desired output level,
RG keeping in mind that the value of REF affects the common−mode
input range. See Typical Characteristics.
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SETTING THE GAIN Figure 3 shows how bias current path can be provided in
the cases of microphone applications, thermistor
The ratio of R2 to R1, or the impedance between pins 1, 5,
applications, ground returns, and dc-coupled resistive
and 6, determines the gain of the INA321. With an
bridge applications.
internally set gain of 5, the INA321 can be programmed for
gains greater than 5 according to the following equation:
G = 5 + 5 (R2/R1)
V+
Shutdown
The INA321 is designed to provide accurate gain, with gain VIN + 3 7
error assured to be less than 0.1%. Setting gain with
Microphone, 8
matching TC resistors will minimize gain drift. Errors from 5 6 VOUT
Hydrophone, REF INA321
external resistors will add directly to the gain error, and etc. 1
VIN− 2
may become dominant error sources. 4
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SBOS168D − DECEMBER 2000 − REVISED JANUARY 2006
2
1 OPA340 VOUT Figure 5. INA321 Directly Drives a
VIN−
4 Capacitive-Input, A/D Converter
V− RG OFFSET TRIMMING
The INA321 is laser-trimmed for low offset voltage. In the
Figure 4. Output Buffering Circuit. Able to drive
loads as low as 600Ω. event that external offset adjustment is required, the offset
can be adjusted by applying a correction voltage to the
SHUTDOWN MODE reference terminal. Figure 6 shows an optional circuit for
trimming offset voltage. The voltage applied to the REF
The shutdown pin of the INA321 is nominally connected to terminal is added to the output signal. The gain from REF
V+. When the pin is pulled below 0.8V on a 5V supply, the to VOUT is +1. An op-amp buffer is used to provide low
INA321 goes into sleep mode within nanoseconds. For impedance at the REF terminal to preserve good
actual shutdown threshold, see the Typical Characteristic common-mode rejection.
curve, Shutdown Voltage vs Supply Voltage. Drawing less
than 1µA of current, and returning from sleep mode in V+
Shutdown
microseconds, the shutdown feature is useful for portable
VIN+ 3 7
applications. Once in sleep-mode, the amplifier has high
8
output impedance, making the INA321 suitable for REF(1) 5 INA321
6 VOUT
multiplexing. 2 1
VIN−
4
RAIL-TO-RAIL OUTPUT
V− RG
A class AB output stage with common-source transistors
is used to achieve rail-to-rail output for gains of 10 or
greater. For resistive loads greater than 25kΩ, the output
OPA336
voltage can swing to within a few millivolts of the supply rail Adjustable
Voltage
while maintaining low gain error. For heavier loads and
over temperature, see the Typical Characteristic curve, NOTE: (1) REF should be adjusted for the desired output level.
Output Voltage Swing vs Output Current. The INA321’s The value of REF affects the common−mode input range.
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SBOS168D − DECEMBER 2000 − REVISED JANUARY 2006
V+
Shutdown
FEEDBACK CAPACITOR IMPROVES RESPONSE
RLIM
VIN+
3 7 For optimum settling time and stability with
8 high-impedance feedback networks, it may be necessary
IOVERLOAD 5 6
10mA max
REF INA321 VOUT to add a feedback capacitor across the feedback resistor,
1 RF, as shown in Figure 8. This capacitor compensates for
VIN− 2
4 the zero created by the feedback network impedance and
RLIM
V− RG
the INA321’s RG-pin input capacitance (and any parasitic
layout capacitance). The effect becomes more significant
Figure 7. Input Protection with higher impedance networks. Also, RX and CL can be
added to reduce high-frequency noise.
OFFSET VOLTAGE ERROR CALCULATION
The offset voltage (VOS) of the INA321E is specified at a
V+
maximum of 500µV with a +5V power supply and the
common-mode voltage at VS/2. Additional specifications Shutdown
3 7
for power-supply rejection and common-mode rejection VIN +
are provided to allow the user to easily calculate 8
INA321 RX
worst-case expected offset under the conditions of a given REF
5 6
VOUT
CIN
application.
1 CL
Power-Supply Rejection Ratio (PSRR) is specified in VIN− 2
RG
µV/V. For the INA321, worst-case PSRR is 200µV/V, 4
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SBOS168D − DECEMBER 2000 − REVISED JANUARY 2006
APPLICATION CIRCUITS optional right leg drive. Filtering can be modified to suit
Medical ECG Applications application needs by changing the capacitor value of the
output filter.
Figure 9 shows the INA321 configured to serve as a
Low-Power, Single-Supply Data Acquisition
low-cost ECG amplifier, suitable for moderate accuracy Systems
heart-rate applications such as fitness equipment. The
input signals are obtained from the left and right arms of the Refer to Figure 5 to see the INA321 configured to drive an
patient. The common-mode voltage is set by two 2MΩ ADS7818. Functioning at frequencies of up to 500kHz, the
resistors. This potential, through a buffer, provides an INA321 is ideal for low-power data acquisition.
VR
OPA336
0.1µF 1.6nF
V+ 1MΩ
Shutdown
100kΩ 1MΩ
VIN+ 3 7
Left Arm Shield
8 10kΩ
REF 5 6
INA321
100kΩ VIN− 1 OPA336 VOUT PUT
2 10kΩ
Right Arm
4 VR
+5V
V− RG 1MΩ
2MΩ 2MΩ
2kΩ
VR = +2.5V Shield
Drive 10kΩ 390kΩ
OPA336
2kΩ
100kΩ
Right
OPA336
Leg
VR
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PACKAGE OPTION ADDENDUM
www.ti.com 5-Apr-2006
PACKAGING INFORMATION
Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
INA2321EA/250 ACTIVE TSSOP PW 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
INA2321EA/250G4 ACTIVE TSSOP PW 14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
INA2321EA/2K5 ACTIVE TSSOP PW 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
INA2321EA/2K5G4 ACTIVE TSSOP PW 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
INA321E/250 ACTIVE MSOP DGK 8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
INA321E/250G4 ACTIVE MSOP DGK 8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
INA321E/2K5 ACTIVE MSOP DGK 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
INA321E/2K5G4 ACTIVE MSOP DGK 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
INA321EA/250 ACTIVE MSOP DGK 8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
INA321EA/250G4 ACTIVE MSOP DGK 8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
INA321EA/2K5 ACTIVE MSOP DGK 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
INA321EA/2K5G4 ACTIVE MSOP DGK 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 5-Apr-2006
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Dec-2008
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Dec-2008
Pack Materials-Page 2
MECHANICAL DATA
0,30
0,65 0,10 M
0,19
14 8
0,15 NOM
4,50 6,60
4,30 6,20
Gage Plane
0,25
1 7
0°– 8°
A 0,75
0,50
Seating Plane
PINS **
8 14 16 20 24 28
DIM
4040064/F 01/97